JP2007530936A - 高速引張り試験装置及び方法 - Google Patents
高速引張り試験装置及び方法 Download PDFInfo
- Publication number
- JP2007530936A JP2007530936A JP2007504477A JP2007504477A JP2007530936A JP 2007530936 A JP2007530936 A JP 2007530936A JP 2007504477 A JP2007504477 A JP 2007504477A JP 2007504477 A JP2007504477 A JP 2007504477A JP 2007530936 A JP2007530936 A JP 2007530936A
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- JP
- Japan
- Prior art keywords
- substrate
- ball
- conductive
- platen
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/001—Impulsive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
Description
一定距離にわたる加速の変化率に応じて、基板の拘束地点での試験治具の速度を調整することを可能にするために有利である。
ール39が設けられる。クランプジョー40が概略的に示されている。
Claims (10)
- 基板に接着されている導電性ボールの接合強度を試験する方法であって、
試験治具を用いて前記ボールを把持するステップと、
前記基板を前記ボールに軽く押し当てつつ、前記ボールの接着面に対してほぼ直交方向に前記ボールを移動させるステップと、
前記基板を急停止させるステップと
を含む、導電性ボールの接合強度を試験する方法。 - 前記基板をプラテンに固定し、それにより該プラテンを急停止させることで前記基板を間接的に停止させるようにする、予備ステップを含む、請求項1に記載の導電性ボールの接合強度を試験する方法。
- 前記基板に前記ボールを押し当てるためのエアラムを設け、該基板が急停止する時点まで前記ボールと該基板との間に軽い圧縮荷重を確保するのに十分な量の圧縮空気を前記ラムに加えるステップを含む、請求項1又は2に記載の導電性ボールの接合強度を試験する方法。
- 基板に接着されている導電性ボールの接合の引張り試験用の装置であって、
フレーム(11)と、
基板(19)に接着されているボール(20)を把持するグリッパ(22)と、
接着面に対してほぼ直交する軸上で前記グリッパ(22)を移動させる装置と、
前記基板を前記軸上で前記グリッパの方に軽く推進する、前記フレームの推進装置(16、17)と、
前記基板のための前記フレームの当接部(14)と
を備え、
それによって、使用の際に、前記基板が前記当接部(14)によって制止されるまで該基板及び前記ボールが前記軸上で同時に移動するようになっている、導電性ボールの接合の引張り試験用の装置。 - 前記推進装置はエアラム(16、17)を備える、請求項4に記載の導電性ボールの接合の引張り試験用の装置。
- 前記推進装置(16、17)は、前記基板のためのプラテン(18)を含む、請求項4又は5に記載の導電性ボールの接合の引張り試験用の装置。
- 前記プラテン(18)上に基板を取り外し可能に固定するクランプ装置をさらに有する、請求項6に記載の導電性ボールの接合の引張り試験用の装置。
- 前記フレーム(33)と前記ラム(34)との前記直接接触によって前記当接を与えるようになっている、請求項4〜7のいずれか一項に記載の導電性ボールの接合の引張り試験用の装置。
- 前記フレーム(14)と前記基板(19)との直接接触によって前記当接を与えるようになっている、請求項4〜7のいずれか一項に記載の導電性ボールの接合の引張り試験用の装置。
- 前記フレームと前記プラテンとの間の直接接触によって前記当接を与えるようになっている、請求項6又は7に記載の導電性ボールの接合の引張り試験用の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0406434.1A GB0406434D0 (en) | 2004-03-22 | 2004-03-22 | High speed pull test device |
PCT/GB2005/001116 WO2005093436A2 (en) | 2004-03-22 | 2005-03-17 | High speed pull test device and method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007530936A true JP2007530936A (ja) | 2007-11-01 |
JP4653159B2 JP4653159B2 (ja) | 2011-03-16 |
Family
ID=32188470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007504477A Expired - Fee Related JP4653159B2 (ja) | 2004-03-22 | 2005-03-17 | 高速引張り試験装置及び方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7856889B2 (ja) |
EP (1) | EP1730487B1 (ja) |
JP (1) | JP4653159B2 (ja) |
CN (1) | CN1950689B (ja) |
GB (1) | GB0406434D0 (ja) |
WO (1) | WO2005093436A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009529667A (ja) * | 2006-03-10 | 2009-08-20 | デイジ プレシジョン インダストリーズ リミテッド | 引張試験較正デバイス及び方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0604700D0 (en) * | 2006-03-08 | 2006-04-19 | Dage Prec Ind Ltd | Shear testing of metallic balls of electrical components |
GB0613205D0 (en) | 2006-07-03 | 2006-08-09 | Dage Prec Ind Ltd | High speed test cartridge |
CN100594368C (zh) * | 2007-10-22 | 2010-03-17 | 宁波大学 | 一种材料高速拉伸试验装置及其试验方法 |
EP2363702B1 (en) | 2010-03-05 | 2016-09-28 | Nordson Corporation | Bond strength tester with switchable backlash control |
EP2363701B1 (en) * | 2010-03-05 | 2015-11-04 | Nordson Corporation | Improved clamping mechanism for shear testing apparatus |
US8534136B2 (en) * | 2010-03-31 | 2013-09-17 | Flextronics Ap, Llc. | Pin soldering for printed circuit board failure testing |
US8875579B2 (en) * | 2012-03-26 | 2014-11-04 | GM Global Technology Operations LLC | Method and apparatus for non-destructive weld testing |
CN103604742A (zh) * | 2013-09-16 | 2014-02-26 | 浙江吉利控股集团有限公司 | 一种轿车焊缝密封胶附着力测试方法及装置 |
CN103760016B (zh) * | 2014-02-13 | 2016-08-17 | 北京工业大学 | 一种用于测试复合材料界面力学性能的夹具及实验方法 |
GB201413225D0 (en) * | 2014-07-25 | 2014-09-10 | Sykes Robert J And Xyztec Bv | Solder cleaning system |
CN106847003B (zh) * | 2015-03-13 | 2019-03-12 | 贵州云享创客科技有限公司 | 一种x型教学拉伸试验台的使用方法 |
DE102016107028A1 (de) | 2016-04-15 | 2017-10-19 | Technische Universität Wien | Bondstellen-Prüfanordnung und Bondstellen-Prüfverfahren |
GB201702162D0 (en) * | 2017-02-09 | 2017-03-29 | Nordson Corp | Bond test apparatus and bond test cartridge with integrated illumination system |
DE102017124255A1 (de) | 2017-10-18 | 2019-04-18 | Technische Universität Wien | Lötstellen-Prüfanordnung und Lötstellen-Prüfverfahren |
DE102020108536A1 (de) | 2020-03-27 | 2021-09-30 | F&S Bondtec Semiconductor GmbH | Bondstellen-Prüfverfahren und Anordnung zu dessen Durchführung |
DE102020114468A1 (de) | 2020-05-29 | 2021-12-02 | Bayerische Motoren Werke Aktiengesellschaft | Prüfvorrichtung sowie Verfahren zum Prüfen eines an einem Prüfelement befestigten Überprüfungselements |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607051U (ja) * | 1983-06-28 | 1985-01-18 | 三菱重工業株式会社 | 衝撃引張試験用アダプタ |
JPS61168235A (ja) * | 1985-01-21 | 1986-07-29 | Resuka:Kk | ボンデイング強度試験装置 |
JPS6369243A (ja) * | 1986-09-05 | 1988-03-29 | エヌ・ベー・フィリップス・フルーイランペンファブリケン | マイクロ−ミニアチュア固体デバイスのワイヤボンドの引張り試験方法および装置 |
JPH08247912A (ja) * | 1995-03-15 | 1996-09-27 | Shimadzu Corp | 引張衝撃試験機 |
EP0772036A2 (en) * | 1995-10-31 | 1997-05-07 | Gerold Staudinger | Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks |
JP2003177088A (ja) * | 2002-09-19 | 2003-06-27 | Fujitsu Ltd | マイクロ接合強度評価試験治具 |
JP2003270105A (ja) * | 2002-03-14 | 2003-09-25 | Hitachi Ltd | 半導体装置接合部強度評価装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9001744D0 (en) * | 1990-01-25 | 1990-03-28 | Molins Plc | Adhesive testing device |
US5401911A (en) * | 1992-04-03 | 1995-03-28 | International Business Machines Corporation | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
US5948997A (en) * | 1997-09-02 | 1999-09-07 | Intriplex Technologies, Inc. | Swaged connection testing apparatus |
GB9724457D0 (en) * | 1997-11-20 | 1998-01-14 | Dage Precision Ind Limited | Test apparatus |
US6177729B1 (en) * | 1999-04-03 | 2001-01-23 | International Business Machines Corporation | Rolling ball connector |
US6564115B1 (en) * | 2000-02-01 | 2003-05-13 | Texas Instruments Incorporated | Combined system, method and apparatus for wire bonding and testing |
JP4580610B2 (ja) * | 2000-04-04 | 2010-11-17 | リンテック株式会社 | 粘着力測定装置 |
US6564648B2 (en) * | 2001-03-05 | 2003-05-20 | Siliconware Precision Industries Co., Ltd. | Method and apparatus for inspecting solder balls on ball grid array package |
DE50208590D1 (de) * | 2002-02-01 | 2006-12-14 | F & K Delvotec Bondtech Gmbh | Testvorrichtung zur Ausführung eines Pulltests |
US20040103726A1 (en) * | 2002-12-02 | 2004-06-03 | Malcolm Cox | Bond test systems with offset shear tool |
WO2004083831A1 (en) | 2003-03-19 | 2004-09-30 | Dage Precision Industries Ltd. | A shield test tool for a bond tester |
US6912915B2 (en) * | 2003-11-21 | 2005-07-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for shear testing bonds on silicon substrate |
TWI274873B (en) * | 2005-04-15 | 2007-03-01 | Advanced Semiconductor Eng | Bonding strength test device |
US7389698B2 (en) * | 2005-08-24 | 2008-06-24 | Physical Systems, Inc. | Nutplate bond strength tester unit |
-
2004
- 2004-03-22 GB GBGB0406434.1A patent/GB0406434D0/en not_active Ceased
-
2005
- 2005-03-17 EP EP05718103.4A patent/EP1730487B1/en not_active Not-in-force
- 2005-03-17 WO PCT/GB2005/001116 patent/WO2005093436A2/en active Application Filing
- 2005-03-17 CN CN2005800141831A patent/CN1950689B/zh not_active Expired - Fee Related
- 2005-03-17 JP JP2007504477A patent/JP4653159B2/ja not_active Expired - Fee Related
- 2005-03-17 US US10/599,153 patent/US7856889B2/en not_active Expired - Fee Related
-
2010
- 2010-12-07 US US12/962,013 patent/US8015883B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607051U (ja) * | 1983-06-28 | 1985-01-18 | 三菱重工業株式会社 | 衝撃引張試験用アダプタ |
JPS61168235A (ja) * | 1985-01-21 | 1986-07-29 | Resuka:Kk | ボンデイング強度試験装置 |
JPS6369243A (ja) * | 1986-09-05 | 1988-03-29 | エヌ・ベー・フィリップス・フルーイランペンファブリケン | マイクロ−ミニアチュア固体デバイスのワイヤボンドの引張り試験方法および装置 |
JPH08247912A (ja) * | 1995-03-15 | 1996-09-27 | Shimadzu Corp | 引張衝撃試験機 |
EP0772036A2 (en) * | 1995-10-31 | 1997-05-07 | Gerold Staudinger | Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks |
JP2003270105A (ja) * | 2002-03-14 | 2003-09-25 | Hitachi Ltd | 半導体装置接合部強度評価装置 |
JP2003177088A (ja) * | 2002-09-19 | 2003-06-27 | Fujitsu Ltd | マイクロ接合強度評価試験治具 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009529667A (ja) * | 2006-03-10 | 2009-08-20 | デイジ プレシジョン インダストリーズ リミテッド | 引張試験較正デバイス及び方法 |
Also Published As
Publication number | Publication date |
---|---|
GB0406434D0 (en) | 2004-04-28 |
CN1950689A (zh) | 2007-04-18 |
US7856889B2 (en) | 2010-12-28 |
JP4653159B2 (ja) | 2011-03-16 |
US20080257059A1 (en) | 2008-10-23 |
EP1730487A2 (en) | 2006-12-13 |
EP1730487B1 (en) | 2016-05-11 |
US20110079088A1 (en) | 2011-04-07 |
WO2005093436A3 (en) | 2006-04-20 |
US8015883B2 (en) | 2011-09-13 |
CN1950689B (zh) | 2010-08-11 |
WO2005093436A2 (en) | 2005-10-06 |
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