TWI222934B - The porous back-shooting inkjet print head module - Google Patents

Abstract

A porous back-shooting ink jet print head module is disclosed. The ink permeates through the porous ink supply layer into the ink chamber contracted outside by inject hole, and the porous ink supply layer prevents the ink floating back. So that ink chamber is sealed very well and more pressure could be generated, and could be used for the high stickiness ink. It need not precision aim process, therefore products manufactured efficiency and decreased the cost.

Description

1222934 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an inkjet printing module and a manufacturing method thereof, and more particularly to a porous back-fired inkjet printing with a highly-closed ink storage chamber. Module and its manufacturing method [Prior technology] Nowadays, the application of computer related products is very common, especially the convenience of inkjet printers is widely loved by the general public. Generally used by traditional inkjet printers The print head is a thermal inkjet print head. The working principle of the ilb jet inkjet q Hp head is to apply a pulse (pu 1 se) voltage to the control chip, and then the voltage signal passes through. A heater with a high resistance characteristic generates heat, which causes the ink to form a thermal bubble, and then the ink droplets generated by this thermal bubble are ejected from a nozzle (nozz 1 e) out of paper or other The object is printed on the surface of the object, and the ink is replenished from the ink cartridge to the ink storage chamber through the ink channel. As shown in "Figure 1", it is a cross-sectional view of a conventional thermal bubble inkjet print head, in which a substrate 201 is formed with a thermal barrier layer ^ 0 2 (thermal barrier), and then A thermal barrier layer 2 0 3 is formed on the thermal barrier layer 202, wherein the thermal barrier layer 2 02 is used to block the resistance heating layer H from transferring thermal energy to the substrate 2 0 1; then, the resistance heating layer 2 3 Overlay ^ ... $ ▲ Electrical layer 204 (conductor), through which voltage signals are transmitted, w, the first insulation layer 205 (insulator) on the conductive layer 204, forming an adhesion layer 206 (v) below the surrounding v, and versus

1222934 V. Description of the invention (2) The mouth plate | The nozzle plate 209 is glued together, and the surrounding area is the ink chamber 2 0 7 (ink chamber). Force 308 (ink channel), which can be used to replenish ink from ink cartridge to ink to 207. When the pulse voltage signal is transmitted through the conductive layer 204 to the resistance plus layer 2 03, high heat is generated, and the ink stored in the ink storage chamber 2 07 generates heat bubbles 2 1 1. Therefore, the instantaneous pressure increases and the The ink is pushed out from the ink storage chamber 7 to the nozzle holes 2 1 0 (η ο zz 1 e) to form ink droplets 2 1 2.

However, when the hot air bubble 2 1 1 is generated and the ink droplet 2 1 2 is pushed out from the nozzle hole 2 1 0 ^ 'often the driving force is dispersed due to the existence of the ink flow channel 2 08' and this inkjet method A precise sandblasting process is required to produce a hollow ink tank communicating with the ink tank and the ink flow path 208; in addition, the orifice plate 0 9 and other related components need to be positioned and attached by precision alignment technology The combined action not only takes time and reduces production capacity, but also increases the cost of production. In addition, there are more and more applications of high viscosity coefficient inks on the market. However, due to the problem of the tightness of the ink storage chamber, the traditional structure cannot be used. This traditional method is applied to inks with high viscosity coefficients.

In addition, Karl inski et al. Proposed an "Inkjetprinthead withink supply through porous medium" U.S. Patent No. 5,940,099, which mainly includes a layer of piezoelectric material (piezoelectric material), a deflection layer, an ink supply layer (ayer), and a glass capillary. Its working principle is to apply a voltage to the piezoelectric layer to deform it and eject the stored ink. However, the parts used in this method need to use precise processing technology and precise alignment.

Page 7 1222934 V. Description of the invention (3) and assembly technology, the processing cost is extremely high, the yield is extremely low, and the assembly time is also long. [Summary of the Invention] In view of the problems of the above-mentioned conventional technology, the present invention provides a porous back-fired inkjet printing module and a method for manufacturing the same, using an ink supply plate with a porous material to cover the nozzle holes to form an excellent sealing performance. The ink storage chamber, after heating the ink, can provide the ink in the ink storage chamber with a larger pressure.

A porous back-fired inkjet printing module disclosed in accordance with the present invention mainly includes a substrate. The material of the substrate may be silicon wafer, glass, metal, ceramic, polymer, etc., and the substrate includes a spray nozzle. hole. The thermal barrier layer is established above the substrate. A heating layer is made of a material with high resistance. It is formed on the surface of the thermal barrier layer and is located near the spray holes. The thermal barrier layer is used to prevent the heat energy generated by the heating layer from being transferred. To the substrate. A conductive layer is electrically connected to the heating layer, and an insulating layer is covered over the conductive layer. An electrode layer is formed on the conductive layer and the insulating layer to receive the external pulse voltage and transfer it to the conductive layer. When the pulse voltage flows through the conductive layer and is guided to the heating layer, the heating layer is a material with high resistance characteristics. High heat is generated; an adhesive layer is formed above the insulating layer and communicates with the spray holes of the substrate. An ink supply layer is made of porous material. One side of the ink supply layer covers and adheres to the adhesive layer and the other side is in contact with the ink cartridge. At this time, the ink storage chamber forms a closed ink storage chamber by the adhesive layer and the ink supply layer. The ink in the ink E is drained to the ink storage chamber through the ink supply layer. The manufacturing method of the porous back-fired inkjet printing module of the present invention,

Page 8 1222934 V. Description of the invention (4) The steps include: providing one of glass, metal, and ceramic, and forming a heating layer on the surface of the substrate. The surface of the upper part of the thermal layer is electrically connected; Make the nozzle hole that establishes the metal electrode layer to be insulated from the external pulse voltage; and then cover the ink supply layer with insulation to connect the ink supply layer with the ink. Unlike the related components, which do not need to be made, the ink with a higher viscosity coefficient is greatly improved. As can be seen from the above, in this module and its manufacturing method, the heating layer heats the ink and the etching process is performed on the substrate. The required flow channel is set, so the pressure difference of the storage, and to solve the dilemma of the industrial liquid, the product rate of the present invention and the related production substrate, the base and the polymer surface form a thermal heating to form an insulating edge layer and then the layer. The invention of the adhesive sealed ink storage liquid storage system is not only able to provide a precise ink chamber interface, but the layer is a highly conductive layer that guides and stores the ink storage structure on the surface of the upper layer of the sand blast. The composition of the board blocks the resistance, and the square surface of the electric layer and the chamber need to be provided with a sealing material to form a layer; the conductive layer above the characteristic is established on the base surface to form a precise storage, Because of this performance, it is a group of thermal resistance material layers and parts of silicon. On the interlayer; on the surface of the heating layer; to connect it as a through layer, then to contain the empty ink layer for the holes and reduce the thickness of the application to expose a multi-conductive layer and a bubble to generate holes, so there is no need to align and fit. It has an excellent application, which can greatly reduce the production voltage and provide a thermal blowhole back-fired inkjet printing pulse voltage. It can directly use the nozzle plate and act by ejecting ink droplets. Furthermore, it can be supplied without ink tightness. Large ink with high viscosity coefficient as cost and improve bubble inkjet printing structure at the same time

Page 9 1222934 V. Description of the invention (5) The future development direction to meet the needs of the industry can really be used by the industry. In order to further understand the purpose, structural features, and functions of the present invention, detailed descriptions are given in conjunction with the drawings as follows: [Embodiment] The porous back-fired inkjet printing module and its manufacturing method disclosed in accordance with the present invention, Receives the external pulse voltage, and uses the high-tightness ink storage chamber and the porous material ink supply layer to generate a large thrust to enable the application of ink liquid with high viscosity coefficient. In order to explain the present invention in detail, please refer to "Figure 2" to "Figure 9", which are schematic flowcharts of the first embodiment of the present invention. As shown in "Figure 2", the substrate 10 is first provided, and the material of the substrate 10 can be silicon wafer, glass, metal, ceramic, and polymer, and a thermal barrier layer 20 is formed on the substrate 10; As shown in "Figure 3", a heating layer 30 is established above the thermal barrier layer 20, and a hole is reserved for subsequent processing (detailed later), and the heating layer 30 is made of a high resistance Material; then as shown in "Figure 4", a discontinuous conductive layer 40 is formed above the heating layer 30, and the heating layer 30 is electrically connected to the conductive layer 40; and as shown in "Figure 5" As shown, a specific shape of the insulating layer 50 is established on the conductive layer 40 by yellow light and an etching process; referring to "Figure 6", an electrode layer 6 is formed on the insulating plate 50 and the conductive layer 40 0, and is electrically connected to the conductive layer 40, and receives the external pulse voltage to be transmitted to the conductive layer 40; refer to the "Figure 7", next to the heating layer 30, on the substrate 10 Sandblasting, laser, dry etching, or wet chemical etching are used to form through holes 70, which are adjacent to the heating layer.

1222934 V. Description of the invention (6) 30, so that the spray hole 70 is located within the range of the hole position left by the heating layer 30; as shown in "Figure 8", an adhesive layer 80 is formed on the insulating layer 50. The upper part of the area is formed with an accommodating space 81 by a ring-shaped structure of an adhesive layer 80. Finally, as shown in "Figure 9", a porous body such as an ink supply layer 90 is covered. The ink storage chamber 91 is formed by being adhered to the adhesive layer 80, and communicates with the nozzle hole 70. That is, a position covering the nozzle hole 70 and the heating layer is formed at the position of the insulating layer 50 disk relative to the nozzle hole 70. The ink storage chamber 91 of 30, in which the ink supply layer 90 is a porous material. However, the adhesive layer 80 can also be replaced with a porous material, as shown in "Fig. 10", which is the present invention. A schematic diagram of the second embodiment, in which an ink supply plate 100 of porous material is used instead of the adhesive layer 80 to be integrally formed, and is processed by electroforming on the bottom of the ink supply plate 100 to form a reservoir. The ink chamber 10 is in communication with the nozzle hole 70, and the ink in the ink cartridge (not shown) penetrates through the ink supply plate 100 and is stored. 1 0 1 in the ink storage chamber; the ink supply plate 100 is not necessarily composed of porous material as a whole, but at least the ink supply plate 100 has a range of porous materials, which must cover the nozzle holes 70 and heating Area of layer 30. Here is a detailed description of the flow of action, please refer to "Figure 11", which is a schematic diagram of the first action of the present invention, in which one side of the ink supply layer 90 is connected to an ink cartridge (not shown in the figure). At this time, the ink cartridge The ink 1 10 inside is stored in the ink storage chamber 91 through the ink supply layer 90, and the insulation layer 50 is used to isolate the ink 1 110 from contact with the conductive layer 40 and cause a short circuit. As shown in "Figure 12", it is a schematic diagram of the second operation of the present invention.

1222934 V. Description of the invention (7) The electrode layer 60 receives the external pulse voltage and transmits it to the conductive layer 40. Since the conductive layer 40 is formed on the heating layer 30 in a discontinuous manner, the pulse voltage passes through at this time. The heating layer 30 is returned to the conductive layer 40. At the same time, when the pulse voltage passes through the heating layer 30, the heating layer 30 is a high-resistance material and generates high heat, so that it is stored in the ink storage chamber 91. The ink generates thermal bubbles 1 11. At this time, due to the instantaneous pressure increase in the ink storage chamber 91, the ink droplets 11 2 flow out from the nozzle holes 70 to the outside. Generally, the thermal bubble generated by the traditional inkjet structure is parallel to the direction of the ink droplet outflow. As shown in "Figure 1", the direction of the thermal bubble 2 1 1 is parallel to the direction of the ink droplet 2 1 2 outflow. The structure is a top shoot; the thermal bubbles 1 1 1 and the ink droplets 1 1 2 produced by the present invention have opposite directions, so they are back shoots. According to Darcy ’s Law, the pressure difference is proportional to the velocity of the fluid, ie:

dP dX

ocV where P is the pressure, X is the direction of flow, and V is the flow rate. However, for the porous material used in the present invention, the pressure difference is described by the modified D a r c y s s L a w force port. The pressure difference is proportional to the sum of the first and third power of the flow velocity, μ dX κ

Page 12 1222934 V. Description of the invention (8)

Where P is the pressure, X is the direction of flow, // is the viscosity coefficient, p is the density of the fluid, and V is the flow rate. It can be seen from this that the pressure difference caused by using the present invention is much larger than the pressure difference caused by the conventional ink flow path. In addition, this structure does not need the traditional ink flow path setting, and supplies ink directly through the ink supply layer of porous material, while preventing ink from flowing back to the ink tank, and provides a highly sealed ink storage chamber and generates a large pressure difference. Therefore, it is possible to carry out the application of ink liquid with high viscosity coefficient; and to make the spray holes on the substrate by the etching process, without the need for precise bonding process steps, and save considerable production costs. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention; that is, all equivalent changes and modifications made in accordance with the scope of the patent application for the invention are covered by the scope of the patent for the invention .

Page 13 1222934 Brief description of the drawings Figure 1 is a schematic sectional view of a conventional thermal bubble inkjet print head; Figures 2 to 9 are schematic flowcharts of the first embodiment of the present invention; Figure 10 is A schematic diagram of the second embodiment of the invention; FIG. 11 is a schematic diagram of the first operation of the invention; and FIG. 12 is a schematic diagram of the second operation of the invention. [Illustration of Symbols]

Page 14 10 Substrate 20 Thermal barrier layer 30 Heating layer 40 Conductive layer 50 Insulation layer 60 Electrode layer 70 Nozzle 80 Adhesive layer 81 Receiving space 90 Ink supply layer 91 Ink storage chamber 100 Ink supply plate 101 Ink storage chamber 110 Ink 111 Thermal bubble 112 Drop 201 Base material 202 Thermal resistance barrier layer 1222934

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Claims (1)

1222934 VI. Application Patent Scope 1. A porous back-fired inkjet printing module, which is combined with an ink cartridge and can receive the external pulse voltage to eject the ink in the ink cartridge, which includes: a substrate An ink supply plate, one side is connected to the ink cartridge, and the other side has a receiving space and covers the area above the nozzle hole of the substrate to form a communication with the nozzle hole, and An ink storage chamber having a closed characteristic, and the ink supply plate above the ink storage chamber region is made of a porous material, so that the ink in the ink cartridge penetrates through the porous material and is stored in the ink storage chamber. A heating layer is arranged around the nozzle holes of the substrate and is located in the ink storage chamber; a conductive layer is electrically connected to the heating layer and can receive the pulse voltage from the outside to cause the pulse voltage to flow through; The heating layer generates thermal energy, and provides the ink stored in the ink storage chamber to generate thermal bubbles, so that the ink is instantaneously pressurized and ejected from the nozzle hole; and an insulating layer is disposed above the conductive layer. , To isolate the ink in contact with the conductive layer. 2. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, wherein the ink supply plate includes an ink supply layer and an adhesive layer, and the adhesive layer is in contact with the ink supply layer, And using the ring structure of the adhesive layer, the receiving space is formed on one side of the adhesive layer. 3. The porous back-fired inkjet printing mold set according to item 1 of the scope of patent application, wherein the ink supply plate is made of a porous material and the bottom is processed 1222934 VI. Scope of patent application The space is integrated and formed. 4. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, wherein the heating layer and the substrate further include a thermal barrier layer to prevent the thermal energy generated by the heating layer. To the substrate. 5. The porous back-fired inkjet printing mold set according to item 1 of the scope of patent application, wherein the heating layer is composed of a material with high resistance characteristics. 6. Porous back-fired inkjet printing die as described in item 1 of the scope of patent application Group, wherein the substrate is one selected from the group consisting of Shi Xi wafer, glass, metal, ceramics and polymer. 7. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, wherein an electrode layer is further included above the insulating layer and the conductive layer, and is used to receive the pulse voltage from the outside and To the conductive layer. 8. — A method for manufacturing a porous back-fired inkjet printing module, wherein the porous back-fired inkjet printing module can be combined with an ink cartridge and receives external pulse voltage to place the ink in the ink cartridge. The ink is ejected, and the manufacturing method includes at least the following steps: (a) providing a substrate; (b) forming a high-resistance heating layer in a part of the substrate; (c) forming a discontinuous conductive layer in a part of the area above the heating layer, and electrically connecting with the heating layer, so that The pulse voltage can flow through the heating layer through the guidance of the conductive layer, so that the heating Page 17 1222934 Sixth, the scope of the patent application edge heat must be added to the shape of the adjacent phase and combined, layer hole thermal spray plus a formation and the shape of the electrical board •, the base heat should be higher than the heat d 6 The production layer and the upper edge of the plate should be in front of the edge of the layer Eulil, and the ink and the hole should be sprayed to form a hole. Water and ink can be supplied to the connected board and the connected ink. The holes should be multi-layered and structured. The internal heat of the layers of the chamber through the ink water storage ink is ® plus water. The infiltration level is for the storage of the chamber, and in the ink storage room, Fan Li specially asked the group to make a mold made by the French method. The inks provided by the board are provided in the 8 shapes of d inks, which are used to spray two-to-one in a circle, and are used to store the ink in the room. The ink is stored in the chamber. * ^ 工 彳 于 项 加 1 中部 第It was concluded that the Fan Fa Ban Li Fang Mo specially produced for the application A: Mouth R The item 8 of the item is more suitable for the hole, and it is more conducive to the application of the adhesive layer, such as the room store, and the quality of the body plate is printed. The step of the barrier should be one of the heat in the resistance, and the base set of the plate should be formed in a square shape. The barrier should be added before the package containing the barrier to print the back hole with a mold. The household item should be passed to Fan Neng Li Rei, who will apply for it like the d-type C outside t t item. The 8 should be the first place, and it is absolutely necessary to be the author of the legal system. The Shen group will print the BUI "-'spray back hole more as described in the process of etching and bright yellow. Page 18 1222934 VI. The manufacturing method of the patent application group, in this step (e) Before, it further includes forming an electrode layer connected to the conductive layer, and the pulse signal from the outside can be received by the electrode layer and transmitted to the conductive layer. 1 4. The method for manufacturing a porous back-fired inkjet printing module as described in item 8 of the scope of patent application, wherein the manufacturing method of the nozzle hole is selected from the group consisting of sandblasting, laser, dry etching and wet chemical etching. One of the combinations made up. 1 5. The method for manufacturing a porous back-fired inkjet printing module as described in item 8 of the scope of patent application, wherein the substrate is selected from the group consisting of a silicon wafer, glass, metal, ceramic, and a polymer One of Page 19