JP2002019119A - Ink jet recording head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive and high-quality ink jet recording head. SOLUTION: A second plate H1400 is stacked on a first plate H1200, and recording element substrates H1100 and H1101 are fixed respectively to a plurality of openings of the second plate H1400. A single electrical wiring tape H1300 is stacked from thereabove and fixed to the second plate. Then, electrode leads H1302 extending into device holes H1 and H2 of the electrical wiring tape H1300 are intermetallic bonded respectively to bumps H1105 on electrodes of the recording element substrates H1000 and H1101, and bonding parts are sealed by a resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head used in a recording apparatus for performing a recording operation by discharging a recording liquid such as ink from a discharge port to form a droplet, and a method of manufacturing the same. The present invention relates to a recording element substrate used in the ink jet recording head, a wiring substrate for connecting the recording element substrate to a power supply, and the like. The ink jet recording head of the present invention can be used not only for general printing apparatuses, but also for apparatuses such as copying machines, facsimile machines having a communication system, word processors having a printing section, and various processing apparatuses. It can be applied to a recording device for use.

[0002]

2. Description of the Related Art An ink jet recording apparatus is a recording apparatus of a so-called non-impact recording system, and can perform high-speed recording and recording on various recording media.
It has the feature that almost no noise occurs in recording.
For this reason, the ink jet recording apparatus is widely used as an apparatus having a recording mechanism such as a printer, a copying machine, a facsimile, and a word processor.

[0003] As a typical ink ejection method for a recording head mounted on such an ink jet recording apparatus, a method using an electromechanical transducer such as a piezo element,
Heat is generated by irradiating electromagnetic waves such as lasers, and the ink is ejected by the action of the heat, or the ink is heated by an electrothermal conversion element having a heating resistor,
A device that ejects ink droplets by the action of film boiling is known. An ink jet recording head using an electro-thermal conversion element is provided with an electro-thermal conversion element in a recording liquid chamber, and supplies an electric pulse as a recording signal to the recording liquid chamber to generate heat, thereby giving thermal energy to the ink, and performing recording at that time. Using a bubble pressure at the time of bubbling (at the time of boiling) of a recording liquid generated by a phase change of the liquid, a minute ink droplet is ejected from a minute ejection port to perform recording on a recording medium. It has an ink jet recording nozzle for discharging ink droplets, and a supply system for supplying ink to the nozzle.

Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 10-776, a copper foil having a thickness of 50 microns is adhered to a polyimide film and patterned to form a TAB (Tape Aut).
A method is known in which the bumps on the electrode pads of the recording element are electrically bonded to the gold-plated electrode leads (inner leads) of the tape by a thermosonic pressure bonding method, the bonded portion is sealed, and then bonded to the support. Have been. Further, Japanese Unexamined Patent Publication No.
Japanese Patent Publication No. 200624 proposes a treatment of an electrode after bump formation. Further, JP-A-11-1388
As disclosed in Japanese Patent Application Laid-Open No. 14, there is known a device in which a plurality of recording elements are connected to independent TAB tapes and then bonded to a support. Japanese Patent Application Laid-Open No. 11-13 / 1999
In the configuration of JP-A-8814, a plurality of recording elements are provided for color printing, but there is also a recording head having a configuration in which the inside is divided so that color printing can be performed on a single substrate.

[0005] In recent years, the price of the ink jet recording apparatus has been remarkably reduced, and it has been an issue how to make the ink jet recording head cheap. To this end, the most effective method is to reduce the material cost of the components, especially the integration of the recording element substrates. For example, a method of integrating the recording element substrates that handle the three color inks of yellow, magenta, and cyan is used. Many are adopted. Further, the recording element substrate for black ink frequently used for printing characters and the like is also integrated with the recording element substrate for color described above, or the recording element substrate for color and the recording element substrate for black are used in the same head. Many methods have been adopted. Patent registration 283
No. 9686 discloses an example in which a method of mounting a plurality of different printing element substrates on a single TAB tape is adopted as a semiconductor element for driving or the like. In this mounting method, one circuit is formed by connecting the plurality of printing element substrates to each other.

[0006]

However, as shown in JP-A-11-138814, in a configuration in which a plurality of recording elements are respectively connected to independent TAB tapes and then bonded to a support, each TAB is bonded at the time of bonding. In addition to the need to align the position of the tape and the support, there is a problem that the recording device becomes large because the respective recording elements cannot be so close to each other, and capping is performed to prevent evaporation during non-recording. In this case, it is necessary to make the capping mechanism independent for each recording element. Furthermore, TA
Since the component in which the B tape and the recording element are combined must be bonded to the support, it has been difficult to accurately fix the recording element to the support. When there are a plurality of printing elements, it is more difficult to bond the respective printing elements with relatively high accuracy. In addition, since the step of sealing the electrode leads (inner leads) with resin is performed in the air, the sealant used in a general TAB technique may be turned around to the discharge port for discharging the recording liquid. If the amount of the sealant is reduced so that the discharge port is not clogged or conversely, the discharge port is clogged, the inner lead is exposed. Further, the resin for sealing the inner leads may flow around the back surface of the recording element, and there may be a case where the recording element cannot be bonded and fixed.

A recording element substrate for black ink;
Use the same head (same TA
When incorporating in B), it is necessary to match the relative positional relationship between the recording liquid ejection ports. However, general TAB
Prior to the technology, the inner lead bonding process of joining the inner lead (electrode lead) projecting into the device hole (opening) provided in the film carrier tape with the electrode of the semiconductor chip, and the process of sealing the inner lead with resin. After that, if each recording element substrate is incorporated into the head, the accuracy of the relative positional relationship of the ejection ports deteriorates, and the black ink and the color ink are remarkably blurred during ink jet recording, or a color shift occurs. There was sometimes.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an ink jet recording head having a configuration in which a plurality of recording element substrates are bonded to the same support. After bonding the substrate), an inner lead bonding step (a step of joining an inner lead (electrode lead) projecting into a device hole provided on a film carrier tape and an electrode of a semiconductor chip), which is a conventional TAB technique, An object of the present invention is to improve the reliability of the inner lead bonding by performing a step of sealing the inner lead with a resin and to realize a reliable electric connection.

Another object of the present invention is to provide an ink jet recording head capable of performing high quality ink jet recording at low cost.

[0010]

SUMMARY OF THE INVENTION A feature of the present invention is that a plurality of printing element substrates having a plurality of printing elements for discharging a printing liquid and a supply port for supplying the printing liquid to the printing elements are provided. A plurality of openings into which the recording element substrates are incorporated, and which are electrically connected to the recording element substrates to transmit a single electric pulse for discharging the recording liquid to the recording element substrates. A flexible wiring board, a first support member supporting a plurality of recording element substrates, and a second support member supporting a single flexible wiring board and fixed to the first support member.
In the ink jet print head having the support members, the positions of the electrodes of the respective print element substrates on the first support member are not arranged in a straight line, and are provided on the electrodes of the respective print element substrates. The bump and the electrode lead of the single flexible wiring board are intermetallicly connected.

According to this, by performing metal-to-metal bonding such as thermosonic pressure bonding to the bump and the electrode lead, the recording element substrate and the flexible wiring substrate are fixed to the first support member, and then the bump and the electrode are connected. Even if the leads are joined, the reliability of the connection can be ensured. Further, since a general-purpose standard device and technology can be used, an ink jet recording head can be provided at low cost.

At least one of the size and the shape of the plurality of recording element substrates may be different. In this case, at least one of the size and the shape of the opening of the single flexible wiring board is different.

A first adhesive layer for fixing the recording element substrate and the first support member to each other, and a second adhesive layer for fixing the first support member and the second support member to each other; The thickness obtained by adding the thickness of the recording element substrate and the thickness of the first adhesive layer is preferably smaller than the thickness obtained by adding the thickness of the second support member and the thickness of the second adhesive layer.

According to a method of manufacturing an ink jet recording head of the present invention, a plurality of recording elements for discharging recording liquid, a plurality of recording element substrates having a supply port for supplying the recording liquid to the recording elements, and a plurality of recording elements are provided. It has a plurality of openings into which the recording element substrate is incorporated, and is electrically connected to the recording element substrate, so that a single flexible member that transmits an electric pulse for discharging the recording liquid to the recording element substrate is provided. A flexible wiring board, a first support member supporting a plurality of recording element substrates, and a second support member supporting a single flexible wiring board and fixed to the first support member. In the method of manufacturing an ink jet recording head, the positions of the electrodes of the respective recording element substrates on the first support member are not aligned, and the electrodes of the respective recording element substrates have a single flexibility. Of the wiring board From the combined, characterized in that these are wire-bonded.

In another method for manufacturing an ink jet recording head according to the present invention, a step of forming a bump on an electrode of a plurality of recording element substrates and a step of connecting the plurality of recording element substrates and the second supporting member to a first supporting member are provided. After fixing the electrode leads of a single flexible wiring substrate to the electrodes of the plurality of recording element substrates fixed on the first support member, Fixing on a second support member fixed on the first support member, and bumps on the electrodes of the plurality of recording element substrates fixed on the first support member;
Metal-to-metal coupling of a single flexible wiring board electrode lead fixed on the second support member.

The step of fixing the plurality of recording element substrates and the second support member on the first support member includes the steps of fixing the second support member on the first support member with an adhesive; Fixing the plurality of printing element substrates to the first support member with an adhesive after aligning the wiring surfaces of the printing elements of the substrate on the first support member. It is preferable that the method further includes a step of sealing the joint between the bump and the electrode lead with a resin after the metal connection between the electrode lead of the substrate and the metal.

The method for forming the bumps on the electrodes may be stud bumps by thermosonic compression bonding or plated bumps by plating.

It is preferable that the method further includes a step of sealing the periphery of the recording element substrate with a resin in the opening of the single flexible wiring substrate.

In the step of fixing the wiring board on the second support member, the gap between the upper surface of the bump and the electrode lead is set to 100 μm.
After that, it is preferable to perform a step of intermetal bonding between the bump and the electrode lead.

The second support member is fixed so that the distance between the upper surface of the second support member and the upper surfaces of the bumps on the plurality of recording element substrates is constant.
Affixing the support member to the first support member,
A reliable and low-cost ink jet recording head can be provided. At this time, by correcting and smoothing the variation in the height dimension of the upper surfaces of the bumps on the plurality of recording element substrates, a more reliable and low-cost ink jet recording head can be provided.

The sealing between the bumps on the recording element substrate and the electrode leads of the single flexible wiring board with resin is performed by fixing the single flexible wiring board to the second support member. By performing it later, stable resin sealing can be performed, and a low-cost ink jet recording head can be provided.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 6 are diagrams for explaining the respective configurations and relationships of the preferred head cartridge, recording head and ink tank to which the present invention is applied or applied. Hereinafter, each component will be described with reference to these drawings.

The recording head (inkjet recording head) H1001 of the present embodiment is similar to that shown in FIGS.
As can be seen from the perspective view of (b), it is one component of the print head cartridge H1000, and the print head cartridge H1000 includes a print head H1001 and a print head H1001.
An ink tank H1900 (H1901, H1902, H190) detachably provided on the recording head H1001.
3, H1904). Recording head H
Reference numeral 1001 discharges ink (recording liquid) supplied from the ink tank H1900 from a discharge port according to recording information.

This recording head cartridge H1000
Is fixedly supported by positioning means and electrical contacts of a carriage (not shown) mounted on the ink jet recording apparatus main body, and is detachable from the carriage. The ink tank H1901 is for black ink, the ink tank H1902 is for cyan ink, the ink tank H1903 is for magenta ink, and the ink tank H1904 is for yellow ink. Thus, the ink tanks H1901, H1902, H19
03 and H1904 are detachable from the recording head H1001 on the seal rubber H1800 side, and the ink tanks are exchangeable, so that the printing running cost in the ink jet recording apparatus is reduced.

Next, the components of the recording head H1001 will be described in detail in order.

(1) Recording Head The recording head H1001 performs bubble jet recording using an electrothermal transducer (recording element) that generates thermal energy for causing film boiling to occur in ink in response to an electric signal. (Registered trademark) type side shooter type recording head.

As shown in the exploded perspective view of FIG. 2, the recording head H1001 comprises a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.

Further, as shown in the exploded perspective view of FIG.
The printing element unit H1002 includes a first printing element substrate H
1100, a second printing element substrate H1101, a first plate (first support member) H1200, an electric wiring tape (flexible wiring substrate) H1300, an electric contact substrate H2200, a second plate (second support) Member) H14
00, and the ink supply unit H1
003 is an ink supply member H1500, a flow path forming member H
1600, a joint seal member H2300, a filter H1700, and a seal rubber H1800.

(1-1) Printing Element Unit FIG. 4 is a partially exploded perspective view for explaining the structure of the first printing element substrate H1100. The first recording element substrate H1100 is a Si substrate H11 having a thickness of 0.5 to 1 mm.
10, a plurality of recording elements (electrothermal conversion elements) H1103 for discharging ink, and each of the electrothermal conversion elements H
Electrical wiring such as Al for supplying power to 1103 is formed by a film forming technique. A plurality of ink flow paths and a plurality of discharge ports H1107 corresponding to the electrothermal conversion elements H1103 are formed by photolithography, and an ink supply port H1102 for supplying ink to the plurality of ink flow paths is provided. It is formed so as to open on the opposite surface (back surface). Also, the recording element substrate H11
00 is adhered and fixed to the first plate H1200, where an ink supply port H1102 is formed. Further, a second plate H1400 having an opening is adhered and fixed to the first plate H1200, and the electric wiring tape H1300 is electrically connected to the recording element substrate H1100 via the second plate H1400. It is held so that it can be connected to each other. The electric wiring tape H1300 is for applying an electric signal for discharging ink to the recording element substrate H1100. The electric wiring corresponding to the recording element substrate H1100 and the electric wiring located at the electric wiring portion and from the printer main body. And an external signal input terminal H1301 for receiving a signal. The external signal input terminal H1301 is positioned and fixed on the back side of the ink supply member H1500.

The ink supply port H1102 is formed by a method such as anisotropic etching or sandblasting utilizing the crystal orientation of Si. That is, the Si substrate H1110
Is <100> in the direction of the wafer surface and <111> in the thickness direction.
> KOH, TMA
H, hydrazine, etc.) and about 5
The etching can proceed at an angle of 4.7 degrees. Thus, etching is performed to a desired depth to form an ink supply port H1102 including a long groove-shaped through-hole. The electrothermal transducers H1103 are arranged in a staggered pattern on both sides of the ink supply port H1102. The electrothermal transducer H1103 and the electrical wiring of Al or the like for supplying power to the electrothermal transducer H1103 are formed by a film forming technique. Further, electrodes H1104 for supplying power to the electric wiring are arranged on both outer sides of the electrothermal transducer H1103, and the electrodes H1104 have bumps H made of Au or the like.
Reference numeral 1105 is formed by a thermosonic compression bonding method. And
On the Si substrate H1110, an electrothermal transducer H1103 is provided.
Flow path wall H for forming an ink flow path corresponding to
A discharge port group H1108 is formed by forming a resin port 1106 and a discharge port H1107 by a photolithography technique using a resin material. Since the ejection port H1107 is provided to face the electrothermal conversion element H1103, the ink supply port H1107 is provided.
The ink supplied from 1102 is an electrothermal transducer H11.
The discharge port H11 is generated by air bubbles generated by the heat generation action of the discharge port H11.
07 is discharged.

FIG. 5 shows a second printing element substrate H1101.
FIG. 3 is a partially exploded perspective view for explaining the configuration of FIG. The second recording element substrate H1101 is a recording element substrate for discharging ink of three colors, and has three ink supply ports H1.
102 are formed in parallel, and the electrothermal transducers H110 are formed on both sides of each ink supply port H1102.
3 and an ink discharge port H1107 are formed. Like the first recording element substrate H1100, the Si substrate H111
0, the ink supply port H1102 and the electrothermal conversion element H110
3. An electric wiring, an electrode H1104, and the like are formed, and an ink flow path and an ink discharge port H1107 are formed thereon by photolithography using a resin material. Then, similarly to the first recording element substrate H1100, a bump H1105 such as Au is formed on the electrode H1104 for supplying electric power to the electric wiring.
200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. In addition, the material of the first plate H1200 is not limited to alumina, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate H1100, and has a thermal conductivity of the material of the recording element substrate H1100. It may be made of a material having the same or higher thermal conductivity. The material of the first plate H1200 is, for example, silicon (Si), aluminum nitride (A
1N), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), tungsten (W)
Any of these may be used. First plate H120
0, an ink communication port H1201 for supplying black ink to the first recording element substrate H1100;
An ink communication port H1201 for supplying cyan, magenta, and yellow inks is formed in the recording element substrate H1101.
2 is an ink communication port H120 of the first plate H1200.
1 and the first recording element substrate H11
00 and the second printing element substrate H1101 are fixed to the first plate H1200 with good positional accuracy. It is desirable that the first adhesive used for bonding has low viscosity, low curing temperature, cures in a short time, has relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive containing an epoxy resin as a main component, and has a first adhesive layer H12 shown in FIG.
02 is desirably 50 μm or less.

The electric wiring tape H1300 applies an electric signal for discharging ink to the first recording element substrate H1100 and the second recording element substrate H1101. The electric wiring tape H1300 has a plurality of device holes (openings) H1 and H2 for incorporating the respective recording element substrates H1100 and H1101, and the electrodes H11 of the respective recording element substrates H1100 and H1101.
And an external signal input terminal H1301 located at the end of the electric wiring tape H1300 for receiving an electric signal from the printer main unit.
And an electrode terminal portion for making an electrical connection with the electric contact substrate H2200 having the above-mentioned structure. The electrode terminal portion and the electrode lead H1302 are connected by a continuous copper foil wiring pattern. This electric wiring tape H1300
Consists of, for example, a flexible wiring board in which the wiring has a two-layer structure and the surface layer is covered with a resist film. In this case, a reinforcing plate is adhered to the back surface side (outer surface side) of the external signal input terminal H1301 to improve the flatness. As the reinforcing plate, for example, a heat-resistant material such as 0.5 to 2 mm glass epoxy or aluminum is used.

The electric wiring tape H1300, the first recording element substrate H1100, and the second recording element substrate H1101 are
They are electrically connected to each other, and the connection method is, for example, a bump H110 on the electrode H1104 of the recording element substrate.
5 and the electrode lead H130 of the electric wiring tape H1300
2 are electrically joined by a thermosonic pressure bonding method.

The second plate H1400 is, for example, a single plate-like member having a thickness of 0.5 to 1 mm, and is made of, for example, a ceramic such as alumina (Al ₂ O ₃ ) or a metal material such as Al or SUS. Is formed. However, the material of the second plate H1400 is not limited to these, but has a linear expansion coefficient equivalent to that of the recording element substrates H1100, H1101 and the first plate H1200, and a thermal conductivity of the same. A material having the same or higher thermal conductivity may be used.

The second plate H1400 has a shape having openings larger than the outer dimensions of the first recording element substrate H1100 and the second recording element substrate H1101, which are bonded and fixed to the first plate H1200. is there. Further, the first plate H12 is connected to the first printing element substrate H1100 and the second printing element substrate H1101 so that the electric wiring tape H1300 can be electrically connected in a planar manner.
00 by a second adhesive layer H1203,
The back surface of the electric wiring tape H1300 is the third adhesive layer H13
06 to fix.

The first recording element substrate H1100 and the second
Printing element substrate H1101 and electrical wiring tape H1300
The electrical connection part of the first sealant (not shown) and the second sealant
To protect the electrical connection portion from corrosion by ink and external impact. The first sealant mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate. The front side of the connection portion is sealed.

Further, an electric contact board H having an external signal input terminal H1301 for receiving an electric signal from the printer main body at the end of the electric wiring tape H1300.
2200 is electrically connected by thermocompression bonding using an anisotropic conductive film or the like.

Then, the electric wiring tape H1300 is
Of the first plate H1200 and the second plate H1400, and at the same time, are bent along one side surface of the first plate H1200 and the second plate H1400.
Is bonded by a third adhesive layer H1306. The second adhesive is preferably one having low viscosity, capable of forming a thin second adhesive layer H1203 on the contact surface, and having ink resistance. The third adhesive layer H1306 is, for example, a thermosetting adhesive layer mainly composed of epoxy resin and having a thickness of 100 μm or less.

(1-2) Ink Supply Unit The ink supply member H1500 is formed, for example, by resin molding. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of a glass filler in order to improve shape rigidity.

As shown in FIGS. 3 and 6, the ink tank H
Ink supply member H150 for detachably holding 1900
0 indicates the recording element unit H from the ink tank H1900.
Ink supply unit H1 for guiding ink to 1002
003, and an ink flow path H1501 extending from the ink tank H1900 to the first plate H1200 is formed by ultrasonic welding of the flow path forming member H1600. Further, a filter H1700 for preventing dust from entering from the outside is joined to the joint portion H1520 which engages with the ink tank H1900 by welding, and a filter H1700 for preventing evaporation of ink from the joint portion H1520. , A seal rubber H1800 is mounted.

The ink supply member H1500 also has a function of holding a detachable ink tank H1900, and has a first hole H1503 for engaging a second claw H1910 of the ink tank H1900.

The recording head cartridge H1000
Guide H1601 for guiding the recording head cartridge to the mounting position on the carriage of the inkjet recording apparatus main body, an engaging portion for fixing the recording head cartridge to the carriage by the headset lever, and X for positioning the recording head cartridge at a predetermined mounting position on the carriage. An abutting portion H1509 in the direction (carriage scan direction), an abutting portion H1510 in the Y direction (recording medium transport direction), and an abutting portion H1511 in the Z direction (ink ejection direction) are provided. Further, the electric contact substrate H22 of the recording element unit H1002
00 has a terminal fixing portion H1512 for positioning and fixing
A plurality of ribs are provided on the terminal fixing portion H1512 and around the terminal fixing portion H1512 to increase the rigidity of the surface having the terminal fixing portion H1512.

(1-3) Coupling of Recording Head Unit and Ink Supply Unit As shown in FIG. 2 described above, the recording head H1001 includes the recording element unit H1002 and the ink supply unit H10.
03, and further, by combining with the tank holder H2000. Coupling is performed as follows.

The ink communication port of the recording element unit H1002 (the ink communication port H120 of the first plate H1200)
1) and the ink communication port of the ink supply unit H1003 (the ink communication port H1602 of the flow path forming member H1600)
Are fixed with screws H2400 so as to press-fit each member via a joint seal member H2300 in order to communicate the ink so that the ink does not leak. At the same time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions of the ink supply unit in the X, Y, and Z directions.

The electric contact substrate H2200 of the recording element unit H1002 is connected to an ink supply member H1500.
Are positioned and fixed on one side face by terminal positioning pins H1515 (two locations) and terminal positioning holes H1309 (two locations). As a fixing method, for example, a terminal positioning pin H15 provided on the ink supply member H1500 is used.
15 is fixed by caulking, but may be fixed using other fixing means. The completed drawing is shown in FIG.

Further, the connection hole and the connection portion of the ink supply member H1500 with the tank holder are set in the tank holder H2.
000 to form a recording head H1.
001 is completed. That is, the ink supply member H150
0, channel forming member H1600, filter H1700,
By bonding the tank holder unit composed of the seal rubber H1800 and the recording element unit composed of the recording element substrates H1100 and H1101, the first plate H1200, the wiring substrate H1300, and the second plate H1400 by adhesion or the like. A recording head is configured. The completed drawing is shown in FIG.

(2) Description of Printhead Cartridge FIGS. 1A and 1B described above show a printhead H1001 and ink tanks H1901, H1902, H1903, and H1904 that constitute a printhead cartridge H1000.
FIG. 8 is a diagram for explaining the mounting of the ink tank H1901,
Inside of H1902, H1903, and H1904, inks of corresponding colors are stored. Further, as shown in FIG. 6, an ink communication port H1907 for supplying the ink in the ink tank to the recording head H1001 is formed in each ink tank. For example, when the ink tank 1901H is mounted on the print head H1001, the ink communication port H1907 of the ink tank H1901 is pressed against the filter H1700 provided at the joint H1520 of the print head H1001, and the ink tank H1
The black ink in the portion 901 is supplied from the ink communication port H1907 to the first recording element substrate H1100 through the first plate H1200 via the ink flow path H1501 of the recording head H1001.

Then, the ink is supplied to the bubbling chamber having the electrothermal transducer H1103 and the discharge port H1107, and is ejected toward the recording sheet as the recording medium by the thermal energy given to the electrothermal transducer H1103.

[Conventional Example] Here, for comparison with the configuration of the present invention, first, a conventional recording element unit will be described with reference to FIGS.

FIGS. 24 and 25 show a conventional TAB mounting method, in which the bumps on the electrodes of the recording element are electrically connected to the electrode leads of the electric wiring tape in advance by a thermosonic compression bonding method.
Further, a method of bonding to a support member after sealing is shown.

In the conventional structure shown in FIGS. 24 and 25, the electric wiring tape H300 has a three-layer structure around the bonding portion, a polyimide base film H300a on the front side, a copper foil H300b on the middle side, and solder on the back side. The configuration is a resist H300c. The electric wiring tape H300 is provided with a device hole (opening) H11 into which the recording element substrate H100 is inserted and a device hole H12 into which the recording element substrate H101 is inserted. The electrode lead (inner lead) H302 to be connected is gold-plated and exposed.

In the device hole H11 of the first recording element substrate H100 and the electric wiring tape H300, a conventional TAB is inserted.
Electrical wiring tape (TAB tape) in advance by mounting method
The TAB unit H300U1 is obtained by aligning the electrode lead H302 of the H300 and the bump H5 on the electrode of the recording element H100, electrically bonding them by a thermosonic pressure bonding method, and further sealing with a sealant H308. In addition, the electrode lead H302 of the electric wiring tape H300 and the bump H5 on the electrode of the recording element H100 are electrically bonded to the second recording element substrate H101 and the device hole H12 of the electric wiring tape H300 by a thermosonic crimping method. Further, sealant H308
The one sealed with is the TAB unit H300U2.
Here, the TAB unit is divided by the conventional TAB unit.
This is because, in the B mounting method, the positional accuracy of the chip (recording element substrate) after sealing with respect to the TAB cannot be sufficiently high for use in an ink jet recording apparatus (particularly, in the case of a color recording apparatus).

Next, the second plate H400 is adhered to the first plate H200 by the second adhesive layer H203. The thickness of the second adhesive layer H203 is suppressed to 0.06 mm or less so that the first recording element substrate H100 and the second recording element substrate H101 can be electrically connected to the electric wiring tape H300 in a planar manner. ing.

Next, the first plate H200 is provided with a first adhesive layer H202 for bonding the first recording element substrate H100 and the second recording element substrate H101 to the second plate H4.
00, a third adhesive layer H306 for adhering the electric wiring tape H300 is formed by coating, respectively, and then the TAB unit H300U1 and the TAB unit H300U2 are connected to the plurality of recording elements H103 for discharging the recording liquid or the wiring of the respective discharge ports H107. It is pressed and fixed by adjusting the relative positional relationship in the plane direction. At this time, the first recording element substrate H10
The sealant H308 is also attached to the upper portion (ink ejection surface side) of the first and second recording element substrates H101, and in order to avoid this attached portion, the pressing head H having the suction pipe V110 is used.
100H, H101H, printing element substrates H100, H1
01 is restricted. Note that the sealant H308 usually stops at the ridge line of the recording element substrate and is hard to adhere to the adhesive surface. However, in rare cases, the sealant H308 may adhere due to viscosity variation of the sealant. The first recording element substrate H100 or the second recording element substrate H1 by the thickness
01 may be floated, the ejection direction may be inclined, or ink may leak.

Thereafter, in order to securely adhere the electric wiring tape H300 to the second plate H400, the electric wiring tape H300 is pressed and fixed to the second plate H400 by the tape pressing head T300. When the first recording element substrate H100 and the second recording element substrate H101 are pressed and fixed for bonding, it is preferable that the electric wiring tape H300 and the third adhesive layer H306 are not in contact with each other. If the pressing is insufficient, the first recording element substrate H10
This is because the 0 and the second print element substrate H101 may float, and the ejection direction may be inclined or ink may leak.

[First Embodiment] A first embodiment of the present invention will be described with reference to FIGS. 9 to 12 in comparison with the conventional example shown in FIGS.

FIG. 9 is an exploded schematic sectional view of a principal part of the recording element unit H1002, and FIG. 10 is a schematic sectional view of a principal part.

As shown in FIG. 9, the electric wiring tape H13
00 has a three-layer structure around the bonding portion,
A polyimide base film H1300a on the front side, a copper foil H1300b on the middle, and a solder resist H130 on the back side.
0c. This electric wiring tape H1300
Include a device hole (opening) H1 into which the first recording element substrate H1100 is inserted, and a second recording element substrate H1.
A device hole H2 into which the substrate 101 is inserted is provided, and bumps H1005 of the recording element substrates H1100 and H1101 are provided.
Lead (electrode lead) H1302 connected to
Is gold plated and exposed.

Hereinafter, a method for manufacturing a recording element unit according to the method for manufacturing an ink jet recording head of the present invention will be described in detail step by step with reference to FIGS. 9 and 10.

First, the second plate H1400 is bonded to the first plate H1200 with the second bonding layer H1203. The thickness of the second adhesive layer H1203 is determined by the first printing element substrate H1100 and the second printing element substrate H11.
01 and the electrical wiring tape H1300, so that the electrical wiring tape H1300 can be electrically connected in a two-dimensional manner. In this embodiment, the second plate H1
The bonding of 400 to the first plate H1200 may be performed before or after the bonding of the recording element substrates H1100 and H1101.

Next, the first printing element substrate H1100 and the second printing element substrate H110 are placed on the first plate H1200.
After applying and forming a first adhesive layer H1202 for adhering No. 1 to the recording element substrates H1100 and H1101, the relative positional relationship between the plurality of electrothermal conversion elements H1103 for discharging the recording liquid or the respective discharge ports H1107 in the wiring surface direction. And press-fix. At this time, unlike the conventional example described above, the contact area of the pressing head is reduced, and the contact with the adhesive of the electric wiring tape is not interfered with.
High-precision adhesive fixation is possible.

Thereafter, a third adhesive layer H1306 for adhesively fixing the back surface of the electric wiring tape H1300 is applied to the second plate H1400, and then the first recording element substrate H1100 and the second recording element substrate H1101 are formed. Electrode H1104 and the electrode lead H of the electric wiring tape H1300
After the alignment of 1302, it is pressed and fixed. Thereafter, the bump H1105 on the electrode 1104 of the recording element substrate
And the electrode lead H1302 of the electric wiring tape H1300
Are electrically connected one by one by a thermosonic compression bonding method. Electrical bonding by thermosonic crimping is widely used in wire bonding and is metal-to-metal bonding, so the reliability of the bonding portion is high and the productivity is very high. Further, a bump H1105 on the electrode portion H1104 of the recording element substrate,
Regarding the positional relationship in the height direction between the electric wiring tape H1300 and the electrode leads H1302, the electric wiring tape H13
Since the electrode lead H1302 of No. 00 can absorb the variation, a highly reliable ink jet recording head can be provided.

Further, the electrode H of the recording element substrate H1100
Bump H1105 on 1104 and electrical wiring tape H1
The joint portion of the electrode lead 300 with the electrode lead H1302 is sealed with a resin so as not to be short-circuited by ink or the like.

In the thermo-ultrasonic compression bonding method employed in this embodiment, the bonding is performed at one point, but the number of wirings of the ink jet recording head is 20 to 10 per recording element substrate.
Since about 0 pieces can be joined in about 0.1 to 0.2 seconds per location, production in a short time is possible.

FIG. 11 shows the first, second and third data shown in FIG.
Plates H1200, H1400, first and second recording element substrates H1100, H1101, electrical wiring tape H13
FIG. 2 shows an exploded view and a cross-sectional view in which 00 is enlarged. FIG.
The configuration of this embodiment will be described in more detail with reference to FIGS.

In this embodiment, the first plate H12
00 is made of alumina and has a thickness of 4 ± 0.03 mm, and the second plate H1400 is also made of alumina and has a thickness of 0.67 ± 0.03 mm.
05 mm, first and second printing element substrates H1100,
H1101 has a thickness of 0.625 ± 0.025 mm. Electrical wiring tape (flexible printed circuit board) H1
Reference numeral 300 denotes a three-layer structure of a base film, a copper foil wiring, and a solder resist as described above,
1, H2 provided and gold-plated electrode lead H13
02 is exposed.

The second plate H1400 of this embodiment is
It is a single plate-shaped member, provided with two holes into which the recording element substrates H1100 and H1101 are inserted, and fixed to the first plate H1200 by adhesion. Further, the electric wiring tape H1300 has an entire surface excluding the device holes H1 and H2 formed to expose the recording element substrates H1100 and H1101.
The third plate H140 is formed by the third adhesive layer H1306.
0.

FIG. 10 shows a first plate H1200 and a first (or second) printing element substrate H1100 (H11
01), second plate H1400, electric wiring tape H
FIG. 1300 is a cross-sectional view of a state in which the layers 1300 are stacked and fixed. In this embodiment, the thickness of the first adhesive layer H1202 is 0.005 ±
0.004 mm, and the thickness of the second adhesive layer H1203 is set to 0.
02 ± 0.005 mm, and the thickness of the third adhesive layer H1306 is 0.03 ± 0.003 mm, and the members are adhered by these adhesive layers. Also, the thickness of the solder resist of the electric wiring tape H1300 is 0.017 ±
0.0125 mm, height of bump H1105 is 0.03
25 ± 0.0075 mm. That is, the gap h between the upper surface of the bump H1105 and the electrode lead H1302 shown in FIG. 10 is 0.075 mm, and the tolerance range is ± 0.058 mm in consideration of various tolerances, which is generally effective in the thermosonic crimping method. Is within the gap. Therefore, the bumps H1105 and the electrode leads H1302 can be easily joined by a thermosonic compression bonding method (inner lead bonding).

The support member (plate) having the structure described above,
By using the recording element substrate and the electric wiring tape (flexible printed circuit board), the reliability of the inner lead bonding can be improved and the electric connection can be reliably realized.

[Electrical Connection] Referring to FIG. 12, a method of sealing around the electrical connection will be described.

As described above, the periphery of the electrode portion 1104 of the recording element substrate and the periphery of the electrode lead H1302 of the electric wiring tape H1300 are exposed in the state of being electrically joined by the thermosonic compression bonding method. Therefore, the gaps H1319A and H1319B at the lower portion of the electrode lead H1302 and the gap H1319B at the upper portion are formed.
0A and H1320B are sealed and sealed with a sealant. At this time, since the electrode leads H1302 of the electric wiring tape H1300 are comb-shaped and have a gap, air can easily escape, so that the reliability of the sealing step can be secured.

As shown in FIG. 25, the lead (electrode terminal) of the electric wiring tape is previously attached by the conventional TAB mounting method.
In the method in which the bumps on the electrode pads of the recording element are electrically joined by a thermosonic compression bonding method, further sealed, and then bonded to a support, sealing is performed even when the TAB unit H300U1 and the TAB unit H300U2 are assembled. Agent H308
Since the gaps H309A and H309B remain in the lower part of the space, it is necessary to further flow a sealant (not shown) in order to prevent ink from entering the gaps. This part
Since the upper part is already sealed, it is difficult for air to escape,
In some cases, such as when air remains and the epoxy-based thermosetting sealant is used, the air expands and a hole is formed.

On the other hand, in the present embodiment, the members existing in the portion to be sealed are aligned and adhered, and then the sealing is performed at the end. Stable production is possible.

It is not necessary that the electrical joint and the sealant around the recording element substrate be the same. For example, the upper part H132 of the electrode lead H1302 of the electric wiring tape H1300
Since 0A and H1320B may be scraped by a wiper member for wiping ink, an epoxy-based hard sealant is preferable.

Further, the periphery of the openings (device holes) H1 and H2 of the electrical wiring tape H1300 is a capping area for performing capping for preventing ink evaporation in the nozzles.
01 and the electric wiring tape H1300 are aligned with each other, and the third plate H1400 is
, A stable capping area can be secured.

In the ink jet recording apparatus of this embodiment, since both the black head and the color head are assembled and integrated on the same wiring board, it is not necessary to correct the ink landing positions of the heads. is there.

When different elements are mounted on a single TAB tape as in the above-described conventional example, the positional accuracy of the elements is 0.1 mm unit due to the bonding accuracy to the TAB tape and subsequent deformation at the time of sealing. The displacement occurred, and the ink jet recording apparatus was unusable. On the other hand, according to the present embodiment, mutual positional accuracy can be ensured. Further, the color head of the present embodiment
Although the outer dimensions are different from those of the black head because it has nozzles for the colors, by incorporating a plurality of printing element substrates of different sizes into a single flexible wiring board, the capping means of the printing apparatus, etc. In addition, the size of the recording device can be reduced, and the size of the recording device can be reduced. In addition, since there is only one flexible wiring substrate serving as the capping surface, the reliability of removing excess ink adhering to the nozzle surface and the flexible wiring substrate can be improved. A long-life inkjet recording head can be provided.

[Embodiment 2] This embodiment has almost the same configuration as the embodiment 1, but the position of the upper surface of the second plate H1400 is 0.72 ± 0.05 mm and the bump H1
005 and the electrode lead H1302 have a gap h1 of 0.
105 ± 0.112 mm. This variation is ± 0.058 mm in the sum of squares. For example, as shown in FIG. 13, the bump H1005 on the print element substrate H1100
H1 between the electrode lead H1302, the bump H1005 on the recording element substrate H1101, and the electrode lead H130.
Even if there is a difference from the gap h2 with the gap 2, the gap is generally within the range of a gap (150 μm or less) which is generally effective in the thermosonic compression bonding method, and a reliable intermetallic connection is possible.

As described above, after a plurality of recording element substrates are bonded and fixed to a single support member, the TAB tape is subjected to thermo-ultrasonic pressure bonding (inner lead bonding), thereby providing a reliable and inexpensive. An inkjet recording head can be manufactured.

In this embodiment, as shown in FIG. 14, an adhesive sheet made of a thermosetting resin is used as the third adhesive layer H.
Although the electrical wiring tape H1300 and the second plate H1400 are bonded by thermocompression bonding as 1306, a configuration in which a non-sheet adhesive is applied and bonded as in the first embodiment may be used. .

[Embodiment 3] In this embodiment, FIGS.
As shown in the figure, the position of the joint surface of the second plate H1400 with the electric wiring tape H1300 is changed to the bump H110.
Error ± 0.0 using jig J01 with reference to the vertex of 5
It is positioned at about 5 mm, and is bonded with an adhesive.
According to this, the bump H1005 and the electrode lead H130
The gap h3 between the two is 0.105 ± 0.0625 mm
(± 0.052 mm in the sum of squares), and the variation was greatly reduced. Therefore, not only can reliable metal bonding be performed, but also the electrode leads H1302 in the resin sealing step.
Of the required amount of the sealant due to the variation of the height of the second plate H1400 and the thickness of the second plate H1400 (for example, the difference between the gaps h3 and h4 is reduced). Further, the distance between the ejection port H1107 and the recording medium can be reduced.

Further, the load for pressing the jig J01 against the bump H1005 is set at 1.2N per bump (12N when 100 bumps are used), the variation of the upper surface of the bump H1005 is suppressed to ± 0.002 mm, and the flatness is reduced. It can be further improved. In that case, bump H1005
The gap h3 between the electrode lead H1302 and the electrode lead H1302 is 0.105.
± 0.0425 mm (± 0.033 mm in the sum of squares), and the variation was further reduced.

Further, as shown in FIG. 17, a jig J02
The suction ports H3 and H4 are opened in the second plate H1400.
The position of the bonding surface with the electric wiring tape H1300 is positioned with an error of ± 0.01 mm while adsorbing via the jig J02 with respect to the apex of the bump H1105.
A silicone-based sealant adhesive is injected into the gap between the first plate H1200 and the second plate H1400 and bonded. According to this, the bump H1005 and the electrode lead H
The gap h3 between the gap 1302 and 1302 is 0.105 ± 0.0225.
mm (± 0.016 mm in the sum of squares), and the variation was further greatly reduced.

According to this, the center value of the dimension setting of the gap h3 between the bump H1005 and the electrode lead H1302 can be reduced from about 0.105 mm to about 0.03 mm, so that the distance between the ejection port and the recording medium can be further reduced. Can be smaller.

In this embodiment, a wiring board of a double-sided wiring type is used, and a contact portion with the printer body is provided on the opposite side of the recording element substrate. A recording head can be manufactured using another double-sided wiring board as in the configuration of JP-138814A.

[Embodiment 4] In the first embodiment, the first recording element substrate H1100 and the second recording element substrate H1101 are used.
A bump H1105 of Au or the like is formed on the electrode H1104 by a thermosonic compression bonding method. However, the intermetallic bonding is not limited to this, and the volume of the electrode portion is increased by plating using heat or the like, and the electrode H1104 is stabilized. Joining is possible. In the first embodiment, the TAB tape having the electrode leads H1302 is used as the electric wiring tape H1300.
After positioning and bonding an electrical wiring tape having electrode terminals at a position about several hundred μm apart from the electrode H1104 of the recording element substrate H1101 and then bonding the metal to each other by a thermosonic crimping method using a wire bonding method using an Au wire or the like. It is also possible to combine.

FIG. 18 shows an embodiment of the wire bonding method. The electric wiring tape H1300W has a base film H around the bonding portion similarly to the first embodiment.
1300a, a copper foil H1300b, a solder resist H1300c on the back side, and a copper foil H130.
The electrode portion H1300d of 0b is gold-plated and exposed. The bonding process of each member is the same as that of the first embodiment, but the electrode portion H1300d of the copper foil H1300b of the electric wiring tape H1300W is not above the electrode H1104 of the recording element substrate H1101 as in the first embodiment. It is glued and fixed on the second plate H1400 at a distance of about several hundred μm.

In this embodiment, the first recording element substrate H11
00 and the electrode H11 of the second printing element substrate H1101
04 and copper foil H1300 of electric wiring tape H1300W
After the electrode portion H1300d of b is wire-bonded using a bonding wire W1100 such as an Au wire, sealing is performed with resin as in the first embodiment.

In a general wire bonding apparatus, the position of the electric wiring tape is not so accurate because the ultrasonic bonding is performed after recognizing the position of each electrode portion and correcting the position. In the case of the head, there is a problem that the landing position of the ink is shifted unless the height of the bonding wire is reduced. Usually, the height of the bonding wire is high at the point where the bonding is performed first, and the height varies when the bonding distance varies. Therefore, in the present embodiment, similar to the first embodiment,
The electric wiring tape H1300W is aligned with the first recording element substrate H1100 and the second recording element substrate H11.
01 with the electrode H1104 as a reference, stabilizing the loop height of the bonding wire W1100,
Further, after the thickness of the second plate H1400 to which the electric wiring tape H1300W is adhered and fixed is made thinner than that of the first embodiment, the electrode portion H1300 of the electric wiring tape H1300W is made thinner.
From d, wire bonding is performed to the electrode portions H1104 of the first printing element substrate H1100 and the second printing element substrate H1101.

According to the present embodiment, the electrode portion H1104 has A
It is not necessary to form the bumps H1105 of u or the like by the thermosonic pressure bonding method, and it is possible to manufacture a low-cost, high-quality ink jet recording head with accurate ink landing positions.

[Embodiment 5] In the embodiment shown in FIGS. 19 and 20, the second recording element substrate H1101 of the first embodiment described above is used.
Are provided on a single recording element substrate by integrating mechanisms for three colors of cyan, magenta, and yellow, whereas three independent recording element substrates, that is, a second recording element substrate H1101A (cyan), third printing element substrate H1101B (magenta), fourth printing element substrate H
1101C (yellow). These second
No. 4 printing element substrates H1101A to H1101C have the same outer size as the first printing element substrate H1100,
7 and the size of the electrothermal transducer H1103 are smaller than the first recording element substrate H1100.

The recording head having such a configuration is particularly suitable for the second recording element substrate H1101A, the third recording element substrate H1101B, and the fourth recording element substrate H for color (three colors).
It is necessary that the attachment accuracy of 1101C is within ± 0.01 mm. However, these recording element substrates are precisely arranged on the first plate H1200 by image recognition in advance, and the second adhesive layer H1203 is used. Adhesion can ensure the necessary sticking accuracy.

Thereafter, as described above, the bumps H1105 on the electrodes H1104 of the recording element substrate and the electrode leads H1302 of the electric wiring tape H1300 are joined one by one by a thermo-ultrasonic crimping method, thereby providing electrical reliability. A high-performance inkjet recording head can be provided. in this way,
Even in the case of an ink jet print head that uses printing element substrates with almost the same external dimensions side by side, the use of a single flexible wiring board with openings of different sizes makes it possible to achieve a highly reliable long life ink jet. A recording head can be provided.

In this embodiment, as in the first embodiment, the sealing around the electric connection portion is performed. The third printing element substrate H110 at the center of the three color printing element substrates
When the sealing of the 1B electrode portion is performed on a TAB tape as in the conventional TAB mounting method, when the space between the adjacent recording element substrates is small, the sealant wraps around to the adhesive surface on the back surface. However, in this embodiment, a low-cost inkjet recording head with a high yield can be provided by sealing the recording element substrate after attaching it to another member.

Embodiment 6 In the embodiment shown in FIG. 21, the second plate is an independent frame H1400A, H1400B having a shape surrounding each of the two recording element substrates. Second
The members used, the adhesive used, and the like are exactly the same as those in Example 1 except that the shape of the plate is different. FIG. 22 shows a first plate H1200, a first (or second) printing element substrate H1100 (H1101), and a second plate H1400.
A, H1400B, and electrical wiring tape (flexible printed circuit board) H1300 are cross-sectional views in a state where they are stacked and fixed. In the case of the present embodiment, since the second plate is a frame surrounding the recording element substrate, the electric wiring tape H130
0 indicates that only the vicinity of the H bump 1105 of the printing element substrate H1100 (H1101) and the periphery of the printing element substrate are located one step higher than other portions. Also in the present embodiment, similarly to the first embodiment, the bump H1105 and the electrode lead H1302 could be easily joined by the thermosonic compression bonding method (inner lead bonding).

[Embodiment 7] In the embodiment shown in FIG. 23, the second plate H1400C is located only in the vicinity of the bumps H1105 of the two recording element substrates. Second
The members used, the adhesive used, and the like are exactly the same as those in Example 1 except that the shape of the plate is different. In the case of this embodiment, the second
Plate H1400C is a printing element substrate H1100 (H
1101), the electrode leads H13 of the electrical wiring tape H1300 are located only near the bumps H1105.
In No. 02, only the vicinity of the bump H1105 of the printing element substrate H1100 (H1101) is positioned one step higher than other portions.

In this embodiment, as in the first embodiment,
The bump H1105 and the electrode lead H1302 could be easily joined by the thermosonic compression bonding method (inner lead bonding).

[0099]

As described above, according to the present invention, in an ink jet recording head having a configuration in which a plurality of recording elements are bonded to a single flexible wiring substrate, first, a plurality of semiconductor chips (recording elements) are mounted on a support member. Substrate), and thereafter, a wiring substrate is laminated, and the inner lead bonding step and the inner lead sealing step are performed on the bumps on the electrodes of the recording element substrate and the electrode leads of the wiring substrate. The reliability of lead bonding can be improved, and electrical connection can be reliably achieved.

In particular, a plurality of recording element substrates are fixed with an adhesive to a first support member to which a second support member is adhered with an adhesive, and the electrodes on the recording element substrate and the electrode leads of the wiring board are fixed. After the alignment, the wiring substrate is fixed to the second support member with an adhesive, and the electrodes on the recording element substrate and the electrode leads of the single flexible wiring substrate are joined, and By sealing the joint between the electrode and the electrode lead of the single flexible wiring board with a resin, it is possible to provide an ink jet recording head having good printing quality, high reliability, and low cost.

When the bumps and the electrode leads are bonded between the metals, an ink cartridge with higher productivity can be provided.

Further, after the distance between the upper surface of the second support member and the upper surface of the bump is made constant, the metal-to-metal bonding and the sealing of the bonding portion are performed, so that the printing quality is good and the reliability is high. And a low-cost inkjet recording head can be provided.

[Brief description of the drawings]

FIG. 1A is a perspective view of a recording head cartridge according to a first embodiment of the present invention, and FIG. 1B is an exploded perspective view thereof.

FIG. 2 is an exploded perspective view showing the configuration of the recording head shown in FIG.

FIG. 3 is an exploded perspective view in which the recording head shown in FIG. 2 is further disassembled;

FIG. 4 is a partially cutaway explanatory perspective view showing a configuration of a printing element substrate in Embodiment 1 of the present invention.

FIG. 5 is a partially cutaway perspective view showing the configuration of another recording element substrate according to the first embodiment of the present invention.

FIG. 6 is a sectional view of a main part of the recording head cartridge according to the first embodiment of the invention.

FIG. 7 is a perspective view illustrating an assembly of the recording element unit and the ink supply unit according to the first embodiment of the present invention.

FIG. 8 is a perspective view illustrating a bottom surface side of the recording head according to the first embodiment of the present invention.

FIG. 9 is an exploded schematic sectional view of a main part of the recording element unit according to the first embodiment of the present invention.

FIG. 10 is an enlarged sectional view of a main part of the recording element unit according to the first embodiment of the present invention.

FIG. 11 is an enlarged exploded perspective view of a main part of the recording element unit according to the first embodiment of the present invention.

FIG. 12 is a cross-sectional view of the recording element unit according to the first embodiment of the present invention.

FIG. 13 is a sectional view of a recording element unit according to a second embodiment of the present invention.

FIG. 14 is an exploded sectional view of a recording element unit according to a second embodiment of the present invention.

FIG. 15 is a cross-sectional view showing a printing element unit manufacturing process in Embodiment 3 of the present invention.

FIG. 16 is a sectional view of a recording element unit according to a third embodiment of the present invention.

FIG. 17 is a cross-sectional view showing a printing element unit manufacturing process in a modified example of Embodiment 3 of the present invention.

FIG. 18 is a sectional view of a recording element unit according to a fourth embodiment of the present invention.

FIG. 19 is a perspective view of a recording head cartridge according to Embodiment 5 of the present invention.

20 is an exploded perspective view showing the configuration of the recording head shown in FIG.

FIG. 21 is an enlarged exploded perspective view of a main part of a recording element unit according to a sixth embodiment of the present invention.

FIG. 22 is an enlarged sectional view of a main part of a recording element unit according to a sixth embodiment of the present invention.

FIG. 23 is an enlarged exploded perspective view of a main part of a recording element unit according to a seventh embodiment of the present invention.

FIG. 24 is an exploded schematic sectional view of a main part of a conventional recording element unit.

FIG. 25 is a schematic sectional view of a main part of a conventional recording element unit.

[Explanation of symbols]

H1000 printhead cartridge H1001 printhead (inkjet printhead) H1002 print element unit H1003 ink supply unit H1100 first print element substrate H1101 second print element substrate H1102 ink supply port (supply port) H1103 electrothermal conversion element (recording element) H1104 Electrode H1105 Bump H1106 Ink flow path wall H1107 Discharge port H1108 Discharge port group H1110 Si substrate H1200 First plate (first support member) H1201 Ink communication port H1202 First adhesive layer H1203 Second adhesive layer H1300, H1300W Electric wiring tape (flexible wiring board) H1301 External signal input terminal H1302 Electrode lead H1306 Third adhesive layer H1309 Terminal positioning hole H1400, H1 400A, H1400B, H1400
C Second plate H1500 Ink supply member H1501 Ink flow path H1503 First hole H1509 X abutment H1510 Y abutment H1511 Z abutment H1512 Terminal fixing part H1515 Terminal positioning pin H1520 Joint part H1600 Flow path forming member H1601 Mounting guide H1602 Ink communication port H1700 Filter H1800 Seal rubber H1900 Ink tank H1901 Black ink tank H1902 Cyan ink tank H1903 Magenta ink tank H1904 Yellow ink tank H1907 Ink communication port H1910 Second claw H2000 Tank holder H2300 Joint seal member H2400 Screw H1, H2 Device hole

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] August 1, 2001 (2001.8.1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

[0010]

SUMMARY OF THE INVENTION The feature of the present invention is that an ink
Record that generates the energy used to eject ink
An element and an electrode portion connected to the recording element are provided.
A plurality of printing element substrates, and electrode portions of the plurality of printing element substrates;
It has electrode terminals that are electrically connected to the recording element.
Wiring board that transmits electric pulses for discharging ink
And an element substrate supporting member for supporting a plurality of recording element substrates
And a method for manufacturing an ink jet recording head having
Supports a plurality of printing element substrates on an element substrate support member.
And a step of supporting a plurality of printing element substrates.
After that, a plurality of electrode portions of the recording element substrate and the electrodes of the wiring substrate
And a step of inter-metal coupling between the terminal and the metal.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

Another feature of the present invention is that the ink
Record that generates the energy used to eject ink
Element and an electrode portion connected to the recording element were provided.
A plurality of printing element substrates, and electrode portions of the plurality of printing element substrates;
It has electrode terminals that are electrically connected to the recording element.
Wiring board that transmits electric pulses for discharging ink
And an element substrate supporting member for supporting a plurality of recording element substrates
And supports the wiring board and is fixed on the element substrate support member.
And a wiring board supporting member,
A method for manufacturing a recording head, comprising:
Fixing the wire substrate support member on the element substrate support member
And the electrodes of the wiring substrate with respect to the electrodes of the plurality of printing element substrates.
Align the pole terminals and place the wiring board on the wiring board support member.
Fixing to the electrodes, wiring of the electrodes of multiple printing element substrates and wiring
Bonding the electrode terminals of the substrate with the metal, and in this order
Including.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

According to these methods, the electrode portion and the electrode terminal
By performing metal-to-metal bonding such as thermosonic crimping
The recording element substrate and the wiring substrate as element substrate support members.
Even if the electrode part and the electrode terminal are joined after fixing,
Reliability can be ensured. In addition, a versatile marker
Inexpensive ink can be used because standard equipment and technology can be used.
A jet recording head can be provided. Also, support the wiring board
Between the upper surface of the member and the upper surfaces of the electrode portions on the plurality of recording element substrates.
Connect the wiring board support member to the element board so that the distance is constant.
Reliable low price by attaching to the support member
Can be provided. At this time,
Variation in the height of the top surface of the electrode on multiple recording element substrates
More reliable by correcting and smoothing
A low-cost inkjet recording head can be provided.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

And a plurality of printing element substrates and wiring bases.
The process of fixing the plate support member on the element substrate support member is bonding
Using a chemical agent to form electrodes and wiring on multiple printing element substrates
After the step of metal-to-metal bonding of the electrode terminals of the board,
A step of sealing the joint with the electrode terminal with resin.
It is preferred to include. Electrodes on the print element substrate and wiring base
Seal the joints of the electrode terminals on the board with the resin
Stable by performing after fixing to the wiring board support member
Inkjet recording at lower cost
Recording head can be provided.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

A plurality of printing element substrates are mounted on a wiring board support member.
In the step of fixing to the wiring board support member
Make sure that the electrodes on the print element substrates are not at the same height
It is preferable to arrange them in In addition, the wiring board is
In the step of fixing on a plate supporting member, a plurality of recording elements
The gap between the electrode part of the board and the electrode terminal of the wiring board is 100μ
m, and then the two are bonded together.
Is preferred.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction contents]

A plurality of recording element substrates and a wiring substrate support
The step of fixing the material on the element substrate supporting member includes a plurality of recording processes.
The element substrate is fixed on the element substrate support member by the first adhesive layer.
Setting the wiring substrate support member on the element substrate support member
And fixing with a second adhesive layer.
Thickness obtained by adding the thickness of the recording element substrate and the thickness of the first adhesive layer
Is the thickness of the wiring board supporting member and the thickness of the second adhesive layer.
It is preferable that the thickness is smaller than the sum of

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

The electrode portions of the plurality of recording element substrates are bonded between metals.
May be included. Form bumps on electrodes
The method is to use stud bumps by thermo-sonic bonding.
May also be a plated bump by plating.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

A plurality of recording element substrates are provided on the wiring substrate.
A plurality of openings to be incorporated and provided are provided.
Further includes a step of sealing the periphery of the recording element substrate with a resin.
You may go out. Size or shape of multiple recording element substrates
Preferably, at least one of the shapes is different from each other. Arrangement
Multiple printing element substrates are incorporated into the line substrate respectively
A plurality of openings are provided, and the size or shape of the openings is
Preferably, at least one is different from each other.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction contents]

The intermetallic connection is made by thermosonic compression bonding.
It may be. Alternatively, metal bond is wire bondin
May be done by

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

Still another feature of the present invention is that an ink
Record that generates the energy used to eject ink
Element and an electrode portion connected to the recording element were provided.
A plurality of printing element substrates, and electrode portions of the plurality of printing element substrates;
It has electrode terminals that are electrically connected to the recording element.
Wiring board that transmits electric pulses for discharging ink
And an element substrate supporting member for supporting a plurality of recording element substrates
And an inkjet recording head comprising:
The electrode portions of the plurality of printing element substrates are
It is not located at the same height,
If the poles and the electrode terminals of the wiring board are
At the time.

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction contents]

The size or shape of a plurality of printing element substrates
Preferably, at least one is different from each other. Wiring base
A plurality of printing element substrates are incorporated into the board, respectively.
Openings are provided, and the size or shape of the plurality of openings is provided.
Are preferably different from each other. wiring
Wiring substrate support that supports the substrate and is fixed to the element substrate support member
Holding a plurality of printing element substrates and element substrate supports.
A first adhesive layer for adhering the holding member, and an element substrate support portion
And a second adhesive layer for adhering the material and the wiring board support member.
Thickness of the plurality of recording element substrates and thickness of the first adhesive layer
Is the thickness of the wiring board supporting member and the thickness of the second contact.
It is preferable that the thickness is smaller than the thickness obtained by adding the thickness of the deposition layer.

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction contents]

The recording element uses thermal energy as energy.
May be used.

[Procedure amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0029

[Correction method] Change

[Correction contents]

Further, as shown in the exploded perspective view of FIG.
The printing element unit H1002 includes a first printing element substrate H
1100, second printing element substrate H1101, first plate (element substrate supporting member) H1200, electric wiring tape (flexible wiring substrate) H1300, electric contact substrate H2200, second plate (wiring substrate supporting member) H1
400 and an ink supply unit H
Reference numeral 1003 includes an ink supply member H1500, a flow path forming member H1600, a joint seal member H2300, a filter H1700, and a seal rubber H1800.

[Procedure amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction contents]

The ink supply port H1102 is formed by a method such as anisotropic etching or sandblasting utilizing the crystal orientation of Si. That is, the Si substrate H1110
Is <100> in the direction of the wafer surface and <111> in the thickness direction.
> KOH, TMA
H, hydrazine, etc.) and about 5
The etching can proceed at an angle of 4.7 degrees. Thus, etching is performed to a desired depth to form an ink supply port H1102 including a long groove-shaped through-hole. The electrothermal transducers H1103 are arranged in a staggered pattern on both sides of the ink supply port H1102. The electrothermal transducer H1103 and the electrical wiring of Al or the like for supplying power to the electrothermal transducer H1103 are formed by a film forming technique. Further, an electrode (electrode part) H1104 for supplying power to the electric wiring is an electrothermal transducer H1103.
And bumps H1105 made of Au or the like are formed on the electrode H1104 by a thermosonic compression bonding method. Then, on the Si substrate H1110, an ink flow path wall H1106 for forming an ink flow path corresponding to the electrothermal transducer H1103 and discharge ports H1107 are formed by a photolithography technique using a resin material.
1108 are formed. Electrothermal conversion element H1103
Is provided so as to face the ink jet head, the ink supplied from the ink supply port H1102 is discharged from the discharge port H1107 by bubbles generated by the heat-generating action of the electrothermal transducer H1103.

[Procedure amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0032

[Correction method] Change

[Correction contents]

FIG. 5 shows a second printing element substrate H1101.
FIG. 3 is a partially exploded perspective view for explaining the configuration of FIG. The second recording element substrate H1101 is a recording element substrate for discharging ink of three colors, and has three ink supply ports H1.
102 are formed in parallel, and the electrothermal transducers H110 are formed on both sides of each ink supply port H1102.
3 and an ink discharge port H1107 are formed. Like the first recording element substrate H1100, the Si substrate H111
0, the ink supply port H1102 and the electrothermal conversion element H110
3. Electric wiring, electrodes (electrode portions) H1104 and the like are formed, and ink flow paths and ink discharge ports H1107 are formed thereon by photolithography using a resin material. Then, like the first recording element substrate H1100, the electrode H1104 for supplying electric power to the electric wiring has A
A bump H1105 of u or the like is formed . Next, the first plate H1200 has a thickness of, for example, 0.5 to 10 mm.
Of alumina (Al ₂ O ₃ ). In addition,
The material of the first plate H1200 is not limited to alumina, has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate H1100, and has a recording element substrate H110.
It may be made of a material having a thermal conductivity equal to or greater than the thermal conductivity of the zero material. First plate H120
For example, materials of silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ),
Any of silicon carbide (SiC), molybdenum (Mo), and tungsten (W) may be used. An ink communication port H1201 for supplying black ink to the first printing element substrate H1100 is provided in the first plate H1200.
And an ink communication port H for supplying cyan, magenta, and yellow inks to the second recording element substrate H1101.
1201 are formed, the ink supply ports H1102 of the recording element substrate correspond to the ink communication ports H1201 of the first plate H1200, respectively, and the first recording element substrate H1100 and the second recording element substrate H1101 are The first plate H1200 is adhered and fixed with high positional accuracy. The first adhesive used for bonding is
It is desirable that the composition has a low viscosity, a low curing temperature, is cured in a short time, has relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive mainly containing an epoxy resin, and the thickness of the first adhesive layer H1202 shown in FIG. 10 is desirably 50 μm or less.

[Procedure amendment 17]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction contents]

The electric wiring tape H1300 applies an electric signal for discharging ink to the first recording element substrate H1100 and the second recording element substrate H1101. The electric wiring tape H1300 includes a plurality of device holes (openings) H1 and H2 for incorporating the respective recording element substrates H1100 and H1101, and electrodes (electrodes ) of the respective recording element substrates H1100 and H1101.
Part) Electrode terminal (electrode lead) corresponding to H1104 H1
302, and an electrode terminal portion for making an electrical connection with an electric contact substrate H2200 having an external signal input terminal H1301 at an end of the electric wiring tape H1300 and receiving an electric signal from the printer main unit. The electrode terminals and the electrode leads H1302 are connected by a continuous copper foil wiring pattern. The electric wiring tape H1300 is made of, for example, a flexible wiring board in which the wiring has a two-layer structure and the surface layer is covered with a resist film. In this case, a reinforcing plate is adhered to the back surface side (outer surface side) of the external signal input terminal H1301 to improve the flatness. As the reinforcing plate, for example, a heat-resistant material such as 0.5 to 2 mm glass epoxy or aluminum is used.

[Procedure amendment 18]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

[0099]

As described above, according to the present invention, in an ink jet print head having a structure in which a plurality of printing elements are bonded to a wiring substrate, a plurality of semiconductor chips (printing element substrates) are first bonded to an element substrate support member. After that, the wiring boards are laminated, and the electrodes of the recording element board and the wiring board are electrically connected.
In a manufacturing method for performing an inner lead bonding step and an inner lead sealing step with respect to the pole terminals,
The reliability of the inner lead bonding can be improved, and electrical connection can be reliably achieved.

[Procedure amendment 19]

[Document name to be amended] Statement

[Correction target item name] 0100

[Correction method] Change

[Correction contents]

In particular, a plurality of recording element substrates are connected to a wiring substrate support.
Support member is fixed with adhesive pasted element substrate support member with an adhesive, the electrode of the wiring board and the electrode portion of the recording element substrate
After aligning the terminals, support the wiring board
It is fixed to the member with adhesive, and the electrodes of the printing element substrate and the wiring
By joining the electrode terminals of the substrate to each other and sealing the joint with a resin, it is possible to provide an ink jet recording head having good printing quality, high reliability, and low cost.

[Procedure amendment 20]

[Document name to be amended] Statement

[Correction target item name] 0101

[Correction method] Change

[Correction contents]

The electrode part of the recording element substrate and the electrode end of the wiring substrate
When the ink cartridge and the ink cartridge are connected to each other, a more productive ink cartridge can be provided.

[Procedure amendment 21]

[Document name to be amended] Statement

[Correction target item name] 0102

[Correction method] Change

[Correction contents]

Further, the upper surface of the wiring board supporting member and the electrode
After the distance from the upper surface of the portion is made constant, the metal-to-metal bonding and the sealing of the bonding portion are performed, whereby a high-quality, high-reliability, and low-cost inkjet recording head can be provided.

[Procedure amendment 22]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

[Description of References] H1000 printhead cartridge H1001 printhead (inkjet printhead) H1002 print element unit H1003 ink supply unit H1100 first print element substrate H1101 second print element substrate H1102 ink supply port (supply port) H1103 electrothermal Conversion element (recording element) H1104 Electrode (electrode part) H1105 Bump H1106 Ink flow path wall H1107 Ejection port H1108 Ejection port group H1110 Si substrate H1200 First plate (element substrate support member) H1201 Ink communication port H1202 First adhesive layer H1203 Second adhesive layer H1300, H1300W Electric wiring tape (wiring base
Plate) H1301 external signal input terminal H1302 electrode lead (electrode terminals) H1306 third adhesive layer H1309 terminal positioning holes H1400, H1400A, H1400B, H1400
C Second plate (wiring board support member) H1500 Ink supply member H1501 Ink flow path H1503 First hole H1509 X abutment H1510 Y abutment H1511 Z abutment H1512 Terminal fixing part H1515 Terminal positioning pin H1520 Joint part H1600 Flow path forming member H1601 Mounting guide H1602 Ink communication port H1700 Filter H1800 Seal rubber H1900 Ink tank H1901 Black ink tank H1902 Cyan ink tank H1903 Magenta ink tank H1904 Yellow ink tank H1907 Ink communication port H1910 Second claw H2000 Tank holder H2300 Joint seal Member H2400 Screw H1, H2 Device hole

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ikumo Watanabe 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2C057 AF21 AF93 AF99 AG12 AG46 AG85 AP24 AP25 AP71 AP77 AP90 AR14 BA04 BA13 5E319 AA03 AB05 AC03 BB04 CC12 GG01

Claims (14)

[Claims] 1. A plurality of printing element substrates, comprising: a plurality of printing elements for discharging a printing liquid; and a supply port for supplying the printing liquid to the printing elements; and the plurality of printing element substrates are incorporated. A single flexible wiring that has a plurality of openings and is electrically connected to the printing element substrate to transmit an electric pulse for discharging the printing liquid to the printing element substrate; A substrate, a first support member that supports the plurality of print element substrates, and a second support member that supports the single flexible wiring board and is fixed to the first support member. In the ink jet recording head, the positions of the electrodes of the recording element substrates on the first support member are not aligned, and the bumps are provided on the electrodes of the recording element substrates. And the single flexible Ink jet recording head and the wiring substrate of the electrode lead is characterized in that it is coupled between metals. 2. The ink jet recording head according to claim 1, wherein at least one of the plurality of recording element substrates has a different size or shape. 3. The ink jet recording head according to claim 1, wherein at least one of the size and the shape of the opening of the single flexible wiring board is different. 4. A first adhesive layer for fixing the recording element substrate and the first support member to each other, and a second adhesive for fixing the first support member and the second support member to each other. A thickness obtained by adding the thickness of the recording element substrate and the thickness of the first adhesive layer to the thickness of the second support member and the thickness of the second adhesive layer. Thinner than the thickness,
The inkjet recording head according to claim 1. 5. A plurality of printing element substrates, comprising: a plurality of printing elements for discharging a printing liquid; and a supply port for supplying the printing liquid to the printing elements; and the plurality of printing element substrates are incorporated. A single flexible wiring that has a plurality of openings and is electrically connected to the printing element substrate to transmit an electric pulse for discharging the printing liquid to the printing element substrate; A substrate, a first support member that supports the plurality of print element substrates, and a second support member that supports the single flexible wiring board and is fixed to the first support member. In the method of manufacturing an ink jet recording head, the positions of the electrodes of the recording element substrates on the first support member are not aligned with each other, and the electrodes of the recording element substrates and the electrodes of the recording element substrates are not aligned with each other. One flexible wiring board A method for producing an ink jet recording head, characterized in that after aligning the pole portion, these are wire-bonded. 6. A plurality of printing element substrates, comprising: a plurality of printing elements for discharging a printing liquid; and a supply port for supplying the printing liquid to the printing elements; and the plurality of printing element substrates are incorporated. Having a plurality of openings for electrically connecting the recording element substrate to the recording element substrate to transmit an electric pulse for discharging the recording liquid to the recording element substrate. A first support member that supports the plurality of recording element substrates; and a second support member that supports the single flexible wiring substrate and is fixed to the first support member. Forming a bump on an electrode of the plurality of printing element substrates; and fixing the plurality of printing element substrates and the second support member on the first support member. The process of After aligning the electrode leads of the single flexible wiring substrate with the electrodes of the plurality of printing element substrates fixed on the first support member, the wiring substrate is moved to the first position.
Fixing on the second support member fixed on the support member, and bumps on the electrodes of the plurality of recording element substrates fixed on the first support member, and the second support Bonding the electrode lead of the single flexible wiring substrate fixed on a member to the metal, and bonding the metal lead to the metal lead. 7. The plurality of printing element substrates and the second printing element substrate.
Fixing the supporting member on the first supporting member,
Fixing the second support member on the first support member with an adhesive, and positioning the wiring surface of the recording element of the recording element substrate on the first support member, Fixing the recording element substrate to the first support member with an adhesive. After the metal of the recording element substrate and the electrode lead of the wiring substrate are bonded to each other, the bump and the electrode The method for manufacturing an ink jet recording head according to claim 6, further comprising a step of sealing a joint portion with a lead with a resin. 8. The method according to claim 6, further comprising, before the step of fixing the recording element substrate to the first support member, a step of inter-metal bonding the bump to the electrode of the recording element substrate. The manufacturing method of the ink jet recording head according to the above. 9. The method according to claim 6, further comprising a step of sealing a periphery of the recording element substrate with a resin in the opening of the single flexible wiring substrate. A method for manufacturing an ink jet recording head. 10. The step of fixing the plurality of recording element substrates on the first support member, wherein the positions of the electrodes of the recording element substrates on the first support member are not aligned on a straight line. The method for manufacturing an ink jet recording head according to any one of claims 6 to 9, wherein the ink jet recording heads are arranged in such a manner. 11. The printing element substrate according to claim 6, wherein at least one of a size and a shape of said plurality of printing element substrates is different.
0. The method for manufacturing an ink jet recording head according to any one of items 0 to 10. 12. The method according to claim 11, wherein at least one of the size and the shape of the opening of the single flexible wiring board is different. 13. A step of fixing the wiring substrate on the second support member, wherein a gap between an upper surface of the bump and the electrode lead is set to 100 μm or less. The method of manufacturing an ink jet recording head according to any one of claims 6 to 12, wherein a step of bonding metal and metal is performed. 14. The step of fixing the plurality of printing element substrates and the second support member on the first support member, wherein the step of fixing the plurality of printing element substrates on the first support member includes a first adhesive layer. And fixing the second support member on the first support member with a second adhesive layer, wherein the thickness of the recording element substrate and the thickness of the first adhesive layer are included. 14. The inkjet recording head according to claim 6, wherein a thickness obtained by adding the thickness is smaller than a thickness obtained by adding a thickness of the second support member and a thickness of the second adhesive layer. Production method.