CN102248794A - Liquid discharging head - Google Patents
Liquid discharging head Download PDFInfo
- Publication number
- CN102248794A CN102248794A CN201110130120XA CN201110130120A CN102248794A CN 102248794 A CN102248794 A CN 102248794A CN 201110130120X A CN201110130120X A CN 201110130120XA CN 201110130120 A CN201110130120 A CN 201110130120A CN 102248794 A CN102248794 A CN 102248794A
- Authority
- CN
- China
- Prior art keywords
- liquid
- substrate
- ink
- flow path
- stream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a liquid discharging head, including a plurality of nozzle arrays. A recess part is formed on the back face of a head substrate and all of the supply ports are formed in the bottom of the recess part. The head substrate and a support member are combined at the bottom of the recess part to lead the supply port and an introducing port to be communicated. According to the arrangement, the grounded area is fully ensured and the liquid discharging head with the high reliability and heat radiation capacity is manufactured at a high production efficiency.
Description
Technical field
The present invention relates to liquid discharging head, and relate more specifically to ink jet print head.
Background technology
Japanese Patent Application Publication No.2005-125516 has discussed ink jet print head.In order to be connected and to keep substrate with outside ink supply system, by will above be formed with electrothermal conversioning element the ink-jet substrate engage with support component and dispose ink jet print head.
Can utilize under the situation that an ink-jet substrate prints with multiple color at ink jet print head, become and to seal various China inks apart from each other in the office, junction surface between ink-jet substrate and the support component, so that prevent the mixing of different China inks.In addition, become the enough areas that to keep the bonding part so that increase the reliability of sealing.
In addition, in recent years, there is requirement for the ink jet recording method of exporting higher resolution image at a relatively high speed.Therefore exist for increasing the quantity of discharging black nozzle and increasing the requirement of discharging frequency.
On the other hand, if writing speed increases, then time per unit input energy and the rising of this temperature to the end increases during writing down.If the temperature of this head rises, then the black discharge rate at each page dissimilates, and makes to discharge the instability that becomes at the high temperature China ink.In addition, may reduce the recording occurring continuously performance.
Japanese Patent Application Publication No.2005-125516 has discussed ink jet print head, and in this ink jet print head, the ink-jet substrate is fixed to support component, makes the heat that produces in the ink-jet substrate be diffused into support component.Therefore the temperature that can reduce by the area (being called contact area hereinafter) that increases the bonding part between ink-jet substrate and support component in the ink jet print head rises.
Yet if for the temperature that reduces in the ink jet print head rises and the contact area of increase between ink-jet substrate and support component, it is big that the size of ink-jet substrate becomes, and makes productivity ratio reduce.
In order to address this is that, can make the attenuation of whole ink-jet substrate.The size of opening that in other words, can be by making the black supply opening of whole ink-jet substrate attenuation reducing.Therefore can be at the contact area that guarantees under the situation of the size that does not increase the ink-jet substrate between ink-jet substrate and support component.
Yet if select this method, the intensity of ink-jet substrate reduces, and makes because stream forms the stress of parts and produce warpage (warpage) in the ink-jet substrate.In this case, greatly reduced productivity ratio.
Summary of the invention
The present invention relates to liquid discharging head, in this liquid discharging head, can guarantee the contact area between a support component and a substrate, and can make this liquid discharging head with high production rate.More particularly, the present invention relates to liquid discharging head, this liquid discharging head is because contact area is enough and highly reliable and have high heat-sinking capability, and can make this liquid discharging head with high production rate.
According to an aspect of the present invention, a kind of liquid discharging head comprises: stream forms parts, described stream forms parts and is configured for discharging the outlet of liquid and the liquid flow path that is communicated with described outlet, and comprises a plurality of nozzle arrays that formed by the described outlet and the described liquid flow path of ground, space connection each other; Substrate, described substrate comprise the exhaust energy producing component that produces the energy that is used to discharge liquid, and are formed for supply opening to described liquid flow path supply liquid at each nozzle array in described substrate; And support component, described support component comprises the intake that is used for to described supply opening supply liquid, wherein said substrate comprising sunk part with a top surperficial relative side that is furnished with described stream formation parts, wherein all supply openings are formed in the bottom of described sunk part with being connected described substrate, and wherein said substrate and described support component be engaged at the place, bottom of described sunk part, makes described supply opening and described intake communicate with each other.
According to the detailed description below with reference to the exemplary embodiment of accompanying drawing, more feature of the present invention and aspect will become clear.
Description of drawings
The accompanying drawing that is added into and constitutes a specification part shows exemplary embodiment of the present invention, feature and aspect, and is used for explaining principle of the present invention with describing.
Fig. 1 illustrates the schematic sectional view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 2 illustrates the schematic cross section perspective view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 3 A and Fig. 3 B illustrate the schematic diagram of the joint between the ink gun substrate and support component according to an exemplary embodiment of the present invention.
Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D, Fig. 4 E, Fig. 4 F, Fig. 4 G and Fig. 4 H are the schematic process flow diagram that the method for the black supply opening that is used to form ink-jet substrate according to an exemplary embodiment of the present invention and sunk part is shown.
Fig. 5 is the schematic sectional view that the ios dhcp sample configuration IOS DHCP of traditional ink jet print head is shown.
Fig. 6 illustrates the schematic sectional view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 7 is the schematic plan view that the layout example of each element in the ink jet print head according to an exemplary embodiment of the present invention is shown.
Fig. 8 illustrates according to an exemplary embodiment of the present invention the vertically perspective schematic view of the ink jet print head of cutting.
Fig. 9 is the amplification sectional view that the part of being surrounded by the frame of broken lines X shown in Fig. 6 is shown according to an exemplary embodiment of the present invention.
Figure 10 is the schematic plan view that the layout example of each element in the ink jet print head according to an exemplary embodiment of the present invention is shown.
Figure 11 A, Figure 11 B, Figure 11 C, Figure 11 D, Figure 11 E, Figure 11 F and Figure 11 G illustrate to be used to make the technological process sectional view of the method for ink jet print head according to an exemplary embodiment of the present invention.
Figure 12 illustrates the schematic diagram of the ios dhcp sample configuration IOS DHCP of ink jet recording device according to an exemplary embodiment of the present invention.
The specific embodiment
Describe each exemplary embodiment of the present invention, feature and aspect below with reference to the accompanying drawings in detail.
The exemplary embodiment of liquid discharging head will be described below.Ink jet print head can be described with as application example of the present invention.Yet the scope of application is not limited thereto.
For example, except carrying out the China ink record, the present invention can also be applied to making biochip or printed circuit.The present invention relates to discharge the liquid discharging head of liquid, and except ink jet print head, colour filter manufacturing head also is the example of liquid discharging head.
Fig. 1 is the sectional view that illustrates according to the ink jet print head of first exemplary embodiment.Fig. 2 is the schematic cross section perspective view that illustrates according to the ink jet print head of this exemplary embodiment.Fig. 3 A illustrates to form the perspective schematic view of the discharge component substrate that parts constitute according to this exemplary embodiment by ink-jet substrate and stream.Fig. 3 B is the perspective schematic view that support component is shown.
With reference to figure 1, Fig. 2, Fig. 3 A and Fig. 3 B, join support component 2 by the ink-jet substrate 1 that will on upper surface, be formed with stream formation parts 3 to by adhesive 4 and constitute ink jet print head.Ink-jet substrate 1 is comprising sunk part with a top surperficial relative side that is furnished with stream formation parts 3.Ink-jet substrate 1 is engaged to support component 2 at the place, bottom of sunk part.
Ink-jet substrate 1 comprises a plurality of exhaust energy producing components 7 that are used to discharge China ink, such as electrothermal conversioning element.In addition, ink-jet substrate 1 can comprise the wiring (not shown) that is used to drive the exhaust energy producing component.In addition, ink-jet substrate 1 comprises the black supply opening 8 that is used for to black stream 5 supply China inks.In the bottom of sunk part, connect ink-jet substrate ground and form a plurality of black supply openings 8.
A plurality of nozzle arrays of the black outlet, black stream and the black supply opening that are communicated with to the space each other that comprise are formed in the stream formation parts 3.In other words, arrange a plurality of black streams 5 and a plurality of outlet 6 so that form a plurality of nozzle arrays (with reference to figure 3A).
In addition, form the black supply opening 8 that runs through the ink-jet substrate at each nozzle array.Shown in Fig. 3 A, preferably arrange nozzle array with embarking on journey.Nozzle array can keep and discharge identical China ink.
In addition, in this exemplary embodiment, form a black supply opening 8 at a nozzle array.In the bottom of sunk part, arrange the opening of a plurality of black outlets 8 with rectangular shape along nozzle array.In addition, support component 2 comprises the bossing that is contained in the sunk part, and is formed on a plurality of black intake 9 that opening is arranged on the upper surface of bossing in support component 2.
Each black intake 9 is arranged to each black supply opening 8 and is communicated with.Shown in Fig. 3 B, form a plurality of black intakes 9 with embarking on journey.
According to the present invention, can be provided under the situation of the productivity ratio that does not reduce the ink-jet substrate highly reliably and liquid discharging head with high heat-sinking capability.Therefore can be suitable for flying print according to liquid discharging head of the present invention.
To describe effect of the present invention in detail below.If enlarge the contact area between ink gun and the support component in order to improve reliability or heat radiation, then the interval between the nozzle array increases.As a result, Substrate Area increases, and makes productivity ratio to reduce.
On the other hand,, then can also reduce the interval between the nozzle array, make productivity ratio to increase if can reduce the aperture area of black supply opening.Can form black supply opening so that reduce the aperture area of black supply opening by anisotropic etching.Yet utilizing the little through hole of the last formation of the general wafer (wafer) of anisotropic etching in will being used to the ink-jet substrate is unpractical from the viewpoint of time.
In addition, if make the attenuation of whole ink-jet substrate and form black supply opening, then the opening of black supply opening can be formed less by anisotropic etching.Yet if make the attenuation of ink-jet substrate, the intensity of ink-jet substrate reduces.Therefore, because stream forms the stress in the parts and produce warpage in the ink-jet substrate, make productivity ratio greatly to reduce.
In order addressing this is that, according to the present invention, on the ink-jet substrate, to form sunk part, and in the bottom of the sunk part of thin substrates, form the ink-jet supply opening.As a result, the opening of ink-jet supply opening can formed to such an extent that keep the intensity of ink-jet substrate in less, and can obtain the big contact area between support component and ink-jet substrate.Therefore can realize highly reliably and ink jet print head with high production rate with high heat-sinking capability.
In addition, according to a further aspect in the invention, can obtain the ink jet print head that has durability and can be miniaturized.In other words, according to the present invention, owing to form to such an extent that kept the intensity of ink-jet substrate in less at opening with the ink-jet supply opening, so ink jet print head can be miniaturized when keeping durability.
In addition, can reduce nozzle array at interval, and can form outlet, make and to improve discharging performance with high density.
As exemplary embodiment of the present invention ink jet print head has been described above.Yet, the invention is not restricted to this, and the present invention relates to discharge the liquid discharging head of the liquid such as China ink.
If describe ink jet print head in detail as liquid discharging head, then its basic configuration is similar.The term that is used for each can be described in detail as follows: China ink is corresponding to liquid, the ink-jet substrate is corresponding to a substrate, the China ink outlet is corresponding to outlet, the China ink stream is corresponding to liquid flow path, the China ink supply opening is corresponding to supply opening, the China ink intake is corresponding to intake, and black supply part is corresponding to the liquid supply part.
As mentioned above, in a substrate, forming sunk part with a top surperficial relative side (that is the back side) that is furnished with stream formation parts.For the method that is used to form sunk part without limits.For example, can use the crystal anisotropy etching to form sunk part.
Can use silicon substrate to form a substrate.In this case, preferably use the crystal anisotropy etching of silicon substrate to form sunk part, the crystal anisotropy etching by this silicon substrate can form sunk part effectively with high production rate on a substrate.
In addition, by have＜silicon substrate of 100〉face crystal orientation forms a substrate.In this case, the bottom of sunk part becomes that crystal anisotropy etching by silicon substrate forms＜and 100〉face, and should＜100〉face composition surfaces that become between a substrate and the support component.
More particularly, remove the part of silicon substrate by the crystal anisotropy etching, and as a result of expose＜100〉face become the composition surface between a substrate and the support component.The thickness of silicon substrate can be that 0.3mm is to 1.0mm.The degree of depth of sunk part can be 325～675 μ m.
According to the present invention, stream forms parts and comprises a plurality of nozzle arrays, and each nozzle array in these a plurality of nozzle arrays comprises the outlet and the liquid flow path of ground, space connection each other.Form at least one supply opening at each nozzle array, and all supply openings are formed in the bottom of sunk part.
With reference to figure 1, Fig. 2 and Fig. 3 A, form a supply opening along a nozzle array with rectangular aperture.Yet, the invention is not restricted to this, and can form a plurality of supply openings at a nozzle array.
If form a plurality of supply openings at a nozzle array, then support component can be for example at supply opening that same nozzle array is communicated with in each form intake.In addition, can form an intake at a plurality of supply openings that are communicated with nozzle array.
Can utilize anisotropic etching (such as dry etching that comprises reactive ion etching (RIE) and crystal anisotropy etching) to form supply opening.Preferably use and utilize the rich construction skill (Bosch process) of RIE to form supply opening.The height of supply opening can be set to 50～400 μ m.
Material for support component has no particular limits.For example, preferably use aluminium oxide (Al with high heat conductance
2O
3) and silicon (Si), aln precipitation (AlN), zirconia (ZrO
2), silicon nitride (Si
3N
4), silicon carbide (SiC), molybdenum (Mo) and tungsten (W).
In addition, preferably use to have the aluminium oxide of high heat conductance and ink-resistant property, and particularly, preferably use aluminium oxide ceramics.In addition, can use resin material, and can form support component by the resin forming (molding) of Noryl resin.In addition, the Noryl (PPE) as the polymer alloy (polymer alloy) of PPE and polystyrene (PS) can be used as resin material.
If the heat that will in the exhaust energy producing component such as electrothermal conversioning element, produce from the beginning substrate be diffused into support component, then the support component that is formed by aluminium oxide is used in expectation.The material of support component 10 is not limited to aluminium oxide.Can by its linear expansion coefficient have with the linear expansion coefficient par of a substrate and have and the material of the thermal conductivity of the thermal conductivity par of a substrate forms support component 10.
As mentioned above, the zone of a part of attenuation of a substrate (that is the bottom of sunk part) located support component is engaged substrate to the end therein.For example, can use adhesive to come engagement head substrate and support component.Owing in the marginal portion of a substrate, have thick zone, therefore can keep intensity.
Support component can be shaped as and comprise for example bossing, makes support component can be engaged the bottom of the sunk part on the substrate to the end.In addition, preferably, support component comprises the part of the convex shaped that the sunk part with a substrate is complementary.
Can be used to form the example that stream forms the material of parts is photonasty epoxy resin and photonasty acrylic resin.Preferably use the compound of photoreactive cationic polymerizable.Because type and characteristic by the liquid that will use have greatly been determined durability, therefore can select suitable compound to form the material of parts as stream according to the liquid such as China ink.
Substrate can comprise the wiring layer that is used to transmit the signal of telecommunication.For example, can use film technique to form the Al wiring.
As mentioned above, liquid discharging head can comprise the liquid supply part of the intake that is used to supply liquid to support component.The liquid supply part is the case (tank) that is used for to the liquid of intake supply such as China ink of support component, and can be formed by organic material or inorganic material.
What expect is, even the liquid supply part is by also not expanding when the liquid supply part contacts with the liquid such as China ink that will be stored in inside or dissolving or do not cause the material of the elution (elution) of organic material or inorganic material to form.
In addition, from the actual cost of material and the easy aspect of processing, preferably use thermoplastic resin as the material that is used to form the liquid supply part.For example, the resins for universal use of main use such as polypropylene and MODIFIED PP E is as black supply part.Can use silica and aluminium oxide as the reinforcing agent that is used to increase mechanical strength.
In addition, can form support component and liquid supply part by inserts moulding (insert molding).
In addition, can be installed in such as printer, duplicator, comprise the facsimile machine of communication system and comprise in the equipment the word processor of printer unit according to the ink jet print head of this exemplary embodiment.In addition, can be installed in wherein multiplely in the industrial recording equipment in conjunction with various treatment facilities according to the ink jet print head of this exemplary embodiment.Ink jet print head can be used at the enterprising line item of various recording mediums such as paper, line (thread), textile, silk, leather, metal, plastics, glass, timber and pottery.
The liquid discharging head that can more effectively control temperature will be described below.
Fig. 6 is the schematic sectional view that illustrates according to the ink jet print head of second exemplary embodiment.Fig. 7 is the schematic plan view of watching from according to the front (that is, stream forms component side) of the ink jet print head of this exemplary embodiment that the position that wherein is furnished with each element is shown.
Fig. 8 illustrates the perspective schematic view of wherein having cut a part of ink jet print head.Fig. 6 is and the corresponding sectional view in cross section along the A-A ' of the dotted line shown in Fig. 7 intercepting.
With reference to figure 6, ink jet print head comprises the discharge component substrate that is formed parts 3 and ink-jet substrate (substrate) 1 formation by stream.In addition, ink jet print head comprises support component 2, uses adhesive 4 that this support component 2 is engaged with the discharge component substrate in the relative side of that side with being furnished with stream formation parts 3 of ink-jet substrate 1.
Stream forms parts 3 and is formed on the ink-jet substrate 1.In addition, stream formation parts 3 comprise the mobile therein black stream of China ink (that is first liquid) (promptly, first liquid flow path), black outlet (promptly, outlet) 6 and the temperature control stream (that is second liquid flow path) 10 that flows therein of temperature control liquid (that is second liquid).
The temperature control medium that flows in temperature control stream 10 is not subjected to limit especially, and can be water or oil.Temperature control medium mainly is used to cool off ink jet print head.First liquid flow path and second liquid flow path are independently of one another.In addition, second liquid is not used to discharge.Owing to constitute record head similarly with first exemplary embodiment, therefore can easily form second liquid flow path.
Ink-jet substrate 1 comprises a plurality of exhaust energy producing components 7 that are used to discharge China ink, such as electrothermal conversioning element.Ink-jet substrate 1 can also comprise the wiring (not shown) that is used to drive exhaust energy producing component 7.In addition, ink-jet substrate 1 comprises the black supply opening (that is supply opening) 8 that is used for to black stream 5 supply China inks.
In addition, ink-jet substrate 1 comprises as the service duct (that is first fluid passage) 11 that is used for to the openings of temperature control stream 10 supply temperatures control liquid.In addition, ink-jet substrate 1 comprises as being used for from the passing away (that is second fluid passage) 13 of the openings of temperature control stream 10 discharge temperatures control liquid.
Shown in Fig. 6 and Fig. 7, form a plurality of nozzle arrays that form by the black stream 5 and the black outlet 6 of ground, space connection each other of formation in the parts 3 at stream.In other words, arrange that a plurality of black outlets 6 and a plurality of black stream 5 are so that form a plurality of nozzle arrays.
In addition, form the black supply opening 8 that runs through ink-jet substrate 1 at each nozzle array.Nozzle array can comprise and discharge identical China ink.
With reference to figure 7, temperature control stream 10 is formed by a stream of arranging along the both sides of each nozzle array.Temperature control stream 10 comprises to the liquid inlet of its supply temperature control liquid and the liquid outlet of controlling liquid from its discharge temperature.The liquid inlet is connected with service duct 11, and liquid outlet is connected with passing away 13.
In addition, temperature control stream 10 begins to extend along nozzle array near the liquid inlet the angular zone that is arranged in stream formation parts 3.Then temperature control stream 10 between each nozzle array by and arrive and be arranged in stream and form near the angular zone of parts 3 liquid outlet.Therefore temperature control liquid is fed to temperature control stream 10 from service duct 11, flows through temperature control stream 10, and discharges from passing away 13.
The temperature of ink jet print head or the temperature of more preferably discharging component substrate can be controlled by the temperature control liquid that flows in the temperature control stream 10.For example, if the temperature control liquid of cooling is flowed in temperature control stream 10, then temperature control liquid absorbs the heat that is produced by the exhaust energy producing component.Can cool off the discharge component substrate of ink jet print head then effectively.
Not the temperature control liquid that must use cooling especially.Can in temperature control stream 10, flow to be discharged into by the heat that the exhaust energy producing component produces by the temperature control liquid that makes room temperature and discharge outside the component substrate.
In addition, ink jet print head is connected with liquid cycling mechanism such as pump, makes the temperature control liquid of discharging from passing away 13 be supplied to service duct 11 again.The liquid cycling mechanism can be included in the liquid discharge apparatus such as ink-jet printer.Temperature control liquid can discharge and absorb heat when being circulated by the liquid cycling mechanism.
In addition, liquid discharge apparatus can comprise the temperature control device of the temperature of adjusting liquid.More particularly, temperature control device is adjusted the temperature of the temperature control liquid of discharging from passing away 13 effectively and temperature is controlled liquid and turns back to service duct 11.Especially, according to the present invention, preferably temperature control device comprises the refrigerating function of cooling liquid, so that cool off the heat that produces effectively in the exhaust energy producing component.
The pump of the energy that pipe that can be flow through by liquid and generation are used for moving liquid constitutes the liquid cycling mechanism.
As exemplary embodiment of the present invention ink jet print head has been described above.Yet, the invention is not restricted to this, and the present invention relates to discharge the liquid discharging head of the liquid such as China ink.
If ink jet print head is a liquid discharging head, then basic configuration is similar.As in above-mentioned bracket, pointing out, term can be by following understanding: China ink is corresponding to first liquid, temperature control liquid is corresponding to second liquid, the ink-jet substrate is corresponding to a substrate, the China ink outlet is corresponding to outlet, the China ink supply opening is corresponding to supply opening, and service duct is corresponding to first fluid passage, and passing away is corresponding to second fluid passage.
Aforesaid liquid is discharged head and is comprised that at least stream forms parts and a substrate, and comprises the liquid cycling mechanism.Stream forms the first mobile therein stream of first liquid of parts formation such as China ink and is used to carry out second liquid flow path that temperature controlled second liquid flows therein.
Substrate comprise be used for to first liquid flow path supply first liquid supply opening, be used for second fluid passage from second liquid to second liquid flow path that supply first fluid passage of second liquid and be used for discharging from second liquid flow path.
According to above-mentioned exemplary embodiment of the present invention, can make in second liquid flow path of second liquid in being formed at stream formation parts and flow.Therefore can control the temperature of ink jet print head, particularly discharge the temperature of component substrate.
In addition, can cool off the ink jet print head that its temperature rises owing to the heat that produces effectively in the exhaust energy producing component by the cooling of serviceability temperature controlling organization and second liquid that circulates.
The invention is not restricted to cooling.For example, temperature control device can be used to the heating and second liquid that circulates, so that ink jet print head is adjusted to suitable temperature.
The formation that stream forms parts is not particularly limited.Yet preferably stream formation parts comprise a plurality of nozzle arrays that formed by the outlet and first liquid flow path of ground, space connection each other.In addition, form at least one supply opening at each nozzle array.Fig. 6, Fig. 7 and Fig. 8 illustrate the example that wherein forms a supply opening with rectangular aperture along a nozzle array.Yet, can form a plurality of supply openings at a nozzle array.
In addition, except first liquid flow path, stream forms parts and also is configured for carrying out temperature controlled second liquid flow path.The formation of second liquid flow path is not particularly limited.Yet preferably second liquid flow path is arranged along the nozzle array longitudinal direction of nozzle array (that is, along).In addition, preferably second liquid flow path is arranged along the both sides of all nozzle arrays.
For the quantity of second liquid flow path without limits, and can have one or two second above liquid flow paths.For example, with reference to figure 7, form one second liquid flow path, this second liquid flow path comprises to it to be supplied the liquid inlet of second liquid and discharges the liquid outlet of second liquid from it.
Further preferably, even when only having one second liquid flow path, also arrange second liquid flow path along the both sides of whole nozzle array.In addition, expectation is that (with reference to the d among the figure 7) is roughly the same for the beeline in the horizontal plane between each the exhaust energy producing component and second liquid flow path.
Can in each second liquid flow path, form first fluid passage and second fluid passage in the substrate.In addition, can in one second liquid flow path, form a plurality of first fluid passages and a plurality of second fluid passage.Not special restriction.In addition, the viewpoint from the efficient of liquid circulation preferably forms one first fluid passage and one second fluid passage at one second stream.
As mentioned above, comprising sunk part according to the substrate in the liquid discharging head of this exemplary embodiment with a top surperficial relative side that is furnished with stream formation parts.In the bottom of sunk part, connect a substrate ground and form all supply openings.Substrate and support component are engaged at the place, bottom of sunk part, make supply opening and intake communicate with each other.
Support component comprises the intake that is used for supplying to supply opening first liquid.In addition, support component comprises and is used for second liquid path from second liquid to first fluid passage of a substrate that supply first liquid path of second liquid and be used for discharging from second fluid passage.
The liquid cycling mechanism is sent to first liquid path with second liquid from second liquid path.The intake of support component can comprise the liquid supply part that is used to supply liquid.The liquid supply part can comprise the function that is used to accommodate second liquid.
Have no particular limits for being used to form the service duct that on the ink-jet substrate, forms and the method for passing away.From the viewpoint of design, preferably use the dry etching such as RIE to be vertically formed service duct and passing away.Yet,, be dry-etched in by utilization that the little through hole of formation is unpractical on the general wafer from the viewpoint of time and cost.
On the other hand, if make the attenuation of whole ink-jet substrate, then can use dry etching to form through hole effectively.Yet if make the attenuation of whole ink-jet substrate, intensity reduces, and make because stream forms the stress of parts and produce warpage in the ink-jet substrate, and productivity ratio may greatly be reduced.
In order to address this is that, go out forming the relative side of that sides of parts and form sunk part as shown in Figure 6 at the ink-jet substrate with the top stream that is furnished with.Place, bottom at sunk part engages support component and ink-jet substrate.
As a result, in the intensity of keeping the ink-jet substrate, can use dry etching in sunk part, to form ink-jet supply opening, service duct and passing away effectively.More particularly, because the edge of ink-jet substrate has preset thickness, therefore can keep intensity.In addition, owing in the bottom of the sunk part of thin substrates, form black supply opening and service duct, therefore the size of opening can be formed less.
In addition,, when keeping substrate strength, the opening of black supply opening can be formed less, make to form the high density nozzle effectively and make the ink jet print head miniaturization according to this exemplary embodiment.Traditionally, general crystal anisotropy etching by silicon substrate forms black supply opening.Yet owing to carry out etching with predetermined gradient in the crystal anisotropy etching, therefore the opening of black supply opening becomes big.
In addition, as mentioned above,, be unpractical by utilizing dry etching to be vertically formed black supply opening from the viewpoint of time and cost.In addition, if, then reduced intensity as mentioned above, and become and be easy to generate the warpage of ink-jet substrate by making the opening of the black supply opening of whole ink-jet substrate attenuation reducing.In order to address this is that, according to this exemplary embodiment, all black supply openings are disposed in the bottom of sunk part, make the opening size of black supply opening to be reduced.As a result, can form nozzle and can make the ink jet print head miniaturization with high density.
In addition, owing to do not make the attenuation of whole ink-jet substrate, and the periphery of substrate has preset thickness, therefore can keep intensity, and not produce warpage.Particularly, according to the present invention, form on the parts and black stream formation temperature control stream discretely at stream.Therefore this exemplary embodiment has realized the better technology that wherein opening of black supply opening and fluid passage can be formed less.
With reference to figure 6, as mentioned above, engage ink-jet substrate 1 and support component 2 by adhesive 4.Ink-jet substrate 1 is comprising sunk part with a top surperficial relative side that is furnished with stream formation parts 3.Ink-jet substrate 1 is engaged to support component 2 at the place, bottom of sunk part.
In the bottom of sunk part, connect ink-jet substrate ground and form whole black supply opening 8, a plurality of service duct 11 and a plurality of passing away 13.China ink supply opening 8, a plurality of service duct 11 are formed by the through hole with sidewall vertical with respect to the surface direction of ink-jet substrate 1 with a plurality of passing aways 13.
Place, bottom at sunk part joins support component 2 to ink-jet substrate 1, makes black supply opening 8 and black intake 9, service duct 11 and feed lines 12 and passing away 13 and discharge path 14 communicate with each other.Ink jet print head can comprise the black supply part (not shown) that is used for to the black storage China ink of black intake 9 supplies of support component 2.
In addition, as mentioned above,, form a black supply opening 8 at a nozzle array according to this exemplary embodiment.In the bottom of sunk part, form the opening of a plurality of black supply openings 8 with rectangular shape along nozzle array.
In addition, support component 2 comprises the convex shape that installs in the sunk part, and black intake 9, feed lines 12 and discharge path 14 have opening on the upper surface of bossing.Each black intake 9 is arranged to each black supply opening 8 and is communicated with when engaging, and forms a plurality of arrays.
In addition, preferably, support component has the bossing with the sunk part of substrate coupling.Can use forming method to make this support component.
As mentioned above, according to this exemplary embodiment, the ink-jet substrate be included in above be furnished with the sunk part that stream forms a surperficial relative side (back side) formation of parts.The method that is used to form sunk part with describe according to first exemplary embodiment the same.
According to this exemplary embodiment, stream forms parts and comprises a plurality of nozzle arrays that formed by the black outlet and first liquid flow path of ground, space connection each other.Form at least one supply opening at each nozzle array, and all supply opening is formed in the bottom of sunk part.In addition, with reference to figure 6, Fig. 7 and Fig. 8, form a supply opening along a nozzle array with rectangular aperture.Yet this is not restriction, and can form a plurality of supply openings at a nozzle array.
If form a plurality of supply openings, then can in support component, arrange intake at each supply opening that is communicated with same nozzle array at a nozzle array.In addition, can form an intake at a plurality of supply openings that are communicated with nozzle array.
In addition, preferably use dry etching to form black supply opening 8, service duct 11 and passing away 13.If the use dry etching, then can be formed the surface direction with respect to the ink-jet substrate be vertical to side surface, and can make opening size littler.In addition, except using dry etching, can use laser to form black supply opening 8, service duct 11 and passing away 13.
According to the 3rd exemplary embodiment of the present invention, will be the example of cooling flowing path wherein with reference to figure 6 descriptions according to the temperature control stream (that is second stream) of second exemplary embodiment.
With reference to figure 6, use 0.3mm to form ink-jet substrate 1 to the thick silicon substrate of 1.0mm.On the front of ink-jet substrate 1, form a plurality of exhaust energy producing components 7, such as heater.In addition, the stream that forms on ink-jet substrate 1 forms parts 3 black stream 5 of formation and outlets 6.
In addition, stream forms parts 3 and forms the cooling flowing path 10 that cooling medium flows therein.The silicon substrate that forms ink-jet substrate 1 has＜100〉face crystal orientation.Layout exhaust energy producing component 7 below black outlet 6.
A plurality of nozzle arrays are arranged and formed with being embarked on journey to China ink stream 5 and black outlet 6.Cooling flowing path 10 is disposed in around the nozzle array and between nozzle array.The back side of using crystal anisotropy to be etched in ink-jet substrate 1 forms sunk part, and expose＜100〉face become the composition surface between ink-jet substrate 1 and support component.
At the black supply opening 8 that pro connect ink-jet substrate 1 of each nozzle array formation from composition surface to ink-jet substrate 1.Ink-jet substrate 1 ground that pro connects from composition surface to ink-jet substrate 1 is formed for to the service duct 11 of cooling flowing path 10 supply cooling mediums and is used for discharging from cooling flowing path 10 passing away 13 of cooling mediums, so that be communicated with the part of cooling flowing path.
From the viewpoint of heat, can select the big and stable liquid of its thermal capacity (such as water) as cooling medium.In addition, can use that discharge and be recorded in China ink on the recording medium from black outlet 6 as cooling medium.
Can be by pressurizeing so that pushed out the fluid transfer medium from liquid outlet from the liquid inlet.In addition, can be by be sucked out transmission cooling liquid medium from liquid outlet.Can use can fluid transfer various pumps as drive source.Pump is set on the main body of ink-jet printer, and can be connected with the cooling medium opening 13 of ink gun 1.
As mentioned above, realized the ink gun that cooling medium can circulate therein, made and greatly to improve because the discharge of the heat that bubble (bubbling) produces.As a result, even when time per unit input energy to the end increases, the temperature that also can reduce head during writing down rises.Therefore can reduce such as black discharge rate and change or discharge problem unstable, and can improve continuous recording capability and record reliability at high temperature at each page.
In addition, go out as shown in Figure 7, preferably arrange cooling flowing path 10, make to become for each heater constant in the beeline along surface direction (horizontal direction) (with reference to the d among the figure 7) that is arranged as between cooling flowing path that surrounds nozzle array and the heater 7 that produces heat.
With reference to figure 7, heater 7 is disposed under the outlet 6.If constant apart from d, then discharge heat equably, make to make heat radiation become consistent at each nozzle.
According to the present invention, thermal diffusion layer can be disposed on the substrate so that the foaming above the exhaust energy producing component partly expands to second liquid flow path.More particularly, the thermal diffusion layer that is formed by metal is formed on exhaust energy producing component top and expands to second liquid flow path.
Utilize this configuration, the heat that produces in the exhaust energy producing component can be sent to second liquid flow path effectively.In addition, thermal diffusion layer can also be used as anti-cavitation (cavitation-resistant) film.
To describe the 4th exemplary embodiment in detail below.Fig. 9 is the amplification sectional view that the part of being surrounded by the frame of broken lines X shown in Fig. 6 is shown.
With reference to figure 9, on the front of the silicon substrate of ink-jet substrate 1, form dielectric film 41 and passivating film 42.Heater 7 (that is exhaust energy producing component) is included in dielectric film 41 and the passivating film 42.Dielectric film 41 and passivating film 42 are formed by the film that satisfies corresponding function (such as silicon oxide film or silicon nitride film).
In the black discharge method that uses heat to bubble, when bubble collapse, produce cavitation (cavitation), this may destroy heater 7 and cause disconnection to connect.In order to reduce the destruction that causes owing to cavitation, generally on passivating film 42, arrange the film of anti-the cavitation.According to the present invention, preferably on passivating film 42, form the film of anti-cavitation the 43.
Consider intensity and flexibility, metal is used to form the film of anti-the cavitation.In addition, among metal, use tantalum (Ta) to form the film of anti-the cavitation.
Owing to use metal to form the film of anti-cavitation the 43, therefore specific thermal conductivity is very high mutually with on every side film (that is, dielectric film 41 and passivating film 42).Therefore, go out as shown in Figure 9, by expand to from heater 7 tops with cooling flowing path 10 contiguous arrange the film of anti-cavitation the 43 regionally, become can be energetically with the thermal diffusion that produces by heater 7 to cooling flowing path 10.
As a result, further improve cooling effectiveness, and can reduce owing to discharge the deterioration of the print quality that causes continuously.Preferably, the film of anti-the cavitation partly expands to the basal surface of cooling flowing path 10 and formation cooling flowing path 10 from the foaming of heater 7 tops.
Fig. 7 is the plane that the 5th exemplary embodiment of the present invention is shown, and can determine that the position of the layout of cooling flowing path 10 and service duct 11 and passing away 13 is so that satisfy its function.For example, can shown in Figure 10 A and Figure 10 B, arrange cooling flowing path 10, service duct 11 and passing away 13.
With reference to figure 10A, arrange a plurality of cooling flowing paths 10 along the both sides of nozzle array.Service duct 11 and passing away 13 are arranged in terminal part office at each cooling flowing path 10.Utilize this configuration, can reduce flow resistance, and can easily transmit cooling medium.
With reference to figure 10B, form a cooling flowing path 10, and arrange passing away 13 and service duct 11 close to each other.Cooling flowing path 10 begins near the liquid inlets the service duct 11 to extend along the both sides of each nozzle array, and arrives near the liquid outlet the passing away 13, and is arranged to and roughly surrounds each nozzle array.Shown in Figure 10 B, can between nozzle array, form two or more cooling flowing paths.
Figure 11 A, Figure 11 B, Figure 11 C, Figure 11 D, Figure 11 E, Figure 11 F and Figure 11 G are the technology sectional views that illustrates according to the manufacture method of the ink jet print head of the 6th exemplary embodiment of the present invention.With reference to figure 11A, be provided with ink-jet substrate 101.On ink-jet substrate 101, form heater 102 and the drive circuit (not shown) that is connected with heater 102.
With reference to figure 11B, form the stream moulding material 103 of black stream and cooling flowing path 10.Because stream moulding material 103 must be removed in subsequent technique, therefore can use aluminium or soluble resin to form stream moulding material 103.The moulding material of China ink stream is also referred to as first moulding material, and the moulding material of cooling flowing path is called as second moulding material.
With reference to figure 11C, organic resin, and is formed stream and forms parts 104 so that cover stream moulding material 103 by spin coating and baking.Form black outlet 105 then.
If it is photosensitive forming the organic resin of stream formation parts 104, then can and develop by exposure form black outlet 105.In addition, if organic resin is not photosensitive, then can form black outlet 105 by laser treatment or photoetching and etching.
If stream forms parts 104 and will be formed on the stream moulding material 103, then stream form the thickness of parts may be in the terminal part office attenuation of nozzle array, and therefore hinder in nozzle array and bubble uniformly.In order to address this is that, Japanese Patent Application Publication No.10-157150 has discussed the pattern that further is provided as substrate (base) in the nozzle array outside, so that improve the flatness that stream forms parts.According to this exemplary embodiment, the stream moulding material that forms in the position that will form cooling flowing path also can be used as this substrate.
With reference to figure 11D, sunk part 106 is formed at the back side of ink-jet substrate 101, and becomes the composition surface with support component.Can use the crystal anisotropy etching of utilizing aqueous slkali to form sunk part.If utilize the crystal anisotropy etching, then can form the diaphragm (not shown) and protect stream to form parts 104.
With reference to figure 11E, connect ink-jet substrate 101 ground and form black supply opening 107, service duct 108 and passing away 109.Can utilize and use the dry etching of photoresist mask to form through hole with predetermined patterns of openings.Rich construction skill as an example of dark silicon etching technology is preferred as dry etching method.
With reference to figure 11F, stream moulding material 103 is dissolved and be removed from black supply opening 107, service duct 108, passing away 109 and black outlet 105.Form black stream 110 and cooling flowing path 111 then.Select the remover of stream moulding material 103 by the material of considering moulding material and stream formation parts.If moulding material is an aluminium, then can use acid or aqueous slkali as remover, and if moulding material is an organic resin, then can use can the elution organic resin solvent.
With reference to figure 11G, adhesive 116 is used at the place, bottom of sunk part 106 support component 112 be combined with ink-jet substrate 101.Support component 112 comprises and is used for supplying black intake 113, being used for to the feed lines 114 of service duct 108 supply cooling mediums and the discharge path 115 that is used for discharging from passing away 109 cooling mediums to black supply opening 107.
Describe the manufacture method of ink jet print head in detail below with reference to Fig. 4 and Fig. 5.The exemplary embodiment that will describe below the invention is not restricted to.
Fig. 4 A illustrates the ink-jet substrate 101 and the stream that use silicon to form and forms parts 105.On the front of ink-jet substrate 101, form etching stop layer 123 and heater 102 (that is exhaust energy producing component).
In addition, above heater 102 and etching stop layer 123, form the insulating barrier (not shown).Form etching stop layer 123 by the thick aluminium of sputter 500nm.Form the thick oxidation film of 700nm with as this insulating barrier by carrying out plasma chemistry vacuum moulding machine (CVD).The thickness of ink-jet substrate 101 is 700 μ m.In addition, forming its thickness on the back side of ink-jet substrate is the heat oxide film 106 of 600nm.
On the front of ink-jet substrate, form the moulding material 103 of black stream.Utilize positive photoresist to form moulding material 103.Above ink-jet substrate 101 and moulding material 103, form stream and form parts 104.Can also form the adhesive layer (not shown) that forms by the polyetheramides resin bed and improve the adhesiveness that stream forms parts and ink-jet substrate.
Use the polyetheramides resin on the back side of ink-jet substrate 101, to be formed for forming the back side masks 107 of sunk part.With reference to figure 4B, it is solution influenced that the front surface that the resist 108 of formation protectiveness protects stream to form parts 105 and ink-jet substrate is avoided alkaline etching.By Tokyo Ohka Kougyou Co., " OBC " that Ltd. makes is used as the resist of protectiveness.
With reference to figure 4C,, use back side masks 107 to carry out the crystal anisotropy etching by the back side of ink-jet substrate being immersed in the tetramethylammonium hydroxide aqueous solution (22wt%, 83 ℃) 12 hours.Therefore form the sunk part that comprises composition surface 109.The degree of depth of sunk part (that is 109 the distance from original back position to composition surface) is 600 μ m.
With reference to figure 4D, remove back side masks 107 and heat oxide film 106 then.
With reference to figure 4E, form black supply opening mask 110.Photosensitive material (by AZ Electronic Materials Co., the AZP4620 " ProductName " that Ltd makes) is used as the material of black supply opening mask 110.In addition, this material is applied equably by using spraying equipment (by EVG Co., the EVG 150 " ProductName " that Ltd. makes), and be exposed and develop, and formation and black supply opening corresponding opening pattern.
With reference to figure 4F, use black supply opening mask 110 to carry out dry etching, and on ink-jet substrate 101, form black supply opening 111.RIE is used as dry etching method.
With reference to figure 4G, remove the black supply opening mask 110 that on the back side of ink-jet substrate 101, forms, and remove etching stop layer 103 and insulating barrier then.
With reference to figure 4H, remove the resist 108 of protectiveness.In addition, remove moulding material 103, form black stream 112, and made the discharge component substrate.
Bottom surface at sunk part engages the support component that obtains by above-mentioned manufacture method and discharges component substrate, makes black supply opening 111 and black intake communicate with each other.Therefore obtain ink jet print head (with reference to figure 1).Aluminium oxide is used to form support component.
The technology shown in execution graph 4 and Fig. 5 when the ink-jet substrate is the wafer form.The ink-jet substrate is cut out in (dicing) technology in section then, and becomes the single ink-jet substrate that goes out as shown in FIG..Applying adhesive around the black intake in support component then, and support component engaged with ink-jet substrate 20.
In addition, ink-jet substrate and ink jet print head are carried out the electrical connection (not shown).
Used the ink jet print head that utilizes above-mentioned manufacture method manufacturing to carry out the printing endurancing.Obtained following result, that is, the reliability height of the sealing between each color is even and also realized high record reliability when carrying out flying print.
In addition, will describe size in detail with reference to figure 1 and Fig. 4, so that effect of the present invention is shown particularly by the ink jet print head of above-mentioned manufacture method formation.
Below with reference to the size of Fig. 1 description according to the ink jet print head of this exemplary embodiment.The opening size of China ink supply opening is 100 μ m.Distance b between the black supply opening of adjacent nozzles array is 1100 μ m.Distance c from the black supply opening that is positioned at edge to the along continuous straight runs of the fringe region of the sunk part at the back side is 300 μ m.
Is 500 μ m from the marginal portion of the sunk part at the back side to the marginal portion of ink-jet substrate apart from d.Therefore the width w of whole ink-jet substrate becomes 4100 μ m.Can obtain the width W of the bonding part of 800 μ m then.
Fig. 5 is the sectional view that traditional ink jet print head is shown.With reference to figure 5, (that is the minimum surface of the ink-jet substrate among Fig. 5) located to join traditional ink mist recording substrate to support component at the back side except sunk part.As a result, if obtain to be equivalent to the width W of the width W of the bonding part shown in Fig. 1 ', then go out as shown in Figure 5, whole ink-jet substrate becomes bigger.
More particularly, the width of bonding part " W ' " is set to 800 μ m similarly with the size of above-mentioned exemplary embodiment.In this case, the opening size a ' of the black supply opening shown in Fig. 5 is 100 μ m.Distance b between the black supply opening of adjacent nozzles array ', that is, become 1950 μ m owing to the crystal orientation of silicon substrate becomes greatly.In addition, c ' becomes 150 μ m, and d ' becomes 500 μ m.Therefore the width w ' of whole ink-jet substrate becomes 5500 μ m, and it is bigger.
As mentioned above, according to the present invention, can guarantee the enough contact areas between a support component and a substrate, and can make the compact in size of a substrate.
According to the present invention, can under the situation of the productivity ratio that does not reduce a substrate, provide highly reliably and liquid discharging head with high heat-sinking capability.As a result, can tackle the increase of print speed according to liquid discharging head of the present invention.
In addition, according to other aspects of the invention, can provide the liquid discharging head that has durability and can be miniaturized.In other words,, in the intensity of keeping a substrate, can reduce the size of supply opening, make and when keeping durability, can carry out miniaturization according to the present invention.In addition, owing to can form outlet, therefore can also improve discharging performance with high density.
Though reference example embodiment has described the present invention, should be appreciated that to the invention is not restricted to disclosed exemplary embodiment.Thereby the scope of following claim will be given the wideest explanation comprises all modifications, equivalent construction and function.
Claims (9)
1. liquid discharging head comprises:
Stream forms parts, described stream forms parts and is configured for discharging the outlet of liquid and the liquid flow path that is communicated with described outlet, and comprise a plurality of nozzle arrays, each nozzle array in described a plurality of nozzle arrays is formed by the described outlet and the described liquid flow path of ground, space connection each other;
Substrate, described substrate comprise the exhaust energy producing component that produces the energy that is used to discharge liquid, and are formed for supply opening to described liquid flow path supply liquid at each nozzle array in described substrate; And
Support component, described support component comprise the intake that is used for to described supply opening supply liquid,
Wherein said substrate comprising sunk part with a top surperficial relative side that is furnished with described stream formation parts,
Wherein all supply openings are formed in the bottom of described sunk part with being connected described substrate, and
Wherein said substrate and described support component are engaged at the place, bottom of described sunk part, make described supply opening and described intake communicate with each other.
2. liquid discharging head according to claim 1, wherein said supply opening is formed along described nozzle array.
3. liquid discharging head according to claim 1, wherein said sunk part forms by anisotropic etching.
4. liquid discharging head according to claim 1, wherein said sunk part forms by the crystal anisotropy etching.
5. liquid discharging head according to claim 4, wherein said substrate be by use have＜silicon substrate of 100〉face crystal orientation forms.
6. liquid discharging head according to claim 5, the bottom of wherein said sunk part by the crystal anisotropy etching form＜100〉face, and should＜100〉face become the composition surface of described substrate and described support component.
7. according to any one described liquid discharging head in the claim 1 to 6, wherein:
Described stream forms parts and also constitutes second liquid flow path that second liquid flows therein;
Wherein be used for being formed on described substrate to second fluid passage that described second liquid flow path is supplied first fluid passage of second liquid and is used for discharging from described second liquid flow path second liquid, and
Wherein said stream forms parts and described substrate and is formed and makes described second liquid flow path, described first fluid passage and described second fluid passage be formed to communicate with each other, and described liquid flow path and described supply opening are formed and communicate with each other.
8. liquid discharging head according to claim 7, wherein said second liquid flow path comprise by it to be supplied the liquid inlet of second liquid and discharges the liquid outlet of second liquid by it from described second liquid flow path to described second liquid flow path, and
Wherein said liquid inlet is connected with described first fluid passage, and described liquid outlet is connected with described second fluid passage.
9. liquid discharging head according to claim 7, wherein the thermal diffusion layer that is formed by metal is formed on the described exhaust energy producing component, so that expands to described second liquid flow path.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-115233 | 2010-05-19 | ||
| JP2010-115232 | 2010-05-19 | ||
| JP2010115232 | 2010-05-19 | ||
| JP2010115233 | 2010-05-19 | ||
| JP2011-099580 | 2011-04-27 | ||
| JP2011099580A JP5717527B2 (en) | 2010-05-19 | 2011-04-27 | Liquid discharge head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102248794A true CN102248794A (en) | 2011-11-23 |
| CN102248794B CN102248794B (en) | 2014-05-07 |
Family
ID=44976494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110130120.XA Expired - Fee Related CN102248794B (en) | 2010-05-19 | 2011-05-19 | Liquid discharging head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102248794B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110325372A (en) * | 2017-04-05 | 2019-10-11 | 惠普发展公司，有限责任合伙企业 | Fluid injection tube core heat exchanger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172011A (en) * | 1996-06-07 | 1998-02-04 | 佳能株式会社 | Liquid discharging method, liquid supplying method, liquid discharge head, liquid discharge head cartridge using such liquid discharge head, and liquid discharge apparatus |
| JPH10157050A (en) * | 1996-11-28 | 1998-06-16 | Dainippon Screen Mfg Co Ltd | Apparatus and method for regulating joint in split plotting |
| US6796019B2 (en) * | 1998-06-19 | 2004-09-28 | Lexmark International, Inc. | Process for making a heater chip module |
| JP2005125516A (en) * | 2003-10-21 | 2005-05-19 | Canon Inc | Ink jet recording head and its manufacturing process |
-
2011
- 2011-05-19 CN CN201110130120.XA patent/CN102248794B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172011A (en) * | 1996-06-07 | 1998-02-04 | 佳能株式会社 | Liquid discharging method, liquid supplying method, liquid discharge head, liquid discharge head cartridge using such liquid discharge head, and liquid discharge apparatus |
| JPH10157050A (en) * | 1996-11-28 | 1998-06-16 | Dainippon Screen Mfg Co Ltd | Apparatus and method for regulating joint in split plotting |
| US6796019B2 (en) * | 1998-06-19 | 2004-09-28 | Lexmark International, Inc. | Process for making a heater chip module |
| JP2005125516A (en) * | 2003-10-21 | 2005-05-19 | Canon Inc | Ink jet recording head and its manufacturing process |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110325372A (en) * | 2017-04-05 | 2019-10-11 | 惠普发展公司，有限责任合伙企业 | Fluid injection tube core heat exchanger |
| US11046073B2 (en) | 2017-04-05 | 2021-06-29 | Hewlett-Packard Development Company, L.P. | Fluid ejection die heat exchangers |
| CN110325372B (en) * | 2017-04-05 | 2022-02-18 | 惠普发展公司，有限责任合伙企业 | Fluid ejection device, print bar, and fluid flow structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102248794B (en) | 2014-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10195851B2 (en) | Printhead die | |
| US8408681B2 (en) | Liquid discharge head having an increased rigidity | |
| US6003971A (en) | High-performance ink jet print head having an improved ink feed system | |
| US6409318B1 (en) | Firing chamber configuration in fluid ejection devices | |
| JP5732526B2 (en) | Fluid ejection device | |
| JP2006123551A (en) | Nozzle plate, inkjet printing head with the same and manufacturing method of nozzle plate | |
| CN101444994B (en) | Inkjet printing head and inkjet printing apparatus | |
| JPH0623990A (en) | Electrothermal conversion-type ink jet printer head | |
| JP2008049531A (en) | Inkjet recording head | |
| CN102089151A (en) | Print head slot ribs | |
| JPH11320889A (en) | Thin film ink-jet print head | |
| TW200406315A (en) | Circulation through compound slots | |
| US6649074B2 (en) | Bubble-jet type ink-jet print head and manufacturing method thereof | |
| US6109735A (en) | Liquid discharging method, liquid supplying method, liquid discharge head, liquid discharge head cartridge using such liquid discharge head, and liquid discharge apparatus | |
| US6959979B2 (en) | Multiple drop-volume printhead apparatus and method | |
| JP2004148827A (en) | Print head assembly and method of forming the same | |
| CN102248794B (en) | Liquid discharging head | |
| AU2005287347A1 (en) | Improved micro-fluid ejection devices and method therefor | |
| US20060218789A1 (en) | Overhanging nozzles | |
| KR100644706B1 (en) | Inkjet printhead and method of manufacturing the same | |
| US8313167B2 (en) | Tiled manifold for a page wide printhead | |
| JP2009096041A (en) | Ink jet head and ink jet head device | |
| CN1482965A (en) | Nozzle flood isolation for ink jet printhead | |
| TWI222934B (en) | The porous back-shooting inkjet print head module | |
| AU773695B2 (en) | Liquid discharging method, liquid supplying method, liquid discharge head, liquid discharge head cartridge using such liquid discharge head, and liquid discharge apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140507 Termination date: 20210519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |