JP2002016162A - Electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent decline of reliability and mass productivity due to excessive solder in an electronic component module used for a portable telephone and a GPS receiver, etc. SOLUTION: A side electrode 5 is formed on the end of a substrate 2, an electronic component is mounted on the surface of the substrate 2 and a metal case 6 is mounted on the surface of the substrate 2 to cover the electronic component. The pawl 6a of the case 6 is engaged with the side electrode 5 of the substrate 2 and the pawl 6a of the case 6 is soldered to the side electrode 5 of the substrate 2 by reflow soldering. In this case, a round hole 6b for communicating the inside and outside of the case 6 is formed at the pawl 6a of the case 6. Thus, since the visual inspection of solder can be executed from the side face of the case 6 through the round hole 6b, a prescribed solder strength is obtained. Also, since excessive solder is sucked up through the round hole 6b to the surface of the case 6 even when more than the stipulated amount of the solder is present, a small bump is not generated on the back surface of the substrate 2 and coplanarity is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a mobile phone and a GPS.
The present invention relates to an electronic component module used for a receiver or the like.

[0002]

2. Description of the Related Art Conventionally, when manufacturing an electronic component module of this type, a side electrode is formed on an end surface of a substrate, and solder paste is printed on the back surface of the substrate. Components (for example, resistors, inductors, transistors, ICs, etc.) are mounted, a metal case is mounted on the surface of the substrate so as to cover these electronic components, and claws of the case are engaged with side electrodes of the substrate, The claws of the case were soldered to the side electrodes of the substrate by reflow soldering.

[0003]

However, this has the following disadvantages.

That is, especially when the size of the electronic component module is small, it is difficult to adjust the amount of solder at the time of reflow soldering due to excessive or insufficient amount of solder paste printed. This reduces the reliability of the module and impairs its mass productivity. This usually tends to supply a larger amount of solder than the specified amount so that the soldering strength is not insufficient, but then the excess solder gathers on the back surface of the board to form small bumps, This is because coplanarity (coplanarity) deteriorates.

In view of such circumstances, the present invention is to improve reliability and mass productivity by preventing the occurrence of small bumps on the back surface of a substrate and improving coplanarity even if the amount of solder is large. It is an object of the present invention to provide an electronic component module capable of performing the following.

[0006]

That is, according to the present invention, a side electrode (5) is formed on an end face of a substrate (2), an electronic component is mounted on the surface of the substrate, and a metal plate is formed so as to cover the electronic component. The case (6) is mounted on the surface of the substrate, and the claws (6a) of the case are engaged with the side electrodes of the substrate,
In the electronic component module (1) in which the claws of the case are soldered to the side electrodes of the substrate by reflow soldering, solder escape paths (6b, 6d, 6e) communicating inside and outside of the case are formed in the claws of the case. It is composed. Here, a round hole, a U-shaped groove, or a V-shaped groove can be given as a solder escape route.

By adopting such a configuration, it is possible to carry out a solder appearance inspection from the side of the case through a solder escape path, and at the same time, when the amount of solder is larger than a prescribed amount, excess solder passes through the solder escape path and passes through the case. It works so that it can be sucked up to the surface.

[0008] The present invention also provides a solder escape path (6b,
6d, 6e), the burring is provided so as to protrude toward the inside of the case. Such a structure acts to increase the soldering strength.

The present invention further comprises a stopper (6c) formed on the claw (6a) of the case (6). With this configuration, the case acts so as to be positioned at a predetermined height with respect to the substrate.

It should be noted that reference numerals in parentheses are for convenience showing corresponding elements in the drawings, and therefore, the present invention is not limited to the description on the drawings. The same applies to the column of “Claims”.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a view showing an embodiment of an electronic component module according to the present invention, wherein FIG.
(B) is a perspective view seen from the back, and FIG. 2 is a front view showing a main part of another embodiment of the electronic component module according to the present invention.

As shown in FIG. 1, this electronic component module 1 has a substrate 2, and soldering pads 3 are formed on the back surface of the substrate 2. A side electrode 5 is formed on an end surface of the substrate 2, and various electronic components (not shown) such as a resistor, an inductor, a transistor, and an IC are mounted on the surface of the substrate 2. Further, a metal case 6 is mounted on the surface of the substrate 2 so as to cover these electronic components.
a. Each of the claws 6 a is soldered to the side electrode 5 of the substrate 2, and all the claws 6 a are formed with round holes 6 b as solder escape paths communicating with the inside and the outside of the case 6. Individual nail 6
a is formed with a pair of stoppers 6c.

By the way, the following procedure is used for manufacturing the electronic component module 1.

First, the substrate 2 is manufactured. To this end, a side electrode 5 is formed on the end surface of the substrate 2 and solder paste printing (screen printing) is performed on the back surface of the substrate 2 using a metal mask.

Next, various electronic components are mounted on the surface of the substrate 2 with the substrate 2 turned upside down, and a case 6 is mounted on the surface of the substrate 2 so as to cover these electronic components. At this time, the stopper 6c of the case 6 is brought into contact with the surface of the substrate 2. Then, the case 6 is positioned at a predetermined height with respect to the substrate 2.

Then, the claws 6a of the case 6 are engaged with the side electrodes 5 of the substrate 2, and the claws 6a of the case 6 are soldered to the side electrodes 5 of the substrate 2 by reflow soldering. At this time, as described above, in addition to the case 6 being positioned at a predetermined height with respect to the substrate 2, the appearance of the solder can be inspected through the round hole 6b from the side surface of the case 6, so that the amount of solder is reduced. Thus, a predetermined soldering strength can be maintained. Further, when the amount of solder is larger than the specified amount, excess solder is sucked up to the surface of the case 6 through the round hole 6b, so that the occurrence of small bumps on the back surface of the substrate 2 can be prevented, and coplanarity can be improved. Become. As a result, the reliability of the electronic component module 1 is improved, and its mass productivity is improved.

In the above-described embodiment, a case has been described in which the claw 6a of the case 6 is formed with the round hole 6b as a solder escape route. However, various shapes of the solder escape route are conceivable. For example, as shown in FIG. 2A, the U-shaped groove 6d may be used as a solder escape route, and as shown in FIG. 2B, the V-shaped groove 6e may be used as a solder escape route. Absent. In addition, these round holes 6
b, burring in U-shaped groove 6d and V-shaped groove 6e (not shown)
Can be projected toward the inside of the case 6.
In this case, since the soldering strength is further increased, the reliability of the electronic component module 1 is further improved.

[0019]

As described above, according to the present invention, the side electrode 5 is formed on the end face of the substrate 2, the electronic component is mounted on the surface of the substrate 2, and the metal component is formed so as to cover the electronic component. The case 6 is mounted on the surface of the substrate 2 and the case 6
In the electronic component module 1 in which the claws 6a of the case 6 are engaged with the side electrodes 5 of the substrate 2 and the claws 6a of the case 6 are soldered to the side electrodes 5 of the substrate 2 by reflow soldering. Since the communicating solder escape paths (circular holes 6b, U-shaped grooves 6d, V-shaped grooves 6e, etc.) are formed in the claws 6a of the case 6, the case 6
Since the appearance of the solder can be inspected from the side surface through the solder escape path, a predetermined soldering strength can be obtained, and at the same time, when the amount of solder is larger than a specified amount, excess solder is sucked up to the surface of the case 6 through the solder escape path. Therefore, even if the amount of solder is large, the reliability and mass productivity of the electronic component module 1 can be ensured by preventing the occurrence of small bumps on the back surface of the substrate 2 and improving coplanarity.

Further, according to the present invention, since the burring is formed so as to protrude toward the inside of the case 6 on the solder escape path, the reliability of the electronic component module 1 is further improved by the increased soldering strength. .

Further, according to the present invention, since the stopper 6c is formed on the claw 6a of the case 6, the case 6 is positioned at a predetermined height with respect to the substrate 2, and a predetermined soldering strength is obtained. As a result, the reliability of the electronic component module 1 is further improved.

[Brief description of the drawings]

FIGS. 1A and 1B are views showing an embodiment of an electronic component module according to the present invention, wherein FIG. 1A is a front view thereof, and FIG.

FIG. 2 is a front view showing a main part of another embodiment of the electronic component module according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component module 2 ... Substrate 5 ... Side electrode 6 ... Case 6a ... Claw 6b ... Round hole (solder escape route) 6c ... Stopper 6d ... U-shaped groove (solder escape route) 6e ... V Ditch (Solder escape route)

Claims (4)

[Claims] 1. A side electrode (5) is formed on an end surface of a substrate (2), an electronic component is mounted on the surface of the substrate, and a metal case (6) is formed on the substrate so as to cover the electronic component. The electronic component module (1), which is mounted on a surface, engages the claws (6a) of the case with the side electrodes of the substrate, and solders the claws of the case to the side electrodes of the substrate by reflow soldering. A solder escape route connecting the inside and outside of the case (6b, 6
An electronic component module, wherein d and 6e) are formed on nails of the case. 2. The electronic component module according to claim 1, wherein the solder escape path is a round hole (6b), a U-shaped groove (6d) or a V-shaped groove (6e). 3. The electronic component module according to claim 1, wherein burring is protruded toward the inside of the case at the solder escape path (6b, 6d, 6e). 4. The electronic component module according to claim 1, wherein a stopper (6c) is formed on the claw (6a) of the case (6).