JPH09187952A - Suction finger, assembling of ink jet head and ink jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the slip of a sheet part to a suction finger to adjust a position with high accuracy by providing a sheet like elastomer provided with a suction hole to the contact part with a sheet like part. SOLUTION: A suction finger is composed of the suction part 1 wherein a rubber member 2 composed of a sheet like elastomer is attached to the contact part with a head 50 fitted with TAB and a suction hole having the same shape as the suction hole 60 of the suction part 1 is provided to the sheet like rubber member 2 at the same position of the suction hole 60. The suction hole 60 communicates with the air suction connection part 80 connected to a suction generating means. The suction part 1 is attached to the connection part with a moving mechanism so as to be slidable up and down. The suction part 1 is energized downwardly by a pressure spring to be positioned by a stopper. At a time of assembling, the head 50 fitted with TAB can be pressed to a chip tank by the force of a pressure spring and the pressure spring is not detached. By this constitution, the slip between the suction finger and a sheet part is made hard to generate by the friction force of the sheet part and the sheet like elastomer and a position can be adjusted within a short time with high accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction finger for assembling a component mounted on a film or a flexible substrate to another component, an inkjet head assembling method using the suction finger, and the suction finger. The present invention relates to an assembled inkjet head.

[0002]

2. Description of the Related Art Conventionally, when a component mounted on a film or a flexible substrate is mounted on another component, the component is directly gripped, or the film or flexible substrate is sucked with a finger made of only metal and positioned. I was making adjustments.

[0003]

However, when a component is directly gripped, damage such as chipping may occur depending on the component. In addition, when a film or flexible substrate on which a component is mounted is adsorbed by a finger made of only metal, and particularly when the position is adjusted while the finger is pressed, slippage occurs between the finger and the film or flexible substrate. In addition, there is a phenomenon that is not preferable for precise position adjustment, such as bending when suctioned by a suction pad or the like.

In view of the above problems of the prior art, the present invention uses a suction finger suitable for precise position adjustment when mounting a film or a flexible substrate on which a component is mounted to another component, and the suction finger. An object of the present invention is to provide an inkjet head assembling method and an inkjet head assembled using the suction finger.

[0005]

In order to achieve the above-mentioned object, the present invention provides an assembly apparatus for adsorbing a sheet-like component and performing highly accurate position adjustment while pressing the sheet-like component against one surface of the assembly component. The suction finger is characterized in that it has a sheet-like elastic body provided with an intake hole at a contact portion with the sheet-like component. It is conceivable that the sheet-shaped elastic body is a rubber member.

Further, a step of adsorbing the sheet-shaped head component by the above-mentioned adsorption finger, a step of pressing the head component to the adhesive application portion of the tank component, and a step of adjusting the position of the head component while pressing the head component. A method of assembling an inkjet head, which includes a step of curing an adhesive, also belongs to the present invention.

Further, an ink jet head assembled by adsorbing a head part by the adsorbing finger and adjusting the position while pressing the head part against the tank part belongs to the present invention.

(Operation) In the invention as described above, a sheet-like elastic body provided with an intake hole is attached to the side of the suction portion which is in contact with the sheet-like component made of, for example, a film or a flexible substrate, so that the sheet is sucked. When the seat portion is pressed against the assembly parts and the position is adjusted, the seat portion is moved against the suction finger due to the frictional force between the seat portion and the sheet-like elastic body. The position is adjusted accurately without slipping.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic structural view of an assembling apparatus including an embodiment of a suction finger according to the present invention, and FIG. 2 is a perspective view of an assembly part assembled by using the suction finger shown in FIG. FIG. 3 shows the peripheral structure of the suction finger of FIG. 1, and FIG. 4 shows the suction portion of the suction finger of FIG.

In the suction finger of this embodiment, as shown in FIG. 1, a sheet-shaped rubber member 2 is provided at a contact portion with a component in a flat suction portion 1, and a head with a TAB as shown in FIG. It can be suitably used for assembling an inkjet head (BJ head) composed of 50 and a chip tank 52. In FIG. 2, the TAB head 50 has a rectangular window portion 56 opened in a flexible TAB tape 59 such as a polyimide resin.
The head 51 is TAB mounted inside and the inner lead portions are protected by the protective layers 81a and 81b. On the upper surface of the head 51, alignment marks 58a and 58b for positioning adjustment with respect to the chip tank 51 are arranged. In addition, the chip tank 52 has the mold portion 8
2, consisting of a predetermined shape with insert metal fittings 83,
Adhesive coating section 53 for coating an adhesive to bond the head 51 of the TAB head 50, and adhesive coating sections 54, 55 for coating an adhesive to mount the tape section.
It has a, 55b, 55c, 55d on one surface. In addition,
In the adhesive application section 53, an adhesive that cures with ultraviolet rays and heat,
A thermosetting adhesive is applied to the application parts 54, 55a, 55.
An ultraviolet curable adhesive is applied to each of b, 55c and 55d.

Such a chip tank 52 is used in the assembling apparatus having the suction finger of this embodiment shown in FIG.
The positioning is performed by the positioning jig 20 with the surface having the adhesive application portion 55 and the like facing upward.

As shown in FIGS. 3 and 4, the suction finger comprises a suction portion 1 in which a sheet-like elastic body, for example, a rubber member 2 having a thickness of 0.5 mm is attached to the contact portion with the TAB head 50. The rubber member 2 is provided with suction holes of the same shape at the same positions as the suction holes 60 of the suction unit 1. This hole diameter is about φ1 mm. In addition, each suction hole 6
Reference numeral 0 communicates with an air intake connecting portion 80 connected to an intake generating means (not shown).

The suction portion 1 is attached to a connecting portion 5 for connection with a moving mechanism described later via a slider 4 and is slidable in the vertical direction. The suction portion 1 is biased downward by the pressure spring 3 and positioned by the stopper 6. Therefore, at the time of assembly, the TAB head 50
Can be pressed against the chip tank 52 by the spring force of the pressure spring 3. The pressure spring 3 is prevented from coming off by the guide pin 7.

Next, the moving mechanism of the suction finger will be described. The connecting portion 5 that supports the suction portion 1 that constitutes the suction finger is attached to the goniometer stage 12 that adjusts the position in the Zθ direction, as shown in FIG. The goniometer stage 12 is a pulse motor stage 1 for adjusting the position in the Z direction.
1, the stage 11 is a pulse motor stage 10 that adjusts the position in the Y direction, and the stage 10 is an X motor.
It is attached to a pulse motor stage 9 that adjusts the position in the direction. From the above, the suction fingers are X, Y, Z
And the position can be adjusted in the Zθ direction.

The control unit of the moving mechanism will be described. The Z direction adjusting stage 11, the Y direction adjusting stage 10, the goniometer stage 12 and the X direction adjusting stage 9 are controlled by a controller 29 via driving drivers 24, 25, 26 and 27, respectively. A control command to the controller 29 is sent from the personal computer 30.

On the other hand, the control command sent to the controller 29 is the alignment marks 58a and 58b on the head 51.
It is performed based on the image processing of. That is, above the suction unit 1, the objective lens 16 and the folding mirrors 15 and 1 are provided.
4, the half mirror box 35, the illumination fiber attachment part 36, the optical system 18 and the camera 17 are integrally arranged as a measurement system, and the measurement system is supported by the pulse motor stage 13 whose position can be adjusted in the Z direction. It is attached to the part 19. The measuring system is composed of two systems for capturing the images of the alignment marks 58a and 58b.

The camera 17 of each measuring system includes a monitor 33,
The signal processing device 21 is connected via camera control units 31 and 32 having 34, and the signal processing device 21 processes the images of the alignment marks 58a and 58b captured from each camera 17 and sends them to the personal computer 30. In addition, the autofocus unit 3 is connected to each camera 17 via the camera control units 31 and 32.
The controller 28 controls the drivers 22 and 23 that drive the pulse motor stages 13 through the personal computer 30 to adjust the focus of the alignment marks 58a and 58b.

Next, TA using the adsorption finger of the present embodiment
The assembling operation of the head 50 with B will be described. FIG. 5 is a flow chart for explaining an assembling operation of the head 50 with TAB.

First, the chip tank 52 with the adhesive applied to the adhesive applying portions 53, 54, 55a, 55b, 55c, 55d on the upper surface of the chip tank 52 is positioned on the chip tank positioning jig 20 (FIG. 5). Step S
1).

Next, the pulse motor stages 9, 10, 1
1 is moved and the TAB head 50 roughly positioned on the temporary stand (not shown) is adsorbed by the adsorbing portion 1 to which the sheet-shaped rubber member 2 is attached (step S in FIG. 5).
2). Then, again the pulse motor stages 9, 10, 1
Chip tank 5 positioned on jig 20 by 1
The TAB-equipped head 50 is moved to the upper surface of No. 2 (step S3 in FIG. 5). By lowering the pulse motor stage 11 by a certain amount, the TAB head 50 is pressed against the upper surface of the chip tank 52 with a predetermined pressure, and the applied adhesive is crushed to a certain thickness (step S4 in FIG. 5). At this time, the pressure spring 3 can absorb the variation in the height direction of the chip tank 52.

FIG. 6 shows a sectional view of the TAB head 50 when it is pressed against the chip tank 52. As shown in this figure, the height TC of the outer circumference 70 of the chip tank 52 is TH> TC with respect to the thickness (height) TH of the head 51.
Therefore, by pressing the TAB tape 59 located on the same plane as the upper surface of the head 51 against the outer peripheral portion 70, the head 51 can also crush the adhesive applied to the adhesive applying portion 53.

Next, the optical systems 18 on the pulse motor stages 13 are connected to the autofocus unit 3 respectively.
Head 5 of head 50 with TAB by signals of 5 and 36
The alignment marks 58a and 58b on the upper surface of the No. 1 are moved so as to be in focus (step S5 in FIG. 5).

Then, each alignment mark 58
The barycentric positions of a and 58b are obtained by image processing (step S6 in FIG. 5). The position of the center of gravity is measured using the method shown in FIG. 7, specifically as follows.

First, the image of the alignment mark is taken in, the histograms in the X and Y directions are taken as shown in FIG. 8, and VT / 2 is set as the slice level. The intersection points a, b, c, d of the histogram and the slice level are obtained, and ((d
+ C) / 2)-((b + a) / 2) = BY to limit the rough position in the Y direction of the round mark in the center of the alignment mark. Similarly, the rough position BX in the X direction is limited.

Next, in FIG. 9, a histogram is taken only between BY in the Y direction. The slice level is VP / 2 of the peak value VP, and the barycentric position is calculated by the following equation for the data exceeding the slice level, and the barycenter Y is obtained. Also in the X direction, the barycentric position is similarly obtained to obtain the barycenter X.

[0027]

[Equation 1] As described above, each alignment mark 58a, 58b
The center-of-gravity positions Y and X are calculated with respect to, and it is determined whether the calculated center-of-gravity positions Y and X are at predetermined positions (step S7 in FIG. 5). As a result, when it is out of the adjustment standard, the difference between each of the center-of-gravity positions Y and X and a predetermined position is calculated, the rotational direction is moved by the goniometer stage 12, and then the pulse motor stages 9 and 10 are used to move the X and Y directions. Is moved (step S8 in FIG. 5). Thereafter, the alignment mark is image-processed again to obtain the barycentric position, and the processes are repeated until the barycentric positions Y and X reach predetermined positions (steps S6 to S in FIG. 5).
8). At this time, the TAB tape 59 is pressed against the outer peripheral portion 70 of the chip tank to be adjusted.
The TAB tape 50 does not slip with respect to the suction finger due to the frictional force between 0 and the sheet-shaped rubber member 2, and the TAB tape 50 is adjusted with high accuracy.

As a result of the above, when the predetermined position is reached, of the adhesive applied to the adhesive applying section 53 of the chip tank 52, the adhesive protruding by the pressing of the head 51 is removed by the window section 56 of the TAB tape 59. Then, it is irradiated with ultraviolet rays from an ultraviolet ray irradiation device (not shown) to be cured. At the same time, the adhesive application parts 55a, 55
The adhesive applied to b, 55c, and 55d is also irradiated with ultraviolet rays to be cured (step S9 in FIG. 5).

Next, the suction of the TAB head 50 is turned off.
(Step S10 in FIG. 5), the suction part 1 is moved in the Z direction by the pulse motor stage 11 (step S11 in FIG. 5), and the chip tank 52 to which the head 50 with TAB is attached is removed (FIG. 5). Step S12).

[0030]

As described above, according to the present invention, the sheet-like elastic body provided with the intake hole is attached to the suction portion side of the sheet-like component which is in contact with the sheet portion, so that the airtightness with the sheet portion when sucked is increased. The force can be increased and the stability during transportation is improved. Further, when the seat portion is pressed against the assembly parts and the position is adjusted, the frictional force between the seat portion and the sheet-like elastic body makes it difficult for slippage to occur between the suction finger and the seat portion, which is highly accurate and short. The position can be adjusted in time.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an assembly apparatus including an embodiment of a suction finger according to the present invention.

FIG. 2 is a perspective view of an assembly part assembled by using the suction finger shown in FIG.

FIG. 3 is a diagram showing the configuration around the suction finger of FIG.

FIG. 4 is a view showing a suction portion with a work in the suction finger of FIG.

5 is a flowchart for explaining an assembling operation of the head with TAB using the suction finger of FIG. 1. FIG.

FIG. 6 is a cross-sectional view showing a state in which the TAB head is pressed against the chip tank.

FIG. 7 is a diagram showing a method of measuring the position of the center of gravity of an alignment mark.

FIG. 8 is an X direction and Y corresponding to an alignment mark.
It is a figure which shows the histogram of a direction.

FIG. 9 is a diagram showing histograms in the X direction and the Y direction when the area is narrowed to a circle at the center of the alignment mark.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Adsorption part 2 Sheet-shaped rubber member 3 Pressure spring 4 Slider 5 Connection part 6 Stopper 7 Guide pin 9, 10, 11, 13 Pulse motor stage 12 Goniometer stage 14, 15 Folding mirror 16 Objective lens 17 Camera 18 Optical system 19 Measurement System support 20 Positioning jig 21 Signal processing device 22, 23, 24, 25, 26, 27 Driver 28, 29 Controller 30 Personal computer 31, 32 Camera control unit 33, 34 Monitor 35 Half mirror box 36 Lighting fiber attachment 37 , 38 Autofocus unit 50 Head with TAB 51 Head 52 Chip tank 53, 54, 55a, 55b, 55c, 55d Adhesive application section 56 Window section 58a, 58b Alignment mark 59 TAB tape 60 Adsorption hole 70 Pputanku outer peripheral portion 80 air intake connecting portions 81a, 81b protective layer 82 molded part 83 insert fitting

Claims (4)

[Claims] 1. A suction finger of an assembling apparatus that sucks a sheet-shaped component and adjusts the position of the sheet-shaped component with high precision while pressing the sheet-shaped component onto one surface of the assembled component, the contacting portion being in contact with the sheet-shaped component. A suction finger having a sheet-like elastic body provided with an intake hole. 2. The suction finger according to claim 1, wherein the sheet-shaped elastic body is a rubber member. 3. A step of adsorbing a sheet-shaped head component by the adsorption finger according to claim 1, a step of pressing the head component against an adhesive application portion of a tank component, and a position adjustment while the head component is pressed. A method of assembling an ink jet head, which comprises a step of: and a step of curing an adhesive. 4. An ink jet head assembled by adsorbing a head component with the suction finger according to claim 1 and adjusting its position while pressing it against a tank component.