JP2007527112A - 直接的なダイの取付けのための金属相互接続システムおよび方法 - Google Patents

直接的なダイの取付けのための金属相互接続システムおよび方法 Download PDF

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JP2007527112A
JP2007527112A JP2006544148A JP2006544148A JP2007527112A JP 2007527112 A JP2007527112 A JP 2007527112A JP 2006544148 A JP2006544148 A JP 2006544148A JP 2006544148 A JP2006544148 A JP 2006544148A JP 2007527112 A JP2007527112 A JP 2007527112A
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アンダーソン，サミュエル，エス
シェン，ツェン
オカダ，デイビッド，エヌ
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グレート ウォール セミコンダクター コーポレイション
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2006544148A 2003-12-12 2004-12-11 直接的なダイの取付けのための金属相互接続システムおよび方法 Pending JP2007527112A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52916603P 2003-12-12 2003-12-12
US54470204P 2004-02-12 2004-02-12
PCT/US2004/044097 WO2005062998A2 (en) 2003-12-12 2004-12-11 Metal interconnect system and method for direct die attachment

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JP2007527112A true JP2007527112A (ja) 2007-09-20
JP2007527112A5 JP2007527112A5 (enExample) 2007-11-08

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US20080296690A1 (en) 2008-12-04
WO2005059957A2 (en) 2005-06-30

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