JP2007335712A - Electronic component module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize an electronic component module which can spread a conductive adhesive all over a junction region without flowing to a mounting region on a substrate, and is thereby excellent in junction strength between the substrate and a metallic member. <P>SOLUTION: A side surface electrode 6 is formed in a side wall 1a of a substrate 1 of a ceramic multilayer substrate or the like from an upper end to a lower end in a thickness direction of the side wall 1a. The metallic member 3 has a click 5 which is joined to the side surface electrode 6 via the conductive adhesive, and a U-shaped cut-out portion 5a is formed from a lower end to an upper side in the click 5. The deepest part 5b of the cut-out portion 5a is formed below by a fine distance T, concretely at the region lower by 150 μm from a position corresponding to an upper end 1b of the substrate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component module, and more particularly to an electronic component module in which various electronic components are mounted on the surface of a substrate such as a ceramic multilayer substrate, and the mounting region of the electronic component is protected by a metal member.

  An electronic component module in which various electronic components are mounted on a substrate surface such as a ceramic multilayer substrate is mounted on a circuit board using a suction jig such as a suction nozzle. In the conventional electronic component module, a metal member is attached to the substrate in order to secure the suction portion of the suction jig and protect the electronic component.

  The metal member generally has a planar top plate portion and a claw portion suspended from the end surface of the top plate portion, and the metal member is soldered to the substrate. Attached to the board. In addition, the position where the claw part and the board are joined was previously provided around the mounting area on the board. However, due to the recent downsizing of electronic components and the expansion of the mounting area, etc. A method is widely adopted in which electrodes are provided on the side walls of the substrate and the claws are soldered and joined to the side electrodes.

  This type of prior art is related to an oscillator. An earth electrode is formed only on two opposite side surfaces of a substrate, and an oscillation circuit mounted on the substrate is covered with a shielding case and shielded. A case in which a case and a ground electrode are soldered via a joint portion of the shielding case and electrically connected is known (Patent Document 1).

  When Patent Document 1 is applied to the metal member described above, as shown in FIG. 10, the claw portion 103 (joint portion) is soldered to the side electrode 102 (ground electrode) formed on the side wall of the substrate 101 and is made of metal. The member 104 is bonded to the substrate 101. When the configuration as shown in FIG. 9 is adopted, the electronic component mounted on the substrate 101 is protected by the metal member 104 and a suction portion for the suction jig can be secured.

  In addition, as shown in FIG. 11, the bonding structure of the mounting member to the substrate is formed by forming the soldering electrode 108 on the upper surface of the substrate adjacent to the side electrode 107 of the substrate 106, while the metal member 109 serving as the mounting member. There has already been proposed a technique in which a notch (slit) 110a is formed in the claw 110 and the deepest part 110b of the notch 110a is positioned above the upper surface of the soldering electrode 108 (patent). Reference 2).

  When the configuration as shown in FIG. 11 is adopted, the soldering electrode 108 and the metal member 109 are soldered from the inside by pouring solder between the deepest portion 110b of the notch 110a and the soldering electrode 108. This makes it possible to improve the bonding strength.

JP-A-4-328903 Japanese Patent No. 3221130

  10 and 11, the claw portions 103 and 110 are bonded to the substrates 101 and 106 by using the metal members 104 and 109 facing down and the claw portions 103 and 110 of the metal members 104 and 109. In general, the substrates 101 and 106 are fitted in the solder paste, solder paste is supplied to the vicinity of the claws 103 and 110 via a solder supply means such as a dispenser or a syringe, and heat treatment is performed in a reflow furnace.

  However, when a structure as shown in FIG. 10 is adopted, the side electrode 102 extends from the upper end to the lower end in the thickness direction of the substrate 101 in order to ensure a sufficient bonding area between the side electrode 102 and the claw portion 103. Although formed, since the claw portion 103 is a simple plate, the solder is mainly supplied from the distal end portion of the claw portion 103, and the base end portion of the claw portion 103 (indicated by x in the figure). Can hardly be supplied with solder. For this reason, even if the reflow process is performed, the claw portion 103 and the side electrode 102 are not joined at the base end portion, and therefore the joining area is small and the joining strength is weak, so that the claw portion 103 and the side electrode 102 are easily detached. There is a risk that.

  In addition, as shown in FIG. 12, even if the concave notch 103a is formed at the tip of the claw 103 and the solder is supplied to the base end portion, the solder paste can reach the base end portion. It is difficult to spread evenly, and a joint portion that must be filled with solder, that is, a cavity is formed between the claw portion 103 and the side electrode 102, resulting in a decrease in joint strength. There is a possibility that the metal member 104 may be easily detached from the substrate 101 at the time of mounting on a circuit board.

  On the other hand, when the structure as shown in FIG. 11 is adopted, since the deepest portion 110b of the notch 110a of the claw portion 110 is located above the soldering electrode 113, the metal member 109 and the substrate 106 Can be firmly bonded via the soldering electrode 108, but the solder paste melted during the reflow process enters the surface of the substrate 106, so that the solder may flow into the mounting region and cause a problem such as a short circuit. There is.

  Further, even when the claw portion 110 is soldered only to the side electrode 107 without providing the soldering electrode 108, the solder paste easily enters the surface of the substrate 106 from the vicinity of the deepest portion 110b of the notch portion 110a, Therefore, similarly to the above, the solder paste melted at the time of reflow may flow into the mounting region and cause a problem such as a short circuit.

  In particular, since the mounting area has expanded with the recent reduction in size and density of electronic component modules, it is necessary to avoid the solder paste from flowing into the substrate surface from the viewpoint of ensuring reliability.

  The present invention has been made in view of such circumstances, and the conductive bonding agent such as solder can be spread throughout the bonding region without flowing into the mounting region, and thereby the substrate, the metal member, and the like. An object of the present invention is to provide an electronic component module having excellent bonding strength.

  In order to achieve the above object, an electronic component module according to the present invention has an electronic component mounted on the surface of the substrate and a metal member attached to the substrate to protect the mounting region of the electronic component. In the module, a side electrode is formed on the side wall of the substrate from the upper end to the lower end in the thickness direction of the side wall, and the metal member has a claw portion to be bonded to the side electrode via a conductive bonding agent. And the claw portion has a notch formed from the lower end to the upper side, and the deepest portion of the notch is lower than the position corresponding to the upper end of the substrate by a minute distance. Yes.

  In the electronic component module of the present invention, the minute distance is 150 μm or less.

  Furthermore, in the electronic component module of the present invention, a back electrode electrically connected to the side electrode is formed on the back side of the substrate, and the width dimension of the side electrode is equal to the width dimension of the back electrode. , Or equivalent or less.

  According to the electronic component module of the present invention, the side electrode is formed on the side wall of the substrate from the upper end to the lower end in the thickness direction of the side wall, and the metal member is attached to the side electrode via the conductive bonding agent. The claw portion has a claw portion to be joined, and the claw portion has a cutout portion formed from the lower end to the upper side, and the deepest portion of the cutout portion is a minute distance (specifically, a position corresponding to the upper end of the substrate. Therefore, the conductive bonding agent can be spread evenly from the notch to the gap between the side electrode and the claw portion. In addition, the formation of the notch reduces the bonding area between the claw and the side electrode, but a fillet can be formed between the side electrode and the edge of the notch, thereby increasing the bonding strength. Can be secured.

  Furthermore, since the deepest part of the notch is a minute distance below the position corresponding to the upper end of the substrate, the conductive bonding agent can be prevented from flowing into the substrate surface side, and is in electrical contact with the mounting component. Therefore, it is possible to avoid the occurrence of defects such as a short circuit, thereby ensuring connection reliability and improving the product yield.

  Furthermore, in the electronic component module of the present invention, a back electrode electrically connected to the side electrode is formed on the back side of the substrate, and the width dimension of the side electrode is equal to the width dimension of the back electrode. Alternatively, the width dimension of the side electrode can be reduced, and an electronic component module suitable for downsizing and high density can be obtained.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view schematically showing an electronic component module according to the present invention, and FIG. 2 is a side view thereof.

  1 and 2, in this electronic component module, a large number of electronic components 2a, 2b,... Such as semiconductor elements and chip-type electronic components are mounted on the surface of a substrate 1 such as a ceramic multilayer substrate or a printed substrate. A metal member 3 is attached to the substrate 1, thereby protecting the mounting area of the electronic components 2 a, 2 b,.

  Specifically, the metal member 3 shields the mounting region from the top plate portion 4 formed in a planar shape, the pair of claw portions 5 suspended from the edge of the top plate portion 4 in an opposing manner. And a U-shaped shielding portion 30 in plan view. The shielding part 30 is formed on the opposite side surface where the claw part 5 is not formed to shield the mounting area, and the claw part 5 is formed with a notch part 5a.

  And the side surface electrode 6 is formed in the side wall part 1a of the board | substrate 1, and the nail | claw part 5 and the side surface electrode 6 are joined via the solder as a conductive bonding agent.

  FIG. 3 is an enlarged view of a portion A in FIG.

  Specifically, the side electrode 6 is formed with a predetermined width D from the upper end to the lower end of the side wall portion 1a so as to be substantially opposed to the claw portion 5 as indicated by oblique lines.

  Further, the notch portion 5a of the claw portion 5 is formed in a substantially U shape from the lower end of the claw portion 5 to the upper side, and the deepest portion 5b of the notch portion 5a is more than the position corresponding to the upper end 1b of the substrate 1. It is formed so as to be downward by a minute distance T.

  Here, the minute distance T is such a distance that the solder can spread uniformly in the gap between the claw part 5 and the side electrode 6 and the solder does not enter the substrate surface from the deepest part 5b of the notch part 5a. Specifically, it is preferably 150 μm or less.

  The width D of the side electrode 6 is not particularly limited, but is preferably 0.6 mm or less in order to prevent the solder from excessively spreading. That is, a back electrode is formed on the back surface of the substrate 1 so as to ensure electrical connection with the circuit board as will be described later, and the side electrode 6 is electrically connected to the back electrode. However, in order to realize the miniaturization and high density of today's substrates, it is necessary to shorten the distance between the back electrodes and to narrow the width of the back electrodes themselves. For this reason, the width D of the side electrode 6 is preferably as narrow as possible as long as a desired bonding strength can be ensured, specifically 0.6 mm or less.

  As described above, in this embodiment, the claw portion 5 is formed with the substantially U-shaped cutout portion 5a, and the deepest portion 5b of the cutout portion 5a is a minute distance T from the position corresponding to the upper end 1b of the substrate 1. Since it is formed so as to be lower, the solder can be spread evenly from the edge portion of the notch 5a to the gap between the side electrode 6 and the claw 5, that is, the junction region. Further, the formation of the notch 5a reduces the bonding area between the claw 5 and the side electrode 6, but a solder fillet is formed between the side electrode 6 and the edge 5c of the notch 5a. Therefore, sufficient bonding strength can be ensured.

  Furthermore, since the deepest part 5b of the notch part 5 is below the position corresponding to the upper end 1b of the substrate 1 by a minute distance T, it is possible to prevent the solder from flowing into the surface of the substrate 1, that is, the mounting region. Thus, it is possible to prevent the occurrence of defects such as a short circuit as much as possible, to ensure connection reliability, and to improve the product yield.

  A plurality of electronic component modules are usually obtained from one substrate body by cutting a large substrate body into a matrix.

  FIG. 4 is a process diagram showing a method for manufacturing the electronic component module.

  First, a predetermined wiring pattern is solder-printed on the surface of the large-sized substrate body 7 using a metal mask or the like, and then a mounter is used, as shown in FIG. Are mounted on the substrate 1, and then a heat treatment is performed using a reflow furnace to mount the electronic components 2a, 2b,.

  A conductive via (not shown) is previously formed in the substrate body 7 in the vertical direction, and the substrate body is cut so that the conductive via is divided into two to form a side electrode, and a component member of the electronic component module A substrate 1 (child substrate) is obtained. In the figure, a two-dot chain line indicates a cutting line.

  Then, the metal member 3 described above is prepared. Then, as shown in FIG. 4 (b), the metal member 3 is arranged so that the claw portion 5 is positioned above, and the substrate 1 is arranged so that the electronic components 2a, 2b,. The substrate 1 is fitted into the claw portion 5.

  Next, as shown in FIG. 4C, the solder 9 is supplied from the notch 5a to the gap between the claw part 5 and the side electrode 6 using the solder supply means 8 such as a syringe, and the solder 9 is inserted into the gap. Fill.

  Next, as shown in FIG. 4D, heat treatment is performed in a reflow furnace to melt the solder 9 to join the claw portion 5 and the side electrode 6, whereby an electronic component as shown in FIG. Modules are manufactured.

  As described above, in the present embodiment, the notch 5a is formed so that the deepest portion 5b is below the upper end 1 of the substrate 1 by a minute distance T. Therefore, the solder 9 does not flow into the substrate surface and the side electrode The metal member 3 and the side electrode 6 are firmly bonded to each other. And since the solder 9 does not flow on the board | substrate 1, it can avoid that a short circuit etc. generate | occur | produce between the electronic components 2a, 2b, ... mounted on the board | substrate 1, and the metal members 3. FIG. Moreover, although the characteristic selection is performed by pressing from above with a pressure jig during product characteristic inspection, since the bonding between the metal member 3 and the side electrode 6 is strong, the pressure jig is used from above. The metal member 3 is not detached from the substrate 1 even when pressed.

  Furthermore, even if the width D of the side electrode is narrow, the bonding strength between the metal member 3 and the side electrode 6 is high, so that the metal member 3 can be prevented from coming off the substrate 1.

  In recent years, it has been required to further reduce the width of the side electrode by downsizing and increasing the density of the electronic component module, and the present invention provides a substrate for such an electronic component module having a narrow side electrode, particularly a ceramic multilayer. Useful for substrates.

  That is, in a ceramic multilayer substrate with built-in internal conductors such as capacitor electrodes and coil conductors, via holes are formed on the ceramic green sheet, while conductive paste is applied and printed on the ceramic green sheet, and then laminated. Then, a large-sized substrate main body is manufactured by performing a firing process, and the substrate main body is cut as described above to obtain a ceramic multilayer substrate as a sub-substrate.

  FIG. 6 is a bottom view of this type of substrate body. The substrate body 10 has a conductive via 11 filled with a conductive material at the boundary between the child substrate 10a and the child substrate 10b. It is formed in the vertical direction with respect to the back surface. Further, a back electrode 12 is formed on the back surface of the substrate body 10 so as to be electrically connected to the conductive via 11. Note that the back electrode 12 and the conductive via 11 electrically connected to the back electrode 12 are both electrically connected to the ground potential of the circuit board when mounted on the circuit board.

  As described above, the back electrode 12 and the conductive via 11 are formed so as to overlap with each other, and by cutting the substrate body 10 along the cutting line 13, as shown in FIG. A multilayer substrate is obtained. As a result, the back electrode 12 is divided into the back electrode 12a and the back electrode 12b, and the conductive via 11 is also divided into the side electrodes 11a and 11b.

  In order to reduce the size and increase the density of the ceramic multilayer substrate, as described above, it is necessary to reduce the width d2 of the back surface electrode 12 and the space between the back surface electrodes 12, and thus the side surface. It is also necessary to reduce the electrode width d1.

  When the back electrode 12 is formed simultaneously with the side electrodes 11a and 11b, that is, when the back electrode 12 is formed simultaneously with the conductive via 11, the width d1 of the side electrodes 11a and 11b (conductive via 11) is the width of the back electrode 12. It is formed in the same dimension as d2.

  Further, after the conductive via 11 is formed to stabilize the shape of the back electrode 12, when the back electrode 12 is further formed, the back electrode 12 is configured to hide the shape of the side electrodes 11a and 11b (conductive via 11). Therefore, the width d1 of the side electrodes 11a and 11b is formed narrower than the width d2 of the back electrode 12.

  However, in the present embodiment, since the claw portion 5 and the side electrode 6 are firmly joined as described above, a sufficient joint strength can be obtained even if the width d1 of the side electrodes 11a and 11b is narrow. Therefore, the present invention is particularly useful for an electronic component module that is required to be reduced in size and increased in density so that the width d1 of the side electrodes 11a and 11b must be reduced.

  FIG. 8 is an internal structure diagram showing an embodiment of an electronic component module manufactured in this way.

  That is, in this electronic module, the internal conductor 15 is built in the ceramic multilayer substrate 16, and the internal conductors 15 of the ceramic layer are electrically connected to each other through the via hole 17, or the via hole 17 is exposed from the ceramic multilayer substrate 16. is doing. Various electronic components 19a to 19e such as chip-type electronic components and semiconductor elements are mounted on the front surface side of the ceramic multilayer substrate 16, and a cavity 20 is formed on the back surface side of the ceramic multilayer substrate 16. In the cavity 20, electronic components 19f and 19g such as an IC are accommodated. These electronic components 19f and 19g are electrically connected to the internal conductors and via holes exposed on the surface of the cavity 20 by wire bonding.

  Then, the claw portion 21a of the metal member 21 is joined to the side electrode 22 via solder, and the side electrode 22 is mounted on a circuit board (not shown) via the back electrode 23 and is electrically connected to the ground potential. It is connected to the.

  Thus, in this Embodiment, since the nail | claw part 21a and the side electrode 22 of the metal members 21 are joined firmly, even if the width of the side electrode 22 is narrow, sufficient joint strength can be obtained, Therefore, the present invention is particularly useful for an electronic component module that requires a reduction in size and density and requires a reduction in the width of the side electrode 22.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the deepest part 5b is formed in a straight line so that the notch part 5a in the claw part 5 is substantially U-shaped (see FIG. 3). However, as shown in FIG. The deepest portion 5c may be formed in an R shape so that the portion 5a is substantially U-shaped.

  Also, the method for applying the solder 9 is not particularly limited. For example, a method for applying the solder to the side electrode or the nail part from the lateral direction or the vertical direction, a method for supplying the solder from above through a metal mask, etc. Any of these may be adopted.

  Furthermore, in the above embodiment, the heat treatment is performed in the reflow furnace to melt the solder. However, hot air may be blown into the solder application region to melt the solder.

It is a perspective view which shows one Embodiment of the electronic component module which concerns on this invention. It is a side view of the said electronic component module. It is the A section enlarged view of FIG. It is process drawing which shows the outline of the manufacturing process of the said electronic component module. It is a BB arrow line view of Drawing 4 (d). It is a bottom view of a large format substrate. It is a bottom view which shows the state which cut | disconnected the large format board | substrate. It is an internal structure figure which shows one Embodiment of the electronic component module of this invention. It is a principal part enlarged view which shows other embodiment of the electronic component module which concerns on this invention. It is a principal part enlarged view which shows an example of the conventional electronic component module. It is a principal part enlarged view which shows the other example of the conventional electronic component module. It is a principal part enlarged view which shows the modification of the prior art example of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Board | substrate upper end 2a, 2b Electronic component 3 Metal member 5 Claw part 5a Notch part 5b Deepest part 5c Deepest part 6 Side electrode 9 Solder (conductive adhesive)
10a, 10b Ceramic multilayer substrate (substrate)
11a, 11b Side electrode 12, 12a, 12b Back electrode 16 Ceramic multilayer substrate (substrate)
19a to 19g Electronic component 21 Metal member 21a Claw portion 22 Side electrode 23 Back electrode

Claims (3)

In the electronic component module in which the electronic component is mounted on the surface of the substrate, and a metal member is attached to the substrate to protect the mounting region of the electronic component.
A side electrode is formed on the side wall of the substrate from the upper end to the lower end in the thickness direction of the side wall,
The metal member has a claw portion that is bonded to the side electrode via a conductive bonding agent,
In addition, the claw portion is formed with a notch portion from the lower end to the upper portion, and the deepest portion of the notch portion is lower than the position corresponding to the upper end of the substrate by a minute distance. module.   The electronic component module according to claim 1, wherein the minute distance is 150 μm or less.   A back electrode electrically connected to the side electrode is formed on the back side of the substrate, and a width dimension of the side electrode is equal to or less than a width dimension of the back electrode. The electronic component module according to claim 1 or 2.

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