JP2007331334A - Inkjet recording head, its manufacturing method and wiring protection sealant for inkjet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet recording head high in printing quality and reliability, capable of enhancing producibility and lowering curing temperatures. <P>SOLUTION: The inkjet recording head is produced using at least an epoxy resin, a cationic polymerization initiator and an adhesive or a sealant containing a vinyl ether; at least an epoxy resin, a cationic polymerization initiator and an adhesive or a sealant containing oxycetane; or at least a cationic polymerization resin and a wiring protection sealant comprising a photo-sensitive and thermosensitive cationic curing resin composition containing a thermosensitive cationic polymerization initiator and a photo-sensitive cationic polymerization initiator, whose shore D hardness is 30 or over. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet recording head mounted on an ink jet recording apparatus that performs recording by discharging a recording liquid onto a recording paper, a manufacturing method thereof, and a wiring protective sealant for the ink jet recording head.

  In general, an ink jet recording apparatus is a recording apparatus that performs recording by discharging a recording liquid onto a recording sheet from an ejection port. The ink jet recording apparatus includes an ink jet recording head for forming a recording liquid discharged from an ejection port, and a supply system that supplies the recording liquid to the ink jet recording head.

  The above-described ink jet recording apparatus is a so-called non-impact recording type recording apparatus, and is characterized in that high-speed recording and recording on various recording media are possible and noise during recording hardly occurs. Therefore, it is widely adopted as a device that bears a recording mechanism such as a printer, a word processor, a facsimile machine, and a copying machine.

  A typical example of the ink jet recording method is a method using an electrothermal conversion element. In this method, an electrothermal conversion element is provided in a pressurizing chamber provided near the discharge port, and an electric pulse serving as a recording signal is applied. As a result, thermal energy is given to the recording liquid, and the recording liquid is ejected from a minute ejection port by utilizing the pressure of foaming (boiling) of the recording liquid caused by the phase change of the recording liquid at that time, and recording is performed on the recording paper.

  In the recording liquid ejection method described above, a recording liquid is ejected in parallel to the substrate on which the electrothermal conversion elements are arranged (edge shooter), and a perpendicular to the substrate on which the electrothermal conversion elements are arranged. There is a method (side shooter) for discharging a recording liquid.

  FIG. 3 is a diagram showing a general recording element substrate, and FIG. 4 is a diagram showing a state in which the recording element substrate shown in FIG. 3 is connected to a wiring substrate.

  As shown in FIGS. 3 and 4, a plurality of ejection ports 2 corresponding to energy generating elements for ejecting the recording liquid are provided on one surface of the recording element substrate 1, and recording is performed on the ejection ports 2 on the other surface. A supply port 3 for supplying the liquid is provided with an opening having a length substantially equal to the length of the two rows of discharge ports. Further, the recording element unit 6 is formed by connecting the wiring substrate 4 for applying an electric pulse for discharging the recording liquid to the recording element substrate 1 by the TAB mounting technique. TAB mounting terminals are generally provided at both ends of the recording element substrate 1 in the longitudinal direction or the lateral direction.

  The recording element substrate 1 is provided with a sealing resin 5 in order to protect the lead wire electrically connecting the recording element substrate 1 and the wiring substrate 4 from corrosion caused by the recording liquid and disconnection due to external force. It has been applied.

  FIG. 5 is an exploded perspective view showing one structural example of a conventional ink jet recording head provided with the recording element unit 6 shown in FIG. 6A and 6B are assembly completion views of the ink jet recording head shown in FIG. 5, in which FIG. 6A is an external perspective view, and FIG. 6B is a partially enlarged view of the AA cross section shown in FIG.

  As shown in FIGS. 5 and 6, the plurality of recording element units 6 a to 6 c are bonded and fixed to the upper surface of the support member 7 via the support plate 8. In addition, on the side surface of the support member 7, a wiring integrated board 10 that collects electric signals for the plurality of wiring boards 4 a to 4 c is fixed and electrically connected to the plurality of wiring boards 4 a to 4 c.

  In the conventional ink jet recording head, there is a portion sealed with the sealing resin 5 at both ends in the longitudinal direction or the short direction of the recording element substrate by TAB mounting. As shown in this part and FIG. 6B, there is a gap between the recording element substrates 1a to 1c and the wiring substrates 4a to 4c, and the recording liquid remaining on the surfaces of the recording element substrates 1a to 1c. There is a possibility of collecting in the gap.

  Here, the wiring boards 4 a to 4 c are bonded to the support plate 8 with an adhesive resin 9. However, since the recording liquid is highly permeable, when the recording liquid accumulates in the gaps described above, the recording liquid permeates between the wiring boards 4a to 4c and the support plate 8, and the recording liquid passes through the wiring boards 4a to 4a. There is a case where it goes around to the back side of 4c. This may corrode the wiring and cause an electrical failure.

  In addition, the support plate 8 may be formed integrally with the support member 7 by a molding material, but in order to suppress the temperature rise of the recording element substrate 1 due to thermal energy, the heat dissipation is improved by using an aluminum material or the like. Some are allowed to. When a metal material such as an aluminum material is used for the support plate 8, the support plate 8 may be corroded by the recording liquid. For this reason, Patent Document 1 proposes to seal the gap with resin.

  FIG. 13 is a diagram showing a state in which the first recording element substrate 103 is mounted on the support member 101.

  As shown in FIG. 13, a discharge port plate 104 is provided on the surface side of the first recording element substrate 103, and a plurality of discharge ports 104a for discharging the recording liquid are formed on the discharge port plate 104. Yes. The discharge ports 104a are opened over two rows at positions facing discharge energy generating elements (for example, electrothermal transducers) 105, which are recording elements, and a discharge port row forming one set of two rows is formed. The recording liquid supply channel 101 a has a larger channel width than the opening width of the inlet portion of the recording liquid supply port 106. For this reason, the thickness of the partition wall 101b separating the recording liquid supply channels 101a adjacent to each other is thinner than the interval between the inlet portions of the recording liquid supply ports 106 adjacent to each other.

Several assembling methods and the like used for manufacturing a recording element substrate as shown in FIG. 13 and a liquid discharge head including the same are known. For example, Patent Document 2 discloses a method for positioning and assembling a recording element substrate with respect to a method for manufacturing a liquid discharge head. In this assembling method, the recording element substrate is accurately positioned with the vacuum suction finger, and the recording element substrate is fixed with an ultraviolet / thermosetting adhesive. Patent Document 3 discloses a method of bonding an orifice plate (discharge port plate) to a liquid discharge head body. Further, Patent Document 4 discloses a method of adhering a nozzle member to a liquid discharge head body having a plurality of ink chambers.
Japanese Patent Laid-Open No. 10-44412 Japanese Patent Laid-Open No. 9-188792 JP-A-11-179923 JP-A-11-188873

  In the conventional ink jet recording head as described above, the sealing resin 11 (see FIG. 2B described later) is filled in the gap between the recording element substrate 1 and the wiring substrate 4, and then the wiring for the ink jet recording head is used. A sealing resin 5 that is a protective sealant is applied. Since the sealing resin 11 seals the periphery of the recording element substrate 1, the elastic modulus is low and the gap is sealed so as not to damage the recording element substrate 1 by applying stress due to curing shrinkage or thermal expansion. Therefore, the viscosity needs to be low. On the other hand, the sealing resin 5 is required to have a high elastic modulus in order to protect the wiring from paper jam or the like, and high viscosity and high thixotropy are required to cover and protect the wiring. Therefore, the sealing resin 11 and the sealing resin 5 are usually different.

  In addition, after the sealing resin 11 is applied, it is necessary to perform thermosetting as necessary so that the sealing resin 11 and the sealing resin 5 do not cross each other. Performing this thermosetting for each resin reduces the productivity. Furthermore, sealing agents having a low elastic modulus generally have a high curing temperature, which adversely affects the constituent members and has a high curing temperature, so that the range of selection of the constituent members is narrowed.

  Moreover, the sealing resin 5 is a resin having a high viscosity and a high thixotropy as described above, and therefore the productivity is inferior. Furthermore, pinholes and the like due to entrainment of bubbles are generated, which may cause product defects.

  Furthermore, along with the improvement in image quality of ink jet recording, the alkali of ink is increasing and the content of polar solvent is increasing. Therefore, the ink resistance to sealing agents (sealing resins) and adhesives that come into contact with ink is increasing. Improvement is demanded. Here, when comparing an epoxy resin that is cured by cationic polymerization and a crylic resin that is cured by radical polymerization, the epoxy resin has a smaller curing shrinkage. Furthermore, there is little generation of stress due to curing, and no stress due to a difference in linear expansion coefficient is generated in a portion that can be cured at room temperature by light. Moreover, the epoxy resin is excellent in adhesiveness, and the cured product is excellent in ink resistance. However, the ink resistance of the epoxy resin is manifested by increasing the crosslinking density, and it is necessary to increase the curing temperature or lengthen the curing time. However, since the inkjet head itself is required to be stable in step with the increase in image quality, the curing temperature of the adhesive is desired to be as low as possible from the viewpoint of the reliability of the head.

  Accordingly, an object of the present invention is to solve the above-described problems of the prior art, improve productivity, lower the curing temperature, and provide an ink jet recording head with high print quality and reliability.

  The ink jet recording head according to the first aspect of the present invention is different from the recording element substrate in which the ink flow path and the discharge port are provided on the substrate on which the ink discharge energy generating element and the wiring for applying the electric pulse are formed. In the ink jet recording head in which the member is bonded and the gap between the other member and the recording element substrate is sealed, the sealing includes a sealing agent containing at least an epoxy resin, a cationic polymerization initiator, and vinyl ether Is used.

  The ink jet recording head of the first aspect of the present invention includes at least a plurality of recording elements that discharge recording liquid, and is provided on a surface opposite to a surface on which the recording elements are provided. A recording element substrate having a supply port for supplying a recording liquid, and an opening for incorporating the recording element substrate. The recording element substrate is connected to the recording element substrate, whereby the recording element substrate is connected to the recording element substrate. A plurality of recording element units each including a wiring substrate to which an electric pulse for discharging a liquid is applied; a support member for holding and fixing the recording element substrate; and an opening for the recording element substrate to contact the support member. An inkjet recording head comprising: a support plate for holding and fixing the wiring board by being interposed between the wiring board and the support member; It said recording element substrate is not provided portion of the opening of at least an epoxy resin, it is preferably sealed with a sealing agent containing a cationic polymerization initiator and a vinyl ether.

  Furthermore, in the ink jet recording head of the first aspect of the present invention, it is preferable that the sealant contains at least an epoxy resin, a thermal cationic polymerization initiator, a photo cationic polymerization initiator, and the surface layer is cured by active energy rays.

  According to a first aspect of the present invention, there is provided a method of manufacturing an ink jet recording head for a recording element substrate in which an ink discharge energy generating element and a wiring for applying an electric pulse are formed on an ink flow path and a discharge port. In the method of manufacturing an ink jet recording head, the method includes a step of bonding another member and sealing a gap between the other member and the recording element substrate. The sealing includes at least an epoxy resin, a cationic polymerization initiator, and vinyl ether. It is characterized by bonding or sealing with an agent.

  The vinyl ether used in the first invention has high cationic polymerizability, and the polymerization reaction proceeds rapidly even at room temperature. Therefore, it is not necessary to proceed with a dark reaction by heating such as cationic polymerization of epoxy resin, and it is suitable as a material for sealing the gap because of its low viscosity. However, the vinyl ether alone is too reactive and may foam due to reaction heat, or the reaction may proceed due to a small amount of cations, so that a thermal cation initiator may not be used. Therefore, in the first aspect of the present invention, by using vinyl ether and an epoxy resin in combination, the excellent performance of vinyl ether can be effectively used, and the original excellent adhesiveness and ink resistance of the epoxy resin can be expressed. In an ink jet recording head in which a member such as an ink supply system is bonded to the recording element, it is possible to improve printing quality and reliability.

  The ink jet recording head of the second aspect of the present invention is different from the recording element substrate in which the ink flow path and the ejection port are provided on the substrate on which the ink ejection energy generating element and the wiring for applying the electric pulse are formed. In the ink jet recording head in which the above members are joined or the gap is sealed, an adhesive or sealant containing at least an epoxy resin, a cationic polymerization initiator and oxetane is used.

  According to a second aspect of the present invention, there is provided a method for manufacturing an ink jet recording head, comprising: an ink discharge energy generating element; and a recording element substrate provided with an ink flow path and discharge ports on a substrate on which wiring for applying an electric pulse is formed. In the method of manufacturing an ink jet recording head, the method includes a step of bonding another member and sealing a gap between the other member and the recording element substrate, and an adhesive containing at least an epoxy resin, a cationic polymerization initiator, and oxetane Or it adheres or seals using a sealing agent, It is characterized by the above-mentioned.

In the manufacturing method of the ink jet recording head of the second invention,
A plurality of recording elements that discharge recording liquid, and a plurality of supply ports that are provided on a surface opposite to the surface on which the recording elements are provided, and that supply the recording liquid to the recording elements. In a method for manufacturing an ink jet recording head, comprising: a recording element substrate; and a support member that holds and fixes the recording element substrate provided with a plurality of supply channels for supplying the recording liquid to the supply ports. A step of applying an adhesive having a property of being cured when irradiated with ultraviolet rays and a property of being cured when heated to a joint surface between the support member and the recording element substrate; and the recording element substrate and the support member Pressing each other, and causing the adhesive to protrude into a region extending into the supply port of the recording element substrate from the joint surface between the recording element substrate and the support member; Serial ultraviolet by irradiating to cure the adhesive in the adhesive protruding from the bonding surface, it is preferable to have a step for positioning and fixing of the recording element substrate against the support member.

  In the second invention, an epoxy resin and oxetane are used in combination. By adding oxetane to the cationic polymerization system of the epoxy resin, a synergistic effect between the speed of initiation of the polymerization reaction of the epoxy resin and the final conversion rate of oxetane can be obtained. As a result, in the second invention, a cured product having a high crosslinking density can be obtained even at a relatively low temperature. Also, since oxetane has a low viscosity, the addition of oxetane decreases the viscosity and improves workability. Of course, the original excellent adhesiveness and ink resistance of the epoxy resin are also exhibited. That is, in an ink jet recording head in which a member such as an ink supply system is bonded to the recording element, the print quality and reliability can be improved.

  The wiring protective sealant for an inkjet recording head according to the third aspect of the present invention comprises a photothermal combined cationic curable resin composition containing at least a cationic polymerizable resin, a thermal cationic polymerization initiator, and a photo cationic polymerization initiator. The Shore D hardness is 30 or more.

  In the wiring protective sealant for an inkjet recording head of the third aspect of the present invention, it is preferable that the cationic curable resin composition contains at least an alicyclic epoxy or oxetane.

  The ink jet recording head of the third aspect of the invention is characterized by having a portion sealed with the wiring protective sealant of the third aspect of the invention.

  The method for producing the ink jet recording head of the third aspect of the invention is characterized by having a step of curing the surface layer of the wiring protective sealant with active energy rays.

  In the third aspect of the present invention, a thermal cationic polymerization initiator and a photocationic polymerization initiator are used in combination. Thereby, for example, after covering the wiring with the sealing agent, the surface layer of the sealing agent can be cured by light, and the inside of the wiring and the interior where the light does not reach sufficiently can be cured by heating. As a result, a cured product that can sufficiently cover the wiring and has excellent physical properties such as chemical resistance can be obtained.

  According to the first aspect of the present invention, since the viscosity of the adhesive or the sealant is low, the resin can be quickly filled in a required portion, and the recording liquid does not soak into the portion and remain. Therefore, for example, corrosion of the wiring board or the support plate caused by the remaining recording liquid flowing around the back surface of the wiring board can be prevented. Further, since the surface can be quickly cured and transferred to the next process, the productivity is excellent, and the interior can be cured by subsequent low-temperature curing, so that the range of materials for the constituent members of the ink jet recording head is widened. Furthermore, the cured product has low elasticity, and if applied to a site where such physical properties are required, the reliability of the inkjet head can be improved.

  According to the second aspect of the present invention, since the viscosity of the adhesive or sealant is low, the workability is excellent, the reaction rate is fast, the productivity is excellent, and the crosslinking density is high even at a relatively low temperature, so that the ink jet is highly reliable. A recording head is obtained. In addition, since the crosslink density becomes high even at a relatively low temperature, the range of materials for the constituent members of the ink jet recording head is widened.

  According to the third aspect of the present invention, since the sealant has a low viscosity, the resin can be quickly filled in a necessary portion, and the recording liquid does not soak into the portion and remain. Therefore, for example, corrosion of the wiring board caused by the remaining recording liquid coming into contact with the wiring of the wiring board can be prevented. Further, the surface can be quickly cured and transferred to the next process, and the interior can be cured by subsequent low-temperature curing, so that productivity is remarkably increased. Moreover, the frequency | count of thermosetting can be reduced by making another adhesive agent or sealing agent into a heat light combined use type. In addition, since curing can be performed at a relatively low temperature, the range of selection of constituent members of the ink jet recording head is widened. Furthermore, the cured product has high elasticity and excellent chemical resistance, and if applied to a site where such physical properties are required, the reliability of the inkjet head can be improved.

  FIG. 1 is an exploded perspective view showing a first embodiment of the ink jet recording head of the present invention, FIG. 2 is an assembled view of the ink jet recording head shown in FIG. 1, and FIG. (B) is the elements on larger scale of the AA cross section shown to (a).

  As shown in FIGS. 1 and 2, a plurality of recording element substrates 1 a to 1 c in which a plurality of recording elements for discharging recording liquid are arranged are arranged in respective openings of the recording element substrates 1 a to 1 c by TAB mounting. Built in and electrically connected. A sealing resin 5 is formed to protect the lead wires connecting the recording element recording element substrates 1a to 1c and the wiring substrates 4a to 4c from corrosion caused by the recording liquid and disconnection due to external force. The recording element substrates 1a to 1c are fixed to a support member 7 for holding and fixing. The recording element substrates 1 a to 1 c have openings for contacting the support member 7, and a support plate 8 for holding and fixing the wiring substrates 4 a to 4 c is connected to the wiring substrates 4 a to 4 c by the adhesive resin 9. It is glued. Also, a wiring integrated board 10 is provided for collecting electrical signals for the wiring boards 4a to 4c. It consists of and.

  Note that the openings of the wiring boards 4a to 4c and the openings of the support plate 8 are substantially equal in size and slightly larger than the recording element substrates 1a to 1c. A gap formed between the recording element substrates 1a to 1c and the wiring substrates 4a to 4c and the support plate 8, that is, a portion of the opening of the support plate 8 where the recording element substrates 1a to 1c are not provided, It is sealed with a sealing resin 11.

  A method for assembling the ink jet recording head configured as described above will be described below.

  First, a heating resistor layer and wiring are patterned on a silicon wafer by a photolithography technique, and then a nozzle wall and a discharge port 2 are formed of a photosensitive resin, and then a recording liquid supply port is formed by anisotropic etching, sandblasting, or the like. Is formed. Thereafter, the outer shape is formed by cutting, whereby the recording element substrates 1a to 1c are formed.

  Next, the recording element substrates 1a to 1c are electrically connected to the wiring substrates 4a to 4c for receiving electric signals by the TAB mounting technique, respectively.

  Next, the recording element substrates 1 a to 1 c are bonded and fixed to the support member 7, and the wiring substrates 4 a to 4 c are bonded and fixed to the support plate 8 by the adhesive resin 9. Thereby, the recording element units 6 a to 6 c including the recording element substrates 1 a to 1 c and the wiring substrates 4 a to 4 c are fixed to the structure of the ink jet recording head including the support member 7 and the support plate 8.

  Then, the wiring boards 4 a to 4 c and the wiring integrated board 10 are electrically connected, and the wiring integrated board 10 is held and fixed to the support member 7.

  Thereafter, the recording element substrates 1a to 1c, the wiring substrates 4a to 4c, and the support plate 8 are sealed with the sealing resin 11 according to the present invention. In the prior art, a thermosetting resin is used, but in the present invention, for example, in order to reduce the thermosetting process, the surface layer of the sealing resin is cured by light and the inside of the sealing resin is thermally cured. You can also.

  Next, the sealing resin 5 is applied on the electrical signal input terminals on the recording element substrates 1a to 1c side and the lead wires on the wiring substrates 4a to 4c side, and cured by UV irradiation of the sealing resin 5 and the sealing resin 11 by heating. Not harden inside.

  Normally, as described above, the recording element substrates 1a to 1c and the wiring substrates 4a to 4c are electrically connected by lead wires using a TAB mounting technique. The lead wires are protected by the sealing resin 5 in advance as the recording element units 6a to 6c in order to prevent corrosion due to the recording liquid or disconnection due to externally acting force.

  There is also a method of preventing the recording liquid from remaining by narrowing the gap between the wiring substrate 4a-4c at the end face of the recording element substrate 1a-1c on the side having no electrical contact terminal with the wiring substrate 4a-4c. However, sealing with a sealing resin 11 in a gap formed between the recording element substrates 1a to 1c and the support plate 8 can more reliably prevent the recording liquid from remaining. In this case, the lower the viscosity of the sealing resin 11 is, the better the wrapping around the details becomes, and the surface of the sealing resin becomes flat, which is advantageous for preventing the recording liquid from remaining.

  As described above, the gap formed between the recording element substrates 1a to 1c and the support plate 8 is filled with the sealing resin 11 so that the space between the recording element substrates 1a to 1c and the wiring substrates 4a to 4c. Remove gaps. Thereby, it is possible to prevent the recording liquid from remaining around the recording element substrates 1a to 1c, and to prevent the wiring substrates 4a to 4c from corroding.

  Next, an example of the configuration of the ink jet recording head of the present invention will be described with reference to the drawings.

  As shown in FIG. 7, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.

  FIG. 8 is an exploded perspective view of the ink jet recording head of the present invention. As shown in FIG. 8, the recording element unit H1002 includes a first recording element substrate H1100, a second recording element substrate H1101, a first plate H1200, an electrical wiring tape H1300, an electrical contact substrate H2200, and a second plate H1400. It consists of The ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint rubber H2300, a filter H1700, and a seal rubber H1800.

  FIG. 9 is a perspective view showing the structure of the first recording element substrate H1100 in a partially exploded state. In the first recording element substrate H1100, for example, an ink supply port H1102 including a long groove-like through-hole is formed as an ink channel on a Si substrate H1110 having a thickness of 0.5 to 1 mm. The ink supply port H1102 is formed by, for example, a method such as anisotropic etching or sandblasting using the crystal orientation of Si. On both sides of the ink supply port H1102, electrothermal conversion elements H1103, which are ejection energy generating elements that generate energy used to eject the recording element ink, are arranged in a staggered pattern, one by one. The electrothermal conversion element H1103 and the electric wiring such as Al for supplying electric power to the electrothermal conversion element H1103 are formed by a film forming technique. Furthermore, electrodes H1104 for supplying electric power to the electric wiring are arranged on both outer sides of the electrothermal transducer H1103, and bumps H1105 such as Au are formed on the electrode H1104. On the Si substrate, an ink channel wall H1106 and an ejection port H1107 for forming an ink channel corresponding to the electrothermal conversion element H1103 are formed of a resin material by a photolithography technique, and an ejection port array H1108 is formed. Forming. Accordingly, since the ejection port H1107 is provided opposite to the electrothermal conversion element H1103, the ink supplied from the ink flow path H1102 is ejected by bubbles generated by the electrothermal conversion element H1103. The ejection energy generating element and the ejection port H1107 constitute a recording element, which ejects a recording liquid and performs recording.

Reference is again made to FIG. The first plate H1200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The material of the first plate is not limited to alumina, and has a linear expansion coefficient equivalent to that of the recording element substrate material, and is equivalent to or equivalent to the thermal conductivity of the recording element substrate material. It may be made of a material having the above thermal conductivity. The material of the first plate is, for example, any of silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), and tungsten (W) It may be. The first plate H1200 has ink supply ports H1201 for supplying black ink to the first recording element substrate H1100 and inks for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101. A supply port H1201 is formed.

  The ink supply port H1102 of the recording element substrate corresponds to the ink supply port H1201 of the first plate H1200. The first recording element substrate H1100 and the second recording element substrate H1101 are each bonded and fixed to the first plate H1200 with high positional accuracy. The first adhesive used for bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

  The electrical wiring tape H1300 applies an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101. The electrical wiring tape H1300 has a plurality of opening portions for incorporating the respective recording element substrates, and electrode terminals H1302 corresponding to the electrodes H1104 of the respective recording element substrates. Further, an electrode terminal portion H1303 for making an electrical connection with an electrical contact substrate H2200 having an external signal input terminal H1301 for receiving an electrical signal from the main body device located at the end of the wiring tape is provided. The electrode terminal H1302 and the electrode terminal 1303 are connected by a continuous copper foil wiring pattern. The electrical wiring tape H1300, the first recording element substrate 1100, and the second recording element substrate H1101 are electrically connected to each other. As a connection method, for example, the electrode 1104 of the recording element substrate and the electrode terminal H1302 of the electric wiring tape H1300 are electrically joined by a thermal ultrasonic pressure bonding method.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 to 1 mm, and is formed of a ceramic material such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. Yes. The first recording element substrate H1100 and the second recording element substrate H1101 that are bonded and fixed to the first plate H1200 have openings that are larger than the outer dimensions thereof. Further, the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are bonded to the first plate H1200 with a second adhesive H1203 so that they can be electrically connected in a plane. The back surface of the electric wiring tape H1300 is bonded and fixed with a third adhesive H1306.

  The first recording element substrate H1100, the second recording element substrate H1101, and the electrical connection portion of the electrical wiring tape H1300 are sealed with a first sealant H1307 and a second sealant H1308. Thereby, the electrical connection portion is protected from ink corrosion and external impact. The first sealing agent mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape and the electrode portion of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent H1308. Has sealed the front side of the connection part.

  Since the first sealing resin material H1307 is sealed around the recording element substrate, it needs to have a low elastic modulus so as not to give stress, and needs to have a low viscosity to seal a gap. . On the other hand, the second sealant H1308 is required to have a high elastic modulus in order to protect the wiring from paper jam or the like, and to have a high viscosity and high thixotropy in order to protect the wiring. Accordingly, it is usually necessary to use different materials for the first sealant H1307 and the second sealant H1308.

  Therefore, conventionally, after applying the first sealant H1307, before applying the second sealant H1308, it is necessary to cure the first sealant H1307 so that the two sealants do not cross each other. Productivity was inferior. In addition, sealants having ink resistance and low elastic modulus generally have a high curing temperature, which adversely affects the constituent members and makes the selection of the constituent members difficult.

  At this time, the adhesive H1202 on the first plate H1200 is transferred to a position shifted outward from the position where the first recording element substrate H1100 contacts. This adhesive is an ultraviolet / thermosetting combination type that cures when irradiated with ultraviolet rays or when heat is applied, and uses an adhesive that is resistant to ink and excellent in transferability.

  Next, a process of attaching the first recording element substrate H1100 to the first plate H1200 will be described.

  10 (a) to 10 (c), 11 (d), 11 (e), 12 (f), and 12 (g) are cross-sectional views for explaining an embodiment of a method for manufacturing an ink jet recording head of the present invention. FIG. 10 to 12 show cross sections obtained by cutting the first recording element substrate H1100 along the longitudinal direction of the ejection port array.

  10 to 12, reference numeral H101 denotes a transfer pin for applying the adhesive H1202, and reference numeral H106 denotes a vacuum suction finger for sucking and positioning the recording element substrate. Reference numerals H110 and H111 denote CCD cameras for recognizing the position of the recording element substrate, and reference signs H112 and H113 denote ultraviolet irradiation nozzles, respectively.

  In the step of attaching the recording element substrate H1100 made using the Si substrate to the first alumina plate H1200, first, as shown in FIG. 10A, an adhesive H1202 is applied to the transfer surface of the transfer pin H101. Apply. Subsequently, as shown in FIG. 5B, the transfer surface of the transfer pin H101 is brought into contact with the first plate H1200. Then, as shown in FIG. 5C, when the transfer pin H101 is separated from the first plate H1200, the adhesive H1202 is applied to the bonding portion of the first plate H1200.

  Next, as shown in FIG. 11D, the surface of the ink flow path wall H1106 that forms the ejection port H1107 of the first recording element substrate H1100 is suction-held by the vacuum suction finger H106. Then, an alignment mark (not shown) of the first recording element substrate H1100 is optically recognized by the CCD cameras H110 and H111, and alignment with the first plate H1200 is performed.

  Subsequently, as shown in FIG. 5E, the positioned vacuum suction finger H106 is lowered, and the first recording element substrate H1100 is brought into contact with and pressed against the first plate H1200. Then, the adhesive H1202 protrudes from the end portion in the longitudinal direction of the first recording element substrate H1100 as shown in FIG. In the drawing, it appears that the adhesive H1202 protrudes only outside the ink flow path, but actually, the adhesive slightly protrudes also in the ink flow path (particularly in the ink supply port H1102) as described later.

Then, as shown in FIG. 12F, ultraviolet rays are irradiated from the ultraviolet irradiation nozzles H112 and H113 while the first recording element substrate H1100 is pressed against the first plate H1200. For example, 10 J / cm ² can be performed. The position of the first recording element substrate H1100 is fixed on the first plate H1200 by irradiating and curing the adhesive H1202 protruding from the end portion with ultraviolet rays.

Further, as shown in FIG. 5G, the vacuum suction finger H106 is released from the vacuum and moved. Thereafter, ultraviolet rays are irradiated again from the surface of the discharge port H1107 by the ultraviolet irradiation nozzles H112 and H113, for example, 20 J / cm ² . The adhesive H1202 that slightly protrudes into the ink flow path (especially the ink supply port H1102) is hardened to prevent the adhesive from flowing out into the ink flow path and the discharge port and clogging.

  Thereafter, this part is further heated to cure the adhesive H1202 at a site that has not yet been cured without receiving ultraviolet rays.

  As described above, the recording element substrate and the supporting member can be temporarily fixed by positively protruding the adhesive from the joint surface and irradiating the portion with ultraviolet rays. As a result, the next thermosetting process can be performed while maintaining high-precision positioning, leading to improvement in productivity and quality. Furthermore, since the ultraviolet rays can be applied to the ink that protrudes into the flow path, the recording element substrate can be more firmly fixed, and the adhesive can be prevented from flowing into the flow path. In this example, the recording element substrate and the support member are joined. However, the ink resistance of the ink jet recording head can be used for bonding the portion of the ink jet recording head that is in contact with the ink.

  As the components of the adhesive or sealant used in the present invention, the following are suitable.

  As the epoxy resin, it is preferable to use an alicyclic epoxy resin having high activity against cations. The following are mentioned as an alicyclic epoxy resin.

  Polyglycidyl ether of polyhydric alcohol having at least one alicyclic ring, cyclohexene, cyclohexene oxide structure-containing compound, cyclopentene oxide structure-containing compound, or vinyl obtained by epoxidizing a cyclopentene ring-containing compound with an oxidizing agent Examples thereof include vinylcyclohexane oxide structure-containing compounds obtained by epoxidizing a compound having a cyclohexane structure with an oxidizing agent. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylcyclohexanecarboxylate 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane Metadioxane, bis ( 3,4-epoxycyclohexylmethyl) adipate, vinylcyclohexene dioxide, 4-vinylepoxycyclohexane, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, Methylene bis (3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylene glycol di (3,4-epoxycyclohexylmethyl) ether, ethylene bis (3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, Epoxy hexahydrophthalate di-2-ethylhexyl and the like.

  Furthermore, it is possible to add an aromatic epoxy resin, an aliphatic epoxy resin, an epoxy-modified butadiene resin, a polyhydric alcohol, an acid anhydride, or the like that is appropriately blended with a normal epoxy resin. It is also possible to add a silane coupling agent or the like to further improve the adhesion.

  Specific examples of the aromatic epoxy resin include the following.

  Polyglycidyl ethers of polyhydric phenols having at least one aromatic ring, or alkylene oxide adducts thereof, such as bisphenol A, bisphenol F, or glycidyl ethers of compounds obtained by further adding alkylene oxide thereto, epoxy novolac resins Bisphenol A novolac diglycidyl ether, bisphenol F novolac diglycidyl ether, and the like.

  Specific examples of the aliphatic epoxy resin include the following.

  Polyglycidyl ether of aliphatic polyhydric alcohol or its alkylene oxide adduct, polyglycidyl ester of aliphatic long-chain polybasic acid, epoxy-containing compound obtained by oxidizing aliphatic long-chain unsaturated hydrocarbon with oxidizing agent, glycidyl acrylate Alternatively, a homopolymer of glycidyl methacrylate, a copolymer of glycidyl acrylate or glycidyl methacrylate, and the like can be given. Typical compounds include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol tetraglycidyl ether, dipentaerythritol. Hexaglycidyl ether of Toll, diglycidyl ether of polyethylene glycol, glycidyl ether of polyhydric alcohols such as diglycidyl ether of polypropylene glycol, and one or more alkylenes in aliphatic polyhydric alcohols such as propylene glycol and glycerin Polyglycidyl ether of polyether polyol and diglycidyl ester of aliphatic long-chain dibasic acid obtained by adding oxide.

  Furthermore, monoglycidyl ethers of higher aliphatic alcohols, phenols, cresols, butylphenols, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxides to these, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxy stearin Examples include octyl acid, epoxy butyl stearate, and epoxidized linseed oil.

  Specific examples of the epoxy-modified butadiene resin include trade names BF-1000 manufactured by Asahi Denka Kogyo Co., Ltd., trade names EPB-13 and EPB-1054 manufactured by Nippon Soda Co., Ltd., and further manufactured by Nippon Petrochemical Co., Ltd. Product names E-700-3.5, E-700-6.5, E-1000-3.5, E-1000-6.5, E-1000-8, E-1800- 6.5 etc. are mentioned.

  As a specific example of the silane coupling agent, one having a high reactivity to cations is desirable. For example, alicyclic epoxy type A-186 (manufactured by Nihon Unicar), oxetane type TESOX (manufactured by Toagosei Co., Ltd.) and the like are preferably used.

  Specific examples of the photocationic polymerization initiator include aromatic onium salts [see J. POLYMER SCI: Symposium No. 56 383-395 (1976)], Irgacure 261 (registered trademark), Asahi, which is marketed by Ciba Geigy. SP-150 (trade name) marketed by Denka Kogyo, SP-170 (trade name), Triazine A, Triazine PMS, Triazine PP, Triazine B marketed by Nippon Sebel Hegner, Photoinitiator 2074 marketed by Rhodia Japan, etc. Is given.

  Specific examples of the thermal cationic polymerization initiator include San-Aid SI-60L (trade name), Sun-Aid SI-80L (trade name), Sun-Aid SI-100L (trade name), and Asahi Denka Kogyo, which are commercially available from Sanshin Chemical Industry. CP-66 (trade name), CP-77 (trade name), or a combination of an aromatic onium salt and a reducing agent (JP-A 54-102394, J. POLYMER SCI: Polymer Chemical Edition Vo1121, 97-109 (1983)).

  Vinyl ether is suitable for use as the sealing resin 11. Specific examples of the vinyl ether include the following.

  Triethylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, diethylene glycol divinyl ether, propylene glycol divinyl ether, dipropylene glycol divinyl ether, butanediol divinyl ether, hydroxybutyl vinyl ether, dodecyl vinyl ether, cyclohexyl vinyl ether, and the like.

  As for the compounding quantity of vinyl ether, 5-60 mass parts is preferable with respect to 100 mass parts of resin. When the amount is 5 parts by mass or more, the effect of vinyl ether is favorably expressed. When the amount is 60 parts by mass or less, high epoxy adhesiveness is favorably exhibited, and the crosslinking density is increased to improve ink resistance. Furthermore, as a compounding quantity, 10-35 mass parts is preferable.

  Oxetane is preferably used for the adhesive 1202 or the sealing resin 5. Examples of oxetane include OXT-101, OXT-121, OXT-221, OXT212, OXT211 and the like marketed by Toa Synthetic Chemical. The blending amount of oxetane is preferably 5 to 95 parts by mass with which the improvement in reactivity can be clearly confirmed by DSC (differential scanning calorimetry) with respect to 100 parts by mass of the resin. In order to save, 30 to 80 parts by mass is more preferable. In particular, since alicyclic epoxy and oxetane have high reactivity, it is possible to obtain an excellent chemical-resistant sealant having a high elastic modulus. In addition, by adding oxetane to the epoxy cationic polymerization system, a synergistic effect between the speed of initiation of the epoxy polymerization reaction and the final conversion rate of oxetane can be obtained, so that a cured product having a high crosslinking density can be obtained even at a lower temperature. Therefore, it is effective when used in a mixed state.

  The hardness of the cured product is preferably 30 or more and more preferably 45 or more in Shore D hardness. If the Shore D hardness is high, good results can be obtained in a paper jam test or the like.

  Hereinafter, the present invention will be described in more detail with reference to examples. In the following, “part” means “part by mass”.

  First, an embodiment (A) of the first invention will be described below.

<Example A1 and Comparative Example A1>
As the sealing resin 11 (FIG. 2), a sealing agent having the following composition was prepared.

The product names in Table 1 indicate the following products.
PB-4700: (Daicel Chemical Industries, butadiene skeleton alicyclic epoxy resin).
Rapi-Cure DVE: (APS Japan, ethylene glycol divinyl ether).
Adekaoptomer SP-170: (Asahi Denka Co., photocationic polymerization initiator).
Adeka Optron CP-66: (Asahi Denka Co., Ltd., thermal cationic polymerization initiator).
A-187: (Silane coupling agent manufactured by Nihon Unicar).

  Although the sealant of Example A1 had a low viscosity, the sealant of Comparative Example 1 took a long time to fill because it had a high viscosity. Next, UV irradiation was performed to harden the surface layer. In Example A1, the surface layer was cured immediately, but in Comparative Example 1, it took time to cure.

  Next, the sealing resin 5 was applied onto the electric signal input terminals on the recording element substrates 1a to 1c side and the lead wires on the wiring substrates 4a to 4c side. And the inside which was not hardened by UV irradiation of sealing resin 5 and sealing resin 11 was hardened by heating.

  In Example A1 and Comparative Example A1, a type of sealant using a cationic photopolymerization initiator is used, but if a thermosetting sealant is used here, curing in a baking furnace is required. Therefore, productivity is extremely lowered and baking at a high temperature is required.

  Further, the completed ink jet recording head was subjected to a heat shock test at −30 ° C. to 100 ° C. In Example A1, no change was observed, but in Comparative Example A1, cracks were observed on the recording element substrate.

  Next, the second embodiment (B) of the present invention will be described below.

<Example B1 and Comparative Example B1>
As the first sealant H1307 (FIG. 7), a sealant having the following composition was prepared.

The product names in Table 2 indicate the following products.
PB-4700: (Daicel Chemical Industries, Butadiene skeleton alicyclic epoxy resin).
CXT-221: (Oxetane manufactured by Toa Gosei Co., Ltd.).
Adekaoptomer SP-170: (Asahi Denka Co., photocationic polymerization initiator).
Adeka Optron CP-77: (Asahi Denka Co., thermal cationic polymerization initiator).
A-187: (Silane coupling agent manufactured by Nihon Unicar).

  In the sealing agent of Example B1, since oxetane was added, the viscosity was low. However, the sealing agent of Comparative Example B1 took a long time to seal because of its high viscosity. Next, UV irradiation was performed to harden the surface layer. In Example B1, the surface layer was cured immediately, but in Comparative Example B1, it took some time to cure.

  Next, the 2nd sealing agent H1308 was applied, the inside which was not hardened by UV irradiation with the 1st sealing agent H1307, and the 2nd sealing agent H1308 were hardened by heating. Further, an electrical contact substrate H2200 having an external signal input terminal H1301 for receiving an electrical signal from the main unit at the end of the electrical wiring tape is thermocompression bonded using an anisotropic conductive film or the like to be electrically connected. .

  In Example B1 and Comparative Example B1, a photo-curing type sealant is used. However, if a thermosetting sealant is used here, curing in a baking furnace is required and productivity is extremely high. It is necessary to bake at high temperature.

<Example B2 and Comparative Example B2>
As the adhesive H1202, an adhesive having the following composition was prepared.

The product names in Table 3 indicate the following products.
Celoxide 2021P: (Daicel Chemical Industries, alicyclic epoxy resin).
CXT-221: (Oxetane manufactured by Toa Gosei Co., Ltd.).
Adekaoptomer SP-170: (Asahi Denka Co., photocationic polymerization initiator).
Adeka Optron CP-77: (Asahi Denka Co., thermal cationic polymerization initiator).
A-187: (Silane coupling agent manufactured by Nihon Unicar).

  Using these adhesives, the bonding step was performed according to the steps of FIGS. 10A to 10C, FIGS. 11D and 11E, and FIGS. 12F and 12G described above. In the step of FIG. 12 (f), the reaction was fast and fixed in Example B2, but it took a little time to fix in Comparative Example B2 because the reaction was slow. Further, the flow-out amount in the process of FIG. 12 (g) was hardly observed in Example B2, but the flow-out was confirmed in Comparative Example B2. That is, this photothermal combined cationic polymerizable adhesive needs to be aligned with high accuracy and quickly fixed temporarily. Therefore, it is preferable to use alicyclic epoxy having high cationic polymerization as a main component.

  Further, the completed element was assembled into an ink jet recording head. This was immersed in the black ink of an inkjet printer BJF8500 manufactured by Canon Inc. and observed after storage at 60 ° C. for 3 months. Although no change was observed in Example B2, in the comparative example, peeling occurred between the plate H1200 made of the first alumina and the recording element substrate H1100 made using the first Si substrate.

  Furthermore, the following test was done about the adhesive agent (sealant) of Example B1, Example B2, Comparative Example B1, and Comparative Example B2.

  That is, it is cured only by heat at 100 ° C. for 60 minutes, and each cured product is immersed in an ink obtained by removing the black ink dye of BJF8500 and exposed to a steam atmosphere at 121 ° C. and 2 atm to confirm organic eluate in the ink. Was measured by UV absorption. Absorption was hardly observed in Examples B1 and B2, but absorption was observed in Comparative Examples B1 and B2.

  Next, Example (C) of the third aspect of the present invention will be described below.

<Examples C1-C5>
First, the sealing agent of Example A1 was prepared as the sealing resin 11.

  Next, a sealing agent having the following composition was prepared as the sealing resin 5.

The product names in Table 4 indicate the following products.
EHPE3150: (Daicel Chemical Industries, alicyclic epoxy resin).
Celoxide 2021P: (Daicel Chemical Industries, alicyclic epoxy resin).
CXT-221: (Oxetane manufactured by Toa Gosei Co., Ltd.).
Adekaoptomer SP-170: (Asahi Denka Co., photocationic polymerization initiator).
Adeka Optron CP-77: (Asahi Denka Co., thermal cationic polymerization initiator).
A-187: (Silane coupling agent manufactured by Nihon Unicar).

  After the surface layer of the sealing resin 11 is cured, the sealing resin 11 is wired with the sealing agent of Examples C1 to C5 on the electrical signal input terminals on the recording element substrates 1a to 1c side and the lead wires on the wiring substrates 4a to 4c side. It was applied on top and the surface layer was cured by UV light. Conventional thermosetting sealants have high viscosity and high thixotropy, so it takes time to apply, and there is a risk of poor sealing due to entrapment of bubbles, etc. It became.

  Subsequently, thermosetting at 100 ° C. for 1 hour was performed, and the insides of the sealing resin 5 and the sealing resin 11 were cured.

  In Examples C1 to C5, curing was performed at 100 ° C. for 1 hour, but when using a thermosetting sealing resin, heating at a high temperature for a long time is required to obtain ink resistance and a high elastic modulus. become. According to the present invention, since curing can be performed at a relatively low temperature, the range of selection of the material for the support member 7 is widened, and the degree of freedom in the manufacturing process is expanded, for example, a thermosetting process is performed at the end of the assembly process.

  Usually, as described above, the recording element substrates 1a to 1c and the wiring substrates 4a to 4c are electrically connected by lead wires using the TAB mounting technique. The lead wires are protected by the sealing resin 5 in advance as the recording element units 6a to 6c in order to prevent corrosion due to the recording liquid or disconnection due to externally acting force.

  As described above, by applying the sealing resin 5 on the wiring and curing the surface layer by UV curing, the wiring is reliably protected, can be cured at a low temperature in a short time, and is excellent in ink resistance. A reliable inkjet recording head was obtained. Moreover, the sealing resin 11 can also reduce the frequency | count of thermosetting by using the heat-light combination type sealing agent, and productivity improved remarkably.

  When a paper jam test was performed on the resulting inkjet recording head to double-feed the paper, no change was observed in Examples C1 to C3. In Examples C4 and C5, the sealant was slightly scratched, but there was no practical problem. In addition, when the sealing agent of Example A1 was used as the sealing agent 5 for comparison, the sealing agent partially lacked and the wiring was exposed. The Shore D hardness of the sealing resin in each example was as follows.

1 is an exploded perspective view showing a first embodiment of an ink jet recording head of the present invention. FIGS. 2A and 2B are assembly completion views of the ink jet recording head shown in FIG. 1, in which FIG. 1A is an external perspective view, and FIG. 2B is a partially enlarged view of the AA cross section shown in FIG. It is a figure which shows a general recording element board | substrate. FIG. 4 is a diagram illustrating a state in which the recording element substrate illustrated in FIG. 3 is connected to a wiring substrate. FIG. 5 is an exploded perspective view showing a configuration example of a conventional inkjet recording head provided with the recording element unit shown in FIG. 4. FIGS. 6A and 6B are assembly completion views of the ink jet recording head shown in FIG. FIG. 2 is an exploded perspective view showing an example of an ink jet recording head of the present invention. FIG. 2 is an exploded perspective view showing an example of an ink jet recording head of the present invention. FIG. 9 is a perspective view showing the first recording element substrate shown in FIG. 8 with a part thereof broken. It is a perspective view for demonstrating one Embodiment of the manufacturing method of an inkjet recording head. It is a perspective view for demonstrating one Embodiment of the manufacturing method of an inkjet recording head. It is a perspective view for demonstrating one Embodiment of the manufacturing method of an inkjet recording head. FIG. 3 is a diagram showing a state in which a recording element substrate is mounted on a support member.

Explanation of symbols

1, 1a, 1b, 1c Recording element substrate 2 Discharge port 3 Supply port 4, 4a, 4b, 4c Wiring substrate 5,11 Sealing resin 7 Support member 8 Support plate 9 Adhesive resin 10 Wiring integrated substrate H1001 Recording head H1003 Ink supply Unit H1100 First recording element substrate H1102 Ink supply port H1103 Electrothermal conversion element H1104 Electrode H1106 Ink channel wall H1107 Discharge port H1110 Si substrate H1201 Ink supply port H1202 Adhesive

Claims (11)

Another member is bonded to the recording element substrate on which the ink flow path and the ejection port are provided on the substrate on which the ink ejection energy generating element and the wiring for applying the electric pulse are formed. In an ink jet recording head in which a gap with the recording element substrate is sealed,
An ink jet recording head, wherein a sealing agent containing at least an epoxy resin, a cationic polymerization initiator and vinyl ether is used for the sealing. A recording element having at least a plurality of recording elements that discharge recording liquid, and a supply port that is provided on a surface opposite to the surface on which the recording elements are provided and that supplies the recording liquid to the recording elements A wiring having a substrate and an opening for incorporating the recording element substrate and applying an electric pulse for discharging the recording liquid to the recording element substrate by being connected to the recording element substrate A plurality of recording element units each including a substrate; a support member for holding and fixing the recording element substrate; and an opening for the recording element substrate to contact the support member; and the wiring substrate and the support member In an ink jet recording head having a support plate for holding and fixing the wiring board by interposing it in between,
2. The ink jet recording head according to claim 1, wherein a portion of the support plate where the recording element substrate is not provided is sealed with a sealant containing at least an epoxy resin, a cationic polymerization initiator and vinyl ether.   The ink jet recording head according to claim 1, wherein the sealant contains at least an epoxy resin, a thermal cationic polymerization initiator, and a photo cationic polymerization initiator, and the surface layer is cured by active energy rays. On the substrate on which the ink ejection energy generating element and the wiring for applying the electric pulse are formed, another member is bonded to the recording element substrate provided with the ink flow path and the ejection port, and the other member In the method of manufacturing an ink jet recording head having a step of sealing a gap with the recording element substrate,
A method for producing an ink jet recording head, comprising adhering or sealing using a sealant containing at least an epoxy resin, a cationic polymerization initiator, and vinyl ether. Another member is bonded to the recording element substrate on which the ink flow path and the ejection port are provided on the substrate on which the ink ejection energy generating element and the wiring for applying the electric pulse are formed, or the gap is sealed. In an inkjet recording head that is stopped,
An ink jet recording head, wherein an adhesive or sealant containing at least an epoxy resin, a cationic polymerization initiator and oxetane is used. On the substrate on which the ink ejection energy generating element and the wiring for applying the electric pulse are formed, another member is bonded to the recording element substrate provided with the ink flow path and the ejection port, and the other member In the method of manufacturing an ink jet recording head having a step of sealing a gap with the recording element substrate,
A method of manufacturing an ink jet recording head, comprising adhering or sealing using an adhesive or a sealing agent containing at least an epoxy resin, a cationic polymerization initiator, and oxetane. A plurality of recording elements that discharge recording liquid, and a plurality of supply ports that are provided on a surface opposite to the surface on which the recording elements are provided, and that supply the recording liquid to the recording elements. In a method for manufacturing an ink jet recording head, comprising: a recording element substrate; and a support member that holds and fixes the recording element substrate provided with a plurality of supply channels for supplying the recording liquid to the supply ports.
A step of applying an adhesive having a property of being cured when irradiated with ultraviolet rays and a property of being cured when heated to a joint surface between the support member and the recording element substrate;
A step of pressing the recording element substrate and the support member together so that the adhesive protrudes from a bonding surface between the recording element substrate and the support member into a region extending into the supply port of the recording element substrate;
The method of manufacturing an ink jet recording head according to claim 6, further comprising a step of irradiating the adhesive protruding from the joint surface with ultraviolet rays to cure the adhesive and positioning and fixing the recording element substrate with respect to the support member. .   For an ink jet recording head comprising a photothermal combined cationic curable resin composition containing at least a cationic polymerizable resin, a thermal cationic polymerization initiator, and a photo cationic polymerization initiator, and having a Shore D hardness of 30 or more after curing. Wiring protective sealant.   The wiring protective sealant for an inkjet recording head according to claim 8, wherein the cationic curable resin composition contains at least alicyclic epoxy or oxetane.   An ink jet recording head comprising a portion sealed with the wiring protective sealant according to claim 8.   11. A method for manufacturing an ink jet recording head according to claim 10, further comprising a step of curing the surface layer of the wiring protective sealant with active energy rays.

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