JP2005125516A - Ink jet recording head and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent ink being fed to an ink supply port from oozing out even after long term use in an ink jet recording head comprising a recording element substrate bonded to a supporting member on the surface where the ink supply port opens. <P>SOLUTION: A second recording element substrate H1101 is bonded to a first plate H1200 on the surface where an ink supply port H1102 opens using adhesive H1203. The adhesive H1203 is a UV-curing/thermosetting adhesive containing an ultraviolet absorber causing no UV-curing. At the time of temporary fixing through irradiation with UV-rays in bonding process, outer circumferential part of the second recording element substrate H1101 and the part up to a specified distance from the edge part of the ink supply port H1102 become a UV-curing region H1204 and only a thermosetting region is ensured around the ink supply port H1102. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an ink jet recording head that performs recording by discharging a recording liquid toward a recording medium and a method for manufacturing the same.

  Conventional ink jet recording heads use a method (edge shooter) that discharges a recording liquid in parallel to a substrate on which electrothermal transducers are arranged, and a type that is perpendicular to the substrate on which electrothermal transducers are arranged. And a system (side shooter) that discharges the recording liquid.

  9 and 10 are schematic views of an ink jet recording head as an example of a conventional side shooter system. This ink jet recording head is configured by adhering a recording element substrate 103 on a support member 101 with an adhesive H1202.

  An ink supply port 106 is formed in the recording element substrate 103 as a long groove-like through-hole, and a plurality of ejections are performed along both edges extending in the longitudinal direction of the opening of the ink supply port 106 on one surface of the recording element substrate 103. An energy generation element (for example, electrothermal conversion element) 105 is disposed. On the surface of the recording element substrate 103 on which the ejection energy generating elements 105 are provided, an ejection port plate 104 in which ejection ports 104a are formed at positions facing the ejection energy generating elements 105 is disposed.

  On the other hand, in the support member 101, ink flow paths 101 a are formed as through holes at positions corresponding to the ink supply ports 106 of the recording element substrate 103. In the example shown in the figure, the ink flow path 101a is formed by arranging three ink flow paths 101a, which are separated by a partition wall 101b. These ink flow paths 101 a are connected to, for example, ink supply systems (not shown) that supply inks of different colors, and the inks of the respective colors are supplied to the ink supply ports 106. Ink of each color is ejected from the ejection port group 103a of each set, each of the two rows of ejection ports 104a, and an image of each color is recorded.

In manufacturing such an ink jet recording head, a method for assembling the recording element substrate 103 and the support member 101 is disclosed in, for example, Patent Document 1. In this assembling method, the recording element substrate 103 is accurately positioned on the support member 101 using a vacuum suction finger, and the recording element substrate 103 is fixed using an ultraviolet / thermosetting adhesive as the adhesive H1202. Yes. As described above, in the bonding process using the ultraviolet / thermosetting adhesive H1202, the recording element substrate 103 is temporarily fixed by irradiating ultraviolet rays, and then the process proceeds to the thermosetting process to completely cure the adhesive H1202. In this way, the recording element substrate 103 and the support member 101 can be positioned and bonded with high accuracy.
Japanese Patent Laid-Open No. 9-188792

  In the recording element substrate as described above, particularly in the recording element substrate 103 having a plurality of ejection port groups 103a, the number of the recording element substrates 103 cut out from one silicon wafer is increased to reduce the cost. When downsizing 103 or increasing the number of ejection port groups 103a without increasing the size of the recording element substrate 103, a plurality of ejection port groups 103a are arranged with high density, and thus a plurality of inks are arranged. It is necessary to arrange the supply ports 106 at a high density by reducing the pitch between them. When the pitch of the ink supply ports 106 is reduced, it is necessary to make the partition wall 101b of the support member 101 thinner accordingly. However, there are the following problems in making the partition wall 101b thinner in this way.

  That is, when the partition wall 101b is thin as described above, when the ink jet recording head is used for a long period of time, a minute peeling of the adhesive occurs in a portion between the ink supply ports 106, and the ink separated by the partition wall. There was a risk of a problem of being mixed.

  As a result of intensive studies, the inventors of the present invention have used silane coupling for the purpose of improving the adhesive force with the recording element substrate 103 in the ultraviolet / thermosetting adhesive H1202 used in the prior art. Although the agent is added in a small amount, the effect of the silane coupling agent is exhibited when it is thermally cured, and the effect of the silane coupling agent is less likely to be exerted in the part that has been UV-cured in advance. It has been found that this is one factor that causes minute peeling of the adhesive at the portion between the supply ports 106. That is, when the partition wall 101b is thin, when the recording element substrate 103 and the support member 101 are bonded as described above, the ultraviolet light is irregularly reflected when temporarily bonded by irradiating the ultraviolet light. The adhesive H1202 penetrates into the interior of the main body 103, and the adhesive H1202 is cured by ultraviolet rays. As a result, the adhesive force also decreases at the portion between the ink supply ports 106.

  The present invention has been made in view of the above points, and an object of the present invention is, in particular, for a long period of time when a plurality of ejection port groups are arranged at high density, and therefore the pitch of the plurality of ink supply ports is reduced. It is an object of the present invention to provide an ink jet recording head capable of operating with high reliability over a long period of time so that the ink supplied to each ink supply port oozes out and does not leak or mix even after use.

  Another object of the present invention is to provide a method of manufacturing an ink jet recording head that can improve the reliability of the ink jet recording head as described above.

  In order to achieve the above-described object, an ink jet recording head of the present invention includes a discharge energy generating element that generates energy for discharging ink from a nozzle, and an ink supply port that receives supply of discharged ink. A recording element substrate, comprising: an element substrate; and a support member that includes an opening connected to the ink supply port, and supports the recording element substrate so that the ink supply port and the opening communicate with each other. The inkjet recording head uses an ultraviolet / thermosetting adhesive that is cured by both irradiation and heating of ultraviolet rays for bonding between the support member and the support member. It contains an ultraviolet absorber that does not cause a curing reaction due to.

  According to this configuration, since the ultraviolet / thermosetting adhesive that cures by both ultraviolet irradiation and heating is used for joining the recording element substrate and the support member, when bonding them together, In a state where both are positioned, ultraviolet rays are irradiated and temporarily fixed, and then the adhesive is thermally cured, whereby both can be positioned and bonded with high accuracy. At this time, when the ultraviolet rays are irradiated, the ultraviolet rays reach the outer peripheral portion of the recording element substrate, and in some cases, diffusely reflect and reach the edge portion of the ink supply port. It is absorbed by the ultraviolet absorber, and therefore, it is possible to prevent the inward entry of these portions beyond a certain distance. Therefore, a portion where the adhesive is cured only by thermal curing can be formed around the ink supply port. In the portion of the adhesive that is cured only by thermal curing, the silane coupling agent can be effectively acted on to perform strong bonding.

  In the ink jet recording head of the present invention, the amount of the ultraviolet absorber added to the adhesive is preferably in the range of 0.01 to 10% with respect to the other solid content. As a result, it is possible to effectively cause the ultraviolet absorbing action by the ultraviolet absorbent and to prevent the adhesive force from being lowered due to the ultraviolet absorbent.

  According to the present invention, a method for manufacturing an ink jet recording head includes a recording element substrate comprising: an ejection energy generating element that generates energy for ejecting ink from a nozzle; and an ink supply port that receives supply of ejected ink. A method for manufacturing an ink jet recording head, comprising the step of joining a support member having an opening connected to an ink supply port of a recording element substrate, wherein both ultraviolet irradiation and heating are performed on the support member. The step of transferring the UV / thermosetting adhesive that cures at the same time, and the recording element substrate is positioned and arranged on the support member, and the recording element substrate is irradiated on the support member in that state, and the recording element substrate is placed on the support member. UV absorption that has a step of temporarily fixing and a step of heat-curing the adhesive, and absorbs ultraviolet rays and does not cause a curing reaction due to ultraviolet rays. Characterized by using what was included.

  According to the manufacturing method of this configuration, the recording element substrate and the support member are bonded together using an ultraviolet / thermosetting adhesive that cures by both ultraviolet irradiation and heating. By temporarily irradiating with ultraviolet rays and then thermally curing the adhesive, both can be positioned and bonded with high accuracy.

  According to the present invention, an ultraviolet absorber is added to the adhesive while allowing the recording element substrate to be accurately positioned and bonded on the support member by using an ultraviolet / thermosetting adhesive. Thus, even when ultraviolet rays are irregularly reflected when irradiated with ultraviolet rays, the adhesive is cured only by thermal curing around the ink supply port, and therefore, the silane coupling agent is effectively acted on and powerful. A region where the bonding is performed can be secured, and the bleeding of the ink from the ink supply port portion can be prevented with high reliability over a long period.

  Therefore, according to the present invention, even when a plurality of ejection port groups are arranged at a high density and therefore the pitch of the plurality of ink supply ports is reduced, the ink supplied to each ink supply port oozes out and leaks. Therefore, it is possible to provide an ink jet recording head that can operate with high reliability over a long period of time. Further, in the present invention, since the configuration of the ink jet recording head is obtained by changing a part of the composition of the adhesive, the manufacturing cost does not increase and the ink jet recording head of the present invention is manufactured. According to the method, it is possible to easily manufacture a highly reliable ink jet recording head at low cost.

  Next, embodiments of the present invention will be described with reference to the drawings.

  First, an example of a recording head cartridge H1000 suitable for applying the present invention will be described with reference to FIGS.

  As can be seen from FIG. 2, the recording head H1001 including the ink jet recording head according to the present embodiment is one constituent element of the recording head cartridge H1000. The recording head cartridge H1000 is detachably attached to the recording head H1001. It is configured by an ink tank H1900 that holds the ink to be supplied to the recording head H1001. The recording head cartridge H1000 is used by being detachably attached to a carriage (not shown) attached to the main body of the ink jet recording apparatus via its positioning means and electrical contacts.

  As the ink tank H1900, there are four black ink tanks H1901, black ink tank H1902, magenta ink tank H1903, and yellow ink tank H1904 for black, cyan, magenta, and yellow ink, respectively, which are detachable from the recording head H1001. Is provided. Accordingly, each of the ink tanks H1900 can be replaced independently, thereby making it possible to keep the running cost of image recording by the ink jet recording apparatus low.

Hereinafter, the recording head H1001 will be described in more detail.
<1> Recording Head The recording head H1001 is a bubble jet (registered trademark) side shooter type that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling in ink according to an electrical signal. Recording head. As shown in the exploded perspective views of FIGS. 3 and 4, the recording head H1001 is roughly composed of a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.
<1-1> Recording Element Unit In the recording element unit H1002, the first recording element substrate H1100, the second recording element substrate H1101, and the second plate H1400 are joined on one surface of the first plate H1200. Further, an electrical contact substrate H2200 is connected to the first recording element substrate H1100 and the second recording element substrate H1101 via an electrical wiring tape H1300.

  FIG. 5 is a partially cutaway perspective view showing the configuration of the first recording element substrate H1100. As shown in the drawing, the first recording element substrate H1100 has, for example, a Si substrate H1110 having a thickness of 0.5 to 1 mm. The Si substrate H1110 is formed with an ink supply port H1102 that is a long groove-like through-hole that functions as an ink flow path. The ink supply port H1102 can be formed by a method such as anisotropic etching or sandblasting using the crystal orientation of Si.

  On one side of the Si substrate H1110 across the ink supply port H1102, one row of electrothermal conversion elements H1103 as ejection energy generating elements is formed, and the electrothermal conversion elements H1103 in both rows form a staggered arrangement. It is provided to do. On the Si substrate H1110, electric wiring (not shown) made of Al or the like for supplying electric power to the electrothermal conversion element H1103 is formed. The electrothermal conversion element H1103 and the electric wiring are not formed. It is formed by membrane technology. Further, on the Si substrate H1110, electrode portions H1104 connected to the electrode terminals H1302 of the electric wiring tape H1300 for supplying electric power to the electric wiring are provided in the vicinity of both ends in the longitudinal direction. Bumps H1105 such as Au are arranged.

  Further, on the Si substrate H1110, a discharge port group H1108 including discharge ports H1107 arranged at positions facing the respective electrothermal transducers H1103 is formed of a resin material patterned by using a photolithography technique. In addition, an ink flow path wall H1106 that separates a plurality of ink flow paths from the ink supply port H1102 to each of the ejection ports H1107 is formed. Therefore, by selectively driving each electrothermal conversion element H1103 in a state where the nozzles constituted by these ink flow paths and the ejection ports H1107 are filled with ink via the ink supply port H1102, each electric heat conversion element H1103 is selectively driven. Bubbles are generated in the ink at the portion of the heat conversion element H1103, whereby the ink is selectively ejected from each ejection port H1107.

  FIG. 6 is a perspective view showing a second recording element substrate H1101 with a part thereof broken. In the figure, the same reference numerals are given to the same components as those of the first recording element substrate H1101 for convenience.

  The second recording element substrate H1101 is a recording element substrate for discharging ink of three colors, and has three ink supply ports H1102 formed in parallel, on both sides of each ink supply port 1102. An electrothermal conversion element H1103 and an ink discharge port H1107 are formed. Also in the second recording element substrate H1101, in addition to the ink supply port H1102 and the electrothermal conversion element H1103, an electrode portion H1104 made of bumps H1105 such as Au is formed on the Si substrate H1110, and further, The ink flow path and the ink discharge port are formed by the resin material patterned using the photolithography technique, as in the first recording element substrate H1100.

Reference is again made to FIG. The first plate H1200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The material of the first plate H1200 is not limited to alumina, but has a linear expansion coefficient equivalent to the linear expansion coefficient of the material of the recording element substrate H1100 and the thermal conductivity of the recording element substrate H1100 material. It is preferable to form it from a material having a thermal conductivity equal to or greater than. Examples of such a material of the first plate H1200 include silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), tungsten ( W) can be used.

  The first plate H1200 is for supplying black ink to the first recording element substrate H1100, and is for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101, respectively. A total of four ink supply ports H1201 are formed. The first and second recording element substrates H1100 and H1101 are bonded and fixed with high positional accuracy so that their ink supply ports 1102 are connected to the corresponding ink supply ports H1201 of the first plate H1200, respectively. . As the adhesive H1203 used for this adhesion, an adhesive having a low viscosity, a low curing temperature, a curing in a short time, a relatively high hardness after curing, and an ink resistance is desirable.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 to 1 mm, and is formed of a ceramic material such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. Yes. On the second plate H1400, the outer dimensions of the corresponding recording element substrates H1100 and H1101 at positions corresponding to the first recording element substrate H1100 and the second recording element substrate H1101 that are bonded and fixed to the first plate H1200. A larger opening is formed. The second plate H1400 is bonded to the first plate H1200 with a second adhesive, and the back surface of the electric wiring tape H1300 is bonded and fixed thereon with a third adhesive. At this time, the second plate H1400 enables the electrical wiring tape H1300 to be electrically connected to the first recording element substrate H1100 and the second recording element substrate H1101 on a plane on which the electrical wiring tape H1300 is bonded and fixed. Work.

  The electric wiring tape H1300 is further bent on one side surface of the first plate H1200, and this side surface is also bonded with a third adhesive. As the third adhesive, for example, a thermosetting adhesive having a thickness of 10 to 100 μm mainly composed of an epoxy resin is used.

  The electrical wiring tape H1300 functions to transmit an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101. The electrical wiring tape H1300 is formed with openings that expose the discharge port surfaces of the recording element substrates H1100 and H1101, and electrodes corresponding to the electrode portions H1104 of the recording element substrates H1100 and H1101 at the edges of the openings. A terminal H1302 is formed. In addition, an electrical wiring tape H1300 has an electrical signal having an external signal input terminal H1301 connected to a terminal of the carriage and receiving an electrical signal from the main body in a state where the recording head cartridge H1100 is mounted on the carriage. An electrical terminal connection portion H1303 for electrical connection with the contact substrate H2200 is formed. The electrode terminal H1302 and the electric terminal connection portion H1303 are connected by a continuous wiring pattern of copper foil.

The electrical connection between the electrical wiring tape H1300, the first recording element substrate H1100, and the second recording element substrate H1101 includes, for example, the electrode portion 1104 of the recording element substrates H1100 and H1101 and the electrode terminal H1302 of the electrical wiring tape H1300. It can be performed by electrical bonding by a thermosonic bonding method. Electrical connection portions between the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are sealed with a first sealing agent H1307 and a second sealing agent H1308 (see FIG. 3). This protects the electrical connection from ink corrosion and external impacts. At this time, the first sealant H1307 mainly includes the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape H1300 and the electrode portion H1104 of the recording element substrates H1100 and H1101, and the outer peripheral portion of the recording element substrates 1100 and H1101. The second sealant H1308 seals the front side of the connection portion. The electrical connection between the electrical wiring tape H1300 and the electrical contact substrate H2200 can be performed by, for example, thermocompression bonding using an anisotropic conductive film.
<1-2> Ink Supply Unit As shown in FIG. 4, the ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint seal member H2300, a filter H1700, and a seal rubber H1800.

  The ink supply member H1500 is formed by, for example, resin molding. In this resin molding, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity.

  As shown in FIG. 7, the ink supply member H1500 ultrasonically welds the flow path forming member H1600 to form an ink flow path H1501 leading from the ink tank H1900 to the recording element unit H1002, and mainly from the ink tank H1900. It serves to guide ink to the recording element unit H1002. A filter H1700 for preventing entry of dust from the outside is joined to a joint portion H1520 of the ink supply member H1500 connected to the ink supply port H1907 of the ink tank H1900 by welding, and further from the joint portion H1520 portion. In order to prevent the ink from evaporating, a seal rubber H1800 is attached.

  Further, the ink supply member H1500 is connected to the tank holder H2000, and also functions as a holding unit that holds the removable ink tank H1900. The ink tank H1900 has a first claw H1909, a second claw H1910, and a third claw formed on a movable lever H1912, which can be elastically deformed, as a mechanism for mounting the holding unit at a predetermined position. H1911 and a tank positioning pin H1908 are formed. Corresponding to these, the ink supply member H1500 has a first hole H1503 and a second hole H1504, and the tank holder H2000 has a third hole H1505 and a tank positioning hole H1502. .

  The ink supply member H1500 also has a function of allowing the recording head cartridge H1000 to be mounted and fixed at a predetermined position on the carriage of the ink jet recording apparatus main body. For this purpose, the X direction (carriage scan direction) abutting portion H1509, a Y direction (recording medium conveyance direction) abutting portion H1510, and a Z direction (ink discharge direction) abutting portion H1511 (see FIGS. 4 and 8). Further, the flow path forming member H1600 is formed with mounting guides H1601 that protrude on both sides in the X direction for guiding the recording head cartridge H1000 to the mounting position of the carriage of the ink jet recording apparatus main body, and the upper end of the ink supply member H1500 is An engaging portion H1508 is provided for pressing the recording head cartridge H1000 by a head set lever (not shown) provided on the carriage and fixing the recording head cartridge H1000 to the carriage.

In addition, a terminal fixing portion H1512 on which the electrical contact substrate H2200 of the recording element unit H1002 is positioned and fixed is provided on one side surface of the ink supply member H1500. A plurality of ribs are provided around the terminal fixing portion H1512 and the periphery thereof to increase the rigidity of the surface on which the terminal fixing portion H1512 is located.
<1-3> Coupling of recording head unit, ink supply unit, and tank holder The recording head H1001 is completed by coupling the recording element unit H1002 to the ink supply unit H1003 and further to the tank holder H2000. These couplings are performed as follows.

  First, the recording element unit H1002 and the ink supply unit H1003 pass a screw H2400 (see FIG. 3) through the concave portion formed in the screw stopper H1206 of the first plate H1200, and the bottom of the ink supply member H1517. It is connected by screwing into the screw fixing boss H1517. At this time, ink does not leak through the ink supply port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) and the ink supply port of the ink supply unit H1003 (ink introduction port H1602 of the flow path forming member H1600). In order to communicate with each other, the joint seal member H2300 is sandwiched between the first plate H1200 and the flow path forming member H1600, and the respective members are pressure-bonded. At this time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions of the ink supply unit H1003 in the X direction, Y direction, and Z direction.

  The electrical contact substrate H2200 of the recording element unit H1002 is fixed to a terminal fixing portion H1512 provided on one side surface of the ink supply member H1500. The terminal fixing portion H1512 is provided with two terminal positioning pins H1515, and the electrical contact substrate H2200 is positioned by passing these through the two terminal positioning holes H1309 of the electrical contact substrate H2200. In the example shown in the figure, the electrical contact substrate H2200 can be fixed by caulking the terminal coupling pin H1516 provided in the terminal fixing portion H1512 through the terminal coupling hole H1310 of the electrical contact substrate H2200. You may fix using a means.

  FIG. 8 shows a schematic diagram of the recording element unit H1002 and the ink supply unit H1003 combined in this manner. The recording head H1001 is further completed by coupling the tank holder H2000 by fitting the coupling hole and coupling portion of the ink supply member H1500 with the tank holder H2000 into the tank holder H2000.

  Next, in the recording head cartridge H1000 having such a configuration, the configuration of this embodiment for improving the reliability of adhesion between the recording element substrates H1100 and H1101 and the first plate H1200 that is the supporting member thereof is shown in FIG. Will be described with reference to FIG. In particular, the configuration of the present embodiment improves the adhesion reliability even when a plurality of ink supply ports H1102 are formed, and therefore there is only a relatively narrow adhesion region between the ink supply ports H1102. Thus, it is possible to prevent ink from being mixed between the ink supply ports H1102 even during long-term use. Therefore, in the following, the adhesion of the second recording element substrate H1101 formed with a plurality of ink supply ports H1102 will be described. However, the configuration of this embodiment can also be used for the first recording element substrate H1100. Of course. FIG. 1A is a perspective view showing a bonding state between the second recording element substrate H1101 and the first plate H1200, and FIG. 1B is along the center line AA in FIG. It is sectional drawing.

  As described above, the second recording element substrate H1101 is bonded and fixed to the first plate H1200 using the adhesive H1203. As the adhesive H1203, an ultraviolet / heat-curing combined adhesive that uniformly absorbs ultraviolet rays and does not cause a curing reaction by ultraviolet rays is used. Here, the term “uniform” refers to a mixture in which both agents are mixed uniformly so that there is no UV absorber present when a mixture of both agents is applied to the required location. Represents a substantially uniform state.

  The bonding process of the second recording element substrate H1101 using the adhesive H1203 is performed as follows.

  First, the adhesive H1203 is transferred to a predetermined area on the first plate H1200. Next, the second recording element substrate H1101 is positioned and arranged on the first plate H1200, and the second recording element substrate H1101 and the first plate H1200 are pressed against each other. Next, ultraviolet rays are irradiated to partially cure the adhesive H1203 with ultraviolet rays and temporarily fix the adhesives. Finally, the adhesive H1203 is cured by heating to completely fix the second recording element substrate H1101 on the first plate H1200.

  In this bonding method, the adhesive H1203 is instantaneously cured when irradiated with ultraviolet rays, so that the second recording element substrate H1101 can be temporarily fixed with high accuracy without causing a positional shift. In the subsequent heat curing step, the position of the second recording element substrate H1101 can be kept at a predetermined position for temporary fixing by ultraviolet curing. Therefore, according to this bonding method, the second recording element substrate H1101 can be accurately positioned and bonded.

  At this time, in the temporary fixing step by ultraviolet irradiation, the irradiated ultraviolet rays reach the edge of the second recording element substrate H1101, and in some cases, the ultraviolet rays that are irregularly reflected, etc. Reach the edge. However, since the adhesive H1203 contains an ultraviolet absorber, the ultraviolet rays are absorbed as they enter from the edge of the second recording element substrate H1101 and the edge of the ink supply port 1102 and thus go inward. It gradually attenuates. Accordingly, the ratio of the thermal curing to the ultraviolet curing increases as the distance from the edge of the second recording element substrate H1101 and the edge of the ink supply port 1102 increases. In particular, the ultraviolet rays hardly reach the edge of the second recording element substrate H1101 and the edge away from the edge of the ink supply port 1102 by a certain distance or more. For this reason, even if the ultraviolet ray is irradiated so as to hit the entire second recording element substrate 1101, it is within a certain distance from the edge of the second recording element substrate H1101 and the edge of the ink supply port 1102 as shown in the figure. The ultraviolet curing is performed only in the ultraviolet curing region H1204.

  In this manner, in the configuration of the present embodiment, each ink supply port H1102 can be in a state surrounded by a portion where the adhesive H1203 is cured only by thermal curing. As described above, the inventors of the present invention have high reliability over a long period of time when the UV / thermosetting adhesive is cured only by thermal curing as compared to the UV cured portion. It has been confirmed that strong bonding is maintained. Therefore, in this way, by allowing a portion cured only by thermal curing to exist around each ink supply port H1102, a portion of the ink supply port H1102 to another ink supply port H1102 or the second It is possible to prevent the ink from oozing out to the peripheral portion of the recording element substrate H1101 with high reliability over a long period of time.

  In this embodiment, examples of the ultraviolet absorber that is added to the adhesive H1203 and does not cause a curing reaction due to ultraviolet irradiation include 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy -4-n-octoxybenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone, 2-hydroxy-4-benzyloxybenzophenone, 2,2'-hydroxy-4-methoxybenzophenone, phenyl salicylate, 4-t- Examples thereof include butylphenyl salicylate, 2-hydroxy-4-methoxybenzophenone, 2,4-di-t-butylphenyl-3 ′, 5′-di-t-butyl-4-hydroxybenzoate. Even those other than these can be used as ultraviolet absorbers as long as they function to absorb ultraviolet rays as described above and can be added to the adhesive H1203.

  It can be set by adjusting the addition amount of the ultraviolet absorber to the adhesive H1203 how far the ultraviolet curing region H1204 is from the edge directly irradiated with ultraviolet rays. Therefore, it is preferable to adjust the addition amount of the ultraviolet absorber according to the distance from the edge directly irradiated with ultraviolet rays to the edge of the ink supply port H1102 and the distance between the ink supply ports H1102. Such adjustment can be carried out by calculating the relationship between the ultraviolet attenuation distance and the amount of the ultraviolet absorber added from experimental data. In this way, by adjusting the addition amount of the ultraviolet absorber, even if the distance between the ink supply ports H1102 is short, the adhesive H1203 is only thermally cured between the ink supply ports H1102. It is possible to reliably prevent the problem that the region to be cured is reliably formed and the ink is mixed with high reliability over a long period of time.

  However, from the experimental results, the present inventors consider that the ultraviolet absorption effect and the adhesive strength decrease, the addition amount range of the ultraviolet absorber is 0.01% to 10% by weight ratio with respect to the other solid content. It has been found that this is preferable. If the addition amount is too small, the effect of adding the ultraviolet absorber is hardly obtained. Moreover, when there is more addition amount than this, there exists a possibility that the adhesive force after adhesive hardening may fall, and there exists a possibility of producing the adhesive force shortage especially in the ultraviolet curing region H1204 shown in FIG.

  Further, when the amount of the ultraviolet absorber added is increased, the attenuation of the ultraviolet rays increases, so that the distance that the ultraviolet rays reach may be very short. However, since the bonding by ultraviolet curing is temporary fixing until the second recording element substrate H1101 is completely bonded by thermal curing, the distance that ultraviolet rays reach is short, and therefore the ultraviolet curing region H1204 is narrowed. However, it is preferable that the amount of the ultraviolet absorber added is as large as possible within the range in which the adhesive strength does not decrease as described above.

  In the present embodiment, an adhesive mainly composed of an epoxy resin can be used as the adhesive H1203. In this case, a photocationic polymerization initiator is often used as the photocuring initiator. Examples of the photocationic polymerization initiator include aromatic iodonium salts, aromatic sulfonium salts [J. POLYMER SCI: Symposium No. 56 383-395 (1976)] and trade names SP-150, SP-170, SP-172 marketed by Asahi Denka Kogyo Co., Ltd. and the like.

  This cationic photopolymerization initiator can be used in combination with a reducing agent (thermosetting initiator) and heated to promote cationic polymerization (crosslinking density is improved as compared to single photocationic polymerization). However, when a photocationic polymerization initiator and a reducing agent are used in combination, the reducing agent is selected so that it becomes a so-called redox type initiator system that does not react at room temperature and reacts at a certain temperature or higher (preferably 60 ° C. or higher). There is a need. As such a reducing agent, copper triflate (copper trifluoromethanesulfonate (II)) is most suitable in consideration of the copper compound, particularly reactivity and solubility in the epoxy resin. A reducing agent such as ascorbic acid is also useful.

  Further, in this embodiment, the adhesive H1203 uses ultraviolet curing for temporary fixing, and it is sufficient that this temporary fixing is performed only in a portion around the second recording element substrate H1101. It is not necessary to use instantaneous curing by ultraviolet irradiation around the supply port H1102. Therefore, the peripheral portion of the ink supply port H1102 is not cured even when light strikes, and the photocuring initiator is removed from the adhesive that is cured only by heat, that is, the adhesive used near the edge of the second recording element substrate H1101. May be used. By doing so, even if the ultraviolet rays to be irradiated wrap around the ink supply port H1102 due to irregular reflection or the like in the temporary fixing step, unnecessary ultraviolet curing occurs around the ink supply port H1102. It can be avoided. As a result of intensive studies, the present inventors have found that the adhesive strength is improved by the effect of the silane coupling agent in the adhesive that is cured only by thermal curing. Therefore, the configuration in which the adhesive that is cured only by thermal curing is used in the peripheral portion of the ink supply port H1102 can further improve the reliability of bonding at this portion. It is preferable because the ink can be prevented from exuding to the surrounding area with higher reliability over a long period of time.

  As described above, according to the present embodiment, the ink-jet recording capable of increasing the adhesive force of the adhesive used for joining the first support member H1200 and the recording element substrates H1100 and H1101 and operating with high reliability over a long period of time. A head can be provided. Further, in the manufacture of the ink jet recording head, it is not necessary to strictly control the ultraviolet irradiation range and the irradiation amount in the bonding process between the first support member H1200 and the recording element substrates H1100 and H1101, and it is easily and stably performed. It is possible to perform a joining process.

1A and 1B are schematic views illustrating a main part of an ink jet recording head according to an embodiment of the present invention, in which FIG. 1A is a plan view showing the adhesive transparently, and FIG. 1B is A in FIG. It is sectional drawing along the -A line. FIG. 2 is a perspective view of an example recording head cartridge in which the ink jet recording head of FIG. 1 and an ink tank are combined. FIG. 3 is an exploded perspective view of the recording head cartridge in FIG. 2. FIG. 4 is an exploded perspective view of the ink supply unit and the recording element unit of FIG. 3. FIG. 5 is a perspective view showing the first recording element substrate of FIG. 4 with a part thereof broken. FIG. 5 is a perspective view showing a second recording element substrate of FIG. 4 with a part thereof broken. FIG. 3 is a cross-sectional view of the recording head cartridge in FIG. 2. FIG. 3 is a perspective view showing a combined body of a recording element unit and an ink supply unit in the recording head cartridge of FIG. 2. It is a top view which sees through and shows the adhesive agent of the principal part of the inkjet recording head of a prior art example. It is sectional drawing along the BB line of FIG.

Explanation of symbols

H1000 Recording head cartridge H1001 Recording head H1002 Recording element unit H1003 Ink supply unit H1100 First recording element substrate H1101 Second recording element substrate H1102, H1201, H1907, 106 Ink supply port H1103 Electrothermal conversion element H1104 Electrode portion H1105 Bump H1106 Ink flow path wall H1107, 104a Ejection port H1108 Ejection port group H1110 Si substrate H1200 First plate H1202, H1203 Adhesive H1204 UV curing region H1400 Second plate H1500 Ink supply member H2000 Tank holder H2200 Electrical contact substrate 101 Support member 101b Partition 103 Recording element substrate 104 Discharge port plate 105 Discharge energy generating element

Claims (3)

A recording element substrate comprising: an ejection energy generating element that generates energy for ejecting ink from the nozzle; and an ink supply port that receives supply of the ejected ink;
A support member provided with an opening connected to the ink supply port, and supporting the recording element substrate so that the ink supply port and the opening are connected and joined;
An inkjet recording head in which an ultraviolet / thermosetting adhesive that cures by both ultraviolet irradiation and heating is used for joining the recording element substrate and the support member,
The ink jet recording head, wherein the adhesive contains an ultraviolet absorber that absorbs ultraviolet rays and does not cause a curing reaction due to ultraviolet rays.   The inkjet recording head according to claim 1, wherein an addition amount of the ultraviolet absorber in the adhesive is 0.01 to 10% with respect to other solid contents. A recording element substrate including an ejection energy generating element that generates energy for ejecting ink from a nozzle and an ink supply port that receives supply of the ejected ink is connected to the ink supply port of the recording element substrate. A method of manufacturing an ink jet recording head, comprising a step of bonding onto a support member having an opening formed thereon,
On the support member, a step of transferring an ultraviolet / thermosetting adhesive that cures by both ultraviolet irradiation and heating;
Positioning and arranging the recording element substrate on the support member, irradiating ultraviolet rays in that state, and temporarily fixing the recording element substrate on the support member;
Heat-curing the adhesive;
And an adhesive containing an ultraviolet absorber that absorbs ultraviolet rays and does not cause a curing reaction due to ultraviolet rays is used as the adhesive.

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