JP2007333672A5 - - Google Patents

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Publication number
JP2007333672A5
JP2007333672A5 JP2006168597A JP2006168597A JP2007333672A5 JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5 JP 2006168597 A JP2006168597 A JP 2006168597A JP 2006168597 A JP2006168597 A JP 2006168597A JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5
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JP
Japan
Prior art keywords
wafer
imaging
illumination
imaging means
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006168597A
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English (en)
Japanese (ja)
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JP2007333672A (ja
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Publication date
Application filed filed Critical
Priority to JP2006168597A priority Critical patent/JP2007333672A/ja
Priority claimed from JP2006168597A external-priority patent/JP2007333672A/ja
Publication of JP2007333672A publication Critical patent/JP2007333672A/ja
Publication of JP2007333672A5 publication Critical patent/JP2007333672A5/ja
Withdrawn legal-status Critical Current

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JP2006168597A 2006-06-19 2006-06-19 外観検査装置および外観検査方法 Withdrawn JP2007333672A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006168597A JP2007333672A (ja) 2006-06-19 2006-06-19 外観検査装置および外観検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006168597A JP2007333672A (ja) 2006-06-19 2006-06-19 外観検査装置および外観検査方法

Publications (2)

Publication Number Publication Date
JP2007333672A JP2007333672A (ja) 2007-12-27
JP2007333672A5 true JP2007333672A5 (https=) 2009-08-06

Family

ID=38933275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006168597A Withdrawn JP2007333672A (ja) 2006-06-19 2006-06-19 外観検査装置および外観検査方法

Country Status (1)

Country Link
JP (1) JP2007333672A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049878B2 (en) * 2008-08-22 2011-11-01 Corning Incorporated Systems and methods for detecting defects in ceramic filter bodies
JP5552779B2 (ja) * 2009-09-04 2014-07-16 セイコーエプソン株式会社 孔内検査方法
JP5664167B2 (ja) * 2010-11-22 2015-02-04 セイコーエプソン株式会社 検査装置
JP6132322B1 (ja) * 2015-12-10 2017-05-24 上野精機株式会社 外観検査装置
JP7798607B2 (ja) * 2022-03-03 2026-01-14 株式会社デンソー 半導体素子の画像検査方法と半導体素子の製造方法
JP7839076B2 (ja) * 2022-11-10 2026-04-01 株式会社デンソー 半導体素子の画像検査
CN120380328A (zh) * 2022-12-23 2025-07-25 大金工业株式会社 拍摄装置以及拍摄方法

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