JP2007333672A5 - - Google Patents
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- JP2007333672A5 JP2007333672A5 JP2006168597A JP2006168597A JP2007333672A5 JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5 JP 2006168597 A JP2006168597 A JP 2006168597A JP 2006168597 A JP2006168597 A JP 2006168597A JP 2007333672 A5 JP2007333672 A5 JP 2007333672A5
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- JP
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- Prior art keywords
- wafer
- imaging
- illumination
- imaging means
- irradiating
- Prior art date
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- 238000003384 imaging method Methods 0.000 claims 15
- 238000005286 illumination Methods 0.000 claims 11
- 230000003287 optical effect Effects 0.000 claims 5
- 230000005540 biological transmission Effects 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 4
- 238000007689 inspection Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000011179 visual inspection Methods 0.000 claims 1
Claims (3)
前記ウェハーの裏面側に配置され当該ウェハーの裏面を撮像する第2撮像手段とを備え、
前記第1撮像手段と前記第2撮像手段とは、それぞれの光軸が前記ウェハーの表面および裏面に略直交しかつ互いに同軸となるように配置され、
前記第1撮像手段の光軸方向に沿って、照明光束を前記ウェハーの表面側に照射する第1照明手段と、
前記第2撮像手段の光軸方向に沿って、照明光束を前記ウェハーの裏面側に照射する第2照明手段とを備え、
前記第1撮像手段は、前記第2照明手段による前記ウェハーの表面における透過像を撮像するとともに、
前記第2撮像手段は、前記第1照明手段による前記ウェハーの裏面における透過像を撮像する
ことを特徴とするウェハーの外観検査装置。 A first imaging means arranged on the surface side of a wafer having translucency and imaging the surface of the wafer;
A second imaging means arranged on the back side of the wafer for imaging the back side of the wafer;
The first imaging means and the second imaging means are arranged so that their optical axes are substantially orthogonal to the front and back surfaces of the wafer and coaxial with each other ,
First illumination means for irradiating the surface of the wafer with an illumination light beam along an optical axis direction of the first imaging means;
A second illuminating means for irradiating the back surface side of the wafer with an illumination light beam along the optical axis direction of the second imaging means ;
The first imaging means captures a transmission image on the surface of the wafer by the second illumination means,
The wafer appearance inspection apparatus, wherein the second imaging means captures a transmission image on the back surface of the wafer by the first illumination means .
前記ウェハーは、表裏を貫通する貫通孔が形成される孔明きウェハーであるThe wafer is a perforated wafer in which through holes penetrating the front and back sides are formed.
ことを特徴とするウェハーの外観検査装置。A wafer visual inspection apparatus characterized by the above.
前記第1撮像手段および前記第2撮像手段の光軸方向に沿って、照明光束を前記ウェハーの表面側に照射する第1照明手段、および照明光束を前記ウェハーの裏面側に照射する第2照明手段とを配置し、
前記第1撮像手段は、前記第2照明手段による前記ウェハーの表面における透過像を撮像するとともに、
前記第2撮像手段は、前記第1照明手段による前記ウェハーの裏面における透過像を撮像する
ことを特徴とするウェハーの外観検査方法。 Respectively on the surface side and the back side of the wafer having a light-transmitting property, the first imaging means and second imaging means such that the optical axis is substantially perpendicular to and coaxial with each other on the front and back surfaces of the wafer,
First illumination means for irradiating the front surface of the wafer with an illumination light beam along the optical axis direction of the first image pickup means and the second image pickup means, and second illumination for irradiating the back surface of the wafer with the illumination light beam Means and arranges
The first imaging means captures a transmission image on the surface of the wafer by the second illumination means,
The wafer imaging inspection method, wherein the second imaging means captures a transmission image on the back surface of the wafer by the first illumination means .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168597A JP2007333672A (en) | 2006-06-19 | 2006-06-19 | Apparatus and method for visual inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168597A JP2007333672A (en) | 2006-06-19 | 2006-06-19 | Apparatus and method for visual inspection |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007333672A JP2007333672A (en) | 2007-12-27 |
JP2007333672A5 true JP2007333672A5 (en) | 2009-08-06 |
Family
ID=38933275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006168597A Withdrawn JP2007333672A (en) | 2006-06-19 | 2006-06-19 | Apparatus and method for visual inspection |
Country Status (1)
Country | Link |
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JP (1) | JP2007333672A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8049878B2 (en) * | 2008-08-22 | 2011-11-01 | Corning Incorporated | Systems and methods for detecting defects in ceramic filter bodies |
JP5552779B2 (en) * | 2009-09-04 | 2014-07-16 | セイコーエプソン株式会社 | In-hole inspection method |
JP5664167B2 (en) * | 2010-11-22 | 2015-02-04 | セイコーエプソン株式会社 | Inspection device |
JP6132322B1 (en) * | 2015-12-10 | 2017-05-24 | 上野精機株式会社 | Appearance inspection device |
JP2024091590A (en) * | 2022-12-23 | 2024-07-04 | ダイキン工業株式会社 | Photographing device and photographing method |
-
2006
- 2006-06-19 JP JP2006168597A patent/JP2007333672A/en not_active Withdrawn
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