JP2006312240A - Liquid delivering head and recording apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent inferiority of connection such as release of a lead from being generated in an electric connecting part caused by thermal strain in a process where a recording element substrate is electrically connected with an electric wiring board. <P>SOLUTION: A second plate H1400 is stuck on a first plate H1200 on which the recording element substrates H1100 and H1101 are fixed, and after the electric wiring board H1300 is stuck on the second plate H1400, a bump H1105 of the recording element substrates H1100 and H1101 is electrically connected with an electrode lead H1302. In this process, to decrease a thermal strain generated in the electric wiring board H1300, an adhesive layer H1306 for sticking the electric wiring board H1300 with the second plate H1400 is applied by restricting it in a region A<SB>1</SB>on the surrounding of the recording element substrates H1100 and H1101, and a wide unsticking region A<SB>0</SB>is provided so as to adjoin one side of two recording element substrates. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a liquid ejection head and a recording apparatus mounted on a liquid ejection type recording apparatus that performs a recording operation by ejecting a liquid such as ink from an ejection port.

  The liquid discharge head according to the present invention is a general printing apparatus, a copying machine, a facsimile having a communication system, an apparatus such as a word processor having a printing unit, and an industrial combination combined with various processing apparatuses. The present invention can be applied to the recording apparatus.

  A liquid discharge type recording apparatus such as an ink jet printer is a so-called non-impact recording apparatus, which can perform high-speed recording and recording on various recording media, and hardly generates noise in recording. With special features. For this reason, a liquid discharge type recording apparatus is widely adopted as an apparatus that bears a recording mechanism such as a printer, a copier, a facsimile machine, or a word processor.

  A typical liquid ejection method in such a recording apparatus is one that uses an electromechanical transducer such as a piezo element, or one that emits heat by irradiating an electromagnetic wave such as a laser, and ejects droplets by the action of this heat generation. Alternatively, a device in which a liquid is heated by an electrothermal conversion element having a heating resistor and droplets are discharged by the action of film boiling is known.

  In a liquid discharge head using an electrothermal conversion element, an electrothermal conversion element is provided in a liquid chamber, and an electric pulse serving as a recording signal is supplied thereto to generate heat, thereby giving heat energy to the liquid. Recording is performed on a recording medium by ejecting minute droplets from minute holes by using the bubble pressure at the time of foaming (boiling) of the liquid generated by the phase change. Generally, droplets are ejected. And a supply system for supplying a liquid to the nozzle.

  15 and 16 show the configuration of the main part of a liquid discharge head (recording head) mounted in a conventional recording apparatus. For example, as disclosed in Patent Document 1, a plurality of recording element substrates ( The discharge element substrates 1100 and 1101 are bonded to the first plate 1200, and the electric wiring tape (electric wiring board) 1300 is bonded to the second plate 1400 fixed on the first plate 1200. The bumps on the electrodes of the recording element substrates 1100 and 1101 are electrically bonded to the electrode leads of the wiring tape 1300 by a thermal ultrasonic pressure bonding method, and further sealed.

  In recent years, the price of the recording apparatus has been drastically reduced, and how to make the recording head cheap has become an issue. For that purpose, the material cost of parts, especially the integration of the recording element substrate, is most effective. For example, in addition to the integration of three colors of yellow, magenta, and cyan for color, it is frequently used for printing characters and the like. Black is also built into the same head.

  On the other hand, in addition to manufacturing at low cost, both color and black are required to improve recording speed and improve image quality.

In particular, color is required to have high speed and high image quality, and black is required to have an ultra-high speed that is higher than that of color. In such a case, the black recording element substrate, which is required to have a higher speed than the color, has a shape that is longer in the discharge port array direction than that for the color. In addition, higher performance is required year by year, and the recording element substrates are becoming larger for both color and black.
JP 2002-19119 A

  However, when the number of color and black co-recording elements is large as described above, the recording element substrates 1100 and 1101 are large. In particular, the black recording element substrate 1100 has a longer shape in the discharge port array direction than that for color. The electric wiring tape 1300 bonded to the second plate 1400 is also enlarged.

  For example, when a color 0.43 inch recording element substrate 1101 and a black 1 inch recording element substrate 1100 are incorporated in the same head, the surface area A of the electrical wiring tape 1300 is located beside the electrical contact substrate of the color recording element substrate 1101. Is widely present.

  As a result, when the bumps on the electrodes of the recording element substrates 1100 and 1101 are electrically joined to the electrode leads of the electrical wiring tape 1300 by the thermosonic bonding method, the electrical wiring tape 1300 is thermally expanded by the heat at the time of electrical joining, When the electrical wiring tape 1300 contracts by being electrically joined in the state and then cooled, the electrode lead at the electrical joint is peeled off, resulting in poor electrical connection.

  This tends to occur remarkably when the substrate size increases, the lengths of the color and black recording element substrates 1100 and 1101 in the ejection port array direction are greatly different, and a part of the electrical wiring tape surface is wide. There is.

  More specifically, the second plate 1400 has a bonding portion having a very large adhesion area in the surface region A of the electric wiring tape 1300 on the electric contact substrate side of the color recording element substrate 1101. Then, when the electrodes of the recording element substrates 1100 and 1101 and the electrode leads of the electric wiring tape 1300 are electrically bonded by the thermosonic bonding method, the back surface side of the first plate 1200, that is, the second plate 1400 is bonded and fixed. In order to apply heat of 100 ° C. or more to the entire surface on the non-finished side, the larger the adhesion area between the second plate 1400 heated by heat and the electric wiring tape 1300, the more heat is transferred to the electric wiring tape 1300, and the heat Expansion is likely to occur.

  As a result, the electrode lead on the side of the electrical contact substrate of the color recording element substrate 1101, that is, the side where the adhesion area between the second plate 1400 and the electrical wiring tape 1300 is large is the longitudinal direction of the electrode lead and the color recording element substrate 1101. It expands and moves toward the opening side where it is mounted. Thus, the recording element substrate 1101 is electrically connected to the electric wiring tape 1300 in a state where the electrode leads have moved due to thermal expansion, and is sealed with resin. Further, the electrodes of the recording element substrate 1100 and the electrode leads of the electric wiring tape 1300 are also bonded and sealed with resin. This is to prevent short-circuiting with ink liquid or the like.

  As described above, when the electrical wiring tape is cooled to room temperature after electrical joining, the electrical joint tape contracts and the electrical joint between the electrode of the recording element substrate and the electrode lead of the electrical wiring tape is in the longitudinal direction of the electrode lead and on the electrical contact substrate side. The electrode lead is peeled off by being pulled.

  The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and prevents electrical connection failure between the electrical wiring board and the ejection element substrate and improves the reliability of ejection performance. An object of the present invention is to provide a liquid discharge head and a recording apparatus that can be used.

  In order to achieve the above object, a liquid discharge head according to the present invention includes a plurality of discharge element substrates each having discharge means for discharging a liquid, and an electrical wiring board having openings for mounting the plurality of discharge element substrates. An electrical connection portion for electrically connecting the plurality of ejection element substrates to the electrical wiring board, a support means for supporting the electrical wiring board and the plurality of ejection element substrates, and the electrical wiring board A liquid ejecting head having a non-bonding region that does not bond the electric wiring board to the supporting means at a portion adjacent to the opening of the electric wiring board. And

  By making the wide area of the electric wiring board a non-bonding area that is not bonded to the support means, the electric wiring board is electrically connected to the electrical leads due to thermal strain generated in the process of electrically bonding the electrode leads of the electric wiring board and the electrodes of the discharge element substrate. Reduce poor connections. Even when the area of the discharge element substrate or the electric wiring board is large, highly reliable discharge performance by reliable electrical connection can be obtained.

  Embodiments of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the first and second recording element substrates (ejection element substrates) H1100 and H1101 constituting the ejection unit of the recording head, which is a liquid ejection head, are bonded to a first plate H1200 to be electrically The wiring board (electrical wiring tape) H1300 is bonded to the second plate H1400 fixed to the first plate H1200. As shown in FIG. 1B, the electrical wiring board H1300 has a three-layer structure around the bonding part, and has a polyimide base film H1300a on the front side, a copper foil H1300b on the middle, and a solder resist H1300c on the back side. .

  The electrical wiring board H1300 is provided with an opening for inserting the first recording element substrate H1100 and an opening for inserting the second recording element substrate H1101, and the bumps of the recording element substrates H1100 and H1101. An electrode lead H1302 joined to H1105 to form an electrical connection is gold plated and exposed in the opening.

  A manufacturing method of the recording head which is the liquid discharge head configured as described above is as follows. First, the second plate H1400 and the first plate H1200 constituting the support means are bonded by the adhesive layer H1203. The thickness of the adhesive layer H1203 is suppressed to 0.06 mm or less so that the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring board H1300 can be electrically connected in a plane. The second plate H1400 and the first plate H1200 may be bonded before or after the recording element substrates H1100 and H1101 are bonded.

  Next, an adhesive layer H1202 for bonding the first recording element substrate H1100 and the second recording element substrate H1101 is applied and formed on the first plate H1200, and then the recording element substrates H1100 and H1101 are ejected to eject a liquid such as ink. The plurality of electrothermal conversion elements H1103 as means or the respective discharge ports H1107 are pressed and fixed in accordance with the relative positional relationship in the wiring surface direction (see FIGS. 11 and 12).

  Thereafter, an adhesive layer H1306, which is a bonding means for bonding and fixing the back surface of the electrical wiring board H1300, is applied to the second plate H1400, and then the bumps H1105 of the first recording element substrate H1100 and the second recording element substrate H1101. The electrode lead H1302 of the electric wiring board H1300 is aligned and pressed and fixed.

The second plate H1400 adhesive layer H1306 for fixing the electrical wiring board H1300, the limit to the area A ₁ around the opening for mounting the recording element substrate H1100, H1101 as shown in FIG. 1 (a) The remaining area is a non-bonded area A ₀ which is a non-bonded area. As described above, the electrical wiring board H1300 is not bonded to the second plate H1400 without being bonded to the second recording element substrate H1101 on the side of the electrical contact substrate on the side of the electrical contact substrate, and thus is not joined. It is possible to significantly reduce electrical connection failure due to thermal strain generated in the process of electrically bonding the electrode lead H1302 of H1300 to the bump H1105 of the recording element substrates H1100 and H1101.

Region A ₁ in which the second plate H1400 and the electric wiring board H1300 is bonded, adhered width D of the electrode lead side of the electric wiring board H1300 is may be at 17mm or less, preferably it is 14mm or less. However, 2.5 mm or more is necessary for capping.

  Table 1 shows the difference between the bonding width D of the electric wiring board H1300 on the electrode lead H1302 side and the target position where the electrode lead H1302 is joined due to thermal expansion at the time of electrical joining by the thermosonic bonding method. And the result of the comparative measurement about the conventional example which adhere | attached the whole area | region of the electrical wiring board on the 2nd plate is shown.

  In this example, the adhesive width D narrowed to about 4 mm has an average deviation of 1.8 μm at two points, and no lead peeling occurs. On the other hand, in the case of whole area adhesion (adhesion width 28 mm) according to the conventional example, the deviation amount was 6 μm on average in two points, and lead peeling occurred.

From this result, it can be seen that by providing the non-bonded region A ₀ which is a non-bonded region and narrowing the bonding width D as in this embodiment, the amount of deviation is reduced and lead peeling does not occur.

  Table 2 shows the relationship between lead peeling and changing the adhesion width D.

  Lead peeling does not occur until the adhesive width D is 17 mm, but lead peeling occurs at 28 mm. That is, if the adhesion width D is 17 mm or less, lead peeling does not occur. Desirably, if the bonding width D is 14 mm or less, it becomes more reliable.

  As described above, the reliability of electrical connection can be improved by limiting the bonding area of the electrical wiring board H1300.

As shown in FIGS. 2 and 3, the first plate H1200, a second plate respectively forming a notch H1210, H1410 is void in H1400, notch the unbonded area A ₀ of the electric wiring board H1300 H1210 , Bent in H1410.

  In other words, the first and second plates H1200 and H1400 have an L shape with a part removed from the electrical contact substrate side of the second recording element substrate H1101.

  Of the bonding portions between the second plate H1400 and the electric wiring board H1300, the bonding width D on the electrode lead side of the electric wiring board H1300 may be 17 mm or less, and preferably 14 mm or less. However, 2.5 mm or more is necessary for capping.

  Further, the electrical wiring board H1300 has slits H1310 parallel to the ejection port array direction of the first recording element substrate H1100 along the notch H1210 of the second plate H1400. The slit H1310 extends to the bent portion C.

  When the electrode portions of the recording element substrates H1100 and H1101 are electrically joined to the lead portions of the electric wiring board H1300 by the thermosonic bonding method, only the minimum necessary portion is heated from below, so that the heat of the electric wiring board H1300 is heated. Expansion can be suppressed as much as possible. Therefore, peeling of the electrode lead does not occur even after cooling to room temperature. Thereafter, the bent portion B and the vicinity E of the bent portion C of the electric wiring board H1300 are pressed and fixed.

The unbonded region A _0, which is a non-bonded region between the bent portion B and the bent portion C, is in an unrestrained state where the electric wiring board H 1300 is not fixed. For this reason, all the thermal expansion and contraction due to cooling are absorbed here, so that the electrode lead portion of the electric wiring board H1300 is not affected.

  Further, since the slit H1310 is provided between the first recording element substrate H1100 and the heat from here is not transmitted.

  Instead of making both the second plate H1400 and the first plate H1200 L-shaped, as shown in FIGS. 4 and 5, only the second plate H1400 may be L-shaped to form a recess. Good. Other points are the same as in the first embodiment.

  As shown in FIGS. 6 and 7, the first plate H1200 and the second plate H1400 are provided with holes H1220 and H1420 which are empty spaces, respectively.

  That is, the first plate H1200 and the second plate H1400 have a perforated shape in which a relatively large area is cut out on the electric contact substrate side of the second recording element substrate H1101.

  Among the bonding regions where the second plate H1400 and the electric wiring board H1300 are bonded, the bonding width D on the electrode lead side of the electric wiring board H1300 may be 17 mm or less, and preferably 14 mm or less. However, 2.5 mm or more is necessary for capping.

  When the lead part of the electric wiring board H1300 and the electrode parts of the recording element substrates H1100 and H1101 are electrically joined by the thermosonic bonding method, only the minimum necessary part is heated from below, so that the thermal expansion of the electric wiring board H1300 is performed. Does not happen. After that, even if it is sealed and cooled, no shrinkage occurs, and therefore the electrode lead part does not peel off.

  Air accumulated in the perforated portion where the electrical wiring board H1300 and the second plate H1400 do not contact escapes from the gap between the ink supply unit H1003 (see FIG. 9) assembled with the first plate H1200, and therefore air due to heat. There is an advantage that no expansion occurs. Other points are the same as in the first embodiment.

  As described above, according to the first to third embodiments, in the recording head having the configuration in which the bump on the electrode of the recording element substrate and the electrode lead of the electric wiring board are electrically joined by the thermosonic bonding method, The thermal expansion of the electrical wiring board due to heat when the lead part of the board and the electrode part of the recording element substrate are electrically joined by the thermosonic bonding method is suppressed, and shrinkage when cooled to room temperature after joining is reduced. it can. As a result, it is possible to eliminate the lead peeling of the electrical connection portion and realize a reliable electrical connection.

  Next, the entire recording head will be described. As shown in FIGS. 8A and 8B, the recording head H1001 is one component constituting the recording head cartridge H1000, and the recording head cartridge H1000 is detachably attached to the recording head H1001 and the recording head H1001. The ink tank H1900 (H1901, H1902, H1903, H1904) is provided. The recording head H1001 discharges the ink (recording liquid) supplied from the ink tank H1900 from the discharge port according to the recording information, and prints it on the recording medium conveyed by the conveying unit. The recording head cartridge H1000 can be attached to and detached from a carriage placed on the recording apparatus main body.

  The ink tank H1901 is for black ink, the ink tank H1902 is for cyan ink, the ink tank H1903 is for magenta ink, and the ink tank H1904 is for yellow ink.

  In this way, each of the ink tanks H1901, H1902, H1903, and H1904 is detachably attached to the seal rubber H1800 side with respect to the recording head H1001, and each ink tank can be replaced. Cost is reduced.

  Next, each component will be described in detail step by step.

(1) Recording Head The recording head H1001 is a side shooter type recording head that performs recording using an electrothermal transducer (recording element) that generates thermal energy for causing film boiling to the ink in response to an electrical signal. It is. As shown in the exploded perspective views of FIGS. 9 and 10, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000. The recording element unit H1002 includes a first recording element substrate H1100, a second recording element substrate H1101, a first plate H1200, an electrical wiring board H1300, an electrical contact substrate H1301, and a second plate H1400. The ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint seal member H2300, a filter H1700, and a seal rubber H1800.

  A second plate H1400 having an opening is bonded and fixed to the first plate H1200, and the electric wiring board H1300 is electrically connected to the recording element substrate H1100 via the second plate H1400. Hold to be connected. The electrical wiring board H1300 is for applying an electrical signal for ejecting ink to the recording element substrates H1100 and H1101, and has electrical wiring corresponding to the recording element substrates H1100 and H1101. Is connected to an electrical contact board H1301 having an external signal input terminal for receiving an electrical signal from the printer main body, and this external signal input terminal is positioned and fixed on the back side of the ink supply member H1500.

(1-1) Recording Element Unit FIG. 11 is a partially exploded perspective view for explaining the configuration of the first recording element substrate H1100. The first recording element substrate H1100 has a plurality of recording elements (electrothermal conversion elements) H1103 for ejecting ink on one surface of a Si substrate H1110 having a thickness of 0.5 to 1 mm, and electric power to each electrothermal conversion element H1103. An electric wiring such as Al for supplying the film is formed by a film forming technique. A plurality of ink flow paths and a plurality of ejection openings H1107 corresponding to the electrothermal conversion element H1103 are formed by photolithography technology, and an ink supply opening H1102 for supplying ink to the plurality of ink flow paths is provided. It is formed so as to open on the opposite surface (back surface).

  The ink supply port H1102 is formed by a method such as anisotropic etching or sandblasting using the crystal orientation of Si. That is, when the Si substrate H1110 has a crystal orientation of <100> in the wafer surface direction and <111> in the thickness direction, it is approximately 54.7 degrees by anisotropic etching with alkali (KOH, TMAH, hydrazine, etc.). Etching can proceed at an angle of

  Thus, etching is performed to a desired depth to form an ink supply port H1102 composed of a long groove-like through-hole. The electrothermal conversion elements H1103 are arranged in a staggered pattern in one row on both sides of the ink supply port H1102.

  Electric wiring such as Al for supplying electric power to the electrothermal transducer H1103 is formed by a film forming technique. Furthermore, electrodes H1104 for supplying electric power to the electric wiring are arranged on both outer sides of the electrothermal transducer H1103, and bumps H1105 such as Au are formed on the electrode H1104 by a thermosonic bonding method. On the Si substrate H1110, an ink flow path wall H1106 and an ejection port H1107 that form an ink channel corresponding to the electrothermal conversion element H1103 are formed of a resin material by a photolithography technique, and an ejection port group H1108 is formed. ing. Since the ejection port H1107 is provided so as to face the electrothermal conversion element H1103, the ink supplied from the ink supply port H1102 is ejected from the ejection port H1107 by bubbles generated by the heat generation action of the electrothermal conversion element H1103. In Example 1, the length of the first recording element substrate in the longitudinal direction is 1 inch.

  FIG. 12 is a perspective view illustrating the configuration of the second recording element substrate H1101. The second recording element substrate H1101 is a recording element substrate for ejecting ink of three colors, and three ink supply ports H1102 are formed in parallel, on both sides of each ink supply port H1102. An electrothermal conversion element H1103 and an ink discharge port H1107 are formed. The number of ink supply ports is not limited to three, and the same three colors may have five configurations in which magenta and cyan are opposed to both sides with yellow in the middle.

  Similar to the first recording element substrate H1100, an ink supply port H1102, an electrothermal conversion element H1103, an electric wiring, an electrode H1104, and the like are formed on a Si substrate H1110, and an ink flow path is formed of a resin material on the Si substrate H1110 by photolithography. And an ink discharge port H1107 is formed. Similarly to the first recording element substrate H1100, bumps H1105 such as Au are formed on the electrodes H1104 for supplying power to the electrical wiring. In Example 1, the length of the second recording element substrate in the longitudinal direction is 0.43 inch.

Next, the first plate H1200 is formed of an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm, for example. The material of the first plate H1200 is not limited to alumina, but has a linear expansion coefficient equivalent to that of the recording element substrate material, and is equivalent to the thermal conductivity of the recording element substrate material or It may be made of a material having an equivalent or higher thermal conductivity.

Examples of the material of the first plate H1200 include silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), and tungsten (W). Either may be sufficient. The first plate H1200 has an ink supply port H1201 for supplying black ink to the first recording element substrate H1100, and a cyan, magenta, and yellow ink for supplying the second recording element substrate H1101. An ink supply port H1201 is formed, the ink supply port H1102 of the recording element substrate corresponds to the ink supply port H1201 of the first plate H1200, and the first recording element substrate H1100 and the second recording element substrate. H1101 is bonded and fixed to the first plate H1200 with high positional accuracy.

  The adhesive used for bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. For example, it is a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer H1202 shown in FIG. 1 is desirably 50 μm or less.

  The electrical wiring board H1300 applies an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101.

  The electrical wiring board H1300 includes a plurality of openings for incorporating the recording element substrates H1100 and H1101, electrode leads H1302 corresponding to the electrodes H1104 of the recording element substrates H1100 and H1101, and ends of the electrical wiring board H1300. And an electrode terminal portion for making an electrical connection with an electrical contact substrate H1301 having an external signal input terminal for receiving an electrical signal from the printer main body device. The electrode terminal portion and the electrode lead It is connected to H1302 by a continuous copper foil wiring pattern. The electrical wiring board H1300 is made of, for example, a flexible wiring board in which the wiring has a two-layer structure and the surface layer is covered with a resist film.

  A reinforcing plate is bonded to the back surface side (outer surface side) of the external signal input terminal of the electrical contact substrate H1301 to improve the flatness. As the reinforcing plate, for example, a material having heat resistance such as 0.5 to 2 mm glass epoxy or aluminum is used.

  The electrical wiring board H1300, the first recording element substrate H1100, and the second recording element substrate H1101 are electrically connected to each other, and the connection method is, for example, a bump H1105 on the electrode H1104 of the recording element substrate, The electrode lead H1302 of the wiring board H1300 is electrically joined by a thermal ultrasonic pressure bonding method.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 to 1 mm, and is formed of a ceramic material such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. Yes. However, the material of the second plate H1400 is not limited to these, and has a linear expansion coefficient equivalent to that of the recording element substrates H1100 and H1101 and the first plate H1200, and is equivalent to their thermal conductivity. A material having the above thermal conductivity may be used.

  The second plate H1400 has a shape having openings larger than the outer dimensions of the first recording element substrate H1100 and the second recording element substrate H1101 that are bonded and fixed to the first plate H1200. The first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring board H1300 are bonded to the first plate H1200 with an adhesive layer H1203 so as to be electrically connected in a plane, and the electric wiring tape The back surface of H1300 is fixed by an adhesive layer H1306.

  The electrical connection portions of the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring board H1300 are sealed with the first sealant and the second sealant, and the electrical connection portions are made of ink. Protects against corrosion and external impacts. The first sealing agent mainly seals the back surface side of the connection portion between the electrode lead H1302 of the electric wiring board H1300 and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent. Seals the front side of the connecting part.

  Furthermore, an electrical contact substrate H1301 having an external signal input terminal for receiving an electrical signal from the printer main body device at the end of the electrical wiring board H1300 is thermocompression bonded and electrically connected using an anisotropic conductive film or the like. Yes.

  The electric wiring board H1300 is bonded to the second plate H1400, and at the same time is bent along one side surface of the first plate H1200 and the second plate H1400, and an adhesive layer H1306 is formed on the side surface of the first plate H1200. Is adhered by. The adhesive layer H1203 is preferably an adhesive having low viscosity, capable of forming a thin layer on the contact surface, and having ink resistance. The adhesive layer H1306 is preferably a thermosetting adhesive having an epoxy resin as a main component and a thickness of 100 μm or less.

(1-2) Ink Supply Unit The ink supply member H1500 is formed by resin molding, for example. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity.

  As shown in FIGS. 10, 13, and 14, the ink supply member H1500 that detachably holds the ink tank H1900 is a component of the ink supply unit H1003 that guides ink from the ink tank H1900 to the recording element unit H1002. The flow path forming member H1600 is ultrasonically welded to form an ink flow path H1501 from the ink tank H1900 to the first plate H1200.

  Further, a filter H1700 for preventing entry of dust from the outside is joined to the joint portion H1520 engaged with the ink tank H1900 by welding, and further, in order to prevent ink from evaporating from the joint portion H1520. A seal rubber H1800 is attached. The ink supply member H1500 also has a function of holding a detachable ink tank H1900, and has a first hole H1503 for engaging the second claw H1910 of the ink tank H1900. A mounting guide H1601 for guiding the recording head cartridge H1000 to the mounting position of the carriage of the ink jet recording apparatus main body, an engaging portion for mounting and fixing the recording head cartridge to the carriage by the head set lever, and positioning at a predetermined mounting position of the carriage For this purpose, an abutting portion H1509 in the X direction (carriage scanning direction), an abutting portion H1510 in the Y direction (recording medium conveyance direction), and an abutting portion H1511 in the Z direction (ink ejection direction) are provided. In addition, a terminal fixing portion H1512 for positioning and fixing the electrical contact substrate H2200 of the recording element unit H1002 is provided, and a plurality of ribs are provided around the terminal fixing portion H1512 to increase the rigidity of the surface having the terminal fixing portion H1512. ing.

(1-3) Coupling of recording head unit and ink supply unit As shown in FIG. 9, the recording head H1001 is completed by coupling the recording element unit H1002 to the ink supply unit H1003 and further to the tank holder H2000. The coupling is performed as follows.

  Ink does not leak between the ink communication port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) and the ink communication port of the ink supply unit H1003 (ink communication port 1602 of the flow path forming member H1600). In order to communicate, each member is fixed with screws 2400 so as to be pressure-bonded via a joint seal member H2300. At the same time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions in the X, Y, and Z directions of the ink supply unit.

  The electrical contact substrate H1301 of the recording element unit H1002 is positioned and fixed to one side surface of the ink supply member H1500 by terminal positioning pins H1515 (2 places) and terminal positioning holes H1309 (2 places).

  As a fixing method, for example, the terminal positioning pin H1515 provided in the ink supply member H1500 is fixed, but it may be fixed using other fixing means.

  Further, the recording head H1001 is completed by fitting and coupling the coupling hole and coupling portion of the ink supply member H1500 with the tank holder to the tank holder H2000.

  That is, a tank holder portion composed of an ink supply member H1500, a flow path forming member H1600, a filter H1700, and a seal rubber H1800, a recording element substrate H1100, H1101, a first plate H1200, an electric wiring board H1300, and a second plate H1400. The recording head is configured by bonding the recording element portion constituted by the above by bonding or the like.

(2) Description of the print head cartridge As shown in FIGS. 8A and 8B, the print head H1001 and the ink tanks H1901, H1902, H1903, and H1904 constituting the printhead cartridge H1000 are illustrated. The ink tanks H1901, H1902, H1903, and H1904 contain ink of corresponding colors.

  Further, as shown in FIG. 14, each ink tank is formed with an ink communication port H1907 for supplying ink in the ink tank to the recording head H1001. For example, when the ink tank H1901 is attached to the recording head H1001, the ink communication port H1907 of the ink tank H1901 is brought into pressure contact with the filter H1700 provided in the joint portion H1520 of the recording head H1001, and the black ink in the ink tank H1901 communicates with the ink. The ink is supplied from the port H1907 to the first recording element substrate H1100 through the first plate H1200 through the ink flow path H1501 of the recording head H1001. Then, ink is supplied to the foaming chamber having the electrothermal conversion element H1103 and the discharge port H1107, and is discharged toward a recording sheet as a recording medium by the thermal energy applied to the electrothermal conversion element H1103.

The principal part of Example 1 is shown, (a) is the perspective view, (b) is a fragmentary sectional view explaining the cross section of an electrical-connection part. FIG. 6 is a perspective view showing a main part of Example 2. It is a disassembled perspective view which decomposes | disassembles and shows the apparatus of FIG. FIG. 10 is a perspective view showing a modified example of the second embodiment. It is a disassembled perspective view which decomposes | disassembles and shows the apparatus of FIG. FIG. 6 is a perspective view showing a main part of Example 3. It is a disassembled perspective view which decomposes | disassembles and shows the apparatus of FIG. FIG. 2A is a perspective view of a recording head cartridge, and FIG. 2B is an exploded perspective view of FIG. FIG. 3 is an exploded perspective view illustrating a configuration of a recording head. FIG. 3 is an exploded perspective view in which the recording head is further disassembled. FIG. 3 is a partially cutaway explanatory perspective view showing a configuration of a first recording element substrate. FIG. 6 is a partially cutaway explanatory perspective view showing a configuration of a second recording element substrate. FIG. 4 is a perspective view showing an assembly of a recording element unit and an ink supply unit. FIG. 3 is a cross-sectional view of a recording head cartridge. It is a perspective view which shows a prior art example. It is a disassembled perspective view which decomposes | disassembles and shows the apparatus of FIG.

Explanation of symbols

H1000 recording head cartridge H1001 recording head H1002 recording element unit H1003 ink supply unit H1100 first recording element substrate H1101 second recording element substrate H1102 ink supply port H1103 electrothermal transducer H1105 bump H1200 first plate H1300 electrical wiring board H1302 Electrode lead H1306 Adhesive layer H1400 Second plate

Claims (4)

  A plurality of ejection element substrates each having ejection means for ejecting a liquid, an electrical wiring board having an opening for mounting the plurality of ejection element substrates, and the plurality of ejection element substrates are electrically connected to the electrical wiring board, respectively. In the liquid ejection head, comprising: an electrical connection portion for connection; a support means for supporting the electrical wiring board and the plurality of ejection element substrates; and a joining means for joining the electrical wiring board to the support means. A liquid discharge head comprising a non-joining region where the electrical wiring board is not joined to the support means at a portion adjacent to the opening of the electrical wiring board.   The liquid discharge head according to claim 1, further comprising an electrical contact substrate for connecting the electrical wiring board to an external wiring, wherein the non-bonding region is disposed on the electrical contact substrate side.   The liquid discharge head according to claim 1, wherein a recess or a void of the support means is disposed in the non-joining region of the electric wiring board.   A recording apparatus comprising: the liquid discharge head according to claim 1; and a transport unit that transports a recording medium so as to face the liquid discharge head.

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