JP2005305960A - Ink-jet recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform an electric mounting stably which requires heating with a short baton, not depending on the material or size of the plate supporting and fixing a recording element substrate. <P>SOLUTION: In the ink-jet recording head which is equipped with the recording element substrates having two or more recording elements discharging a recording liquid and electrodes for transmitting electric signals, a first plate for supporting and fixing the recording element substrates and an external wiring substrate which has electric terminals electrically connected to each electrode of each recording element substrate, the first plate has an opening at the part located on the electrode rear face, and an electric joining process is performed while directly heating the rear face of the recording element substrates through the opening using a heating means. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inkjet recording head used in an inkjet recording apparatus that performs a recording operation by discharging a liquid such as ink, and a method for manufacturing the inkjet recording head. The present invention can be applied to a general printing apparatus, a copying machine, a facsimile having a communication system, an apparatus such as a word processor having a printing unit, or a multifunction recording apparatus combining these apparatuses.

  Inkjet recording devices have low running costs, can be miniaturized, and are ready to support color image recording using multiple colors of ink. Used and commercialized.

  On the other hand, as an energy generating element that generates energy for ejecting ink from the ejection port of the recording head, an element that uses an electromechanical transducer such as a piezo element, or an electromagnetic wave such as a laser emits heat to generate heat. There are those that discharge ink droplets by the action of, and those that heat a liquid by an electrothermal conversion element having a heating resistor.

  Among them, an ink jet recording system head that ejects ink droplets using thermal energy can perform high-resolution recording because the ejection ports can be arranged at high density. Among them, a recording head using an electrothermal transducer as an energy generating element can be easily reduced in size, and can sufficiently overcome the advantages of IC technology and micromachining technology that have made remarkable progress in technology and improved reliability in the recent semiconductor field. It is advantageous because it can be used in half, easy to mount with high density and inexpensive to manufacture.

  Conventionally, as in JP-A-10-776, a lead (electrode terminal) of a flexible film wiring board (hereinafter also referred to as an electric wiring tape or an external wiring board) in which a copper foil is bonded and patterned on a polyimide film and then plated. In addition, a method is known in which bumps on the electrodes of the recording element are electrically bonded by a thermal ultrasonic pressure bonding method, further sealed, and then bonded to a support. In addition, as disclosed in Japanese Patent Application Laid-Open No. 11-138814, a plurality of recording elements are connected to independent electric wiring tapes and then bonded to a support. Japanese Patent Application Laid-Open No. 11-138814 has a plurality of recording elements for color printing, but there are some in which the inside is divided so that color printing can be performed on a single substrate.

  In recent years, the price of inkjet recording apparatuses has been drastically reduced, and it has become a problem how to make inkjet recording heads cheaper. For this purpose, the material cost of the parts, particularly the integration of the recording element substrate, is most effective. For example, it is often used to integrate three colors of yellow, magenta, and cyan for color. Further, black frequently used for printing characters and the like is often incorporated into the same head. On the other hand, in addition to manufacturing inexpensively, particularly in the case of black, improvement in recording speed is required, and by increasing the number of recording elements, a method of achieving this is often taken, but in such cases, The black recording element substrate has a shape that is longer in the ejection port array direction than that for color. As described above, a method for mounting a plurality of different recording element substrates on a single electric wiring tape is employed in Japanese Patent Application Laid-Open No. 2002-19130. Use of a single electric wiring tape as disclosed in JP-A-2002-19130 is advantageous because the recording head becomes compact and the cost of the recording head is reduced, and the printing apparatus is also compact and low-cost. . In such a configuration, since relative positional accuracy between a plurality of recording element substrates is required, in Japanese Patent Application Laid-Open No. 2002-19130, a plurality of recording element substrates are first positioned and fixed on a plate, and thereafter The order of steps is adopted in which an external wiring substrate is attached to a plate and an electrical bonding step is performed.

By the way, materials such as alumina (Al ₂ O ₃ ) have been used for the plate for fixing the recording element substrate. Alumina has a high thermal conductivity and has a function of dissipating the temperature rise of the recording element substrate during the printing operation.

A cross-sectional view of such an ink jet recording head having a conventional configuration is shown in FIG. In FIG. 18, a recording element substrate H1100 is supported and fixed on a plate H1290 made of alumina or the like, and an electric wiring tape H1300 is positioned and attached. Electrode terminals H1302 extending from the electric wiring tape H1300 are bonded to each other by bumps H1105 formed on electrodes (not shown) of the recording element substrate H1100 by a thermosonic bonding method. Intermetallic bonding is achieved by passing the recording element substrate from the back side of the alumina plate by the heater T and heating the electrical junction.
Japanese Patent Laid-Open No. 10-776 Japanese Patent Laid-Open No. 11-138814

  However, due to the recent high-speed printing of inkjet recording apparatuses, the temperature rise of the recording element substrate during printing operation becomes more severe. To suppress this, the thickness of the plate made of alumina or the like is increased, or the volume is increased. There is a movement to increase.

  On the other hand, since the price of inkjet recording devices has fallen sharply, there has been a movement toward adopting plates made of lower-cost resin materials from relatively expensive alumina, particularly in low-price inkjet recording devices. Yes.

In such a movement, the following problems are starting to occur in the ink jet recording head having the above configuration.
(1) Increasing the thickness of the alumina plate or increasing the volume provides a higher heat dissipation effect during the printing operation, but conversely, electricity that requires heating by the thermosonic bonding method or the like. In the mounting process, even if the plate on which the recording element substrate is fixed is heated with a heater or the like, the temperature of the recording element substrate (electrode part) does not rise easily, so mounting cannot be performed immediately, resulting in a manufacturing tact. It becomes long and costs increase.
(2) Further, in a plate made of a resin material, a general resin material has an extremely low thermal conductivity as compared with alumina or the like. It is difficult to use the required electrical mounting method. (In the method of electrical mounting after fixing the recording element substrate to the plate first)
The object of the present invention is to solve the above-mentioned problems of the prior art, and can stably carry out electrical mounting such as a thermal ultrasonic pressure bonding method that requires heating, regardless of the material and size of the plate. An ink jet recording head capable of performing ink jet recording and an ink jet recording head manufacturing method are provided.

  In order to achieve the above object, an ink jet recording head of the present invention includes a recording element substrate having a plurality of recording elements for discharging a recording liquid, an electrode for transmitting an electrical signal to each of the recording elements, and the recording element. In the ink jet recording head, comprising: a first plate for supporting and fixing the substrate; and an external wiring substrate having electrode terminals electrically connected to the electrodes of the recording element substrates. An opening is formed in a portion located on the back surface of the recording element substrate, and an electrical joining step between the electrode and the electrode terminal is performed while heating the back surface of the recording element substrate using a heating unit directly through the opening. It is characterized by that.

  In the ink jet recording head of the present invention as described above, when the electrode terminals of the external wiring substrate are connected, the back surface of the recording element substrate is directly heated to perform the electrical joining process, so that the electrode portion of the recording element substrate is rapidly As a result, the temperature rises, the manufacturing tact time is short, and stable electrical connection is possible. In addition, since it is not necessary to heat through the first plate, it is not always necessary to select a material having high thermal conductivity for the first plate. For example, a resin material can be used, so that the component cost is low. Thus, an inexpensive ink jet recording head can be configured.

  In the ink jet recording head of the present invention, it is desirable that the opening is located on the back of the electrode or in the vicinity of the back.

  Thereby, heating of the electrode part to be electrically bonded can be performed more rapidly and stably, and thus it is possible to perform a highly reliable electrical bonding process with a short tact.

  Furthermore, the inkjet recording head of the present invention includes each step in the order of a step of supporting and fixing each recording element substrate to the first plate, a step of fixing the external wiring wiring substrate to the first plate, and the electric joining step. The process of implementing may be included.

  Further, the effect of the present invention is exhibited when the first plate is made of a resin material having a low thermal conductivity.

  The ink jet recording head of the present invention as described above can perform the electrical joining process after accurately positioning and fixing the recording element substrate to the first plate, and as a result, can perform high-quality printing. Further, even when the first plate is made of a resin material, the recording element substrate can be directly heated, so that a highly reliable electrical bonding process is possible, and the cost of components due to the use of the resin material is reduced. Reduction is possible.

  In the ink jet recording head of the present invention, a heater or laser light irradiation can be used as the heating means.

  In the ink jet recording head of the present invention, a plurality of the recording element substrates may be disposed on the first plate, and the single external wiring substrate may be provided.

  Accordingly, it is possible to configure an ink jet recording head in which each recording element substrate is accurately positioned and fixed with a plurality of recording element substrate integrated types, and it is possible to provide a recording head that is compact and capable of high-quality printing.

  In the ink jet recording head of the present invention, the electrical joining step may be performed by thermosonic bonding (so-called inner lead bonding) or by thermocompression bonding using a thermosetting adhesive.

  In the inkjet recording head of the present invention, the electrical joining step is performed by wire bonding in which the electrode and the electrode terminal are connected by a wire, and the first plate has an electrode terminal of the external wiring substrate. The electrical bonding step may be performed by heating directly from the back of the electrode terminal portion using a heating means by having an opening at the back of the portion or in the vicinity thereof.

  As a result, the electrode terminal portion can also be easily heated, so that electrical mounting using wire bonding is possible, and the configuration range of the ink jet recording head is widened.

  In the ink jet recording head, it is preferable that a second plate is fixed to the external wiring board.

  The second plate is preferably made of a material having high thermal conductivity such as SUS or alumina.

  With such a configuration, the back of the electrode terminal portion is reinforced by the second plate, so that more stable electrical bonding can be performed.

  Furthermore, the inkjet recording head of the present invention is configured such that the ink supplied to the opening is filled during the printing operation of the inkjet recording head, and the recording element substrate is filled with the ink filled in the opening. This also has the effect of reducing the temperature rise.

  The opening is used for the purpose of directly heating the recording element substrate during electrical mounting, but the ink flow path formed by the first plate and the ink flow path member joined to the first plate after the electrical mounting process is open. By including the portion, the opening is filled with ink when performing a printing operation on the ink jet recording apparatus. As a result, the recording element substrate can also receive ink from the opening, and the temperature rise of the recording element substrate during the printing operation can be relatively suppressed, high-speed and high-quality printing is possible, and the opening is secondary. It will have a special function.

  Alternatively, it is possible to cool the recording element substrate by embedding a heat radiating member having high thermal conductivity in the opening of the first plate.

  By embedding a heat radiating member having high thermal conductivity, the heat of the recording element substrate is positively released, thereby having a cooling effect.

  Furthermore, in the ink jet recording head of the present invention, a third plate is fixed to the back surface of the first plate so as to close the opening, and one side of the third plate communicates with the opening. On the opposite side, a minute hole that is in contact with the ink in the ink flow path is formed, so that the opening functions as an air buffer during the printing operation of the ink jet recording head.

  In this way, by covering the opening with the third plate having a minute hole, the opening functions secondarily as an air buffer, thereby causing vibration of ink during the printing operation. Therefore, it is possible to provide a recording head capable of high-quality printing even during high-speed printing.

  An ink jet recording head manufacturing method according to the present invention includes a recording element substrate having a plurality of recording elements that discharge recording liquid, an electrode for transmitting an electrical signal to each recording element, and the recording element substrate supported and fixed. An ink jet recording head manufacturing method comprising: a first plate for performing an operation; and an external wiring substrate having an electrode terminal electrically connected to each electrode of each recording element substrate, wherein each recording element substrate Including the step of supporting and fixing the external wiring wiring board to the first plate, the step of performing the respective steps in the order of the electrical joining step, There is an opening in a portion located on the back surface of the element substrate, and the electrode and the electrode terminal are directly heated through the opening using the heating means. And performing electrical bonding step.

  In the method of manufacturing the ink jet recording head of the present invention as described above, when connecting each electrode terminal of the external wiring board, the back surface of the recording element substrate is directly heated to perform the electrical joining process. The temperature of the part rapidly rises, the manufacturing tact is short, and stable electrical connection is possible. In addition, since it is not necessary to heat through the first plate, it is not always necessary to select a material having high thermal conductivity for the first plate. For example, a resin material can be used, so that the component cost is low. Thus, this is a manufacturing method capable of constituting an inexpensive ink jet recording head.

  In the method of manufacturing an ink jet recording head of the present invention, the heating means may be a heater or may be based on laser light irradiation.

  According to the present invention, regardless of the material and size of the plate for fixing the recording element substrate, electrical mounting such as a thermal ultrasonic pressure bonding method that requires heating can be stably performed, and consequently, inexpensive, high-speed, and high-quality ink jet recording. An ink jet recording head capable of performing the above and a method for manufacturing the ink jet recording head can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 to FIG. 6 are explanatory diagrams for explaining each of the head cartridge and the ink tank suitable for application of the ink jet recording head of the present embodiment, and their relationship. Hereinafter, each component will be described with reference to these drawings.

  As can be seen from the perspective views of FIGS. 1A and 1B, the recording head H1001 of the present invention is one constituent element of the recording head cartridge H1000. The recording head cartridge H1000 includes the recording head H1001. An ink tank H1900 (a black ink tank H1901, a cyan ink tank H1902, a magenta ink tank H1903, and a yellow ink tank H1904) provided detachably on the recording head H1001 is configured. The recording head cartridge H1000 is fixedly supported by positioning means and electrical contacts of a carriage (not shown) mounted on the ink jet recording apparatus main body, and is detachable from the carriage. The black ink tank H1901 is for black ink, the cyan ink tank H1902 is for cyan ink, the magenta ink tank H1903 is for magenta ink, and the yellow ink tank H1904 is for yellow ink. In this way, each of the ink tanks H1901, H1902, H1903, and H1904 is detachable from the recording head H1001, and each ink tank can be replaced. Thus, the running cost of printing in the ink jet recording apparatus is reduced.

  Next, the recording head H1001 will be described in detail for each component constituting the recording head.

(1) Recording Head The recording head H1001 is a bubble jet (registered trademark) system that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling to the ink in response to an electrical signal. The recording head is a side shooter type.

  As shown in the exploded perspective view of FIG. 2, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.

  Further, as shown in the exploded perspective view of FIG. 3, the recording element unit H1002 includes a first recording element substrate H1100, a second recording element substrate H1101, a first plate H1200, an electrical wiring tape H1300, and an electrical contact substrate H2200. In addition, the ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint rubber H2300, a filter H1700, and a seal rubber H1800.

  In FIG. 3, the first plate and the second plate are separate components, but two plates may be integrated to form a single component.

(1-1) Recording Element Unit FIG. 4 is a partially exploded perspective view for explaining the configuration of the first recording element substrate H1100.

  The first recording element substrate H1100 is anisotropically etched using, for example, a Si substrate H1110 having a thickness of 0.5 to 1 mm and an ink supply port H1102 having a long groove-like through-hole as an ink channel using the crystal orientation of Si. The electrothermal conversion elements H1103 are arranged in a staggered pattern on both sides of the ink supply port H1102 and supply electric power to the electrothermal conversion elements H1103 and the electrothermal conversion elements H1103. An electric wiring (not shown) such as Al is formed by a film forming technique. Furthermore, electrode portions H1104 for supplying power to the electrical wiring are arranged on both outer sides of the electrothermal transducer H1103, and bumps H1105 such as Au are formed on the electrode portion H1104. On the Si substrate H1110, an ink flow path wall H1106 and a discharge port H1107 for forming an ink flow path corresponding to the electrothermal conversion element H1103 are formed of a resin material by a photolithography technique, and a discharge port group H1108. Is forming.

  The ink supplied from the ink flow path H1102 is ejected from an ejection port H1107 provided opposite to the electrothermal conversion element H1103 by bubbles generated by the electrothermal conversion element H1103.

  The first recording element substrate H1100 is used as a recording element substrate for discharging black ink.

  FIG. 5 is a partially exploded perspective view for explaining the configuration of the second recording element substrate H1101.

  The second recording element substrate H1101 is a recording element substrate for discharging inks of three colors of cyan, magenta, and yellow, and three ink supply ports H1102 are formed in parallel, and each ink supply is supplied. An electrothermal conversion element H1103 and a discharge port H1107 are formed on both sides of the mouth. Of course, like the first recording element substrate H1100, the ink supply port H1102, the electrothermal conversion element H1103, the electric wiring, the electrode portion H1104, and the like are formed in the Si substrate H1110, and a resin material is formed on the Si substrate H1110 by a photolithography technique. An ink flow path and a discharge port H1107 are formed.

  Similarly to the first recording element substrate H1100, a bump H1105 such as Au is formed on the electrode portion H1104 for supplying electric power to the electric wiring.

  Next, the first plate H1200 will be described.

The first plate H1200 may be formed of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm, but a resin material is used to configure a cheaper recording head. Also good. In the present invention, since the recording element substrate is directly heated, the heating means such as a heater does not directly touch the first plate. However, the radiant heat from the heating means or the transfer through the recording element substrate is not necessarily used. Since there is heat or the like, it is desirable that the resin material has heat resistance.

  For example, since the temperature of the heating means in the thermosonic bonding method is about 150 ° C. to 200 ° C., it is desirable to have a heat resistance temperature higher than this. Specifically, any of PPS (polyphenylene sulfide), PSF (polysulfone), PES (polyethersulfone), phenol, modified PPO (polyphenylene oxide) and the like may be used.

  The first plate H1200 has ink supply ports H1201 for supplying black ink to the first recording element substrate H1100 and inks for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101. A supply port H1201 is formed, each ink supply port 1102 of the first recording element substrate H1100 and the second recording element substrate H1101 corresponds to the ink supply port H1201 of the first plate H1200, and the first The recording element substrate H1100 and the second recording element substrate H1101 are bonded and fixed to the first plate H1200 with high positional accuracy. The first adhesive used for bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

  The electrical wiring tape H1300 applies an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101, and includes a plurality of recording element substrates. An opening, an electrode terminal H1302 corresponding to the electrode portion H1104 of each recording element substrate, and an external signal input terminal H1301 for receiving an electric signal from the main body device are provided at the end of the electric wiring tape H1300. The electrode terminal portion H1303 for electrical connection with the electrical contact substrate H2200 is connected, and the electrode terminal H1302 and the electrode terminal H1303 are connected by a continuous copper foil wiring pattern.

  The electrical wiring tape H1300, the first recording element substrate 1100, and the second recording element substrate H1101 are electrically connected to each other, and the connection method is, for example, bumps on the electrode portions H1104 of the first recording element substrate H1100. H1105 and the electrode terminal H1302 of the electric wiring tape H1300 corresponding to the electrode portion H1104 of the first recording element substrate H1100 are electrically joined by the thermosonic bonding method, and similarly the electrode portion of the second recording element substrate H1101. The bump H1105 of the H1104 and the electrode terminal H1302 of the electric wiring tape H1300 corresponding to the electrode portion H1104 of the second recording element substrate H1101 may be electrically joined by a thermosonic bonding method.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 mm to 1 mm, and is formed of a ceramic material such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. However, in the present invention, it is possible to construct a cheaper recording head if it is made of a resin material integrally molded with the first plate. Of course, the same resin material as that of the first plate described above can be selected as the resin material. The shape of the first recording element substrate H1100 and the second recording element substrate H1101 which are bonded and fixed to the first plate H1200 is larger than the outer dimensions of the first recording element substrate H1100. Further, the second plate H1400 is connected to the first plate H1200 with the second adhesive so that the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 can be electrically connected in a plane. And the back surface of the electric wiring tape H1300 is bonded and fixed by the third adhesive.

  Electrical connection portions between the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are sealed with a first sealing agent H1307 and a second sealing agent H1308 (see FIG. 2). The electrical connection is protected from ink corrosion and external impact. The first sealing agent H1307 mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape H1300 and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent. The agent H1308 seals the front side of the connection portion described above.

  An electrical contact substrate H2200 having an external signal input terminal H1301 for receiving an electrical signal from the main unit at the end of the electrical wiring tape H1300 is electrically connected by thermocompression bonding using an anisotropic conductive film or the like. The

  Then, the electric wiring tape H1300 is bent at one side surface of the first plate H1200, and is bonded to the side surface of the first plate H1200 with the third adhesive H1306. As the third adhesive H1306, for example, a thermosetting adhesive having an epoxy resin as a main component and a thickness of 10 μm to 100 μm is used.

(1-2) Ink Supply Unit The ink supply member H1500 is formed by resin molding, for example. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity.

  As shown in FIGS. 3 and 6, the ink supply member H1500 is one component of the ink supply unit H1003 for guiding ink from the ink tank H1900 to the recording element unit H1002, and the flow path forming member H1600 is ultrasonically welded. As a result, an ink flow path H1501 is formed. In addition, a filter H1700 for preventing entry of dust from the outside is joined to the joint H1517 engaged with the ink tank H1900 by welding. Further, in order to prevent ink from evaporating from the joint H1517 portion, A seal rubber H1800 is attached.

  The ink supply member H1500 also has a part of the function of holding the removable ink tank H1900, and a first hole H1503 that engages with the second claw H1910 of the ink tank H1900 is formed. Also, a mounting guide H1601 for guiding the recording head cartridge H1000 to the mounting position of the carriage of the ink jet recording apparatus main body, an engaging portion for mounting and fixing the recording head cartridge H1000 on the carriage by the head set lever, and a predetermined carriage An abutting portion H1509 in the X direction (carriage scan direction) for positioning at the mounting position, an abutting portion H1510 in the Y direction (recording medium conveyance direction), and an abutting portion H1511 in the Z direction (ink ejection direction) are provided. . In addition, a terminal fixing portion H1512 for positioning and fixing the electrical contact substrate H2200 of the recording element unit H1002 is provided, and a plurality of ribs are provided around the terminal fixing portion H1512 to increase the rigidity of the surface having the terminal fixing portion H1512. ing.

(1-3) Coupling of recording head unit and ink supply unit As shown in FIG. 2, the recording head H1001 is completed by coupling the recording element unit H1002 to the ink supply unit H1003 and further to the tank holder H2000. . These couplings are performed as follows.

  The ink supply port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) and the ink supply port of the ink supply unit H1003 (ink supply port H1602 of the flow path forming member H1600) are communicated so as not to leak. Therefore, each member is fixed with the screw H2400 so as to be pressure-bonded via the joint rubber H2300. At the same time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions of the ink supply unit H1003 in the X, Y, and Z directions.

  The electrical contact substrate H2200 of the recording element unit H1002 is positioned and fixed to one side surface of the ink supply member H1500 by terminal positioning pins H1515 (2 places) and terminal positioning holes H1309 (2 places). The fixing method is, for example, fixing by crimping a terminal coupling pin H1515 provided on the ink supply member H1500, but may be fixed using other fixing means. The state in which the recording element unit H1002 is assembled to the ink supply unit H1003 in this manner is shown in FIG. 7, and the coupling hole and the coupling portion of the ink supply member H1500 with the tank holder H2000 are fitted and coupled to the tank holder H2000. Thus, the recording head H1001 is completed. FIG. 8 shows a recording head H1001 completed by assembling the ink supply unit H1003 and the recording element unit H1002 to the tank holder H2000.

(2) Description of Print Head Cartridge As shown in FIGS. 1A and 1B, a black ink tank H1901, a cyan ink tank H1902, and a magenta ink cartridge mounted on the printhead H1001 constituting the printhead cartridge H1000. As described above, the ink of the corresponding color is stored in each of the ink tank H1903 and the yellow ink tank H1904. Further, as shown in FIG. 6, each ink tank H1901, H1902, H1903, H1904 is formed with an ink supply port H1907 for supplying the ink in each ink tank H1901, H1902, H1903, H1904 to the recording head H1001. Has been. For example, when the ink tank H1901 is attached to the recording head H1001, the ink supply port H1907 of the black ink tank H1901 is brought into pressure contact with the filter H1700 provided in the joint H1517 of the recording head H1001, and the black ink in the black ink tank H1901 is ink. The ink is supplied from the supply port H1907 to the first recording element substrate H1100 through the first plate H1200 through the ink flow path H1501 of the recording head H1001.

  Then, ink is supplied to a bubbling chamber (not shown) having the electrothermal conversion element H1103 and the discharge port H1107, and is ejected toward a recording sheet as a recording medium by heat energy applied to the electrothermal conversion element H1103.

  Next, the details of the connecting portion between each electrode H1104 of the first recording element substrate H1100 and the second recording element substrate H1101 and the electrode terminal H1302 of the electric wiring tape H1300, and the bonding are in accordance with the actual process order. explain.

  FIG. 9 is a cross-sectional view in the discharge port array direction in the vicinity of the electrical joint portion of the recording element substrate of the recording element unit. This cross-sectional view shows the cross section around the first recording element substrate H1100, but the cross section around the second recording element substrate H1101 has the same configuration.

  First, the first recording element substrate H1100 is bonded and fixed to the first plate H1200 with high positional accuracy by a first adhesive (not shown). Although not shown in the drawing, the second recording element substrate H1101 is also simultaneously bonded and fixed to the first plate H1200, and the first recording element substrate H1100 and the second recording element substrate H1101 are relative to each other. It is fixed in a state where the positional accuracy is ensured. The second plate is a single component integrated with the first plate H1200 in the drawing. The first plate H1200 is provided with an opening H1210, and the opening H1210 is formed so as to be located in a portion directly behind the electrode H1104 of the first recording element substrate H1100.

  Next, after the electrode terminal portion H1302 of the electric wiring tape H1300 and the bump H1105 formed on the electrode H1104 (not shown) are positioned, the back surface of the electric wiring tape H1300 is placed on the upper surface of the first plate H1200. The adhesive is fixed by the third adhesive H1306. The bump H1105 is made of a material such as Au.

  Then, the electrode terminal H1302 at the opening of the electric wiring tape H1300 is bonded to and electrically connected to the bump H1105 by, for example, thermosonic bonding (so-called inner lead bonding = ILB). Thus, the electrical connection between each recording element substrate and the electrical wiring tape is completed. In the thermosonic bonding method, the connection is performed by applying ultrasonic waves while heating the electrical connection portion. In the present embodiment, by providing the opening H1210, the heater T1 passes through the opening H1210. However, since the first recording element substrate H1100 can be directly heated from the back surface side, the electrical junction can be rapidly heated. Even when the first plate H1200 is generally made of a resin material having a low thermal conductivity, the electrode portion of the recording element substrate can be heated regardless of this. Accordingly, it is possible to provide an ink jet recording head that has a short manufacturing tact, a low component cost, and a stable electrical joining process.

  In this embodiment, thermosonic pressure bonding is used as the electric bonding means. However, the present invention is not limited to this, and an optimum means suitable for the configuration of the recording head, for example, heat pressure bonding using a thermosetting adhesive. Or the like. The present invention is effective when an electrical joining means that requires heating is used.

  FIG. 10 shows a modification of FIG. In FIG. 10, the shape of the opening H1211 provided in the first plate is tapered toward the first recording element substrate H1100, unlike the opening of FIG. With such a shape, when the heater T1 is inserted toward the first recording element substrate H1100, there is an effect that the catch is reduced and the heater T1 is inserted more smoothly and process trouble is reduced. In addition, when the first plate H1200 is formed by a mold, the taper shape can be easily removed, and the component yield can be increased.

  Furthermore, the secondary effect of the opening H1210 provided in the first plate H1200 will be described with reference to FIGS.

  FIG. 11 shows an example in which the electrical connection portion of the recording element unit in which the electrical joining process shown in FIG. 9 is completed is sealed with a first sealant H1307 or a second sealant 1308. By sealing, the electrical connection portion is protected from ink corrosion and external impact. Furthermore, a flow path forming member H1600 (not shown) is joined to the first plate H1200 via a joint rubber H2300 (not shown). The flow path forming member H1600 is joined so as to completely cover the opening H1210. As a result, during a printing operation, the ink supplied from the ink tank H1900 (not shown) passes through the flow path forming member H1600 and fills the opening H1210. Further, the supplied ink passes through an ink supply port H1201 formed in the first plate H1200, and is guided to a foaming chamber (not shown) of the first recording element substrate H1100. Then, by the printing operation, droplets are ejected from the ejection port H1107 onto recording paper or the like as a recording medium. In the case of an ink jet recording method using an electrothermal conversion element, recording is performed by the printing operation. A phenomenon occurs in which the temperature of the element substrate rises. This is particularly noticeable due to recent high-speed printing. In the present invention, as described above, the opening H1210 is filled with ink, and heat from the recording element substrate is transferred to the ink. There is an effect to escape. Further, the ink in the opening is swung by the reciprocating movement of the carriage by the printing operation, so that the warm ink diffuses into the liquid chamber and the flow path, so that the temperature rise of the recording element substrate is relatively reduced. There is. For this reason, it is possible to provide an inkjet recording head capable of higher-speed printing and higher-quality printing.

  FIG. 12 is similar to FIG. 11 in which the electrical connection portion of the recording element unit in which the electrical joining process shown in FIG. 9 is completed is sealed with the first sealant H1307 and the second sealant 1308. is there.

  In FIG. 12, the third plate H2500 is joined to the back surface of the first plate H1200. A minute hole H2501 is formed in the third plate, and one side of the hole H2501 communicates with the opening H1210 of the first plate H1200. The opposite side of the hole is formed so as to be in contact with the ink supplied into the flow path forming member H1600 (not shown).

  The hole H2501 is in contact with the ink but has a small diameter, and the ink has a meniscus so that the ink does not enter the opening H1210.

  As a result, during the printing operation, the opening H1210 functions secondarily as an air buffer. This air buffer absorbs and reduces ink vibration and oscillation (particularly noticeable during high-speed printing) due to ink ejection operations, etc., and acts as a damper, enabling high-speed and high-quality printing. An ink jet recording head can be provided.

  The diameter of the hole H2501 is determined by the surface tension of the ink used, the wettability between the material used for the third plate H2500 and the ink, the position of the hole, and the like, and the ink enters the opening H1210. It should just be a size that does not enter and can be formed. In the present embodiment, for example, the diameter of the hole is set to about φ0.2 to 1 mm, but is not limited thereto.

  In the present embodiment, the third plate H2500 is a single member. However, if possible, the number of components may be reduced by integrating with other components such as the flow path forming member H1600.

  Furthermore, in FIG. 13, the heat radiating member H1270 with good heat conduction is embedded in the opening. The heat dissipating member H1270 may be, for example, a metal such as Al or SUS having a good thermal conductivity, or may be configured to embed a thermally conductive paste-like material. In the case of an ink jet recording system using an electrothermal conversion element, the phenomenon that the temperature of the recording element substrate rises due to the printing operation, and there is a risk that the ejection becomes unstable due to an excessive temperature rise. However, by embedding the heat radiating member in the opening in this way, it serves to release heat due to the temperature rise of the recording element substrate and has the effect of cooling, so an inkjet recording head capable of high-speed printing and high-quality printing can be provided. It is possible to provide. The heat dissipating member H1270 may be arranged in the ink liquid chamber as in FIG. 11, but the heat dissipating effect is further enhanced if the heat dissipating member H1270 is provided outside the liquid chamber and the heat dissipating member is in contact with the atmosphere. Further, if the heat dissipating member H1271 is elongated as shown in FIG. 14 (or the heat dissipating member may be provided with a large number of fins or a larger heat dissipating member), the surface area of the heat dissipating member increases, and the heat dissipating further. An effect is obtained.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG. The recording element unit shown in FIG. 15 has the same configuration as that of FIG. 9, and most of the manufacturing process is the same. The first plate 1200 has an opening H1210 as in FIG. 9, but in FIG. 9, the recording element substrate is heated by the heater through the opening H1210. FIG. 15 is different in that the first recording element substrate H1100 is heated by performing laser irradiation using a laser irradiator T2 in the electrical joining step. Depending on the size of the recording element substrate and the size of the opening that can be formed, a heater may not be used as shown in FIG. In recent years, in order to reduce the cost, there has been an active movement to shrink the recording element substrate and reduce the component cost. As another problem, when the recording element substrate is bonded and fixed to the first plate using the first adhesive, the opening may have an adhesive depending on the application amount / transfer amount of the first adhesive. There is a possibility of protruding. In that case, the protruding adhesive may become an obstacle, and the heater may not be sufficiently adhered to the recording element substrate, and sufficient heating may not be performed.

  In such a case, by directly irradiating the recording element substrate with laser light as in the present embodiment, heating can be performed in a non-contact manner, and the same effect as in the first embodiment can be obtained.

In FIG. 15, the laser irradiation is performed from the back of the electrode H1104 (not shown). However, since there is no supporting / reinforcing member on the back of the electrode H1104 at the time of thermosonic bonding, the ultrasonic waves are transmitted well. Therefore, there is a possibility that sufficient bonding is not performed, or the recording element substrate itself is damaged and cracks or the like are generated. In such a case, as shown in FIG. 16, the above problem can be solved by forming an opening H1220 near the back of the electrode. In general, since the recording element substrate is made of a material with very high thermal conductivity such as Si, the temperature near the electrode immediately rises just by heating the vicinity near the electrode. Is done.
Also in the second embodiment, the opening may have a tapered shape as shown in FIG. 10, which is a modification of the first embodiment. Furthermore, it goes without saying that providing an opening in the vicinity of the back of the electrode as shown in FIG. 16 is also applicable to the first embodiment.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG. FIG. 17 is a cross-sectional view in the discharge port array direction in the vicinity of the electrical joint portion of the recording element substrate of the recording element unit, as in the first and second embodiments, but FIG. 17 shows an electrical joining method by wire bonding. Selected.

First, the first recording element substrate H1100 is bonded and fixed to the first plate H1200 with high positional accuracy by a first adhesive (not shown). Next, after the electrode terminal portion H1302 ′ of the electric wiring tape H1300 ′ to which the second plate H1410 is fixed in advance and the electrode H1104 (not shown) on the first recording element substrate H1100 are positioned, the electric wiring is performed. The back surface of the second plate H1410 fixed to the tape H1300 ′ is bonded and fixed to the upper surface of the first plate H1200 by the third adhesive H1306. The second plate H1410 is made of a material having high thermal conductivity and rigidity such as SUS, alumina (Al ₂ O ₃ ), for example, and serves as a reinforcing plate so that bonding can be stably performed.

  Then, the electrode H1104 on the first recording element substrate H1100 and the electrode terminal portion H1302 ′ of the electric wiring tape H1300 ′ are electrically connected by wire bonding with a wire H1350. The wire H1350 is made of a material such as Au.

  The first plate H1200 is provided with an opening H1240. The opening H1240 is formed so as to be located in a portion directly behind the electrode H1104 of the first recording element substrate H1100 (or a portion near the back). Yes. Further, another opening H1250 is formed in the first plate H1200, and the opening H1250 is formed so as to be located directly behind the electrode terminal portion H1302 ′ of the electrical wiring tape H1300 ′ (or a portion near the back). Has been.

  As a result, during the electrical bonding process by wire bonding, the heater H1 'is inserted through the openings of the openings H1240 and H1250, so that both the electrode H1104 and the electrode terminal part H1302' are directly heated. Become. Therefore, even in the mounting method using wire bonding, the manufacturing tact is short, the first plate made of a resin material can be used, the cost of parts can be reduced, and a stable electrical connection process can be performed. It is.

  In the present embodiment, the second plate H1410 is fixed to the electric wiring tape H1300 ′ in advance, but the present invention is not limited to this, and the second plate H1410 is fixed to the first plate 1200 first, Thereafter, the electrical wiring tape H1300 ′ may be bonded and fixed to the second plate H1410.

  In the present embodiment, the second plate H1410 is used as a reinforcing plate during bonding. However, if there is no problem in bonding properties, the second plate may be omitted.

  In addition, a heater is used for heating the electrical junction, but this may be performed by laser irradiation as in the second embodiment.

  As described above, when the size of the recording head is increased due to the increase in the number of nozzles (lengthening) of the ink jet recording head, the increase in color, etc., or when the construction accuracy of the electric wiring tape is difficult to be obtained. In some cases, the mounting method by wire bonding as described in the present embodiment may be selected, but also in this case, the first plate made of a resin material can be used because the manufacturing tact is short. In addition, a reduction in component costs can be measured, and a stable electrical connection process can be performed.

1 is an external perspective view of a recording head cartridge according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the recording head cartridge shown in FIG. FIG. 3 is an exploded perspective view of an ink supply unit and a recording element unit shown in FIG. 2. FIG. 4 is a perspective view in which the first recording element substrate shown in FIG. 3 is partially broken. FIG. 4 is a perspective view in which the second recording element substrate shown in FIG. 3 is partially broken. FIG. 2 is a side sectional view of the recording head cartridge shown in FIG. 1. FIG. 4 is a perspective view illustrating a state where a recording element unit is assembled to an ink supply unit. FIG. 3 is a perspective view showing a recording head completed by assembling an ink supply unit and a recording element unit to a tank holder. FIG. 3 is a cross-sectional view of the vicinity of the electrical joint of the recording element unit showing the first embodiment of the invention. It is a modification of embodiment of FIG. FIG. 10 is a diagram illustrating a state where ink is filled after the recording element unit illustrated in FIG. 9 is assembled with the ink supply unit. FIG. 10 is a diagram illustrating a state in which a third plate is joined to the recording element unit illustrated in FIG. 9 and is assembled with the ink supply unit and then filled with ink. FIG. 10 is a diagram illustrating a state in which a heat dissipation member is embedded in the opening of the first plate of the recording element unit illustrated in FIG. 9. It is a figure which shows the state which embedded the heat radiating member different from FIG. FIG. 5 is a cross-sectional view of the vicinity of an electrical joint of a recording element unit showing another embodiment of the present invention. It is a modification of embodiment of FIG. FIG. 6 is a cross-sectional view of the vicinity of an electrical joint of a recording element unit showing still another embodiment of the present invention. FIG. 6 is a cross-sectional view in the vicinity of an electrical joint of a recording element unit showing a conventional configuration.

Explanation of symbols

H1000 recording head cartridge H1001 recording head H1002 recording element unit H1003 ink supply unit H1100 first recording element substrate H1101 second recording element substrate H1102 ink supply port H1103 electrothermal conversion element H1104 electrode H1105 bump H1106 ink channel wall H1107 ejection port H1108 Discharge port array H1110 Si substrate H1200 First plate H1210, H1211, H1220, H1230, H1240, H1250 Opening portion H1201 Ink supply port H1270, H1271 Heat radiation member H1290 First plate H1300, H1300 ′ Electric wiring tape H1301 External signal Input terminal H1302, H1302 ′ Electrode terminal H1303 Electrode terminal portion H1306 Third adhesive H130 First sealant H1308 Second sealant H1309 Terminal positioning hole H1310 Terminal coupling hole H1350 Wire H1400, H1410 Second plate H1500 Ink supply member H1501 Ink flow path H1502 Tank positioning hole H1503 First hole H1504 Second Hole H1505 third hole H1506 opening H1508 engaging part H1509 X abutting part H1510 Y abutting part H1511 Z abutting part H1512 terminal fixing part H1514 inter-color rib H1515 terminal positioning pin H1516 terminal coupling pin H1517 joint H1600 flow path Forming member H1601 Installation guide H1602 Ink supply port H1700 Filter H1800 Seal rubber H1900 Ink tank H1901 Black ink tank H1902 Ink tank H1903 Magenta ink tank H1904 Yellow ink tank H1907 Ink supply port H1908 Tank positioning pin H1909 First claw H1910 Second claw H1911 Third claw H1912 Movable lever H2000 Tank holder H2200 Electrical contact board H2300 Joint seal member H2400 Screw H2500 Third plate H2501 Hole T1, T1 ′, T Heater T2 Laser irradiator

Claims (18)

A plurality of recording elements for discharging recording liquid; a recording element substrate having electrodes for transmitting electrical signals to the respective recording elements; a first plate for supporting and fixing the recording element substrate; In an ink jet recording head comprising an external wiring substrate having an electrode terminal electrically connected to each electrode of the recording element substrate,
The first plate has an opening in a portion located on the back surface of the recording element substrate, and the electrode, the electrode terminal, and the electrode terminal are heated while directly heating the back surface of the recording element substrate using a heating means through the opening. An ink jet recording head characterized by performing the electrical joining step.   The ink jet recording head according to claim 1, wherein the opening is located on the back of the electrode or in the vicinity of the back.   Including a step of supporting and fixing each recording element substrate to a first plate, a step of fixing the external wiring wiring substrate to the first plate, and a step of performing each step in the order of the electrical joining step. The ink jet recording head according to claim 1.   The ink jet recording head according to claim 1, wherein the first plate is made of a resin material having low thermal conductivity.   The ink jet recording head according to claim 1, wherein the heating unit is a heater.   The ink jet recording head according to claim 1, wherein the heating unit is by laser light irradiation.   7. The ink jet recording head according to claim 1, wherein a plurality of the recording element substrates are arranged on the first plate, and the external wiring substrate is a single one.   The ink jet according to any one of claims 1 to 7, wherein the electrical joining step is performed by thermosonic bonding (so-called inner lead bonding) or by thermocompression bonding using a thermosetting adhesive. Recording head.   The electrical joining step is performed by wire bonding for connecting the electrode and the electrode terminal by a wire, and the first plate has an opening directly behind or near the electrode terminal portion of the external wiring board. 8. The ink jet recording head according to claim 1, wherein the electric joining step is performed by heating directly from the back of the electrode terminal portion using a heating means.   The inkjet recording head according to claim 9, wherein a second plate is fixed to the external wiring board.   The inkjet recording head according to claim 10, wherein the second plate is made of a material having high thermal conductivity such as SUS or alumina.   During the printing operation of the inkjet recording head, the ink supplied to the opening is filled, and the ink filled in the opening has an effect of reducing the temperature rise of the recording element substrate. An ink jet recording head according to any one of claims 1 to 11.   The inkjet recording head according to claim 1, wherein the recording element substrate is cooled by embedding a heat dissipation member having high thermal conductivity in the opening of the first plate.   A third plate is fixed to the back surface of the first plate so as to close the opening, and one side of the third plate communicates with the opening, and the other side is in the ink flow path. An ink jet according to any one of claims 1 to 11, wherein a minute hole in contact with the ink is formed, whereby the opening functions as an air buffer during a printing operation of the ink jet recording head. Recording head. A plurality of recording elements for discharging recording liquid; a recording element substrate having electrodes for transmitting electrical signals to the respective recording elements; a first plate for supporting and fixing the recording element substrate; An inkjet recording head manufacturing method comprising: an external wiring substrate having an electrode terminal electrically connected to each electrode of the recording element substrate,
Including a step of supporting and fixing each recording element substrate to a first plate, a step of fixing the external wiring wiring substrate to the first plate, and a step of performing each step in the order of the electrical joining step.
The first plate has an opening in a portion located on the back surface of the recording element substrate, and the electrode, the electrode terminal, and the electrode terminal are heated while directly heating the back surface of the recording element substrate using a heating means through the opening. A method of manufacturing an ink jet recording head, comprising performing the electrical joining step.   The method of manufacturing an ink jet recording head according to claim 15, wherein the heating means is a heater.   16. The method of manufacturing an ink jet recording head according to claim 15, wherein the heating means is by laser light irradiation.   The inkjet according to any one of claims 15 to 17, wherein the electrical joining step is performed by thermosonic bonding (so-called inner lead bonding) or by heat bonding using a thermosetting adhesive. A manufacturing method of a recording head.

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