JP2007331007A - Method for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device, which is capable of efficiently cutting or dividing the display device with a laser beam. <P>SOLUTION: In the method for manufacturing the display device 10, the display device 10 is formed by irradiating a laminated body P3 with the laser beam 45. The method comprises a step of forming a first wiring pattern 51a on a first substrate P1 included in the laminated body P3, a step of forming a second wiring pattern 51b on a second substrate P2 placed at a position facing the first substrate P1, a step of forming the laminated body P3 by laminating the first substrate P1 and the second substrate P2, a step of forming a converted material part 47 by irradiating the laminated body P3 with the laser beam 45, and a step of forming a split piece Q by applying a stress F to the laminated body P3. The first wiring pattern 51a and the second wiring pattern 51b are arranged so as to confront each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device using laser light.

  Conventionally, when a substrate such as a semiconductor material substrate, a piezoelectric material substrate, or a glass substrate is cut, there is a method of cutting and dividing the substrate by irradiating the substrate with laser light.

  For example, as disclosed in Patent Document 1, in a method of cutting and dividing a substrate such as a semiconductor material substrate, a piezoelectric material substrate, or a glass substrate, laser light that is absorbed by the substrate is irradiated along the planned cutting line, There has been proposed a method in which a modified region portion by multiphoton absorption is formed from the front surface to the back surface of a substrate, and a divided piece is formed by cutting and dividing along the modified region portion.

JP 2002-192371 A

  However, in the method of Patent Document 1, in the case of a display device such as a TFT panel, for example, when the TFT substrate (laminated body) is cut into chips after the counter substrate and the TFT substrate are bonded together, the display device In order to form a display device by dividing a TFT panel (laminated body) into individual chips, it is necessary to cut the outer peripheral portion, the terminal portion, and between the counter substrate and the TFT substrate. A cutting part was necessary. As a result, the more cutting parts, the longer the processing time, and it was difficult to improve the cycle time.

  An object of the present invention is to provide a manufacturing method of a display device capable of efficiently cutting and dividing the display device in the manufacturing method of cutting and dividing the display device using laser light.

  The manufacturing method of a display device of the present invention is a manufacturing method of forming a display device by irradiating a laminate with laser light, the step of forming a first wiring pattern on a first substrate included in the laminate. A step of forming a second wiring pattern on a second substrate disposed at a position facing the first substrate, and bonding the first substrate and the second substrate together to form a laminate. A step of irradiating the laminated body with a laser beam to form a material altered portion, and applying a stress to the laminated body to form a divided piece. The wiring pattern and the second wiring pattern are arranged to face each other so as to face each other.

  According to the present invention, the first wiring pattern and the second wiring pattern are arranged to face each other, and the first substrate and the second substrate are bonded together to form a laminated body. Since the portion of the material altered portion formed by irradiating the laser beam can be narrowed down to the minimum necessary quantity, the cycle time can be shortened, resulting in efficiency.

  In the method of manufacturing the display device according to the aspect of the invention, in the step of forming the material altered portion, the laminate is irradiated with the laser light while avoiding the first wiring pattern and the second wiring pattern, and the material It is desirable to form an altered portion.

  According to the present invention, since the material altered portion is formed by irradiating the laminated body with laser light while avoiding the arrangement positions of the first wiring pattern and the second wiring pattern, the first wiring generated by the laser light irradiation is formed. Since quality degradation of the pattern and the second wiring pattern can be suppressed, a display device with stable quality can be provided.

  In the method for manufacturing a display device of the present invention, the laminate is made of a material that is transmissive to the laser light, and in the step of forming the material altered portion, the laser light is applied to the laminate. It is desirable that the material altered portion is formed by condensing and irradiating with a condensing element.

  According to this invention, since the laser beam is condensed by the light condensing element and irradiated onto the laminated body, the material altered portion can be formed at a predetermined position of the laminated body.

  In the manufacturing method of the display device of the present invention, in the material altered portion forming step, the laser beam is either a titanium sapphire laser or a YAG laser, and the fundamental wave of the titanium sapphire laser or the YAG laser. It is desirable to form the material altered portion by irradiating the material.

  According to the present invention, when the laminated body is irradiated with a fundamental wave of a titanium sapphire laser or a YAG laser, the fundamental wave of the titanium sapphire laser or the YAG laser has a wavelength that is transparent to the laminated body. Therefore, the material altered portion can be formed at a predetermined position of the laminate.

  In the method for manufacturing a display device according to the present invention, in the step of forming the divided pieces, it is desirable to form the divided pieces by applying either one of bending stress and tensile stress to the laminate.

  According to the present invention, the laminated body can be cut and divided simply by applying a stress to the laminated body, so that the divided pieces can be easily formed.

  Hereinafter, embodiments of the method for manufacturing a display device of the present invention will be described in detail with reference to the accompanying drawings. Before describing the characteristic manufacturing method of the present invention, a substrate used in the present embodiment and a forming method for forming a material-modified portion in the substrate will be described.

<Substrate>
The substrate that can be used in this embodiment can be made of a material (mainly a ceramic material) such as glass, quartz, quartz, or silicon. Here, quartz is used as the substrate material.

<Formation method of material alteration part>
A formation method for forming a material altered portion in the substrate by irradiating the substrate with laser light will be described.

  FIG. 1 is an explanatory diagram for explaining a method for forming a material-affected portion as a modified layer by laser light.

  In FIG. 1, the laser beam 45 is condensed and irradiated inside the substrate P, and the laser beam 45 is scanned in the scanning direction X (dividing direction). Since the laser beam 45 is condensed by the lens 46 as a condensing element, the laser beam 45 can be focused inside the substrate P. When the laser beam 45 is scanned in the scanning direction X (division direction), the material altered portion 47 as a modified layer can be formed inside the substrate P. The moving speed of the laser beam 45 in the scanning direction X is 100 mm / sec. The thickness of the substrate P is about 200 μm.

  Further, since the amount of the material altered portion 47 as the modified layer can be several tens of μm only by scanning the laser beam 45 once, in order to form the material altered portion 47 in the entire depth direction of the substrate P. Needs to scan the laser beam 45 several times in the scanning direction X (division direction). Each time the laser beam 45 is scanned, the focal position of the lens 46 as a condensing element is raised from the lower surface of the substrate P toward the upper surface. Here, the reason why the focal position of the laser beam 45 is raised from the lower surface to the upper surface of the substrate P is that the laser beam 45 is scattered by the material altered portion 47 formed earlier, and the entire region in the depth direction of the substrate P. This is to prevent the material altered portion 47 from being unable to be formed.

(Embodiment)
In this embodiment, the surface of the laminate is irradiated with laser light to form a material altered portion inside the laminate, and stress is applied from the outside of the laminate to cut and divide the laminate to produce a display device. A method for manufacturing the display device will be described.

  FIG. 2 is a schematic diagram of the laser processing apparatus in the present embodiment, and FIG. 3 is a block diagram of a control system of the laser processing apparatus.

  The laser processing apparatus will be described with reference to FIGS.

  As shown in FIG. 2, the laser processing apparatus 100 includes a laser light source 101 that emits laser light 45, and a dichroic mirror 102 as a reflector that reflects the laser light 45 emitted from the laser light source 101. . Further, the dichroic mirror 102 has a function of reflecting the amount of incident laser light 45. The dichroic mirror 102 is arranged so that the laser beam 45 can be irradiated substantially perpendicularly to the surface of the substrate P as shown in FIG.

  The laser processing apparatus 100 includes a lens 46 as a condensing element that condenses the laser light 45 reflected by the dichroic mirror 102. And the lens 46 is arrange | positioned so that the laser beam 45 can be irradiated to the surface of the board | substrate P substantially perpendicularly, as shown in the figure.

  In addition, a stage 107 on which a substrate P, which is a processing target, is placed, and an X-axis slide unit 110 and a Y-axis slide that move the stage 107 in the X-axis direction and the Y-axis direction with respect to the lens 46 as a condensing element Part 108.

  Further, a Z-axis slide mechanism 104 that adjusts the position of the condensing point of the laser light 45 by changing the position of the lens 46 as a condensing element in the Z-axis direction with respect to the substrate P placed on the stage 107 is provided. Yes. The lens 46 as a condensing element is supported by a slide arm 104 a extending from the Z-axis slide mechanism 104. The lens 46 as a condensing element is an objective lens having a magnification of 50 times, a numerical aperture of 0.8, and a WD (Working Distance) of 3 mm.

  Further, the laser processing apparatus 100 includes an imaging device 112 located on the opposite side of the lens 46 as a light condensing element with the dichroic mirror 102 interposed therebetween. The imaging device 112 includes a coaxial incident light source (not shown) and a CCD (Charge Coupled Device) (not shown). The imaging device 112 can capture an image, and the captured image data is configured to be captured by the image processing unit 124. Then, the visible light emitted from the coaxial incident light source passes through the lens 46 as a condensing element and is focused.

Here, a laser beam 45 having transparency to the substrate P is employed. In the present embodiment, a YAG laser that excites a semiconductor laser is employed as the laser light emitted from the laser light source 101. The YAG laser is a so-called nanosecond laser that emits with a nanosecond pulse width. Detailed conditions of the laser beam 45 are as follows. The laser light source excites a semiconductor laser. Laser medium: Nd: YAG. Laser wavelength: 1064 nm. Laser light spot cross section: 3.14 × 10 ⁻⁸ cm ² . Oscillation form: Q switch pulse. Repeat frequency: 100 KHz. Pulse width: 30 ns. Output: 20 μJ / pulse. Laser light quality: TEM ₀₀ . Polarization characteristics: linearly polarized light (C). Condenser lens magnification: 50 times. NA: 0.55. Transmittance with respect to laser light wavelength: 60% (D). Movement speed: 100 mm / sec.

  The laser wavelength of the YAG laser does not stick to 1064 nm, and for example, the second harmonic of the YAG laser may be used. The laser wavelength of the second harmonic is 532 nm. Further, the laser beam 45 may not be a YAG laser, and for example, an ultrashort pulse laser represented by a titanium sapphire laser may be adopted. If a titanium sapphire laser, which is an ultrashort pulse laser, is used, even if the beam diameter is somewhat increased due to the influence of aberrations, internal processing can be performed without any problem, and the material altered portion 47 (see FIG. 1) can be formed. . Detailed conditions of the laser beam 45 in this case are as follows. Laser wavelength: about 800 nm. Pulse width: about 300 fs (femtosecond). The pulse period is 1 kHz. Output: about 700 mW.

  The laser light source 101 that emits the laser beam 45 is controlled by the laser control unit 121 under predetermined conditions.

  As shown in FIG. 3, the laser processing apparatus 100 (see FIG. 2) includes a main computer 120 that can control each of the above components. The main computer 120 includes a CPU 127 (Central Processing Unit), a RAM 128 (Random Access Memory), and an image processing unit 124. The CPU 127 has a function capable of determining when a machining abnormality occurs. The RAM 128 has a function capable of storing the coordinate position of the scheduled cutting line.

  The main computer 120 is connected to an input unit 125 and a display unit 126. The input unit 125 can input data of various processing conditions used in laser processing. The display unit 126 can display various information at the time of laser processing.

  The laser control unit 121 is connected to the main computer 120 by a buffer 129 via the I / F 131, and can control the output of the laser light source 101, the pulse width, the pulse period, and the like.

  The lens control unit 122 is connected to the main computer 120 by a buffer 129 via the I / F 131. The lens control unit 122 has a built-in position sensor (not shown) that can detect the moving distance. Then, by detecting the output of this position sensor, the Z-axis slide mechanism 104 (see FIG. 2) shown in FIG. 2 can be driven to control the position of the lens 46 as the light condensing element in the Z-axis direction. .

  The stage control unit 123 is connected to the main computer 120 by a buffer 129 via the I / F 131. The stage control unit 123 drives a servo motor (not shown) that moves the X-axis slide unit 110 and the Y-axis slide unit 108 shown in FIG. 2 along the rails 111 and 109 (see FIG. 2), respectively. Can do.

  The image processing unit 124 is connected to the imaging device 112 (see FIG. 2). The image processing unit 124 confirms the position in the Z-axis direction of the lens 46 as the light condensing element based on the image data of the image information acquired by the image capturing device 112, and focuses the lens 46 as the light condensing element. Processing for adjusting the position can be performed. Further, the image processing unit 124 can confirm the position of the planned cutting line on the substrate P and can perform a process of adjusting the position.

  The laser processing apparatus 100 includes a main computer 120 as a control unit that can control the laser control unit 121, the lens control unit 122, the stage control unit 123, and the image processing unit 124.

  FIG. 4 is a view of the lower substrate in the present embodiment, FIGS. (A) to (c) are plan views, and FIG. (D) is cut along the line AA in FIG. It is a schematic sectional drawing, Drawing (e) is a schematic sectional drawing cut along the AA line of Drawing (b), and Drawing (f) is along the AA line of Drawing (c). It is the schematic sectional drawing which cut | disconnected. 5A and 5B are views of the upper substrate in the present embodiment, FIG. 5A is a plan view, and FIG. 5B is a schematic cross-sectional view cut along the line AA in FIG. is there. FIG. 6 is a diagram in which the lower substrate and the upper substrate in the present embodiment are bonded together, FIG. 6A is a schematic cross-sectional view, and FIG. It is a figure which shows the formation process to form, and the figure (c) is a perspective view which shows a division | segmentation piece. FIG. 7 is a flowchart for explaining a manufacturing procedure in which the lower substrate and the upper substrate in the present embodiment are bonded together to form a laminated body, and the laminated body is cut and divided to form divided pieces.

  A manufacturing method of the display device will be described with reference to FIGS.

  In step S1 of FIG. 7, as shown in FIG. 4A, the second wiring pattern 51b is formed on the surface of the lower substrate P2 as the second substrate. A plurality of second wiring patterns 51b are formed on the surface of the lower substrate P2. As shown in FIG. 4D, the second wiring pattern 51b is a thin film, and the material thereof is a conductive metal material such as gold, silver, or copper. The second wiring pattern 51b is formed by a thin film forming method such as a sputtering method or a vacuum evaporation method.

  In step S2 of FIG. 7, the sealing material 4 is drawn as shown in FIG. The sealing material 4 is formed between the second wiring pattern 51b and another adjacent second wiring pattern 51b. A plurality of the sealing materials 4 are formed on the surface of the lower substrate P2. Therefore, the region surrounded by the sealing material 4 is the liquid crystal injection portion 55. As shown in FIG. 4E, the sealing material 4 is a thin film and is a resin film. The sealing material 4 is formed by adopting a printing method such as a screen printing method.

  In step S3 of FIG. 7, the liquid crystal 5 is injected into the liquid crystal injection unit 55 as shown in FIG. As shown in FIG. 4F, the liquid crystal 5 is injected into the liquid crystal injection part 55 surrounded by the sealing material 4, and a plurality of liquid crystals 5 are arranged on the surface of the lower substrate P2. Thus, the lower substrate P2 on which the second wiring pattern 51b and the liquid crystal 5 are arranged is formed.

  In step S11 of FIG. 7, as shown in FIG. 5A, the first wiring pattern 51a is formed on the surface of the upper substrate P1 as the first substrate. A plurality of first wiring patterns 51a are formed on the surface of the upper substrate P1. As shown in FIG. 5B, the first wiring pattern 51a is a thin film, and the material thereof is a metal material having conductivity such as gold, silver, or copper. The first wiring pattern 51a is formed by employing a thin film forming method such as a sputtering method or a vacuum deposition method. Thus, the lower substrate P2 having the first wiring pattern 51a is formed. The first wiring pattern 51a and the second wiring pattern 51b have the same electrical characteristics.

  In step S21 of FIG. 7, as shown in FIG. 6A, an upper substrate P1 as a first substrate and a lower substrate P2 as a second substrate are bonded together to form a stacked body P3. The second wiring pattern 51b formed on the lower substrate P2 and the first wiring pattern 51a formed on the upper substrate P1 face each other and are arranged to face each other so as to be substantially parallel. Here, the liquid crystal 5 injected into the liquid crystal injection unit 55 is sandwiched and held between the lower substrate P2 and the upper substrate P1. Note that a protective film (eg, a PI film) may be formed on the surfaces of the first wiring pattern 51a and the second wiring pattern 51b. In this way, damage to the first wiring pattern 51a and the second wiring pattern 51b due to the stress F when the stacked body P3 is divided into chips, or deterioration in quality due to disconnection or the like can be suppressed. The protective film (eg, PI film) can be removed by a technique such as etching after the stacked body P3 is divided. Further, in the case where an antireflection film is required on either side of the chip for the function of the chip, an antireflection film may be selectively formed before dividing the stacked body P3. The method for forming the antireflection film is not particularly limited, and it may be formed by employing a manufacturing method such as a vacuum deposition method, a sputtering method, or a spin coating method. If it is difficult to form the antireflection film before dividing the multilayer body P3 into chips, the antireflection film may be formed after the multilayer body P3 is divided.

  In step S22 of FIG. 7, as shown in FIG. 6B, internal processing is performed. In this internal processing, the laser beam 45 is condensed by a lens 46 as a condensing element and irradiated to the stacked body P3 to form a material altered portion 47 inside the upper substrate P1 and the lower substrate P2. And the material alteration part 47 is formed in the thickness direction whole region of the laminated body P3. Here, in order not to expose the first wiring pattern 51a and the second wiring pattern 51b with the laser light 45, the laser light 45 is irradiated while avoiding the first wiring pattern 51a and the second wiring pattern 51b. In the figure, the laser beam 45 is shown to be simultaneously irradiated from both the front and back surfaces of the laminate P3. However, in actuality, the upper substrate P1 is irradiated with the laser beam 45, and then the laminate P3 is turned over and the lower substrate P2 is turned over. In this method, the laser beam 45 is irradiated. In order to form the material altered portion 47, internal processing is performed using the laser processing apparatus 100 shown in FIG. 2, and the laser light 45 emitted from the laser light source 101 is a nanosecond laser employing a YAG laser. is there.

  Here, the number of processes for forming the material-affected portion 47 will be compared and examined between the method according to the prior art and the method according to the present embodiment. In the conventional technique in which the first wiring pattern 51a (or the second wiring pattern 51b) is formed on either the upper substrate P1 or the lower substrate P2, when two chips are formed, the chip is processed 12 times. It will be. The breakdown is that the upper substrate P1 is processed seven times in total, four sides in the outer circumferential direction, two sides in the portion of the sealing material 4, and one side between the upper substrate P1 and the lower substrate P2. Next, the lower substrate P2 is processed a total of five times for four sides in the outer peripheral direction and one side between the upper substrate P1 and the lower substrate P2. As a result, when the number of times of processing the upper substrate P1 is seven times and the number of times of processing the lower substrate P2 is five times, a total of twelve times are processed. On the other hand, when two chips are formed by the method according to the present embodiment, it is processed 10 times. The breakdown is that the upper substrate P1 has four sides in the outer circumferential direction and one side in the portion of the sealing material 4, and is processed five times in total. Similarly, in the lower substrate P2, there are four sides in the outer peripheral direction and one side in the portion of the sealing material 4, which is processed five times in total. As a result, when the number of times of processing the upper substrate P1 and the number of times of processing of the lower substrate P2 are combined, the total number of processing is 10 times. Therefore, if the bonding method according to the present embodiment is employed, the number of times of processing can be reduced by two compared to the conventional method (when two chips are formed). As a result, cycle time can be shortened.

  Next, in step S23 of FIG. 7, division is performed as shown in FIG. In this dividing method, stress F is applied to the multilayer body P3 from the upper surface side of the multilayer body P3 (substrate P1). As a method of applying the stress F from the outside of the stacked body P3, for example, bending or shearing stress is applied to the stacked body P3 along a planned cutting line. It is also possible to generate thermal stress by giving a temperature difference to the laminate P3. When a stress F is applied from the outside to the laminated body P3 having the material-modified part 47, the laminated body P3 is broken along the material-modified part 47, and the divided pieces Q can be formed. As shown in the figure, the upper substrate P1 is formed with divided pieces Q having a total of five sides m1 to m5 around the chip. Similarly, divided pieces Q having a total of five sides of n1 to n5 are also formed on the lower substrate P2 around the chip. Then, the display device 10 (see FIG. 8) can be formed by cutting and dividing the stacked body P3 into chips.

According to the manufacturing method of the above embodiment, the following effects are acquired.
(1) An upper substrate P1 as a first substrate and a lower substrate P2 as a second substrate are pasted so that the first wiring pattern 51a and the second wiring pattern 51b are opposed to each other. By forming the stacked body P3 together, it is possible to narrow the number of the material altered portions 47 formed by irradiating the laser beam 45 to the minimum necessary number. As a result, the cycle time can be shortened, which is efficient. Furthermore, since the first wiring pattern 51a and the second wiring pattern 51b are arranged so as to be substantially parallel, the number of arrangements of the first wiring pattern 51a and the second wiring pattern 51b can be increased. Therefore, since the density of arrangement is increased, the material of the stacked body P3 can be saved.
(2) Since the laminated body P3 is irradiated with the laser beam 45 to avoid the arrangement positions of the first wiring pattern 51a and the second wiring pattern 51b, and the material alteration portion 47 is formed, the second generation caused by the irradiation of the laser beam 45 is performed. Since the deterioration of the quality of the first wiring pattern 51a and the second wiring pattern 51b can be suppressed, the display device 10 having a stable quality can be provided.
(3) Since the laser beam 45 is condensed by the lens 46 serving as a condensing element and irradiated onto the stacked body P3, the material altered portion 47 can be easily formed at a predetermined position of the stacked body P3.
(4) When the laminated body P3 is irradiated with a fundamental wave of a titanium sapphire laser or a YAG laser, the fundamental wave of the titanium sapphire laser or the YAG laser has a wavelength having transparency to the laminated body P3. Therefore, the material altered portion 47 can be easily formed at a predetermined position of the stacked body P3.
(5) Since the laminated body P3 can be cut and divided only by applying the stress F to the laminated body P3, the divided pieces Q can be easily formed.

  Next, a liquid crystal panel as a display device according to the present invention will be described.

  FIG. 8 is a schematic view showing the structure of the liquid crystal panel in the present embodiment, FIG. 8A is a schematic plan view, and FIG. 8B is cut along the line AA in FIG. FIG.

  As shown in FIGS. 8A and 8B, the liquid crystal panel 10 includes a TFT substrate 1 having a TFT 3, a counter substrate 2 having a counter electrode 6, and a TFT substrate 1 bonded by a sealing material 4. And a liquid crystal 5 filled in a gap with the substrate 2.

As the TFT substrate 1, a quartz substrate having a thickness of about 1.2 mm is used, and the surface thereof is composed of a pixel electrode (not shown) constituting a pixel and a plurality of transistor elements (not shown). TFT3 is formed. One of the three terminals of the individual transistor elements constituting the TFT 3 is connected to the pixel electrode, and the other two are data lines (in the figure) arranged in a grid in a state of being insulated from each other surrounding the pixel electrode. And a scanning line (not shown). The data line and the scanning line are connected to the drive circuit unit 9 in the terminal unit 1a through the wiring pattern 11. The input side wiring pattern 12 of the drive circuit unit 9 is connected to the mounting terminals 13 arranged in the terminal unit 1a.

  The counter substrate 2 includes a counter substrate body 2 a, a microlens 15, and a cover glass 16. A quartz substrate having a thickness of about 1.1 mm is used as the counter substrate main body 2a, and a microlens surface 2b is formed on a portion of the TFT substrate 1 facing the pixel electrode. The microlens 15 is formed by filling the microlens surface 2b of the counter substrate body 2a with a compatible resin. A quartz substrate having a thickness of about 50 μm is used for the cover glass 16, and is bonded to the counter substrate body 2 a with a compatible resin forming the microlens 15.

  The microlens 15 functions to improve the aperture ratio of the liquid crystal panel 10 and has a one-to-one correspondence with the pixel electrode. The cover glass 16 protects the microlens 15 by covering the entire area of the counter substrate body 2a.

  The counter substrate 2 is provided with a counter electrode 6 as a common electrode. The counter electrode 6 is electrically connected to a wiring pattern (not shown) provided on the TFT substrate 1 side through vertical conduction parts 14 provided at the four corners of the counter substrate 2, and the wiring pattern is also provided in the terminal part 1a. Connected to the mounting terminals 13. Alignment films 7 and 8 are respectively formed on the surface of the TFT substrate 1 facing the liquid crystal 5 and the surface of the counter substrate 2.

  In the liquid crystal panel 10, a relay board (not shown) that is electrically connected to an external drive circuit (not shown) is connected to the mounting terminal 13. When an input signal from the external drive circuit is input to the drive circuit unit 9, the TFT 3 is switched for each pixel electrode, and a drive voltage is applied between the pixel electrode and the counter electrode 6 to perform display. .

  Since the liquid crystal panel 10 is manufactured by the cutting and dividing method of the present invention, the divided pieces Q (see FIG. 6C) can be manufactured efficiently.

  Next, a liquid crystal display device which is an example of the electro-optical device according to the invention will be described.

  FIG. 9 is an exploded perspective view of a liquid crystal display device as an electro-optical device.

  As shown in FIG. 9, the liquid crystal display device 500 includes a multilayer circuit board 30. The liquid crystal display device 500 includes a color display liquid crystal panel 10, a multilayer circuit board 30 connected to the liquid crystal panel 10, a liquid crystal driving IC 300 mounted on the multilayer circuit board 30, and the like. If necessary, an illumination device such as a backlight and other auxiliary devices are attached to the liquid crystal panel 10. The liquid crystal display device 500 has a COF (Chip / On / Film) structure.

  The liquid crystal panel 10 has a pair of TFT substrates 1 and a counter substrate 2 bonded by a sealing material 4, and liquid crystal is formed in a gap (cell gap) formed between the TFT substrate 1 and the counter substrate 2. 5 is sealed, and the sealed liquid crystal 5 is sandwiched between the TFT substrate 1 and the counter substrate 2. The TFT substrate 1 and the counter substrate 2 are generally formed of a translucent material such as quartz, glass, synthetic resin or the like. A polarizing plate 56 is attached to the outer surfaces of the TFT substrate 1 and the counter substrate 2.

  Further, the pixel electrode 66 is formed on the inner surface of the TFT substrate 1, and the counter electrode 6 is formed on the inner surface of the counter substrate 2. The pixel electrode 66 and the counter electrode 6 are formed of a light-transmitting material such as ITO ((Indium / Tin / Oxide): indium tin oxide). The TFT substrate 1 has a projecting portion that projects from the counter substrate 2, and a plurality of mounting terminals 13 are formed on the projecting portion. These mounting terminals 13 are formed simultaneously with the pixel electrode 66 when the pixel electrode 66 is formed on the TFT substrate 1. Accordingly, these mounting terminals 13 are made of, for example, ITO. These mounting terminals 13 include one that extends integrally from the pixel electrode 66 and one that is connected to the counter electrode 6 via a conductive material (not shown).

  On the other hand, wiring patterns 39 a and 39 b are formed on the surface of the multilayer circuit board 30. That is, an input wiring pattern 39a is formed from one short side to the center of the multilayer circuit board 30, and an output wiring pattern 39b is formed from the other short side to the center. Electrode pads (not shown) are formed at the ends of the input wiring pattern 39a and the output wiring pattern 39b on the center side.

  A liquid crystal driving IC 300 is mounted on the surface of the multilayer circuit board 30. Specifically, with respect to a plurality of electrode pads (not shown) formed on the surface of the multilayer circuit board 30, a plurality of bump electrodes formed on the active surface of the liquid crystal driving IC 300 are connected to an ACF (Anisotropic Conductive • (Film: anisotropic conductive film) 160 is connected. The ACF 160 is formed by dispersing a large number of conductive particles in a thermoplastic or thermosetting adhesive resin. As described above, the so-called COF structure is realized by mounting the liquid crystal driving IC 300 on the surface of the multilayer circuit board 30.

  A multilayer circuit board 30 including a liquid crystal driving IC 300 is connected to the TFT substrate 1 of the liquid crystal panel 10. Specifically, the output wiring pattern 39 b of the multilayer circuit board 30 is electrically connected to the mounting terminal 13 of the TFT substrate 1 via the ACF 140. Since the multilayer circuit board 30 has flexibility, space saving can be realized by freely folding it.

  In the liquid crystal display device 500 configured as described above, a signal is input to the liquid crystal driving IC 300 via the input wiring pattern 39 a of the multilayer circuit board 30. Then, a driving signal is output from the liquid crystal driving IC 300 to the liquid crystal panel 10 via the output wiring pattern 39 b of the multilayer circuit board 30. As a result, an image is displayed on the liquid crystal panel 10.

  Since the liquid crystal panel 10 serving as a cheaper display device having good quality is provided, the liquid crystal display device 500 serving as a cheaper electro-optical device having good display quality can be provided.

  Next, an electronic apparatus equipped with a liquid crystal display device as an electro-optical device according to the invention will be described.

  FIG. 10 is a perspective view of a mobile phone as an electronic device.

  As shown in FIG. 10, a mobile phone 2000 as an electronic apparatus according to the present embodiment includes the above-described liquid crystal display device 500 (see FIG. 9) as a display unit. The mobile phone 2000 includes a display unit 2001. As described above, since the mobile phone 2000 as an electronic apparatus according to the present invention can include the liquid crystal display device 500 as an electro-optical device with good production efficiency, the mobile phone 2000 as an electronic apparatus with good production efficiency. Can be provided. Also, the electronic device is not particular about the mobile phone 2000. For example, a portable information device called a printer, a wristwatch, a NOTE-PC, a PDA, an electronic paper, a portable terminal device, a personal computer, a word processor, a digital still camera, It can be suitably used as an image display means for a vehicle-mounted monitor, a monitor direct-view digital video recorder, a car navigation device, an electronic notebook, a workstation, a video phone, a POS terminal, and the like. By doing so, the use of the liquid crystal display device 500 as an electro-optical device is expanded, and various electronic devices can be provided.

  The present invention has been described above with reference to preferred embodiments. However, the present invention is not limited to the above-described embodiments, and includes modifications as described below, as long as the object of the present invention can be achieved. It can be set to any other specific structure and shape.

(Modification)
In the above-described embodiment, the method of irradiating the upper substrate P1 with the laser beam 45, then turning the stacked body P3 over and irradiating the lower substrate P2 with the laser beam 45 is not limited thereto. For example, the laser beam 45 may be irradiated simultaneously (or alternately) from both the front and back surfaces of the laminate P3. In this way, since the material-affected portion 47 can be formed in a short time, the same effect as in the embodiment can be obtained, and the time can be further shortened, which is more efficient.

Explanatory drawing for demonstrating the formation method of the material alteration part as a modified layer by a laser beam. Schematic of the laser processing apparatus in the embodiment. The block diagram of the control system of a laser processing apparatus. It is a figure of a lower substrate, Drawing (a)-(c) is a top view, Drawing (d) is a schematic sectional view cut along an AA line of Drawing (a), (e) is the schematic sectional drawing cut | disconnected along the AA line of FIG. (b), FIG. (f) is the schematic sectional drawing cut | disconnected along the AA line of FIG. (c). It is a figure of an upper board, Drawing (a) is a top view and Drawing (b) is a schematic sectional view cut along an AA line of Drawing (a). It is the figure which bonded the lower board | substrate and the upper board | substrate, a figure (a) is a schematic sectional drawing, and a figure (b) is a figure which shows the formation process in which a laser beam is irradiated and a material alteration part is formed. FIG. 8C is a perspective view showing the divided piece. The flowchart for demonstrating the manufacturing procedure which bonds a lower board | substrate and an upper board | substrate, forms a laminated body, cuts and divides | segments the laminated body, and forms a division | segmentation piece. It is the schematic which shows the structure of the liquid crystal panel as a display apparatus, A figure (a) is a schematic plan view, A figure (b) is a schematic sectional drawing cut | disconnected along the AA line of Fig. (A) . 1 is an exploded perspective view of a liquid crystal display device as an electro-optical device. The perspective view of the mobile telephone as an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal panel as a display apparatus, 45 ... Laser beam, 46 ... Lens as a condensing element, 47 ... Material alteration part as a modification layer, 51a ... 1st wiring pattern, 51b ... 2nd wiring pattern, DESCRIPTION OF SYMBOLS 100 ... Laser processing apparatus, 101 ... 1st laser light source, 102 ... Dichroic mirror as a reflector, 107 ... Stage, 112 ... Imaging apparatus, 120 ... Main computer as a control part, 121 ... Laser control part, 122 ... Lens control , 123... Stage control unit, 500. Liquid crystal display device as electro-optical device, 2000. Mobile phone as electronic device, F. Stress, P... Substrate, P 1. Lower substrate as substrate of P2, P3 ... laminate, Q ... divided piece.

Claims (5)

A manufacturing method for forming a display device by irradiating a laminate with laser light,
Forming a first wiring pattern on a first substrate included in the laminate;
Forming a second wiring pattern on a second substrate disposed at a position facing the first substrate;
Bonding the first substrate and the second substrate to form a laminate;
Irradiating the laminated body with a laser beam to form a material altered portion; and
A step of applying stress to the laminate to form divided pieces,
A method of manufacturing a display device, wherein the first wiring pattern and the second wiring pattern are arranged so as to face each other. In the manufacturing method of the display device according to claim 1,
In the step of forming the material altered portion,
A manufacturing method of a display device, wherein the material alteration portion is formed by irradiating the laminated body with the laser light while avoiding the first wiring pattern and the second wiring pattern. In the manufacturing method of the display device according to claim 1 or 2, The layered product is constituted by material which has permeability to the laser beam,
In the step of forming the material altered portion,
Condensing the laser beam with a condensing element to irradiate the laminate,
A method for manufacturing a display device, comprising forming the material altered portion. In the manufacturing method of the display device according to any one of claims 1 to 3,
In the material altered portion forming step,
The laser beam is either a titanium sapphire laser or a YAG laser,
A method for manufacturing a display device, wherein the material altered portion is formed by irradiating a fundamental wave of the titanium sapphire laser or the YAG laser. In the manufacturing method of the display device according to any one of claims 1 to 4,
In the step of forming the divided pieces,
A method for manufacturing a display device, wherein the divided piece is formed by applying one of a bending stress and a tensile stress to the laminate.

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