TW200407227A - The porous back-shooting inkjet print head module - Google Patents

Abstract

A porous back-shooting inkjet print head module is disclosed. The ink permeates through the porous ink supply layer into the ink chamber contracted outside by inject hole, and the porous ink supply layer prevents the ink floating back. So that ink chamber is sealed very well and more pressure could be generated, and could be used for the high stickiness ink. It need not precision aim process, therefore products manufactured efficiency and decreased the cost.

Description

200407227 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an inkjet printing module and a method for manufacturing the same, and more particularly to a porous back-fired inkjet printing with a highly-closed ink storage chamber. Module and its manufacturing method [Prior technology] Nowadays, the application of computer related products is very common, especially the convenience of inkjet printers is widely loved by the general public. Generally used by traditional inkjet printers The print head is a thermal inkjet print head. The working principle of this inkjet print head applies a pulse (pU 1 se) voltage to the control chip, and then the voltage signal passes through the high-pressure inkjet print head. The heater has a resistance characteristic and generates south heat, which causes the ink to form a thermal bubble, and then the ink droplets generated by the thermal bubble are ejected from the nozzle (η ο zz 1 e) to the paper or other The object is printed on the surface of the object, and the ink is replenished from the ink g to the ink storage chamber through the ink flow channel (inkcha η ne 1). As shown in "Figure 1", it is a schematic cross-sectional view of a conventional thermal bubble inkjet print head, in which a substrate 20 1 is formed with a thermal barrier layer 2 0 2 (thermal barrier), and then thermally A resistive heating layer 2 0 3 is formed on the barrier layer 2 0 2, wherein the thermal barrier layer 2 2 is used to block the resistive heating layer 2 0 3 and transfer heat to the substrate 2 0 1, and then the resistive heating layer 2 0 3 is covered with a low-resistance conductive layer 204 (conductor) to transmit a voltage signal, and then an electrical insulation layer 2 5 5 (insulator ·) is formed on the conductive layer 204, and an adhesive layer 206 (adhesion) is formed around it layer) and

200407227 V. Description of the invention (2) Nozzle plate 209 (nozzle plate), ^, ink chamber 2 0 7 (ink chamber), germanium repeated mouth chamber 20 perimeter = area is flow 迢 2 0 8 ( ink channel), which can be used to store & When the pulse voltage signal passes the conductive layer ^ ink cartridge to ^ layer 20j, high heat is generated, and then the library is stored in the storage chamber = resistance plus generates thermal bubbles 2 1 1, so the instant pressure of the ink 2 0 7 #. ^ 21〇 (nozzle) ^ ^ ,! t However, the thermal bubble 211 is generated and the ink droplets 212 are sprayed on the same day, often due to the existence of the ink flow channel 208 =, and this method of congratulating ink requires precise spraying. The empty ink tank in the sand manufacturing process communicates with the ink tank and the ink flow path 208; clothing +-stencil 209 and other related components need to be inserted into the hole piece by the precise alignment technology # Not only is time-consuming and the production capacity is low, it is also increasing at the same time: the production position and the number of copies; In addition, the application of high viscosity coefficient inks on the market is more and more, but the traditional structure cannot be closed due to the tightness of the ink tank Apply this traditional method to inks with high viscosity coefficients. In addition, Karlinski et al. Proposed an "Inkje ΐ printhead withink supply through porous medium" U.S. Patent No. 5,940,099, which mainly includes a layer of piezoelectric material ( The piezoelectric material), the deflection layer, the ink supply 1 ayer, and the glass capillary work by applying a voltage to the piezoelectric layer to cause deformation, and ejecting the stored ink. However, the parts used in this method all need to use precise machining technology and precise alignment. 200407227 V. Description of the invention (3) and assembly technology, the processing cost is extremely high, the yield is extremely low, and the assembly time is long. [Summary of the Invention] In view of the problems of the above-mentioned conventional technology, the present invention provides a porous back-fired inkjet printing module and a method for manufacturing the same, using an ink supply plate with a porous material to cover the nozzle holes to form an excellent sealing performance. The ink storage chamber, after heating the ink, can provide the ink in the ink storage chamber with a larger pressure. A porous back-fired inkjet printing module disclosed in accordance with the present invention mainly includes a substrate. The material of the substrate may be Shi Xi wafer, glass, metal, ceramic, polymer, etc., and the substrate includes Nozzle. The thermal barrier layer is established above the substrate. A heating layer is made of a material with high resistance. It is formed on the surface of the thermal barrier layer and is located near the spray holes. The thermal barrier layer is used to prevent the heat energy generated by the heating layer from being transferred. To the substrate. A conductive layer is electrically connected to the heating layer, and an insulating layer is covered over the conductive layer. An electrode layer is formed on the conductive layer and the insulating layer to receive the external pulse voltage and transfer it to the conductive layer. When the pulse voltage flows through the conductive layer and is guided to the heating layer, the heating layer is a material with high resistance characteristics. High heat is generated; an adhesive layer is formed above the insulating layer and communicates with the spray holes of the substrate. An ink supply layer is made of porous material. One side of the ink supply layer covers and adheres to the adhesive layer and the other side contacts the ink cartridge. At this time, the ink storage chamber forms a closed ink storage chamber by the adhesive layer and the ink supply layer. The ink in the ink cartridge is drained to the ink storage chamber through the ink supply layer. The manufacturing method of the porous back-fired inkjet printing module of the present invention,

200407227 V. Description of the invention (4) The steps include: providing a substrate, and the material of the substrate may be one of a combination of Shi Xi wafer, glass, metal, ceramic and polymer, and formed on the upper surface of the substrate A thermal barrier layer; forming a heating layer above the thermal barrier layer, the heating layer is a material with high resistance characteristics; forming a conductive layer on a part of the surface above the heating layer, and the conductive layer is electrically connected to the heating layer; The insulating layer is on a part of the surface above the conductive layer; a metal electrode layer is established on the insulating layer and the conductive layer to receive the external pulse voltage; and then a through hole is formed in the substrate by sandblasting; An adhesive layer is established on the upper part of the surface, and then the ink supply layer is covered on the surface of the adhesive layer to form a closed ink storage chamber with a receiving space, which is in communication with the spray holes, and is used to store the ink supplied by the ink supply layer. . Different from the traditional structure, the nozzles and related components need to be accurately positioned, and the ink flow path is not required. Therefore, it not only reduces the production cost, but also greatly improves the sealing performance of the ink storage chamber. It can be applied to high viscosity coefficient Ink liquid. It can be known from the above that the present invention discloses a porous back-fired inkjet printing module and a method for manufacturing the same, which provides a conductive layer with a pulse voltage, and heats the ink through the heating layer to generate bubbles and eject ink droplets. The etching process is used to open nozzle holes on the substrate, so there is no need to use nozzle holes, and the precise alignment and bonding operations required by related traditional processes. Furthermore, there is no ink flow path, so the ink storage chamber has an excellent The tightness provides a large pressure difference, and solves the dilemma of the industry facing the inability to apply ink liquids with high viscosity coefficients. The invention not only greatly reduces the production cost and simultaneously increases the product rate and related productivity, and provides a thermal bubble inkjet Print structure

Page 9 200407227 V. Description of the invention (5) The future development direction to meet the needs of the industry can really be used by the industry. In order to further understand the purpose, structural features, and functions of the present invention, detailed descriptions are given in conjunction with the drawings as follows: [Embodiment] The porous back-fired inkjet printing module and its manufacturing method disclosed in accordance with the present invention, Receives the external pulse voltage, and uses the high-tightness ink storage chamber and the ink supply layer of porous material to generate a large thrust to enable the application of ink liquids with a south viscosity coefficient. In order to explain the present invention in detail, please refer to "Figure 2" to "Figure 9", which are schematic flowcharts of the first embodiment of the present invention. As shown in "Figure 2", the substrate 10 is first provided, and the material of the substrate 10 can be silicon wafer, glass, metal, ceramic, and polymer, and a thermal barrier layer 20 is formed on the substrate 10; As shown in "Figure 3", a heating layer 30 is established above the thermal barrier layer 20, and a hole is reserved for subsequent processing (detailed later), and the heating layer 30 is made of a high resistance As shown in "Figure 4", a discontinuous conductive layer 40 is formed above the heating layer 30, and the heating layer 30 is electrically connected to the conductive layer 40; and as shown in "No. 5" As shown in the figure, a specific shape of the insulating layer 50 is created with yellow light and #engraving process on the conductive layer 40; refer to "Figure 6" and form over the insulating plate 50 and the conductive layer 40 The electrode layer 60 is electrically connected to the conductive layer 40, and receives the external pulse voltage to be transmitted to the conductive layer 40. Referring to "Figure 7", it is adjacent to the heating layer 30 and the substrate 10 Sand blasting, laser, dry etching or wet chemical etching are used to form the through holes 70, which are adjacent to the heating layer.

Page 10 ZUU4U / Z2 / V. Description of the invention. (6) _ 30, so that the nozzle hole 70 is located in the aforementioned plus; as shown in "Figure 8", jealousy: ,,, see 3 0 Part of the area, and by the point of the layer > formation, the layer 80 is above the insulating layer 8 0; 8; finally, as shown in the "Figure 9" ^ Chen-shaped structure to form the accommodation space mater ia 1 ) For the black body ^ 'Porous material (porous to form the ink storage chamber 91, and spray = $ 〇,' cover and adhere to the adhesive layer 80 and the position of the 50 disc relative to the spray hole 70 band pass through That is, in the ink storage chamber 91 'of the insulating layer, the second ink supply layer is 30 material and the heating layer). Porous material (porous, but the adhesive layer 80 can also be shown with a capacity map), which is the second embodiment of the present invention instead of 'such as the "porous material of the ink supply board 100 instead of steam. The intention is not to 'multi-electroformed in L plate II; :: 80 and -body forming' and connected to the nozzle hole 7. It: y; Formation: ink storage chamber, water via ink supply plate 1 〇〇 人人 ^^ 2 = In the above picture, the ink supply board 100 is entirely porous material m. Soil 'chamber 101; the other is not necessarily 10. Porous material two Fan;:; "but at least the area of the ink supply plate 30. The consumption of the shellfish must cover the nozzle orifice and the heating layer. The detailed description of the action flow is here. The first action of the present invention is dry.> The tester diagram is S 7lc two r @ Α Γ where the ink supply layer 90 One side is connected to μ 90τίί) ^ 1 ▲ No), at this time, the ink 1 1 0 in the ink cartridge passes through the ink supply slider in the ink storage chamber 9 1, and the insulating layer 5 0 is used to isolate the ink 1 1 〇 from conductive The layer 40 contacts to cause a short circuit. ^ As shown in Figure 12 ", it is a schematic diagram of the second operation of the present invention,

200407227 V. Description of the invention (7) The electrode layer 60 receives the external pulse voltage and transmits it to the conductive layer 40. Since the conductive layer 40 is formed on the heating layer 30 in a discontinuous manner, the pulse voltage passes through The heating layer 30 is returned to the conductive layer 40. At the same time, when the pulse voltage passes through the heating layer 30, the heating layer 30 is a high-resistance material and generates high heat, so that it is stored in the ink storage chamber 91. The ink generates thermal bubbles 11 1, and at this time, due to the instantaneous pressure increase in the ink storage chamber 91, the ink droplets 11 2 flow out from the nozzle holes 70 to the outside. Generally, the thermal bubble generated by the traditional inkjet structure is parallel to the direction of the ink droplet outflow. As shown in "Figure 1", the direction of the thermal bubble 2 1 1 is parallel to the direction of the ink droplet 2 1 2 outflow. The structure is an orthographic (t 〇psh ο 〇t); and the thermal bubble 1 1 1 and the ink droplet 1 1 2 generated in the present invention flow in the opposite direction, so it is a back shoot type (back shoot). According to Darcy ’s Law, the pressure difference is directly proportional to the velocity of the fluid, ie ...

dP dX

ocV where P is the pressure, X is the direction of flow, and V is the flow rate. However, for the porous material used in the present invention, the pressure difference is described by the corrected D a r c y s s L a w force port. The pressure difference is proportional to the sum of the first power and the third power of the flow rate. One dX κ μ

200407227 V. Description of the invention (8) where P is pressure, X is density, V is flow velocity < worse than traditional ink flow, the ink supply layer box of porous material of this structure provides high-closed High viscosity systems can be produced on the substrate to save considerable production. The above-mentioned ones are not intended to limit the scope of the present invention. The flow direction, // is the viscosity coefficient, P is the fluid > From this, it can be seen that the pressure difference caused by using the pressure channel generated by the present invention is much larger. There is no need for traditional ink flow path setting, and multiple inks can be directly supplied through it. At the same time, the ink is prevented from flowing back to the ink-based ink storage chamber and a large pressure difference is caused. Related to the application of ink liquid; and the orifice is etched without precision paste Combined process steps, costs. It is only the preferred embodiments of the present invention, and the scope of implementation is clear; that is, all changes and modifications specifically applied for in accordance with the present invention are within the scope of the present patent.

Page 13 200407227

200407227 Brief description of the drawing 203 Resistance heating layer 204 Conductive layer 205 Electrical insulation layer 206 Adhesive layer 207 Ink storage chamber 208 Ink flow channel 209 Nozzle piece 210 Nozzle hole 211 Thermal bubble 212 Ink drop

Page 15

Claims (1)

200407227 6. Scope of patent application 1. A porous back-fired inkjet printing module can accept external pulse voltage and the system includes: a side-through spray connected to the substrate and a closed special ink plate sprayed with water Via the substrate, there is an ink supply plate accommodating space covering the communication with the spray hole, and the supply above the ink chamber area enables the ink in the ink cartridge to be in the ink storage chamber; and is connected to an ink cartridge. The ink in the ink cartridge is ejected with holes; the ink cartridge has a hole area above the other side to form a uniform ink storage chamber, and the porous material is formed, and the porous material penetrates to store the heating layer The pulse voltage is provided around the nozzle hole of the substrate and is located in the ink storage chamber; the pulse voltage enables the energy and is provided in the storage bubble, so that the ink is subjected to the ink and the conductive layer. 2. If applied The porous back-fired inkjet printing module described in the first item of the patent scope, wherein the ink supply plate comprises an ink supply layer and an adhesive layer conductive layer, and an electrical pulse voltage of the heating layer and the ink storage chamber ^ Insulating layer disposed between the pressure on the conductive contact. It can be connected by nature, and can receive the ink that flows through the heating layer to generate heat and generate hot gas to be ejected from the nozzle; and above the layer, it is used to isolate the connection and form the multi-porosity described in the volume. The adhesive layer and the ink supply layer are structured so that one side of the adhesive layer 3. For example, in the group 1 of the scope of the patent application, wherein the ink supply plate is a ring-shaped connection space using the adhesive layer. Hole back-fired He ink printing die material and processed the bottom Page 16 200407227 VI. Scope of patent application The space is integrated into one. 4. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, wherein the heating layer and the substrate further include a thermal barrier layer to prevent the thermal energy generated by the heating layer. To the substrate. 5. The porous back-fired inkjet printing mold set according to item 1 of the scope of patent application, wherein the heating layer is composed of a material with high resistance characteristics. 6. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, wherein the substrate is selected from the group consisting of a silicon wafer, glass, metal, ceramic, and a polymer. One. 7. The porous back-fired inkjet printing module according to item 1 of the scope of patent application, further comprising an electrode layer above the insulating layer and the conductive layer, which is used to receive the pulse voltage from the outside and To the conductive layer. 8. — A method for manufacturing a porous back-fired inkjet printing module, wherein the porous back-fired inkjet printing module can be combined with an ink cartridge and receives external pulse voltage to place the ink in the ink cartridge. The ink is ejected. The manufacturing method includes at least the following steps: (a) providing a substrate; (b) forming a high-resistance heating layer on a portion of the substrate; (c) a portion of the area above the heating layer A discontinuous conductive layer is formed and electrically connected to the heating layer respectively, so that the pulse voltage can flow through the heating layer through the guidance of the conductive layer, so that the heating 200407227 Sixth, the scope of application for patents The layer edge heat insulation should be added on the adjacent phase of the shape, the layer hole thermal spray should be added on the formation and shape of the electrical board, the heat of the base should be higher than that of the product. 6 Production > / (V x (v layer and plate X) / f and ink and a hole for spraying a hole into the cover culvert to spray the space between the opposite edges of the layer and the layer and the The edge plate is provided with ink in the supply room, and the ink cartridge stores water. The ink is available in the same way as the connected plate, and the structure is formed. The storage should be stored in the infiltration of the material holes and more should be made by the water ^ g of the inner box. The water chamber ink and ink fan Fan Li specially invited Zhongrujia 1 Central and its first bottom ring, Faban Lifang Fangmo specializes in making and applying for the application of the spray-type perforation multi-back printing inks for printed materials, such as printing and printing inks, which are provided by the Lisuo series of inks. 8 The chamber ink stores the outlets described above, and the department is 0- | The mold-printed chamber contains ink that should be formed and the quality of the body board. The 8th dimension of the hole is multi-functional. It is conducive to special stickers. Please apply-layers as described in the mold-printed inkjet-type back hole. The layer in step C. The separator is heated in the resistive base, and the heat transfer plate can be formed by transferring the heat to the base layer. The heat is added before the inclusion and the barrier is used. The printing process is printed by ΤΝΊ tuj · 歹 HAI ink money spray and yellow light on the back with holes more d / (\ I β step h 8 in the step, Fan Fa Li specially made the application, such as Out of the group, the inkjet-type ejection back hole is described in more detail. The special feature is 8 ^. 1 ^ — Page 18, 200407227 6. The manufacturing method of the patent application group, which before step (e), further comprises forming an electrode layer connected to the conductive layer, and the electrode layer can receive the pulse signal from the outside and To the conductive layer. 1 4. The method for manufacturing a porous back-fired inkjet printing module as described in item 8 of the scope of patent application, wherein the manufacturing method of the nozzle hole is selected from the group consisting of sandblasting, laser, dry etching and wet chemical etching. One of the combinations made up. 15. The method for manufacturing a porous back-fired inkjet printing module according to item 8 of the scope of the patent application, wherein the substrate is selected from the group consisting of a silicon wafer, glass, metal, ceramic, and a polymer One of