JP2007333672A5 - - Google Patents

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Publication number
JP2007333672A5
JP2007333672A5 JP2006168597A JP2006168597A JP2007333672A5 JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5 JP 2006168597 A JP2006168597 A JP 2006168597A JP 2006168597 A JP2006168597 A JP 2006168597A JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5
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JP
Japan
Prior art keywords
wafer
imaging
illumination
imaging means
irradiating
Prior art date
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Withdrawn
Application number
JP2006168597A
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Japanese (ja)
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JP2007333672A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006168597A priority Critical patent/JP2007333672A/en
Priority claimed from JP2006168597A external-priority patent/JP2007333672A/en
Publication of JP2007333672A publication Critical patent/JP2007333672A/en
Publication of JP2007333672A5 publication Critical patent/JP2007333672A5/ja
Withdrawn legal-status Critical Current

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Claims (3)

透光性を有するウェハーの表面側に配置され当該ウェハーの表面を撮像する第1撮像手段と、
前記ウェハーの裏面側に配置され当該ウェハーの裏面を撮像する第2撮像手段とを備え、
前記第1撮像手段と前記第2撮像手段とは、それぞれの光軸が前記ウェハーの表面および裏面に略直交しかつ互いに同軸となるように配置され
前記第1撮像手段の光軸方向に沿って、照明光束を前記ウェハーの表面側に照射する第1照明手段と、
前記第2撮像手段の光軸方向に沿って、照明光束を前記ウェハーの裏面側に照射する第2照明手段とを備え、
前記第1撮像手段は、前記第2照明手段による前記ウェハーの表面における透過像を撮像するとともに、
前記第2撮像手段は、前記第1照明手段による前記ウェハーの裏面における透過像を撮像する
ことを特徴とするウェハーの外観検査装置。
A first imaging means arranged on the surface side of a wafer having translucency and imaging the surface of the wafer;
A second imaging means arranged on the back side of the wafer for imaging the back side of the wafer;
The first imaging means and the second imaging means are arranged so that their optical axes are substantially orthogonal to the front and back surfaces of the wafer and coaxial with each other ,
First illumination means for irradiating the surface of the wafer with an illumination light beam along an optical axis direction of the first imaging means;
A second illuminating means for irradiating the back surface side of the wafer with an illumination light beam along the optical axis direction of the second imaging means ;
The first imaging means captures a transmission image on the surface of the wafer by the second illumination means,
The wafer appearance inspection apparatus, wherein the second imaging means captures a transmission image on the back surface of the wafer by the first illumination means .
請求項1に記載のウェハーの外観検査装置において、The wafer appearance inspection apparatus according to claim 1,
前記ウェハーは、表裏を貫通する貫通孔が形成される孔明きウェハーであるThe wafer is a perforated wafer in which through holes penetrating the front and back sides are formed.
ことを特徴とするウェハーの外観検査装置。A wafer visual inspection apparatus characterized by the above.
透光性を有するウェハーの表面側および裏面側にそれぞれ、前記ウェハーの表面および裏面に光軸が略直交しかつ互いに同軸となるように第1撮像手段および第2撮像手段と、
前記第1撮像手段および前記第2撮像手段の光軸方向に沿って、照明光束を前記ウェハーの表面側に照射する第1照明手段、および照明光束を前記ウェハーの裏面側に照射する第2照明手段とを配置し、
前記第1撮像手段は、前記第2照明手段による前記ウェハーの表面における透過像を撮像するとともに、
前記第2撮像手段は、前記第1照明手段による前記ウェハーの裏面における透過像を撮像する
ことを特徴とするウェハーの外観検査方法。
Respectively on the surface side and the back side of the wafer having a light-transmitting property, the first imaging means and second imaging means such that the optical axis is substantially perpendicular to and coaxial with each other on the front and back surfaces of the wafer,
First illumination means for irradiating the front surface of the wafer with an illumination light beam along the optical axis direction of the first image pickup means and the second image pickup means, and second illumination for irradiating the back surface of the wafer with the illumination light beam Means and arranges
The first imaging means captures a transmission image on the surface of the wafer by the second illumination means,
The wafer imaging inspection method, wherein the second imaging means captures a transmission image on the back surface of the wafer by the first illumination means .
JP2006168597A 2006-06-19 2006-06-19 Apparatus and method for visual inspection Withdrawn JP2007333672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006168597A JP2007333672A (en) 2006-06-19 2006-06-19 Apparatus and method for visual inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006168597A JP2007333672A (en) 2006-06-19 2006-06-19 Apparatus and method for visual inspection

Publications (2)

Publication Number Publication Date
JP2007333672A JP2007333672A (en) 2007-12-27
JP2007333672A5 true JP2007333672A5 (en) 2009-08-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006168597A Withdrawn JP2007333672A (en) 2006-06-19 2006-06-19 Apparatus and method for visual inspection

Country Status (1)

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JP (1) JP2007333672A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049878B2 (en) * 2008-08-22 2011-11-01 Corning Incorporated Systems and methods for detecting defects in ceramic filter bodies
JP5552779B2 (en) * 2009-09-04 2014-07-16 セイコーエプソン株式会社 In-hole inspection method
JP5664167B2 (en) * 2010-11-22 2015-02-04 セイコーエプソン株式会社 Inspection device
JP6132322B1 (en) * 2015-12-10 2017-05-24 上野精機株式会社 Appearance inspection device
JP2024091590A (en) * 2022-12-23 2024-07-04 ダイキン工業株式会社 Photographing device and photographing method

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