JP2007313831A - Ink-jet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably carry out sealing by an ink-proof sealing agent at a joint between an electric wiring tape and a contact substrate in an ink-jet recording head since sealing is separately performed in order to seal the upper and lower joints and it is application to a corner part having a step. <P>SOLUTION: This invention enables one-time sealing by providing a slit in the vicinity of the electric wiring tape, thereby enabling stable sealing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet recording head used in an ink jet recording apparatus that performs a recording operation by ejecting a liquid such as ink, and more particularly, from a wiring tape that applies an electrical signal for ink ejection of the ink jet recording head and the ink jet recording apparatus. The present invention relates to a configuration in the vicinity of a connecting portion with a contact substrate for receiving a signal and an ink jet recording head in which the connecting portion is protected with an ink-resistant sealant.

  Conventionally, an inkjet recording apparatus is low in running cost, can be downsized, and can easily support color image recording using a plurality of colors of ink. Widely used and commercialized.

  On the other hand, as an energy generating element that generates energy for ejecting ink from the ejection port of the recording head, an element that uses an electromechanical transducer such as a piezo element, or an electromagnetic wave such as a laser emits heat to generate heat. There are those that discharge ink droplets by the action of, and those that heat a liquid by an electrothermal conversion element having a heating resistor.

  Among them, an ink jet recording system head that uses thermal energy to eject ink droplets enables high-resolution recording because the ejection ports can be arranged at high density. Among them, a recording head using an electrothermal transducer as an energy generating element can be easily reduced in size, and can sufficiently overcome the advantages of IC technology and micromachining technology that have made remarkable progress in technology and improved reliability in the recent semiconductor field. It is advantageous because it can be used in half, easy to mount with high density and inexpensive to manufacture.

  Conventionally, as disclosed in Japanese Patent Laid-Open No. 2000-127404, a wiring tape in which a copper foil is bonded onto a polyimide film, and the copper foil is patterned and gold-plated for applying an electrical signal to a recording element in order to eject ink. And a contact substrate for receiving an electric signal from the ink jet recording apparatus are connected using an anisotropic conductive film made of conductive particles and an insulating adhesive.

Further, as shown in FIG. 2, the connection portion is sealed with an ink-resistant sealant for the purpose of protecting the connection portion from ink mist, ink leakage, and external impact. The side (contact substrate and electrical wiring tape connecting part back side) is also configured to be sealed.
JP2000-127404

  However, the electrical connection between the electrical wiring tape and the contact substrate that receives an electrical signal from the ink jet recording apparatus is connected with an anisotropic conductive film, and the connection portion is connected to the ink-resistant sealant. However, the inkjet recording head configured to be sealed with the ink has the following problems.

(1) Due to the configuration of the wiring pattern of the contact substrate, the plating lead portion for gold plating reaches the end surface of the substrate, so it is plated with the anisotropic conductive film used for electrical connection with the electrical wiring tape. In order to prevent electrical shorting from ink mist or ink leakage during ink ejection, the lead portion cannot be covered (Fig. 3-a). I was sealing. (Figs. 3-c and 3d)
(2) As shown in FIG. 3, the ink-resistant sealant uses a sealant such as silicone RTV, and is applied to the portion of FIG. 3-d when the second sealant is applied ( (C-C cross-section back surface), coating position variation of coating device and viscosity variation of sealant cause defects that the peripheral part of anisotropic conductive film cannot be completely sealed, and electrical leakage due to ink leakage etc. It could cause a short circuit.

  (3) Further, as shown in FIG. 3C, the contact substrate and the electrical wiring tape connecting portion must be sealed on the front side of the connecting portion with the first sealant. A sealant having a viscosity different from that of the sealant is used. For this reason, there are problems such as an increase in the cost of the manufacturing apparatus and an increase in the cost of the product due to an increase in the number of manufacturing process personnel due to an increase in the number of processes.

  Accordingly, in view of the above-described problems of the prior art, the present invention forms a notch portion in which a base film and a cover film are removed from a part of an electric wiring tape, and an ink-resistant seal at a connection portion between the contact substrate and the electric wiring tape. An object of the present invention is to provide a highly reliable ink jet recording head that can ensure the stability of sealing with a stopper and can be manufactured on an inexpensive production line.

  In order to achieve the above object, an ink jet recording head of the present invention holds a plurality of recording elements that discharge recording liquid, a plurality of recording element substrates each having a plurality of electrodes corresponding to the recording elements, and the recording element substrate. A recording element unit comprising a supporting member to be fixed, comprising: an electric wiring tape for applying an electric signal for ejecting ink to the recording element; and a contact substrate for receiving an electric signal from an ink jet recording apparatus; A base film, an adhesive for the base film, an electrical conductor layer, a cover film adhesive, and a cover film, wherein the electrical wiring tape and the contact substrate are electrically connected using an anisotropic conductive film, Inkjet recording head in which anisotropic conductive film connection is sealed with ink sealant The electrical wiring tape wiring pattern portion in the vicinity of the electrical connection portion between the contact substrate and the electrical wiring tape is partially removed in the width direction, the base film and the cover film are widely removed, and a notch portion having a predetermined shape is formed. It is the structure formed.

  The cut-out portion of the electrical wiring tape may have a plurality of independent predetermined shapes.

  The both ends of the electric wiring tape in the width direction may be configured such that the base film and the cover film are not removed.

  Further, the electrical wiring tape notch portion is sealed with the same ink-resistant sealant as the portion electrically connected with the anisotropic conductive film, and the electrical wiring tape notch top surface of the present invention The sealing agent is poured into the structure, so that the sealing between the contact substrate and the electric wiring tape connecting back surface portion can be reliably performed.

  According to the present invention, in order to securely seal both the front and back of the electrical connection portion between the contact substrate and the electrical wiring tape, by providing a notch on the electrical wiring tape side near the connection portion and pouring the sealing agent from the upper surface thereof, Since the back side contact substrate plating lead part (Fig. 3-a) can be reliably sealed, sealing errors due to variations in the sealing agent viscosity, sealing agent shortage due to misalignment of sealing, etc. In addition, it is possible to eliminate an electrical short due to ink mist and ink adhesion when the ink jet recording head is discharged, thereby improving reliability. 3-c part is also sealed on the front side of the connection part, but it can be sealed from the upper surface side of the electrical wiring tape, and the cost of the product can be reduced by reducing the cost of production equipment and manufacturing personnel by reducing the process. Therefore, an inexpensive and highly reliable ink jet recording head can be provided.

  4 to 11 are explanatory diagrams for explaining each of the suitable head cartridge, the recording head, and the ink tank and the relationship thereof in which the present invention is implemented or applied. Hereinafter, each component will be described with reference to these drawings.

  As can be seen from the perspective views of FIGS. 4A and 4B, the recording head H1001 of the present invention is one constituent element of the recording head cartridge H1000. The recording head cartridge H1000 includes the recording head H1001. An ink tank H1900 (a black ink tank H1901, a cyan ink tank H1902, a magenta ink tank H1903, and a yellow ink tank H1904) provided detachably on the recording head H1001 is configured. The recording head cartridge H1000 is fixedly supported by positioning means and electrical contacts of a carriage (not shown) mounted on the ink jet recording apparatus main body, and is detachable from the carriage. The black ink tank H1901 is for black ink, the cyan ink tank H1902 is for cyan ink, the magenta ink tank H1903 is for magenta ink, and the yellow ink tank H1904 is for yellow ink. In this way, each of the ink tanks H1901, H1902, H1903, and H1904 is detachable from the recording head H1001, and each ink tank can be replaced. Thus, the running cost of printing in the ink jet recording apparatus is reduced.

  Next, the recording head H1001 will be described in detail for each component constituting the recording head.

(1) Recording Head The recording head H1001 is a bubble jet (registered trademark) system that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling to the ink in response to an electrical signal. The recording head is a side shooter type.

  As shown in the exploded perspective view of FIG. 5, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.

  Further, as shown in the exploded perspective view of FIG. 6, the recording element unit H1002 includes a first recording element substrate H1100, a second recording element substrate H1101, a first plate H1200, an electrical wiring tape H1300, and an electrical contact substrate H2200. In addition, the ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint rubber H2300, a filter H1700, and a seal rubber H1800.

(1-1) Recording Element Unit FIG. 7 is a partially exploded perspective view for explaining the configuration of the first recording element substrate H1100.

  The first recording element substrate H1100 is anisotropically etched using, for example, a Si substrate H1110 having a thickness of 0.5 to 1 mm and an ink supply port H1102 having a long groove-like through-hole as an ink channel using the crystal orientation of Si. The electrothermal conversion elements H1103 are arranged in a staggered pattern on both sides of the ink supply port H1102 and supply electric power to the electrothermal conversion elements H1103 and the electrothermal conversion elements H1103. An electric wiring (not shown) such as Al is formed by a film forming technique. Furthermore, electrode portions H1104 for supplying power to the electrical wiring are arranged on both outer sides of the electrothermal transducer H1103, and bumps H1105 such as Au are formed on the electrode portion H1104. On the Si substrate H1110, an ink flow path wall H1106 and a discharge port H1107 for forming an ink flow path corresponding to the electrothermal conversion element H1103 are formed of a resin material by a photolithography technique, and a discharge port group H1108. Is forming.

  The ink supplied from the ink flow path H1102 is ejected from an ejection port H1107 provided opposite to the electrothermal conversion element H1103 by bubbles generated by the electrothermal conversion element H1103.

  FIG. 8 is a partially exploded perspective view for explaining the configuration of the second recording element substrate H1101.

  The second recording element substrate H1101 is a recording element substrate for discharging inks of three colors of cyan, magenta, and yellow, and three ink supply ports H1102 are formed in parallel, and each ink supply is supplied. An electrothermal conversion element H1103 and a discharge port H1107 are formed on both sides of the mouth. Of course, like the first recording element substrate H1100, the ink supply port H1102, the electrothermal conversion element H1103, the electric wiring, the electrode portion H1104, and the like are formed in the Si substrate H1110, and a resin material is formed on the Si substrate H1110 by a photolithography technique. An ink flow path and a discharge port H1107 are formed.

  Similarly to the first recording element substrate H1100, a bump H1105 such as Au is formed on the electrode portion H1104 for supplying electric power to the electric wiring.

  Next, the first plate H1200 will be described.

  The first plate H1200 is made of, for example, an alumina (Al2O3) material having a thickness of 0.5 to 10 mm. The material of the first plate H1200 is not limited to alumina, and has a linear expansion coefficient equivalent to that of the material of the recording element substrate H1100, and the thermal conductivity of the material of the recording element substrate H1100. It may be made of a material having a thermal conductivity equal to or greater than. The material of the first plate H1200 is, for example, any of silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si3N4), silicon carbide (SiC), molybdenum (Mo), and tungsten (W). May be. The first plate H1200 has ink supply ports H1201 for supplying black ink to the first recording element substrate H1100 and inks for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101. A supply port H1201 is formed, each ink supply port 1102 of the first recording element substrate H1100 and the second recording element substrate H1101 corresponds to the ink supply port H1201 of the first plate H1200, and the first The recording element substrate H1100 and the second recording element substrate H1101 are bonded and fixed to the first plate H1200 with high positional accuracy. The first adhesive used for bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

  The electrical wiring tape H1300 applies an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101, and includes a plurality of recording element substrates. An opening, an electrode terminal H1302 corresponding to the electrode portion H1104 of each recording element substrate, and an external signal input terminal H1301 for receiving an electric signal from the main body device are provided at the end of the electric wiring tape H1300. The electrode terminal portion H1303 for electrical connection with the electrical contact substrate H2200 is connected, and the electrode terminal H1302 and the electrode terminal H1303 are connected by a continuous copper foil wiring pattern.

  The electrical wiring tape H1300, the first recording element substrate 1100, and the second recording element substrate H1101 are electrically connected to each other, and the connection method is, for example, bumps on the electrode portions H1104 of the first recording element substrate H1100. H1105 and the electrode terminal H1302 of the electric wiring tape H1300 corresponding to the electrode portion H1104 of the first recording element substrate H1100 are electrically joined by the thermosonic bonding method, and similarly the electrode portion of the second recording element substrate H1101. The bump H1105 of the H1104 and the electrode terminal H1302 of the electric wiring tape H1300 corresponding to the electrode portion H1104 of the second recording element substrate H1101 may be electrically joined by a thermosonic bonding method.

  The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 mm to 1 mm, and is formed of a ceramic material such as alumina (Al2O3) or a metal material such as Al or SUS. The shape is a shape having openings larger than the outer dimensions of the first recording element substrate H1100 and the second recording element substrate H1101 that are bonded and fixed to the first plate H1200. Further, the second plate H1400 is connected to the first plate H1200 with the second adhesive so that the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 can be electrically connected in a plane. And the back surface of the electric wiring tape H1300 is bonded and fixed by the third adhesive.

  Electrical connection portions of the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are sealed with a first sealing agent H1307 and a second sealing agent H1308 (see FIG. 12). The electrical connection is protected from ink corrosion and external impact. The first sealing agent H1307 mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape H1300 and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent. The agent H1308 seals the front side of the connection portion described above.

  Further, an electrical contact substrate H2200 having an external signal input terminal H1301 for receiving an electrical signal from the main body device at the end of the electrical wiring tape H1300 is electrically bonded by thermocompression bonding using an anisotropic conductive film or the like. Connected.

  Then, the electric wiring tape H1300 is bent at one side surface of the first plate H1200, and is bonded to the side surface of the first plate H1200 with the third adhesive H1306. As the third adhesive H1306, for example, a thermosetting adhesive having an epoxy resin as a main component and a thickness of 10 μm to 100 μm is used.

  As shown in FIG. 2, the electrical connection portion between the electrical wiring tape H1300 and the electrical contact substrate H2200 is sealed with an ink-resistant first sealant H2500 to protect it from ink leakage and mist. Further, as shown in FIG. 3B, the back surface of the connection portion is also protected by the second sealant H2501. For example, silicone RTV is used as the ink-resistant sealant.

(1-2) Ink Supply Unit The ink supply member H1500 is formed by resin molding, for example. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity.

  As shown in FIGS. 6 and 9, the ink supply member H1500 is a component of the ink supply unit H1003 for guiding ink from the ink tank H1900 to the recording element unit H1002, and the flow path forming member H1600 is ultrasonically welded. As a result, an ink flow path H1501 is formed. In addition, a filter H1700 for preventing entry of dust from the outside is joined to the joint H1517 engaged with the ink tank H1900 by welding. Further, in order to prevent ink from evaporating from the joint H1517 portion, A seal rubber H1800 is attached.

  The ink supply member H1500 also has a part of the function of holding the removable ink tank H1900, and a first hole H1503 that engages with the second claw H1910 of the ink tank H1900 is formed. Also, a mounting guide H1601 for guiding the recording head cartridge H1000 to the mounting position of the carriage of the ink jet recording apparatus main body, an engaging portion for mounting and fixing the recording head cartridge H1000 on the carriage by the head set lever, and a predetermined carriage An abutting portion H1509 in the X direction (carriage scan direction) for positioning at the mounting position, an abutting portion H1510 in the Y direction (recording medium conveyance direction), and an abutting portion H1511 in the Z direction (ink ejection direction) are provided. . In addition, a terminal fixing portion H1512 for positioning and fixing the electrical contact substrate H2200 of the recording element unit H1002 is provided, and a plurality of ribs are provided around the terminal fixing portion H1512 to increase the rigidity of the surface having the terminal fixing portion H1512. ing.

(1-3) Coupling of recording head unit and ink supply unit As shown in FIG. 5, the recording head H1001 is completed by coupling the recording element unit H1002 to the ink supply unit H1003 and further to the tank holder H2000. . These couplings are performed as follows.

  The ink supply port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) and the ink supply port of the ink supply unit H1003 (ink supply port H1602 of the flow path forming member H1600) are communicated so as not to leak. Therefore, each member is fixed with the screw H2400 so as to be pressure-bonded via the joint rubber H2300. At the same time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions of the ink supply unit H1003 in the X, Y, and Z directions.

  The electrical contact substrate H2200 of the recording element unit H1002 is positioned and fixed to one side surface of the ink supply member H1500 by terminal positioning pins H1515 (2 places) and terminal positioning holes H1309 (2 places). The fixing method is, for example, fixing by crimping a terminal coupling pin H1515 provided on the ink supply member H1500, but may be fixed using other fixing means. The state in which the recording element unit H1002 is assembled to the ink supply unit H1003 in this way is shown in FIG. 10, and further, the coupling hole and the coupling portion of the ink supply member H1500 with the tank holder H2000 are fitted and coupled to the tank holder H2000. Thus, the recording head H1001 is completed. FIG. 11 shows a recording head H1001 completed by assembling the ink supply unit H1003 and the recording element unit H1002 to the tank holder H2000.

(2) Description of Print Head Cartridge As shown in FIGS. 4A and 4B, a black ink tank H1901, a cyan ink tank H1902, and magenta mounted on the printhead H1001 constituting the printhead cartridge H1000. As described above, the ink of the corresponding color is stored in each of the ink tank H1903 and the yellow ink tank H1904. Further, as shown in FIG. 6, each ink tank H1901, H1902, H1903, H1904 is formed with an ink supply port H1907 for supplying the ink in each ink tank H1901, H1902, H1903, H1904 to the recording head H1001. Has been. For example, when the ink tank H1901 is attached to the recording head H1001, the ink supply port H1907 of the black ink tank H1901 is brought into pressure contact with the filter H1700 provided in the joint H1517 of the recording head H1001, and the black ink in the black ink tank H1901 is ink. The ink is supplied from the supply port H1907 to the first recording element substrate H1100 through the first plate H1200 via the ink flow path H1501 of the recording head H1001.

  Then, ink is supplied to a bubbling chamber (not shown) having the electrothermal conversion element H1103 and the discharge port H1107, and is ejected toward a recording sheet as a recording medium by heat energy applied to the electrothermal conversion element H1103.

  FIG. 1A shows an electric wiring tape H1300 of an ink jet recording head according to an embodiment of the present invention, in which a base film and a cover film are partially removed in the width direction in the vicinity of an electric connection portion with a contact substrate wiring, and a notch portion is formed. It is the perspective view which showed having been formed. Moreover, the notch part is also a structure which consists of several independent predetermined shapes, and also the both ends of an electric wiring tape width direction are perspective views showing the state without a notch.

  Conventionally, the contact substrate wiring pattern H501 has reached the tip of the contact substrate as shown in FIG. 3A and also reaches the end surface (side surface) of the substrate. Therefore, sealing with an ink-resistant sealant is required. In order to prevent electrical short-circuiting from ink mist and ink leakage when the inkjet recording head is discharged.

  Actually, as shown in FIGS. 3C and 3D, the periphery of the electrical connection portion is coated with an ink-resistant sealant on the upper surface side of the electrical wiring tape and the back surface side of the electrical wiring tape as in the cc cross section. Both sides were sealed. However, when sealing the back surface side of the electrical connection portion as shown in FIG. 3D, sealing is performed with the second sealant H2501, but there is a difference in level difference between the contact substrate and the electrical wiring tape and the wettability of the surface. The contact substrate plating lead H2201 shown in FIG. 3A may not be completely covered by the viscosity variation of the sealant, which may cause an electrical short circuit due to ink leakage or mist. was there.

  In addition, when sealing Fig. 3-c and Fig. 3-d with sealant, two types of sealants with different viscosities are used, increasing investment in production equipment and increasing product costs due to increased processes. It was causing.

Therefore, as in the embodiment of the present invention, a notch portion in which the base film and the cover film are removed is formed in the vicinity of the electrical connection portion of the electrical wiring tape with the contact substrate, and H2501 is sealed from the upper surface of the notch portion. By pouring the agent, it is possible to completely cover the back side contact substrate plating lead part H2201. (FIGS. 1-a, 1-b, 1-c)
Also, the front side, which is the electrical connection portion between the electrical wiring tape and the contact substrate, can be sealed from the same direction, and by using the H2501 sealant, the process is reduced and the cost is reduced by unifying the sealant. be able to.

  Furthermore, the notch portion of the electric wiring tape does not reach both end portions in the width direction, and the structure of both end portions is not removed from the cover film and the base film. Even if it is applied, it is possible to prevent the disconnection of the pattern of the electric conductor layer pattern while maintaining the strength.

  1A is a perspective view showing a plurality of notches that are independent in the width direction of the electric wiring tape according to the embodiment of the present invention.

  As described above, the configuration of the plurality of independent notches is further advantageous against the stress in the twisting direction of the electric wiring tape, and the conventional configuration can be used as it is for the inkjet recording head assembly and production equipment. it can.

(A) It is an external appearance perspective view of the electrical wiring tape which is the 1st Embodiment of this invention. (B) It is a perspective view of the state which sealed the connection part of the electrical wiring tape which is the 1st Embodiment of this invention, and a contact board | substrate. (C) It is DD sectional drawing of FIG. 1-b of the state which sealed the electrical wiring tape which is the 1st Embodiment of this invention, and a contact substrate connection part. It is a perspective view which shows the state which sealed the contact substrate and the electrical wiring tape connection part. (A) It is the perspective view which showed the state of the connection part of a contact substrate and an electrical wiring tape from the back surface. (B) It is the perspective view which showed the state of the anisotropic conductive film which electrically connects a contact substrate and an electrical wiring tape. (C) It is the perspective view which showed the state which connected the contact substrate and the electrical wiring tape, and was sealed with the sealing agent. (D) It is a partial cross section figure in the CC line of FIG. 3-c which showed the state which has sealed the electrical connection part back surface. 1 is an external perspective view of a recording head cartridge according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the recording head cartridge shown in FIG. FIG. 3 is an exploded perspective view of an ink supply unit and a recording element unit shown in FIG. 2. FIG. 4 is a perspective view in which the first recording element substrate shown in FIG. 3 is partially broken. FIG. 4 is a perspective view in which the second recording element substrate shown in FIG. 3 is partially broken. FIG. 2 is a side sectional view of the recording head cartridge shown in FIG. 1. FIG. 4 is a perspective view illustrating a state where a recording element unit is assembled to an ink supply unit. FIG. 3 is a perspective view showing a recording head completed by assembling an ink supply unit and a recording element unit to a tank holder. FIG. 3 is a partial cross-sectional view of the recording element unit taken along line BB shown in FIG. 2.

Explanation of symbols

H500 Electrical contact substrate empty space H501 Electrical contact substrate wiring pattern H502 Electrical contact substrate independent convex portion H503 Anisotropic conductive film H504 Electrical contact substrate convex portion H1000 Recording head cartridge H1001 Recording head H1002 Recording element unit H1003 Ink supply unit H1100, H1100 ', H1100 "first recording element substrate H1101, H1101', H1101" second recording element substrate H1101C second recording element substrate for cyan H1101M second recording element substrate for magenta H1101Y second recording element substrate for yellow H1102 Ink supply port H1103 Electrothermal conversion element H1104, H1104 "Electrode H1105, H1105" Bump H1106 Ink channel wall H1107 Outlet H1108 Discharge port array H1110 Si substrate H1200 First plate H1201 Ink supply port H1300, H1300 ′, H1300 ”Electrical wiring tape H1301 External signal input terminal H1302, H1302 ′, H1302a, H1302b Electrode terminal H1303 Electrode terminal portion H1304 Thermosetting adhesion Resin H1305 First bent portion H1306 Third adhesive H1307 First sealant H1308 Second sealant H1309 Terminal positioning hole H1310 Terminal coupling hole H1311 Electric wiring tape Base film H1312 Electric wiring tape Cover film H1313 Electric wiring Tape Electrical conductor layer H1400 Second plate H1500 Ink supply member H1501 Ink flow path H1502 Tank positioning hole H1503 First hole H150 Second hole H1505 Third hole H1506 Opening portion H1508 Engaging portion H1509 X abutting portion H1510 Y abutting portion H1511 Z abutting portion H1512 Terminal fixing portion H1514 Intercolor rib H1515 Terminal positioning pin H1516 Terminal coupling pin H1517 Joint H1600 Flow path forming member H1601 Mounting guide H1602 Ink supply port H1700 Filter H1800 Seal rubber H1900 Ink tank H1901 Black ink tank H1902 Cyan ink tank H1903 Magenta ink tank H1904 Yellow ink tank H1907 Ink supply port H1908 Tank positioning pin H1909 First claw H1910 Second Claw H1911 3rd claw H1912 Movable lever H2000 Tank holder H220 Electric contact substrate H2201 electrically contact substrate plating lead portion H2300 joint seal member H2400 bis H2500 ink resistance first sealant H2501 ink resistance second sealant

Claims (4)

  A recording element unit comprising a plurality of recording elements for discharging recording liquid, a plurality of recording element substrates having a plurality of electrodes corresponding to the recording elements, and a support member for holding and fixing the recording element substrate. An electric wiring tape for applying an electric signal for ejecting ink and a contact substrate for receiving an electric signal from an ink jet recording apparatus, wherein the electric wiring tape includes a base film, an adhesive for the base film, and an electric conductor A layer, a cover film adhesive, and a cover film, wherein the electrical wiring tape and the contact substrate are electrically connected using an anisotropic conductive film, and the connecting portion of the anisotropic conductive film is an ink resistant sealant In the ink jet recording head sealed with, the electrical connection portion between the contact substrate and the electrical wiring tape Electric wiring tape wiring pattern portion is a portion in the width direction beside portion, the base film and the cover film is widely removed, the ink jet recording head, wherein a notched portion of a predetermined shape is formed.   2. The ink jet recording head according to claim 1, wherein the cutout portion of the electrical wiring tape has a plurality of independent predetermined shapes.   The inkjet recording head according to claim 1, wherein the base film and the cover film are not removed at both ends in the width direction of the electric wiring tape.   The said electrical wiring tape notch part is sealed using the same ink-proof sealant as the part electrically connected with the said anisotropic conductive film, The Claims 1-3 characterized by the above-mentioned. Inkjet recording head.

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