JP2007527330A - 圧電管 - Google Patents
圧電管 Download PDFInfo
- Publication number
- JP2007527330A JP2007527330A JP2006518599A JP2006518599A JP2007527330A JP 2007527330 A JP2007527330 A JP 2007527330A JP 2006518599 A JP2006518599 A JP 2006518599A JP 2006518599 A JP2006518599 A JP 2006518599A JP 2007527330 A JP2007527330 A JP 2007527330A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- rod
- tube
- container
- suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims abstract description 82
- 238000000034 method Methods 0.000 claims abstract description 67
- 239000000725 suspension Substances 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 14
- 238000001962 electrophoresis Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 230000005684 electric field Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000010287 polarization Effects 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000004062 sedimentation Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 54
- 239000010410 layer Substances 0.000 description 49
- 238000005452 bending Methods 0.000 description 22
- 238000001652 electrophoretic deposition Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 239000000523 sample Substances 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000009021 linear effect Effects 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001027 hydrothermal synthesis Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004574 scanning tunneling microscopy Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/506—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a cylindrical shape and having stacking in the radial direction, e.g. coaxial or spiral type rolls
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/02—Electrophoretic coating characterised by the process with inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/20—Pretreatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
- Rigid Pipes And Flexible Pipes (AREA)
- Glass Compositions (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
【選択図】 図1
Description
例えば、同時係属中の“Pump”という名称の特許出願(出願番号第60/415844号、代理人書類番号DAVI190.001PRFとして2002年10月2日に出願)に記載されているようなSTMでの使用に適した、又はポンプトランスデューサとしての、単層圧電トランスデューサ管の形成に使用される条件の具体的な実施形態が次に説明される。
所与の外径で、変位は内径の増加と共に増加し、外径が大きくなるほど、同じ内径に対する変位が小さくなる。
製造された圧電管がSTMにおいて使用されるか、又は圧電モータのトランスデューサとして使用される場合、それぞれ、より大きい走査範囲、又はより高い回転速度及びトルクを達成するため、大きい変位が望ましい。このことは、複層管状トランスデューサを使用して達成され、その一実施形態が図15に示されている。本実施形態では、複層トランスデューサは、中間電極42によって分離された第1のセラミック層40及び第2のセラミック層41を含み、内側電極43及び外側電極44がさらに設けられ、図示されるように四分区間に区分される。製造プロセスは、単層トランスデューサに関して既に説明した製造プロセスと実質的に同じであるので、詳細には説明されない。
Claims (37)
- 圧電管を形成する方法であって、
(a)流体媒体中にセラミック粒子の懸濁を形成するステップと、
(b)前記流体媒体にロッドを位置決めするステップと、
(c)電気泳動を使用して前記ロッドに粒子を堆積するステップと、
(d)圧電管を形成するため前記堆積した粒子を熱処理するステップと、
を含む、方法。 - 前記圧電管が複層圧電管であり、
(a)中間電極を形成するため熱処理された前記堆積した粒子から作られた第1の層の外面に金属ペーストを塗布するステップと、
(b)第2の層を形成するため電気泳動を使用して前記ロッドにさらなる粒子を堆積するステップと、
(c)前記複層圧電管を形成するため前記堆積した層を熱処理するステップと、
をさらに含む、請求項1記載の方法。 - 前記圧電管が多層圧電管であり、
(a)中間電極を形成するため熱処理された前記堆積した粒子から作られた層の外面に金属ペーストを塗布するステップと、
(b)さらなる層を形成するため電気泳動を使用して前記ロッドにさらなる粒子を堆積するステップと、
(c)前記堆積した層を熱処理するステップと、
(d)多層圧電管を形成するため前記ステップを繰り返すステップと、
をさらに含む、請求項1記載の方法。 - (a)前記圧電管の前記内面及び前記外面に金属ペーストを塗布するステップと、
(b)トランスデューサを形成するため前記圧電管を分極するステップと、
をさらに含む、請求項1記載の方法。 - 分極条件が20〜120分間の持続時間、及び100〜150℃の範囲の温度での2〜4kV/mmの範囲の電場の印加を含む、請求項4記載の方法。
- 前記粒子を堆積する方法が、
(a)前記懸濁を含む容器内で前記ロッドを位置決めするステップと、
(b)前記ロッドを電源の第1の端子に接続するステップと、
(c)前記流体媒体と接触している電極を前記電源の第2の端子に接続するステップと、
(d)所定のDC電圧を前記電極及び前記ロッドに印加し、それによって、前記粒子の少なくとも一部を前記ロッドに堆積させるために前記電源を使用するステップと、
を含む、請求項1〜5のいずれか一項記載の方法。 - 前記容器が前記電極としての役目をするようになっている導電性容器である、請求項6記載の方法。
- 前記容器が、ステンレス鋼、銅、及び別の金属のうちの少なくとも1つから作られる、請求項7記載の方法。
- 前記容器がガラスとプラスチックの少なくとも一方から作られ、前記容器が少なくとも1層の導電層で覆われる、請求項7記載の方法。
- 前記堆積した粒子を熱処理する方法が、
(a)前記粒子を前記ロッドの表面に凝固させ、前記ロッドをバーンオフし、それによって、一方の端部が閉じられた凝固した粒子の管を残すように、前記堆積した粒子を第1の所定の温度まで加熱するステップと、
(b)高密度セラミック管を形成するため前記管を焼結するように前記管を第2の所定の温度まで加熱するステップと、
を含む、請求項1〜9のいずれか一項記載の方法。 - 前記管の前記閉じた端部を切断するステップをさらに含む、請求項10記載の方法。
- 前記第2の所定の温度が前記第1の所定の温度より高い、請求項10記載の方法。
- 前記第1の所定の温度が500℃〜1200℃である、請求項10記載の方法。
- 前記第2の所定の温度が850℃〜1300℃である、請求項10記載の方法。
- 前記ロッドがグラファイトから作られる、請求項1〜14のいずれか一項記載の方法。
- 前記ロッドが、プラスチックと、前記第1の所定の温度でバーンオフされる別の材料とのうちの少なくとも一方から作られ、前記ロッドが少なくとも1層の導電層で覆われる、請求項10記載の方法。
- 前記懸濁中の前記粒子の沈降を防止するため電磁攪拌機を使用するステップをさらに含む、請求項1〜16のいずれか一項記載の方法。
- 前記懸濁を形成する方法が、
(a)前記懸濁を形成するため前記粒子を溶媒に分散させるステップと、
(b)前記懸濁のpH値を所定のpH値に調整するステップと、
を含む、請求項1〜17のいずれか一項記載の方法。 - 前記溶媒が有機溶媒である、請求項18記載の方法。
- 前記溶媒がエタノールとアセトンの少なくとも一方である、請求項19記載の方法。
- 前記溶媒が水である、請求項18記載の方法。
- 前記粒子を分散させる方法が、
前記粒子を超音波で分散させるステップを含む、請求項18記載の方法。 - 安定剤を前記懸濁に添加するステップを含む、請求項18記載の方法。
- 前記安定剤がエーテルグリコールである、請求項18記載の方法。
- 前記粒子が、
チタン酸ジルコン酸鉛と、
ドープトチタン酸ジルコン酸鉛と、
BaTiO3と、
0.95Pb(Zr0.52Ti0.48)O3・0.03BiFeO3・0.02Ba(Cu0.5W0.5)O3+0.5重量%MnO2と、
その他の圧電粒子のうちの少なくとも1つである、
請求項1〜24のいずれか一項記載の方法。 - (a)流体媒体中のセラミック粒子の懸濁を収容する容器と、
(b)前記流体媒体と接触したロッドと、
(c)前記流体媒体と接触した電極と、
(d)使用中に前記粒子の少なくとも一部を前記ロッドに堆積するために、所定の電圧を前記ロッド及び前記電極に印加するようになっている電源と、
(e)圧電管を形成するため前記堆積した粒子を熱処理する熱源と、
を含む、圧電管を形成する装置。 - 前記堆積した粒子から作られた第1の層の外面に金属ペーストを供給する塗布装置をさらに含む、請求項26記載の装置。
- 前記容器が前記電極としての役目をするようになっている導電性容器である、請求項26又は27記載の装置。
- 前記容器が、ステンレス鋼、銅、及び別の金属のうちの少なくとも1つから作られる、請求項28記載の装置。
- 前記容器がガラスとプラスチックの少なくとも一方から作られ、前記容器が少なくとも1層の導電層で覆われる、請求項28記載の装置。
- 前記熱源が、
前記堆積した粒子を第1の所定の温度まで加熱し、それによって、
前記粒子を前記ロッドの表面に凝固させ、
前記ロッドをバーンオフし、それによって、一方の端部が閉じられた凝固した粒子の管を残し、
前記管を第2の温度まで加熱し、それによって、高密度セラミックを形成するため前記管を焼結するようになっている、
請求項26〜30のいずれか一項記載の装置。 - 前記第2の所定の温度が前記第1の所定の温度より高い、請求項31記載の装置。
- 前記第1の所定の温度が500℃〜1200℃である、請求項31記載の装置。
- 第2の所定の温度が850℃〜1300℃である、請求項31記載の装置。
- 前記ロッドがグラファイトから作られる、請求項26〜34のいずれか一項記載の装置。
- 前記ロッドが、プラスチックと、前記第1の所定の温度でバーンオフされる別の材料とのうちの少なくとも一方から作られ、前記ロッドが少なくとも1層の導電層で覆われる、請求項26〜34のいずれか一項記載の装置。
- 前記懸濁中の前記粒子の沈降を防止するため前記流体媒体を撹拌する電磁攪拌機をさらに含む、請求項26〜36のいずれか一項記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/611,401 | 2003-07-01 | ||
US10/611,401 US20040118686A1 (en) | 2002-10-02 | 2003-07-01 | Piezoelectric tubes |
PCT/SG2004/000038 WO2005004249A1 (en) | 2003-07-01 | 2004-02-12 | Piezoelectric tubes |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007527330A true JP2007527330A (ja) | 2007-09-27 |
JP2007527330A5 JP2007527330A5 (ja) | 2010-09-24 |
JP4922755B2 JP4922755B2 (ja) | 2012-04-25 |
Family
ID=33564253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006518599A Expired - Fee Related JP4922755B2 (ja) | 2003-07-01 | 2004-02-12 | 圧電管を形成する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040118686A1 (ja) |
EP (2) | EP1976039B1 (ja) |
JP (1) | JP4922755B2 (ja) |
AT (1) | ATE488875T1 (ja) |
DE (2) | DE602004030173D1 (ja) |
WO (1) | WO2005004249A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118231A (ja) * | 2011-12-01 | 2013-06-13 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
KR101612381B1 (ko) | 2014-09-16 | 2016-04-14 | 국방과학연구소 | 마이크로 압전 유연와이어의 제조방법, 상기 마이크로 압전 유연와이어를 이용한 압전 에너지 하베스터 및 상기 압전 에너지 하베스터의 제조방법 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006022557A1 (en) * | 2004-08-24 | 2006-03-02 | Auckland Uniservices Limited | Optical fibre switch |
US20080097620A1 (en) | 2006-05-26 | 2008-04-24 | Nanyang Technological University | Implantable article, method of forming same and method for reducing thrombogenicity |
DE102006026481A1 (de) * | 2006-06-07 | 2007-12-13 | Siemens Ag | Verfahren zum Anordnen einer Pulverschicht auf einem Substrat sowie Schichtaufbau mit mindestens einer Pulverschicht auf einem Substrat |
US8206636B2 (en) | 2008-06-20 | 2012-06-26 | Amaranth Medical Pte. | Stent fabrication via tubular casting processes |
US8206635B2 (en) | 2008-06-20 | 2012-06-26 | Amaranth Medical Pte. | Stent fabrication via tubular casting processes |
US10898620B2 (en) | 2008-06-20 | 2021-01-26 | Razmodics Llc | Composite stent having multi-axial flexibility and method of manufacture thereof |
US8431037B2 (en) * | 2009-10-11 | 2013-04-30 | Indian Institute Of Technology Madras | Liquid composite dielectric material |
CN102263199B (zh) * | 2011-08-10 | 2013-07-31 | 边义祥 | 分布电极式含芯压电棒弹簧 |
DE102011116255B3 (de) * | 2011-10-18 | 2012-11-08 | Wdt-Wolz-Dental-Technik Gmbh | Verfahren und Vorrichtung zur elektrophoretischen Herstellung von flächigen Rohlingen aus einem Metall- oder Keramikschlicker |
CN103193482B (zh) * | 2013-03-11 | 2015-09-09 | 华中科技大学 | 一种锆钛酸铅厚膜及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01101155A (ja) * | 1987-10-14 | 1989-04-19 | Hitachi Metals Ltd | 液体噴射装置 |
JPH04202791A (ja) * | 1990-11-30 | 1992-07-23 | Ishikawajima Harima Heavy Ind Co Ltd | 電気泳動装置 |
JPH09300614A (ja) * | 1996-05-09 | 1997-11-25 | Minolta Co Ltd | 圧電アクチュエータおよびその製造方法 |
US6127283A (en) * | 1999-11-02 | 2000-10-03 | Cerel (Ceramic Technologies) Ltd. | Method of electrophoretic deposition of ferroelectric films using a trifunctional additive and compositions for effecting same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305825A (en) * | 1963-08-26 | 1967-02-21 | Mobil Oil Corp | Telemetering device and system for pumping wells |
US5108982A (en) * | 1988-12-22 | 1992-04-28 | General Atomics | Apparatus and method for manufacturing a ceramic superconductor coated metal fiber |
US5324177A (en) * | 1989-05-08 | 1994-06-28 | The Cleveland Clinic Foundation | Sealless rotodynamic pump with radially offset rotor |
US5147281A (en) * | 1990-04-23 | 1992-09-15 | Advanced Medical Systems, Inc. | Biological fluid pumping means and method |
US5472583A (en) * | 1992-09-24 | 1995-12-05 | W. R. Grace & Co.-Conn. | Manufacture of conical pore ceramics by electrophoretic deposition |
US5947892A (en) * | 1993-11-10 | 1999-09-07 | Micromed Technology, Inc. | Rotary blood pump |
US5761782A (en) * | 1994-08-29 | 1998-06-09 | Oceaneering International, Inc. | Method of fabrication of piezoelectric bender elements |
US5798600A (en) * | 1994-08-29 | 1998-08-25 | Oceaneering International, Inc. | Piezoelectric pumps |
JP3319223B2 (ja) | 1995-06-14 | 2002-08-26 | 富士電機株式会社 | 圧電素子およびその製造方法 |
US5840070A (en) * | 1996-02-20 | 1998-11-24 | Kriton Medical, Inc. | Sealless rotary blood pump |
US20020024270A1 (en) * | 1998-10-14 | 2002-02-28 | Sumsung Electro-Mechanics Co. | Piezoelectric/electrostrictive film element formed at low temperature using electrophoretic deposition |
US6349455B1 (en) * | 1998-10-14 | 2002-02-26 | Samsung Electro-Mechanics Co., Ltd. | Method for forming piezoelectric/electrostrictive film element at low temperature using electrophoretric deposition |
US6527520B2 (en) * | 1999-07-29 | 2003-03-04 | Jonathan B. Rosefsky | Ribbon drive pumping with centrifugal contaminant removal |
JP2001207988A (ja) * | 2000-01-26 | 2001-08-03 | Nipro Corp | 磁気駆動型軸流ポンプ |
CA2614620C (en) * | 2000-05-10 | 2010-02-02 | Alberta Research Council Inc. | Production of hollow ceramic membranes by electrophoretic deposition |
US6593681B2 (en) * | 2000-12-15 | 2003-07-15 | Matsushita Electric Industrial Co., Ltd. | Polarization apparatus and polarization method of coaxial flexible piezoelectric cable |
JP2002252391A (ja) * | 2001-02-22 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 同軸状可撓性圧電体チューブの分極装置 |
US6388364B1 (en) * | 2001-03-15 | 2002-05-14 | Optovation (Canada) Corp. | Piezoelectric rotator |
-
2003
- 2003-07-01 US US10/611,401 patent/US20040118686A1/en not_active Abandoned
-
2004
- 2004-02-12 WO PCT/SG2004/000038 patent/WO2005004249A1/en active Application Filing
- 2004-02-12 DE DE602004030173T patent/DE602004030173D1/de not_active Expired - Lifetime
- 2004-02-12 DE DE602004022049T patent/DE602004022049D1/de not_active Expired - Lifetime
- 2004-02-12 AT AT08104575T patent/ATE488875T1/de not_active IP Right Cessation
- 2004-02-12 EP EP08104575A patent/EP1976039B1/en not_active Expired - Lifetime
- 2004-02-12 EP EP04710575A patent/EP1639657B1/en not_active Expired - Lifetime
- 2004-02-12 JP JP2006518599A patent/JP4922755B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01101155A (ja) * | 1987-10-14 | 1989-04-19 | Hitachi Metals Ltd | 液体噴射装置 |
JPH04202791A (ja) * | 1990-11-30 | 1992-07-23 | Ishikawajima Harima Heavy Ind Co Ltd | 電気泳動装置 |
JPH09300614A (ja) * | 1996-05-09 | 1997-11-25 | Minolta Co Ltd | 圧電アクチュエータおよびその製造方法 |
US6127283A (en) * | 1999-11-02 | 2000-10-03 | Cerel (Ceramic Technologies) Ltd. | Method of electrophoretic deposition of ferroelectric films using a trifunctional additive and compositions for effecting same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118231A (ja) * | 2011-12-01 | 2013-06-13 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
KR101612381B1 (ko) | 2014-09-16 | 2016-04-14 | 국방과학연구소 | 마이크로 압전 유연와이어의 제조방법, 상기 마이크로 압전 유연와이어를 이용한 압전 에너지 하베스터 및 상기 압전 에너지 하베스터의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
EP1976039A3 (en) | 2009-01-14 |
WO2005004249A1 (en) | 2005-01-13 |
DE602004022049D1 (de) | 2009-08-27 |
EP1639657B1 (en) | 2009-07-15 |
JP4922755B2 (ja) | 2012-04-25 |
ATE488875T1 (de) | 2010-12-15 |
EP1976039A2 (en) | 2008-10-01 |
EP1976039B1 (en) | 2010-11-17 |
US20040118686A1 (en) | 2004-06-24 |
EP1639657A1 (en) | 2006-03-29 |
DE602004030173D1 (de) | 2010-12-30 |
EP1639657A4 (en) | 2006-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4922755B2 (ja) | 圧電管を形成する方法 | |
Wilson et al. | New materials for micro-scale sensors and actuators: An engineering review | |
Limmer et al. | Sol–gel electrophoretic deposition for the growth of oxide nanorods | |
Chen et al. | Dielectric, ferroelectric, and piezoelectric properties of lead zirconate titanate thick films on silicon substrates | |
Uršič et al. | Investigations of ferroelectric polycrystalline bulks and thick films using piezoresponse force microscopy | |
Kalinin et al. | A decade of piezoresponse force microscopy: progress, challenges, and opportunities | |
Gruverman et al. | Nanoscale ferroelectrics: processing, characterization and future trends | |
Xu et al. | Fabrication and mechanical property of nano piezoelectric fibres | |
US20130149500A1 (en) | Soft-template infiltration manufacturing of nanomaterials | |
Hoshyarmanesh et al. | PZT/PZT and PZT/BiT composite piezo-sensors in aerospace SHM applications: photochemical metal organic+ infiltration deposition and characterization | |
Wang et al. | Fabrication and characterisation of substrate-free PZT thick films | |
Kuscer et al. | Lead–Zirconate–Titanate Thick Films by Electrophoretic Deposition for High‐Frequency Ultrasound Transducers | |
Liu et al. | Preparation and properties of 3–1 type PZT ceramics by a self-organization method | |
Goel | Recent developments in electroceramics: MEMS applications for energy and environment | |
Lee et al. | Macroscopic and local approaches of phase transition in sol–gel synthesized (Bi 0.5 Na 0.5) TiO 3–SrTiO 3 thin films | |
Mahajan et al. | Unleashing the full sustainable potential of thick films of lead-free potassium sodium niobate (K0. 5Na0. 5NbO3) by aqueous electrophoretic deposition | |
Wang et al. | Large-scale fabrication of titanium-rich perovskite PZT submicro/nano wires and their electromechanical properties | |
Safari et al. | Ferroelectric ceramics and composites for piezoelectric transducer applications | |
Wang et al. | Electrohydrodynamic atomization deposition and mechanical polishing of PZT thick films | |
Choi et al. | Template-directed formation of functional complex metal-oxide nanostructures by combination of sol–gel processing and spin coating | |
Chen et al. | Electrophoretic deposition and characterization of helical piezoelectric actuator | |
JP2004304193A (ja) | 機能素子、機能素子を用いた装置、および機能素子の製造方法 | |
Yoo et al. | Near-net ceramic micro-tubes fabricated by electrophoretic deposition process | |
Chen et al. | Investigation on the electrophoretic deposition of a FGM piezoelectric monomorph actuator | |
Torah | Optimisation of the piezoelectric properties of thick-film piezoceramic devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100209 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100510 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100517 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100609 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100616 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100709 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100716 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20100809 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20101124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110324 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110325 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20110524 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110920 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120110 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120206 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4922755 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150210 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |