JP2002154209A - Ink jet recording head and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize an ejection characteristic and a supply characteristic of a recording liquid and a positioning accuracy of a recording element substrate with respect to a support member when ejection nozzles are arranged in a high density. SOLUTION: An ink jet recording head has a plurality of ejection energy generating elements 4 each for ejecting the recording liquid. The ink jet recording head comprises a recording element substrate 1 which is provided to a face opposite to a face where the elements 4 are provided and has a plurality of recording liquid supply holes 5 for supplying the recording liquid to the elements 4 and a support member 2 for supporting and fixing the recording element substrate 1. A plurality of recording liquid supply passages 2a for supplying the recording liquid to each of the supply holes 5 on the recording element substrate 1 are provided on the support member 2. The width of each the supply passages 2a is narrower than the opening width of the inlet of each of the supply holes 4. A step between the supply passage 2a and the supply hole 5 is filled with an adhesive 10 which extrudes from a bonding face between the recording element substrate 1 and the support member 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head for performing recording by discharging a recording liquid onto a recording medium, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A liquid jet recording apparatus is a recording apparatus of a so-called non-impact recording system, capable of performing high-speed recording and recording on various recording media, and generating almost no noise during recording. It has such features. As a typical example of the liquid ejection recording method used in this type of liquid ejection recording apparatus, there is a method using an electrothermal conversion element as a discharge energy generating element. In a liquid jet recording head using this method, an electrothermal conversion element is provided in a pressurized chamber, and thermal energy is given to the recording liquid by applying an electric pulse serving as a recording signal to the recording medium, and the phase change of the recording liquid at that time The bubble pressure generated at the time of bubbling (at the time of boiling) of the recording liquid is used for discharging the recording liquid droplets.

Further, in a liquid jet recording head using an electrothermal conversion method, a recording liquid is discharged in parallel to a substrate on which electrothermal conversion elements are arranged (edge shooter).
And a method (side shooter) in which the recording liquid is discharged perpendicularly to the substrate on which the electrothermal transducers are arranged.

FIG. 18 is a view showing a state in which a recording element substrate according to the background art of the present application is mounted on a support member.

[0005] As shown in FIG.
The discharge plate 104 provided on the surface side of
A plurality of ejection ports 104a for ejecting the recording liquid are opened in two rows at positions facing ejection energy generating elements (for example, electrothermal conversion elements) 105 which are recording elements, and two rows constitute a set of ejection ports. An exit row is configured.

The recording liquid supply passage 101a is connected to the recording liquid supply port 1
06 has a channel width larger than the opening width of the inlet. Therefore, the recording liquid supply flow paths 101a adjacent to each other
The thickness of the partition wall 101b that separates the recording liquid supply ports 106 is smaller than the distance between the entrance portions of the recording liquid supply ports 106 adjacent to each other.

There are known several assembling methods and the like used for manufacturing the above-described recording element substrate and a liquid discharge head including the same.

For example, Japanese Patent Application Laid-Open No. Hei 9-187952 discloses a method for positioning and assembling a recording element substrate with respect to a method for manufacturing a liquid discharge head. This assembly method
The recording element substrate is precisely positioned by a vacuum suction finger, and the recording element substrate is fixed by an adhesive of a combination of ultraviolet and heat curing.

Japanese Patent Application Laid-Open No. 11-179923 discloses a method of bonding an orifice plate (discharge port plate) to a liquid discharge head main body.

Japanese Patent Application Laid-Open No. 11-188873 discloses a method of bonding a nozzle member to a liquid ejection head body having a plurality of ink chambers.

[0011]

Among the printing element substrates as described above, in particular, in the second printing element substrate 103 having a plurality of ejection port arrays, the number of printing element substrates cut out from one silicon wafer When the number of ejection port arrays 103a is increased without increasing the size of the recording element substrate, or when increasing the number of ejection port arrays 103a, the pitch between the recording liquid supply ports 106 is reduced to increase the density. Must be arrayed.

When the pitch between the recording liquid supply ports 106 is reduced, the partition 101b of the support member 101 is adjusted accordingly.
When the partition wall 101b is thinned, it is difficult to form a thin partition wall having a certain thickness or less on the support member 101 made of ceramic. In addition, a vibration wave generated when the recording liquid is discharged is transmitted along the partition 101b to the adjacent supply flow path, and in the adjacent supply flow path, the supply failure of the recording liquid due to the vibration occurs. Further, if the partition wall 101b is thin, the adjacent supply flow path 1
01a so as not to mix the recording liquids of each other.
There is a concern that it is necessary to further increase the mounting accuracy of the printing element substrate 103 with respect to No. 1.

On the other hand, if the partition wall 101b is too thick, the width of the supply flow path 101a becomes narrow, and it becomes impossible to supply a sufficient amount of the recording liquid to the recording liquid supply port 106.

Therefore, when the pitch between the recording liquid supply ports 106 is reduced, the thickness of the partition wall 101b formed on the support substrate 101 and the supply flow path 1
01a must be determined.

The above-mentioned assembling method and the like used for manufacturing the recording element substrate and the liquid discharge head including the same include the recording element substrate among the places where the adhesive for both ultraviolet and heat curing is applied. Since the ultraviolet irradiation light does not reach the shadowed area of the suction finger to be sucked, it is moved to the next thermosetting step without being completely positioned and fixed, and the position of the recording element substrate is shifted. The UV / thermosetting adhesive, which is located where UV light does not reach the surface, causes the viscosity to drop drastically immediately before thermosetting in the thermosetting process, and the capillary force propagates through the corners of the recording liquid flow path due to capillary force. However, there is a disadvantage that the discharge nozzle is clogged.

The present invention has been made in view of the above points, and when the pitch between the recording liquid supply ports is reduced and the discharge port array is arranged at a high density, the discharge characteristics and supply characteristics of the recording liquid are improved. It is another object of the present invention to provide an ink jet recording head capable of optimizing the positioning accuracy of a recording element substrate with respect to a support member.

Another object of the present invention is to provide a method of manufacturing an ink jet recording head which can improve the reliability of the ink jet recording head.

[0018]

In order to achieve the above object, an ink jet recording head according to the present invention includes a plurality of recording elements for discharging a recording liquid, and a side opposite to a surface on which the recording elements are provided. A recording element substrate provided with a plurality of supply ports for supplying the recording liquid to the recording element, and a portion for incorporating the recording element substrate, and connected to the recording element substrate. Thereby, at least one recording element unit having a wiring substrate for applying an electric pulse for discharging the recording liquid to the recording element substrate, and a support member for holding and fixing the recording element substrate are provided. In the ink jet recording head, the support member is provided with a plurality of supply flow paths for supplying the recording liquid to the respective supply ports of the recording element substrate. Characterized in that the channel width of the respective supply channel is narrower than said opening width of the inlet portion of the supply port.

According to the ink jet recording head constructed as in the present invention, the partition separating the plurality of supply channels formed in the support member from each other is formed between the inlets of the supply ports adjacent to each other on the recording element substrate. Since the recording liquid is formed thicker than the gap, the transmission of the vibration wave when the recording liquid is discharged to the adjacent supply flow path via the partition is suppressed, and the discharge performance of the recording liquid can be improved. Further, since the partition is provided thicker than the interval between the inlets of the adjacent supply ports, not so high accuracy is required for alignment with the region between the partition and the supply port, so that the support member It is not necessary to increase the mounting accuracy of the recording element substrate more than necessary.

Further, each of the supply ports of the recording element substrate may be formed in a tapered shape such that a flow path width becomes narrower from an inlet to an outlet of the supply port.

Further, the recording element substrate and the supporting member may be joined by an adhesive.

Further, a step formed between the supply channel and the supply port is filled with the adhesive so that a gap between the supply port of the recording element substrate and the supply channel of the support member is provided. Can be prevented, and the supply performance of the recording liquid can be prevented from being impaired.

Further, the adhesive may have a property of curing when irradiated with ultraviolet rays and a property of curing when heated. In the present invention, since the width of the supply channel of the support member is formed to be smaller than the opening width of the inlet of the supply port of the print element substrate as described above, the supply port of the print element substrate and the supply of the support member are formed. A step formed between the flow path and the flow path is formed on the upper surface side of the support member, that is, on the side facing the supply port of the printing element substrate. Therefore, the adhesive protruding from the bonding surface between the printing element substrate and the support member is
Irradiation may be by ultraviolet light entering the supply port through the outlet of the supply port. Then, by curing the protruding adhesive with ultraviolet light, it is possible to prevent the incompletely cured adhesive from flowing into the flow channel.

Further, the discharge port plate for discharging the recording liquid provided corresponding to the recording element substrate may be formed of a transparent member.

Further, a support plate interposed between the wiring board and the support member for holding and fixing the wiring board may be further provided.

Further, the method of manufacturing an ink jet recording head according to the present invention comprises a plurality of recording elements for discharging a recording liquid, and is provided on a surface opposite to the surface on which the recording elements are provided. A recording element substrate having a plurality of supply ports for supplying the recording liquid to the element, having a portion for incorporating the recording element substrate, and being connected to the recording element substrate, Manufacture of an ink jet print head comprising at least one print element unit having a wiring substrate for applying an electric pulse for discharging the print liquid, and a support member for holding and fixing the print element substrate In the method, an adhesive having a property of curing when irradiated with ultraviolet light and a property of curing when heated is used to bond the support member and the recording element substrate. Coating the recording element substrate and the supporting member against each other, and extending the adhesive from a bonding surface between the recording element substrate and the supporting member into a supply port of the recording element substrate. A step of irradiating the adhesive protruding from the bonding surface with ultraviolet rays to cure the adhesive and positioning and fixing the recording element substrate with respect to the support member. And

According to the present invention, by positioning and fixing the recording element substrate with respect to the support member by curing the adhesive which has protruded from the joining surface to the ink flow path side (ink supply port side), the recording element with respect to the support member is fixed. After the positioning of the substrate, when the adhesive is moved into a heating furnace for performing the thermosetting step of the adhesive, it is possible to prevent the displacement between the recording element substrate and the support member from occurring. Further, the adhesive can be prevented from flowing into the ink flow path.

Further, the discharge port plate for discharging the recording liquid provided corresponding to the recording element substrate may be made of a transparent member.

Further, the step of applying the adhesive to the joint surface between the recording element substrate and the support member may include the step of applying the adhesive to a region extending from the joint surface between the recording element substrate and the support member. A configuration including a step of applying the adhesive may be adopted.

Further, the recording element substrate is formed in a substantially rectangular shape, and a region extending from the bonding surface is
The recording element substrate formed in the substantially rectangular shape may be configured such that, at both ends in the longitudinal direction, the recording element substrate extends in a width direction perpendicular to the longitudinal direction.

Alternatively, the recording element substrate is constituted by forming a plurality of discharge ports for discharging the recording liquid in a line.
The region extending from the bonding surface may be a region extending in a longitudinal direction of the discharge port array including the plurality of discharge ports.

In the step of pressing the recording element substrate and the support member together to cause the adhesive to protrude from the bonding surface between the recording element substrate and the support member, the recording element substrate is held by a vacuum chuck. After the step of holding and positioning and fixing is completed, the vacuum suction chuck is moved out of the irradiation region of the ultraviolet light, and the vacuum suction of the adhesive protruding from the bonding surface in the step of performing the positioning and fixing is performed. It is preferable to further include a step of irradiating the ultraviolet rays again to a portion where the ultraviolet rays are blocked by the chuck. Thereby, the adhesive in the portion where the ultraviolet rays are blocked is also completely cured, and the positioning and fixing of the support member and the recording element substrate can be performed more reliably.

Further, the part of the adhesive whose ultraviolet rays are blocked by the vacuum suction chuck may be a part arranged in the supply port. In this case, the adhesive can be cured by irradiating the inside of the supply port with ultraviolet rays from the outlet side of the supply port.

[0034] Further, the method includes a step of irradiating the adhesive protruding from the joint surface with ultraviolet rays to cure the adhesive, and then heating the applied adhesive to further thermally cure the adhesive. Thereby, the recording element substrate is completely joined to the support member.

Further, it is preferable that the applied thickness of the adhesive between the recording element substrate and the support member is 4 to 10 μm.

Further, a configuration may be adopted in which a support plate is interposed between the wiring board and the support member, and the wiring board is held and fixed to the support plate.

It is preferable that the width of the supply channel formed in the support member is smaller than the width of the supply port formed in the recording element substrate.

[0038]

Next, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIGS. 1 to 6 are explanatory views for explaining preferred head cartridges, recording heads, and ink tanks to which the present invention is applied or applied, and their respective relationships. is there. Hereinafter, each component will be described with reference to these drawings.

As can be seen from FIGS. 1 and 2, the recording head H1001 of the present invention
The printhead cartridge H1000 includes a printhead H1001 and an ink tank H detachably mounted on the printhead H1001.
1900 (H1901, H1902, H1903, H1
904). The recording head cartridge H1000 is fixedly supported by positioning means and electrical contacts of a carriage (not shown) mounted on the ink jet recording apparatus main body, and is detachable from the carriage. Ink tank H19
01 is for black ink, ink tank H1902 is for cyan ink, ink tank H1903 is for magenta ink, and ink tank H1904 is for yellow ink. Thus, the ink tank H190
1, H1902, H1903, and H1904 are detachable from the print head H1001, and the respective ink tanks are replaceable.
The running cost of image recording by the inkjet recording apparatus is reduced.

Next, the recording head H1001 will be described in more detail, in the order of each of the constituent elements constituting the recording head.

<1> Recording Head The recording head H1001 is a bubble jet (registered trademark) that performs recording using an electrothermal converter that generates thermal energy for causing film boiling to occur in ink according to an electric signal. This is a recording head of a side shooter type.

As shown in the exploded perspective view of FIG. 3, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H200.
0.

Further, as shown in the exploded perspective view of FIG.
The printing element unit H1002 includes a first printing element substrate H
1100, a second recording element substrate H1101, a first plate H1200, an electric wiring tape H1300, an electric contact substrate H2200, and a second plate H1400. The ink supply unit H1003
Are the ink supply member H1500 and the flow path forming member H160.
0, joint rubber H2300, filter H170
0, a seal rubber H1800.

<1-1> Printing Element Unit FIG. 5 is a perspective view showing the structure of the first printing element substrate H1100 in a partially exploded state.

The first recording element substrate H1100 has, for example, an ink supply port H11 formed of a long groove-shaped through hole as an ink flow path on a Si substrate H1110 having a thickness of 0.5 to 1 mm.
02 is formed by a method such as anisotropic etching or sandblasting using the crystal orientation of Si, and the ink supply port H1 is formed.
Electrothermal transducers H which are recording elements on both sides of
1103 are arranged in a row in a staggered manner, and the electrothermal conversion element H1103 and the electrothermal conversion element H1103 are arranged.
The electric wiring such as Al for supplying electric power to the substrate is formed by a film forming technique. Further, electrode portions H1104 for supplying power to the electric wiring are arranged on both outer sides of the electrothermal transducer H1103, and bumps H1105 such as Au are formed on the electrode portions H1104. And the S
On the i-substrate, ink flow path walls H1106 and discharge ports H1107 for forming ink flow paths corresponding to the electrothermal transducers H1103 are formed by a photolithography technique using a resin material to form discharge port arrays H1108. I have. Therefore, since the ejection port is provided to face the electrothermal transducer H1103, the ink supplied from the ink flow path H1102 is ejected by bubbles generated by the electrothermal transducer H1103.

FIG. 6 shows the second recording element substrate H11.
FIG. 1 is a perspective view showing a partially exploded state of 01.

The second recording element substrate H1101 is a recording element substrate for discharging ink of three colors, and has three ink supply ports H1102 formed in parallel, with each of the ink supply ports being sandwiched. Electrothermal conversion elements and ink discharge ports are formed on both sides. Of course, like the first recording element substrate H1100, an ink supply port, an electrothermal conversion element, an electric wiring, an electrode section, and the like are formed on the Si substrate, and an ink flow path and ink ejection are formed on the ink substrate by photolithography using a resin material. An outlet is formed.

Similarly to the first recording element substrate, a bump H1105 such as Au is formed on the electrode portion H1104 for supplying electric power to the electric wiring.

Here, FIG. 4 is referred to again. The first plate H1200 is formed of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The material of the first plate is not limited to alumina, and has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate H1100, and is equal to the thermal conductivity of the material of the recording element substrate H1100. Alternatively, it may be made of a material having the same or higher thermal conductivity. The material of the first plate H1200 is, for example, silicon (Si), aluminum nitride (AlN),
Zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (Si
Any of C), molybdenum (Mo), and tungsten (W) may be used. The first plate H1200 has an ink supply port H1201 for supplying black ink to the first recording element substrate H1100 and an ink for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101. A supply port H1201 is formed, and the ink supply port 1102 of the recording element substrate is connected to the first port.
The first recording element substrate H1100 and the second recording element substrate H1101 correspond to the ink supply ports H1201 of the plate H1200, respectively, and are adhesively fixed to the first plate H1200 with high positional accuracy. It is desirable that the first adhesive H1202 used for bonding has a low viscosity, a low curing temperature, is cured in a short time, has a relatively high hardness after curing, and has ink resistance. The first adhesive H1202 is, for example, a thermosetting adhesive mainly containing an epoxy resin, and the thickness of the adhesive layer is 50 μm.
The following is desirable.

The electric wiring tape H1300 applies an electric signal for discharging ink to the first recording element substrate H1100 and the second recording element substrate H1101, and is used to incorporate the respective recording element substrates. Of the plurality of openings and the electrode portions H11 of the respective print element substrates.
Electrode terminal H1302 corresponding to an electric contact board H2200 having an external signal input terminal H1301 at the end of the wiring tape for receiving an electric signal from the main unit. H1303, and the electrode terminal H1302 and the electrode terminal 1303 are connected by a continuous copper foil wiring pattern.

The electric wiring tape H1300, the first recording element substrate 1100, and the second recording element substrate H1101 are electrically connected to each other.
Electrode portion 1104 of recording element substrate and electric wiring tape H13
00 electrode terminals H1302 are electrically joined by thermosonic crimping.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 to 1 mm, and is made of, for example, a ceramic such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. Is formed. Then, the first recording element substrate H11 bonded and fixed to the first plate H1200
00 and the second printing element substrate H1101 have openings larger than the outer dimensions of the second printing element substrate H1101. Further, the first printing element substrate H1100 and the second printing element substrate H1101 are bonded to the first plate H1200 with a second adhesive H1203 so that the electrical wiring tape H1300 can be electrically connected in a planar manner. The back surface of the wiring tape H1300 is bonded and fixed with a third adhesive H1306.

The first recording element substrate H1100 and the second
Printing element substrate H1101 and electrical wiring tape H1300
The electrical connection portion of the first sealant H1307 (not shown)
And the second sealant H1308 to protect the electrical connection portion from corrosion by ink and external impact.
The first sealant is mainly composed of the electrode terminals H13 of the electric wiring tape.
02 and the outer peripheral portion of the recording element substrate are sealed with the back surface side of the connection portion between the electrode portion H1105 of the recording element substrate, and the second sealing agent seals the front side of the connection portion.

Further, an external signal input terminal H13 for receiving an electric signal from the main unit is provided at an end of the electric wiring tape.
01 is electrically connected by thermocompression bonding using an anisotropic conductive film or the like.

The electric wiring tape H1300 is
Is bent at one side of the plate H1200, and is bonded to the side of the first plate H1200 with a third adhesive H1306. As the third adhesive H1306, for example, a thermosetting adhesive having a thickness of 10 to 100 μm mainly containing an epoxy resin is used.

<1-2> Ink Supply Unit The ink supply member H1500 is formed, for example, by resin molding. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of a glass filler in order to improve shape rigidity.

As shown in FIG. 7, the ink supply member H15
00 is an ink supply unit H for guiding ink from the ink tank H1900 to the recording element unit H1002.
1003, a component of the flow path forming member H1600
Are ultrasonically welded to form an ink flow path H1501. Further, a filter H1700 for preventing dust from entering from the outside is joined to the joint H1517 engaged with the ink tank H1900 by welding, and further, in order to prevent evaporation of ink from the joint H1517, Seal rubber H1800 is mounted.

The ink supply member H1500 also partially has a function of holding the detachable ink tank H1900, and the second claw H1910 of the ink tank H1900.
Has a first hole H1503.

As shown in FIG. 4, a mounting guide H16 for guiding the print head cartridge H1000 to a mounting position on the carriage of the ink jet printing apparatus main body.
01, an engaging portion H150 for mounting and fixing the recording head cartridge to the carriage by a headset lever
8, and an abutting portion H in the X direction (carriage scanning direction) for positioning at a predetermined mounting position of the carriage.
1509, an abutting portion H1510 in the Y direction (recording medium transport direction), and an abutting portion H1511 in the Z direction (ink ejection direction). Also, the recording element unit H1
002, a terminal fixing portion H1512 for positioning and fixing the electrical contact substrate H2200.
A plurality of ribs are provided on and around the surface 2 to increase the rigidity of the surface having the terminal fixing portion H1512.

<1-3> Coupling of Print Head Unit and Ink Supply Unit As shown in FIG. 3, the print head H1001 is obtained by connecting the print element unit H1002 to the ink supply unit H1003, and further to the tank holder H2000. Complete. Coupling is performed as follows.

The ink supply port of the recording element unit H1002 (the ink supply port H120 of the first plate H1200)
1) and the ink supply port of the ink supply unit H1003 (the ink supply port H1601 of the flow path forming member H1600)
Are fixed with screws H2400 so as to press-fit each member via a joint rubber H2300 in order to communicate with each other so that ink does not leak. At this time, the recording element unit H1002 simultaneously moves the ink supply unit in the X direction.
It is accurately positioned and fixed with respect to the reference positions in the Y and Z directions.

The electric contact substrate H1301 of the recording element unit H1002 is connected to the ink supply member H1500.
Are positioned and fixed on one side face by terminal positioning pins H1515 (two locations) and terminal positioning holes H1309 (two locations). The fixing method is, for example, fixing by caulking a terminal connection pin H1515 provided on the ink supply member H1500, but it may be fixed using other fixing means. The completed drawing is shown in FIG.

Further, the connection hole and the connection portion of the ink supply member H1500 with the tank holder are set in the tank holder H20.
00 and the print head H100
1 is completed. The completed drawing is shown in FIG.

<2> Recording Head Cartridge FIGS. 1 and 2 show a recording head cartridge H1000.
Head H1001 and Ink Tank H19 Constituting
FIG. 19 is a diagram for explaining how to mount ink tanks H1901, H1901, H1903, and H1904.
2, H1903 and H1904 contain inks of corresponding colors. Also, as shown in FIG. 7, each ink tank has an ink supply port H1 for supplying the ink in the ink tank to the recording head H1001.
907 are formed. For example, the ink tank 1901
When the recording head H is mounted on the recording head H1001, the ink supply port H1907 of the ink tank H1901 is connected to the recording head H1001.
1001 is pressed against the filter H1700 provided at the joint H1520, and the black ink in the ink tank H1901 passes through the first plate H1200 from the ink supply port H1907 via the ink flow path H1501 of the recording head H1001 to perform the first recording. It is supplied to the element substrate.

Then, ink is supplied to the bubbling chamber having the electrothermal transducer H1103 and the discharge port H1107, and is ejected toward the recording medium as a recording medium by the thermal energy given to the electrothermal transducer H1103.

Next, a description will be given of a process of attaching the first recording element substrate H1100 to the first plate H1200 in the manufacturing process of the recording head having the above-described configuration.

FIGS. 10 (a) to 10 (c), FIGS.
12E, 12F, and 12G are cross-sectional views illustrating an embodiment of the method for manufacturing an ink jet recording head of the present invention. FIGS. 10 to 12 show cross sections of the first printing element substrate H1100 cut along the longitudinal direction of the discharge port array.

10 to 12, reference numeral H101 denotes a transfer pin for applying an adhesive H1202, reference numeral H106 denotes a vacuum suction finger for suctioning and positioning the recording element substrate, and reference numerals H110 and H111 identify the position of the recording element substrate. CCD camera, H112, H113
Indicates an ultraviolet irradiation nozzle.

In the step of attaching the first recording element substrate H1100 to the first plate H1200, first,
As shown in FIG. 10A, an adhesive H1202 is applied to the transfer surface of the transfer pin H101. Subsequently, as shown in FIG. 7A, the transfer surface of the transfer pin H101 is brought into contact with the first plate H1200. Then, as shown in FIG. 3C, the transfer pins H101 are connected to the first plate H1200.
Then, the adhesive H1202 is applied to the bonding portion of the first plate H1200.

At this time, the adhesive H1202 on the first plate H1200 is transferred to a position shifted outward from the position where the first recording element substrate H1100 comes into contact. The adhesive is of an ultraviolet / thermosetting combination type that cures even when irradiated with ultraviolet light or heat, and has a high resistance to ink and excellent transferability.

Next, as shown in FIG. 11D, the first recording element substrate H11 is
Ink flow path wall H11 forming discharge port H1107 of No. 00
06 by suction and holding the CCD cameras H110 and H1.
11, an alignment mark (not shown) of the first recording element substrate H1100 is optically recognized, and alignment with the first plate H1200 is performed.

Subsequently, as shown in FIG. 9E, the positioned vacuum suction finger H106 is lowered, and
Of the printing element substrate H1100 to the first plate H1200
The adhesive H1202 protrudes to the longitudinal end of the first recording element substrate H1100 as shown in FIG. In the figure, the adhesive H1202 appears to protrude only outside the ink flow path, but in fact, the adhesive slightly protrudes into the ink flow path (particularly, the ink supply port H1102) as described later.

Then, as shown in FIG.
Of the first printing element substrate H1100 on the plate H1200 of FIG.
While holding the pressed state, the ultraviolet irradiation nozzle H1
12, H113, adhesive H12 protruding from the end portion
The position of the first recording element substrate H1100 is fixed on the first plate H1200 by irradiating ultraviolet rays on the second substrate H2.

Further, as shown in FIG. 7G, after the vacuum of the vacuum suction finger H106 is released and moved,
Discharge port H1 by ultraviolet irradiation nozzles H112 and H113
Ultraviolet rays are again radiated from the surface 107 to cure the adhesive H1202 which slightly protrudes into the ink flow path (in particular, the ink supply port H1102), and prevents the adhesive from flowing out and clogging the ink flow path and the discharge port. In. A detailed description of the adhesive protruding into the ink flow path using ultraviolet light is shown in FIG.
6 and FIG. 17 will be described later.

Thereafter, the assembly is further heated,
Adhesive H1 of the part which has not yet been cured because it has not reached ultraviolet rays
202 has been cured.

As described above, by temporarily extruding the adhesive from the bonding surface and irradiating the portion with ultraviolet rays, the recording element substrate and the support member can be temporarily fixed. As a result, the next thermosetting process can be performed while maintaining high-precision positioning, which leads to improvement in productivity and quality. Furthermore, since the ink that has protruded into the flow path can be irradiated with ultraviolet rays, the recording element substrate can be more firmly fixed, and the flow of the adhesive into the flow path can be prevented.

FIG. 13 is a perspective view showing the first recording element substrate H1100 shown in FIG. 11E during the assembling process.

As shown in FIG. 13, the adhesive H1202 protrudes from the longitudinal end of the first recording element substrate H1100.

FIG. 14 is a perspective view showing the second recording element substrate H1101 in the state of FIG. 11E during the assembling process.

The second printing element substrate H1101 is also used for the first plate H1200 in the same process as described above.
Positioned and fixed on top. The adhesive H1202 protrudes from the longitudinal end of the second printing element substrate H1101.

If the thickness of the cured adhesive is less than 4 μm, there is a risk of poor adhesion. If the thickness of the adhesive exceeds 10 μm, heat radiation from the recording element substrate to the first plate is hindered. Therefore, there is a possibility that normal ink ejection is not performed. Therefore, the recording element substrate H11
It is desirable that the thickness of the adhesive H1202 between the first plate H001, H1101 and the first plate H1200 is about 4 μm to about 10 μm.

(Second Embodiment) FIG. 15 is a cross-sectional view showing a recording element included in an ink jet recording head according to a second embodiment of the present invention mounted on a support member.

The recording element substrate 1 has a function of discharging the recording liquid in which the electrothermal conversion elements are arranged, and is disposed on the support member 2. The recording element substrate 1 is joined on the support member 2 by an adhesive resin or the like. The support member 2 is made of a ceramic such as alumina (Al ₂ O ₃ ),
The printing element substrate 1 is made of silicon (Si).

A plurality of discharge ports 3a for discharging a recording liquid are provided on a discharge plate 3 provided on the surface side of the recording element substrate 1 with a discharge energy generating element (for example, an electric heating element). The opening is formed in two rows at a position opposing the conversion element) 4, and two rows form a set of discharge ports. In the center of the back side of the recording element substrate 1,
A penetrating recording liquid supply port 5 for supplying a recording liquid from the recording liquid supply flow path 2a of the support member 2 to the discharge ports 3a is opened with a length substantially equal to the length of each discharge port array in the arrangement direction. .

In the present embodiment, even if the recording liquid supply system is arranged at a high density, the recording liquid supply channel 2a has a width capable of supplying a sufficient amount of recording liquid to the recording liquid supply port 5. In addition, the adverse effect of the vibration wave when the recording liquid is discharged from the partition wall 2b of the support member 2 is not transmitted to the adjacent supply flow path 2a, and the requirement for the mounting accuracy of the recording element substrate 1 with respect to the support member 2 is not too high. The purpose of the present invention is to avoid providing an unnecessary step portion that causes bubbles in the recording head.

Therefore, the recording liquid supply flow path 2a of the present embodiment
Have a flow path width smaller than the opening width of the inlet portion of the recording liquid supply port 5 and are adjacent to each other.
The thickness of the partition wall 2b separating a is larger than the interval between the entrance portions of the recording liquid supply ports 5 adjacent to each other. Specifically, the width A of the recording liquid supply path 2a of this embodiment is set to 0.6.
mm, the thickness B of the partition wall 2b is 0.63 mm, and the distance C between the entrances of the adjacent recording liquid supply ports 5 is about 0.25 mm.
mm. Each supply port 5 is formed in a tapered shape such that the width of the flow path becomes narrower from the inlet to the outlet of the supply port 5. In the present embodiment, an example having five liquid flow paths is shown, but the number of liquid flow paths is not limited to this.

According to the present embodiment, the partition wall 2b is provided thicker than the space between the inlet portions of the adjacent recording liquid supply ports 5 (in other words, the recording liquid supply flow path 2a of the support member 2).
Is smaller than the opening diameter of the recording liquid supply port 5 of the recording element substrate 1).
The transmission of the recording liquid to the adjacent supply flow path 2a via the b can be suppressed, and the discharge performance of the recording liquid can be improved. Also,
Since the partition wall 2b is provided thicker than the interval between the adjacent recording liquid supply ports 5, a high mounting accuracy of the recording element substrate 1 with respect to the support member 2 is not required. That is, it also leads to an improvement in productivity.

FIG. 16 and FIG. 17 are cross-sectional views for explaining the joining step between the recording element substrate and the support member shown in FIG.

In the present embodiment, the bonding between the recording element substrate 1 and the support member 2 is performed using an ultraviolet (UV) light-curing adhesive 10.
Is used. Then, by filling the step between the recording element substrate 1 and the support member 2 with the adhesive 10, unnecessary accumulation of liquid and bubbles in the supply path of the recording liquid can be prevented. In an embodiment in which one printing element substrate has a plurality of rows of printing liquid supply ports as in this embodiment, the configuration of the present invention can achieve high density, that is, low cost of the printing element substrate. Further, even at a high density, the thickness of the wall between the supply flow paths of the support member can be increased to some extent, which leads to prevention of crosstalk and improvement of productivity.

When the adhesive 10 applied to the joining surface between the recording element substrate 1 and the support member 2 presses the recording element substrate 1 and the support member 2 together, as shown in FIG. And the side surface of the recording liquid supply port 5. The printing element substrate 1 is
By irradiating ultraviolet light from above, the adhesive 10
Can be cured, so that the adjacent flow path 2a
They are more reliably sealed. Since the discharge port plate 3 is made of a transparent resin material or the like as shown in FIG.
Ultraviolet light can be transmitted. The ultraviolet light is scattered as shown in the figure when passing through the discharge port plate 3, and further, the recording liquid supply port 5 and the recording liquid supply flow path 2a.
Irregularly reflected on the surface of the recording element substrate, the ultraviolet ray can reach the adhesive 10 which has protruded into the recording liquid supply port of the recording element substrate, whereby the adhesive can be quickly cured.
In FIG. 17, for the sake of simplicity, only the left recording liquid supply port 5 is shown in a schematic view in the direction of irradiation of ultraviolet rays. Accordingly, the ultraviolet rays can reach the protruding adhesive 10, and the adhesive 10 can be quickly cured.

Therefore, the temporary fixing between the recording element substrate 1 and the support member 2 can be performed more firmly. Further, as described above, by filling the step portion of the joining surface between the recording element substrate 1 and the support member 2 with an adhesive, unnecessary liquid accumulation and bubble accumulation can be prevented.

In the present embodiment, since the width of the recording liquid supply channel 2a is smaller than the opening width of the entrance of the recording liquid supply port 5, recording is performed at the joint between the support member 2 and the recording element substrate 1. A level difference that becomes a liquid pool is generated. However,
This step can be filled with the adhesive 10 protruding as described above, and the adhesive 10 can be cured by ultraviolet light irradiated from above the recording element substrate 1. Therefore, even if the width of the recording liquid supply flow path 2a is smaller than the opening width of the inlet of the recording liquid supply port 5 as in the present embodiment, a liquid pool is formed in the recording liquid supply path. The recording liquid supply performance is not impaired.

The adhesive 10 used in the present embodiment is not limited to the ultraviolet light curing type, but may be a combination of ultraviolet and heat curing type. In the case where the adhesive 10 of the ultraviolet / thermosetting combination type is used, the adhesive 10 is heated more in addition to irradiating the adhesive 10 with the ultraviolet light as described above, so that the adhesive 10 can be more reliably formed. Can be cured.

In each of the above embodiments, the bubble jet method using an electrothermal converter that generates thermal energy has been described as a recording method, particularly the side shooter type. However, the present invention is not limited to this. Absent. For example, the present invention is also applicable to a so-called piezo discharge method using an electromechanical transducer, and an ink jet head of a type such as an edge shooter type head.

[0096]

As described above, in the ink jet recording head of the present invention, the support member is provided with a plurality of supply channels for supplying the recording liquid to the respective supply ports of the recording element substrate. Since the width of each supply channel is formed to be smaller than the opening width of the inlet of each supply port, the partition walls separating the plurality of supply channels formed in the support member are adjacent to each other on the recording element substrate. It is thicker than the gap between the inlets of the supply port. Therefore, the transmission of the vibration wave when the recording liquid is discharged to the adjacent supply flow path via the partition can be suppressed, and the discharge performance of the recording liquid can be improved. Since very high accuracy is no longer required for alignment with the region, it is possible to eliminate the need to unnecessarily increase the mounting accuracy of the printing element substrate with respect to the support member.

Further, the recording element substrate and the support member are joined with an adhesive, and the step generated between the supply flow path and the supply port is filled with the adhesive protruding from the joint surface between the recording element substrate and the support member. By doing so, it is possible to prevent a liquid pool from being generated between the supply port of the recording element substrate and the supply flow path of the support member, and to prevent the recording liquid supply performance from being impaired.

The method of manufacturing an ink jet recording head according to the present invention comprises the steps of applying an adhesive having a property of curing when irradiated with ultraviolet rays and a property of curing when heated to a support member; Pressing the element substrate and the support member together to cause the adhesive to protrude from the bonding surface between the recording element substrate and the support member, and irradiating the adhesive protruding from the bonding surface with ultraviolet light to cure the adhesive. And the step of positioning and fixing the recording element substrate with respect to the support member. Therefore, it is possible to prevent the displacement of the recording element substrate with respect to the support member after the positioning of the recording element substrate with respect to the support member.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a recording head cartridge according to the present invention, in which a recording head and an ink tank are combined.

FIG. 2 is a diagram illustrating an embodiment of a print head cartridge of the present invention in a state where a print head and an ink tank are separated.

FIG. 3 is an exploded perspective view of the recording head cartridge shown in FIG. 1 and the like.

FIG. 4 is an exploded perspective view of the ink supply unit and the recording element unit shown in FIG.

FIG. 5 is a perspective view showing a first recording element substrate shown in FIG. 4 with a part thereof cut away;

FIG. 6 is a perspective view showing a second recording element substrate shown in FIG. 4 with a part thereof cut away.

FIG. 7 is a sectional view of the recording head cartridge shown in FIG. 1 and the like.

FIG. 8 is a perspective view showing a combined body of a recording element unit and an ink supply unit in the recording head cartridge shown in FIG. 1 and the like.

FIG. 9 is a perspective view illustrating a bottom surface of the recording head cartridge illustrated in FIG. 1 and the like.

FIG. 10 is a cross-sectional view illustrating one embodiment of a method for manufacturing an ink jet recording head of the present invention.

FIG. 11 is a cross-sectional view for explaining one embodiment of a method for manufacturing an ink jet recording head of the present invention.

FIG. 12 is a cross-sectional view for explaining one embodiment of a method for manufacturing an ink jet recording head of the present invention.

FIG. 13 is a perspective view showing the first recording element substrate shown in FIG. 11E during an assembling process.

FIG. 14 shows a second state in the state of FIG.
FIG. 3 is a perspective view showing the recording element substrate of FIG.

FIG. 15 is a cross-sectional view illustrating a state where a recording element included in an inkjet recording head according to a second embodiment of the present invention is mounted on a support member.

16 is a cross-sectional view for explaining a bonding step between the printing element substrate and the support member shown in FIG.

FIG. 17 is a cross-sectional view for explaining a bonding step between the printing element substrate and the support member shown in FIG.

FIG. 18 is a view showing a state in which a recording element substrate is mounted on a support member according to the background art of the present application.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 recording element substrate 2 support member 2a recording liquid supply flow path 2b partition 3 discharge port plate 3a discharge port 4 discharge energy generating element 5 recording liquid supply port 10 adhesive H1, H1a, H1b, H1c recording element substrate H2 discharge port H3 recording Liquid supply port H4, H4a, H4b, H4c Wiring board H5 Sealing resin H6, H6a, H6b, H6c Recording element unit H7 Support member H8 Support plate H10 Wiring integrated board H101 Transfer pin H106 Vacuum suction finger H110, H111 CCD camera H112, H113 UV irradiation nozzle H1000 Recording head cartridge H1001 Recording head H1002 Recording element unit H1003 Ink supply unit H1100, H1100 'First recording element substrate H1101 Second recording element substrate H1102 Ink supply port H 103 Electrothermal conversion element H1104 Electrode H1105 Bump H1106 Ink flow path wall H1107 Discharge port H1108 Discharge port array H1110 Si substrate H1200 First plate H1201 Ink supply port H1202 Adhesive H1300 Electric wiring tape H1301 External signal input terminal H1302 Electrode terminal H1303 Electrode Terminal part H1307 First sealant H1308 Second sealant H1309 Terminal positioning hole H1310 Terminal coupling hole H1400 Second plate H1500 Ink supply member H1501 Ink flow path H1502 Tank positioning hole H1503 First hole H1504 Second Hole H1509 X abutment H1510 Y abutment H1511 Z abutment H1512 Terminal fixing part H1515 Terminal positioning pin H1516 Terminal coupling pin H1520 Joint section H1600 Flow path forming member H1601 Mounting guide H1602 Ink supply port H1700 Filter H1800 Seal rubber H1900 Ink tank H1901 Black ink tank H1902 Cyan ink tank H1903 Magenta ink tank H1904 Yellow ink tank H1907 Ink supply port H1908 Tank positioning pin H1909 First Claw H1910 Second claw H1911 Third claw H1912 Movable lever H2000 Tank holder H2300 Joint rubber H2400 Screw

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shuzo Iwanaga 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Kenta Utagawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inside the Company (72) Inventor Attack Morita 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Osamu 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F Terms (reference) 2C057 AF09 AF93 AG71 AP25 AP77

Claims (18)

[Claims] 1. A printing apparatus comprising: a plurality of printing elements for discharging a printing liquid; and a plurality of supply elements provided on a surface opposite to a surface on which the printing elements are provided, for supplying the printing liquid to the printing elements. A recording element substrate having an opening, and a portion for incorporating the recording element substrate, and an electric device for discharging the recording liquid to the recording element substrate by being connected to the recording element substrate. In an ink jet print head comprising: at least one printing element unit having a wiring substrate for applying a pulse; and a support member for holding and fixing the printing element substrate. A plurality of supply channels for supplying the recording liquid to the respective supply ports are provided, and the width of each supply channel is formed to be smaller than the opening width of the inlet of each supply port. An ink jet recording head according to claim Rukoto. 2. The printing apparatus according to claim 1, wherein each of the supply ports of the recording element substrate is formed in a tapered shape such that a flow path width decreases from an inlet to an outlet of the supply port. The inkjet recording head according to the above. 3. The ink jet recording head according to claim 1, wherein the recording element substrate and the support member are joined with an adhesive. 4. A step formed between the supply channel and the supply port is filled with the adhesive.
3. The ink jet recording head according to item 1. 5. The ink jet recording head according to claim 3, wherein the adhesive has a property of curing when irradiated with ultraviolet rays and a property of curing when heated. 6. The ink jet recording head according to claim 5, wherein an ejection port plate portion provided for the recording element substrate for ejecting a recording liquid is made of a transparent member. 7. The ink jet recording head according to claim 1, further comprising a support plate interposed between said wiring board and said support member for holding and fixing said wiring board. 8. A printing apparatus comprising: a plurality of printing elements for discharging a printing liquid; and a plurality of supply elements provided on a surface opposite to a surface on which the printing elements are provided, for supplying the printing liquid to the printing elements. A recording element substrate having an opening, and a portion for incorporating the recording element substrate, and an electric device for discharging the recording liquid to the recording element substrate by being connected to the recording element substrate. In a method for manufacturing an ink jet recording head, comprising: at least one recording element unit having a wiring substrate to which a pulse is applied; and a support member for holding and fixing the recording element substrate, wherein the composition is cured by being irradiated with ultraviolet rays. Applying an adhesive having a property and having a property of curing when heated to a bonding surface between the support member and the recording element substrate; and the recording element substrate and the support section. Pressing the materials together, causing the adhesive to protrude into a region extending into the supply port of the recording element substrate from the bonding surface between the recording element substrate and the support member; and Irradiating the adhesive with ultraviolet light to cure the adhesive, and positioning and fixing the recording element substrate with respect to the supporting member. 9. The method for manufacturing an ink jet recording head according to claim 8, wherein a discharge port plate portion provided for the recording element substrate for discharging a recording liquid is made of a transparent member. 10. The step of applying the adhesive to a joint surface between the recording element substrate and the support member, the step of applying the adhesive also to a region extending from the joint surface between the recording element substrate and the support member. The method for manufacturing an ink jet recording head according to claim 8, further comprising a step of applying the adhesive. 11. The recording element substrate is formed in a substantially rectangular shape, and a region extending from the bonding surface is formed at both ends in the longitudinal direction of the recording element substrate formed in the substantially rectangular shape in the longitudinal direction. The method for manufacturing an ink jet recording head according to claim 10, wherein the region extends in a width direction perpendicular to the width direction. 12. The printing element substrate, wherein a plurality of ejection ports for ejecting the recording liquid are arranged in rows, and a region extending from the bonding surface is formed of the plurality of ejection ports. The method for manufacturing an ink jet recording head according to claim 10, wherein the region extends in a longitudinal direction of the row. 13. In the step of pressing the recording element substrate and the support member together to cause the adhesive to protrude from the joint surface between the recording element substrate and the support member, the recording element substrate is held by a vacuum chuck. After the step of holding and positioning and fixing is completed, the vacuum suction chuck is moved out of the irradiation region of the ultraviolet ray, and the vacuum suction of the adhesive protruding from the bonding surface in the step of performing the positioning and fixing is performed. The method of manufacturing an ink jet recording head according to claim 8, further comprising a step of re-irradiating the ultraviolet light to a portion where the ultraviolet light is blocked by a chuck. 14. The method of manufacturing an ink jet recording head according to claim 13, wherein a part of the adhesive, the part of which is blocked by the vacuum suction chuck from the ultraviolet rays, is a part arranged in the supply port. 15. The method according to claim 15, further comprising a step of irradiating the adhesive protruding from the joint surface with ultraviolet rays to cure the adhesive, and then heating the applied adhesive to further thermally cure the adhesive. 15. The method for manufacturing an ink jet recording head according to any one of 8 to 14. 16. The method for manufacturing an ink jet recording head according to claim 8, wherein an applied thickness of the adhesive between the recording element substrate and the support member is 4 to 10 μm. . 17. The ink jet recording head according to claim 8, wherein a support plate is interposed between the wiring board and the support member, and the wiring board is held and fixed to the support plate. Manufacturing method. 18. The ink jet recording according to claim 8, wherein a width of a supply channel formed in the support member is formed smaller than a width of the supply port formed in the recording element substrate. Head manufacturing method.