JP2007318156A - Transport device of film carrier tape for electronic part mounting, and method of transporting film carrier tape for electronic part mounting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transport device of a film carrier tape for electronic part mounting and a method of transporting the same capable of transporting a film carrier tape for electronic part mounting at a uniform transport speed in a processing device and of capable of uniform processing with a constant resident time of the film carrier tape for electronic part mounting in the processing device and without a change in the degree of processing when it is necessary to transport the film tape carrier for electronic part mounting in the processing device not only in an etching process but also, for example, a plating process etc. <P>SOLUTION: The present invention relates to an etching device of a film carrier tape for electronic part mounting supplied continuously, comprising an etching plate 40 on the top surface of which the film carrier tape for electronic part mounting travels, wherein an ejection hole 44 for ejecting a lubrication liquid onto the traveling surface side of the etching plate 40 of the film carrier tape for electronic part mounting is formed in the etching plate 40. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention is a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, CSP (Chip Size Package) tape, ASIC (Application Specific Integrated Circuit) tape, etc.)) Below, simply “
It is called “film carrier tape for mounting electronic components”. ) And a method for transporting a film carrier tape for mounting electronic components.

With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) is increasing rapidly. Higher functionality is required, and recently, mounting methods using TAB tape, T-BGA tape, ASIC tape, etc. have been adopted as mounting methods for these electronic components.
In particular, the importance is increasing in the electronic industry using a liquid crystal display element (LCD) such as a personal computer, for which high definition, thinning, and narrowing of the frame area of a liquid crystal screen are desired.

Conventionally, in such a film carrier tape for mounting electronic components, for example, as a method of manufacturing a TAB tape, it has been manufactured through the following process.
That is, first, an insulating film serving as a base material such as a polyimide film is subjected to pattern punching with a press, and then a copper foil is attached to the insulating film by thermocompression bonding with an adhesive. Then, a photoresist is applied on the entire upper surface of the copper foil, the photoresist is exposed to a desired pattern shape with ultraviolet rays using a photoresist mask, and the exposed photoresist portion is dissolved with a developer. Remove. The copper foil portion not covered with this photoresist is removed by chemically dissolving (etching) with an acid which is an etching solution, and remaining on the insulating film by dissolving and removing the photoresist with an alkaline solution. A desired wiring pattern is formed from the copper foil.

  And, inner leads and liquid crystal display elements that are connected to devices such as ICs (electronic components) in the wiring pattern to prevent short circuits due to dust, whiskers, and migration during mounting, and to protect and insulate wiring. Solder resist, which is an insulating resin, is applied through a screen on which a coating pattern is formed by a screen printing method using a squeegee, and then dried and cured, except for lead portions such as outer leads connected to the solder. A resist coating layer is formed.

  Thereafter, in order to prevent oxidation and discoloration of the exposed lead portion and to secure adhesive strength with a connection portion such as a bump of a device connected to the lead portion, the lead portion is, for example, tin-plated, gold-plated, tin- It is manufactured by applying eutectic alloy plating of lead.

By the way, in the manufacture of such a TAB tape, in the above etching process, an etching process is conventionally performed by a method as shown in FIG.
That is, the TAB tape film T with the copper foil portion not covered with the photoresist exposed on the surface is continuously fed into the etching processing apparatus 110.
In this etching processing apparatus 110, as shown in FIG. 9, a plurality of etching solution discharge nozzles 122 (124) are arranged above the film T in the feeding direction of the film T at a predetermined interval. Etching solution discharge nozzles 122 (124) are arranged in two rows in parallel with the film T feeding direction.

The etching liquid E is discharged from the etching liquid discharge nozzles 122 (124) onto the upper surface of the film. And the copper foil part which is not covered with a photoresist is removed by an etching, and a wiring pattern is formed with the copper foil which remained on the insulating film.
However, in this case, the film T fed into the etching processing apparatus 110 is conveyed on the etching plate 114 disposed in the etching processing apparatus 110, and at the same time, an etching solution discharge nozzle 122 ( The discharge pressure of the etching solution E from 124) is applied downward.

Therefore, in order to improve the etching effect, when the discharge pressure of the etching solution E is increased to some extent, the film T is strongly pressed onto the etching plate 114, and the film T in the etching processing apparatus 110 is pressed. The conveyance cannot be performed smoothly.
Therefore, the transport speed of the film T in the etching processing apparatus 110 becomes non-uniform, that is, the residence time becomes non-uniform and non-uniform, the degree of etching changes, and the lead line width becomes non-uniform. . In addition, depending on the degree of etching, the wiring pattern is eroded too much by the plating solution, the line width becomes too narrow, or it breaks, causing mechanical strength to drop and causing poor contact, etc. The quality of the tape will be degraded. Such a phenomenon has a great influence on a TAB tape in which the lead line width is fine pitch.

In addition, if the line width finish is not uniform, the leads will come into contact with each other, causing a short circuit or changing the current-carrying characteristics, which will affect the electrical characteristics and reduce the mechanical strength of the wiring pattern. As a result, the quality of the TAB tape is adversely affected.
Furthermore, when the film T is strongly pressed onto the etching plate 114, the leads are bent, which causes a decrease in mechanical strength and causes a contact failure.

  Therefore, the object of the present invention is not only in the etching process, but also in the processing apparatus when it is necessary to transport the film carrier tape for mounting electronic components in the processing apparatus, for example, in the plating process. The film carrier tape for mounting electronic components can be transported at a uniform transport speed, the residence time of the film carrier tape for mounting electronic components in the processing equipment is constant, and uniform processing is possible without changing the degree of processing. An object of the present invention is to provide a transport device for a film carrier tape for mounting electronic components and a transport method for a film carrier tape for mounting electronic components.

The present invention has been made in order to achieve the above-described problems and objects in the prior art, and the electronic component mounting film carrier tape transport device of the present invention is a continuously supplied electronic component. An electronic component mounting film carrier tape transport device for transporting a mounting film carrier tape,
The electronic component mounting film carrier tape comprises a transport plate that runs on the upper surface,
The ejection plate for ejecting the lubricating liquid is formed in the transport plate on the traveling surface side of the transport plate of the electronic component mounting film carrier tape.

Furthermore, the transport method of the film carrier tape for mounting electronic components of the present invention is a transport method of the film carrier tape for mounting electronic components for transporting the continuously supplied film carrier tape for mounting electronic components,
The film carrier tape for mounting electronic components is ejected from the transport plate on which the film carrier tape for mounting electronic components travels on the upper surface to the running surface side of the etching plate of the film carrier tape for mounting electronic components, It is made to run.

  In this way, while the lubricating liquid is ejected from the ejection hole of the transport plate to the travel surface side of the transport plate of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is traveled to perform various processes. Since the sprayed lubricating liquid expands in a film shape between the upper surface of the transport plate and the traveling surface side of the transport plate of the film carrier tape for mounting electronic components, it functions as a lubricating oil. Become.

  Therefore, the film carrier tape for mounting electronic components in various processing apparatuses can be smoothly transported, the transport speed is uniform, the residence time is constant, and as a result, the degree of various processing is constant and uniform processing is possible. Is possible.

  According to the present invention, the film carrier tape for mounting an electronic component is caused to travel while the lubricating liquid is jetted from the ejection hole of the etching plate to the traveling surface side of the etching carrier of the film carrier tape for mounting an electronic component, thereby performing an etching process. Therefore, the jetted lubricating liquid expands in a film shape between the upper surface of the etching plate and the traveling surface side of the etching plate of the electronic component mounting film carrier tape, and functions as a lubricating oil.

Therefore, the film carrier tape for mounting electronic components in the etching processing apparatus can be smoothly conveyed, the conveyance speed is uniform, the residence time is constant, and as a result, the degree of etching is constant and uniform etching is possible. The line width of the lead becomes uniform.
As a result, the finish of the line width becomes uniform, so that the quality of the film carrier tape for mounting electronic components can be greatly improved without lowering the mechanical strength of the wiring pattern and causing poor contact. .

  Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings. 1 is a front view of an etching apparatus for a film carrier tape for mounting electronic components according to the present invention, FIG. 2 is an end view taken along line II-II in FIG. 1, and FIG. 3 is a film carrier for mounting electronic components in FIG. FIG. 4 is a top view of the etching plate member of the etching apparatus for film carrier tape for mounting electronic components of the present invention, FIG. 5 is a side view of the etching plate member of FIG. 4, and FIG. 4 is a sectional view taken along line IV-IV of the etching plate member in FIG. 4, FIG. 7 is an enlarged view of part A in FIG. 5, and FIG. 8 is a diagram for explaining the operation of the etching apparatus for film carrier tape for mounting electronic components according to the present invention. FIG.

  As shown in the schematic diagram of FIG. 8, the film carrier tape etching apparatus 10 of the present invention (hereinafter simply referred to as “etching apparatus”) of the present invention uses a photoresist mask as a photoresist mask in advance. Film carrier tape for mounting electronic components in which a desired pattern shape is exposed to ultraviolet light, and the exposed photoresist portion is dissolved and removed with a developer to expose a copper foil portion not covered with the photoresist. As, for example, a delivery roll 12 around which a film T for TAB tape is wound is provided.

Then, the film T is continuously fed from the feed roll 12 to the etching processing chamber 14 of the etching apparatus 10, and the copper foil portion not covered with the photoresist is etched in the etching processing chamber 14. A wiring pattern is formed by the copper foil removed by (acid) and remaining on the insulating film.
Then, the film T that has passed through the etching processing chamber 14 (hereinafter referred to as “chamber 14”) of the etching apparatus 10 is dissolved and removed of the photoresist with an alkali solution, formed of a solder resist layer, A TAB tape is finally produced by performing eutectic alloy plating or the like.

As shown in FIGS. 1 to 3 and FIG. 8, an etching solution discharge device 16 is disposed above the film T in the etching processing chamber 14 of the etching device 10.
As shown in FIGS. 1 to 3, the etchant discharge device 16 is provided with an etchant transport pipe 18 that is spaced apart by a certain distance in the width direction of the film extending in the film T feed direction. A plurality of etchant discharge nozzles 22 are arranged in these etchant transport pipes 18 at regular intervals in the film T feeding direction.

  As shown in FIG. 8, the etchant transport pipe 18 is supplied with an etchant from the etchant storage tank 26 via the pump P and via the etchant supply pipe 28 at a constant pressure. The etching liquid E is configured to be discharged from the discharge nozzle 22 onto the upper surface T1 of the film T passing through the etching processing chamber 14 at a constant discharge pressure.

Further, the etching solution E discharged from the etching solution discharge nozzle 22 onto the upper surface of the film T appropriately passes through a recovery device 30 (not shown) from the etching processing chamber 14 through the recovery pipe 30 and then is again stored in the etching solution storage tank 26. It is designed to be recycled.
Further, as shown in FIGS. 1 to 3, the chamber 14 is provided with two rows of etching plates 40 parallel to each other in the longitudinal direction of the chamber 14. The film T is configured to travel.
In this case, the discharge pressure of the etching solution E from the etching solution discharge nozzle 22 disposed in the upper portion of the chamber 14 is applied downward to the film T fed into the chamber 14.

  Accordingly, in order to improve the etching effect, when the discharge pressure of the etching solution E is increased to some extent, the film T is strongly pressed against the etching plate 40, and the film T is smoothly conveyed in the chamber 14. It will be impossible to do. Therefore, the transport speed of the film T in the chamber 14 becomes non-uniform, that is, the residence time becomes non-uniform, non-uniform, the degree of etching changes, and the lead line width becomes non-uniform.

For this reason, in the etching processing apparatus 10 of the present invention, as shown in FIGS. 4 to 6, the lubricating liquid, that is, the etching liquid E ′ is ejected to the etching plate member 42 of the etching plate 40 as shown in FIGS. In order to achieve this, a nozzle hole 44 that functions as a nozzle is formed.
Further, as shown in FIGS. 4 to 6, the etching plate member 42 is provided with a hollow portion 46 therein. As shown in FIG. 8, the etching plate member 42 is supplied from the etching solution storage tank 26 via the pump P. Thus, the etching solution is supplied into the cavity 46 through the etching solution supply pipe 34 at a constant pressure.

Then, the etching solution E ′ supplied into the cavity 46 is ejected from the ejection hole 44 to the traveling surface side of the etching plate of the film T that passes through the chamber 14 and travels on the upper surface of the etching plate member 42. It is configured to be ejected by pressure.
Further, as shown in FIG. 7, both end portions of the etching plate member 42 are formed with tapered portions 45, so that friction at the end portions and damage to the film can be prevented so that the film T can run smoothly. It is like that.

  In this way, the etching process is carried out by running the film T while jetting the etching liquid E ′ from the jetting hole 44 of the etching plate member 42 to the running surface side T2 of the etching plate of the film T. The liquid E ′ expands in a film shape between the etching plate upper surface 43 and the traveling surface side T2 of the etching plate of the film T and functions as a lubricating oil.

Therefore, the film T can be smoothly transported in the etching processing apparatus, that is, in the chamber 14, the transport speed is uniform, the residence time is constant, and as a result, the etching degree is constant and uniform etching is possible. The line width of the lead becomes uniform.
As a result, the finish of the line width becomes uniform, so that there is no adverse effect on various electrical characteristics such as a short circuit due to contact between the leads and a change in the energization characteristics, and the mechanical properties of the wiring pattern. The quality of the TAB tape can be greatly improved without lowering the strength and causing poor contact.

  In this case, as shown in FIGS. 4 to 6, the ejection holes 44 are formed from a plurality of ejection holes 44 that are spaced apart from each other in the lateral direction of the etching plate member 42, that is, in the width direction of the TAB tape. These ejection holes 44 are also formed from a plurality of ejection holes 44 spaced apart from each other in the longitudinal direction of the etching plate member 42 and the longitudinal direction of the TAB tape. In the drawing, for convenience of explanation, only the ejection holes 44 at both ends of the etching plate member 42 are shown.

As a result, the etching liquid E ′ is ejected over the width direction of the film T, and therefore the etching liquid E ′ that functions as a lubricating liquid spreads in a film shape over the width direction and the longitudinal direction of the film T. The lubrication effect is further improved.
In this case, it is appropriate that the diameter of the ejection hole 44 is 0.2 to 1.5 mmφ, and the ejection pressure is set in a range of 1 to ³ kgf / cm ² and an ejection amount of 5 to 15 l / min. That's fine.

  Further, as the separation distance L in the lateral direction of the etching plate member 42 of the ejection holes 44, that is, in the width direction of the TAB tape, the effect that the etching solution E ′ spreads uniformly in the width direction of the TAB tape is considered. In this case, it is desirable that the thickness is 5 to 15 mm. Further, as the separation distance M in the longitudinal direction of the etching plate member 42 and the longitudinal direction of the TAB tape in the ejection holes 44, the effect of the etching solution E ′ spreading uniformly in a film shape in the longitudinal direction of the TAB tape is taken into consideration. 5 to 15 mm is desirable.

Further, as a ratio of the discharge pressure of the etching liquid E from the etching liquid discharge nozzle 22 and the jet pressure at which the etchant E ′ is jetted from the jet holes 44 to the running surface side of the etching plate of the film T, the film T is etched. In order to prevent the leads from being bent by being strongly pressed onto the plate 40, the ratio may be 1: 1.
Further, as the feeding speed of the film T, the jetted etching liquid E ′ expands in a film shape between the etching plate upper surface 43 and the traveling surface side T2 of the etching plate of the film T and functions as a lubricating oil. For this purpose, it is desirable to set the speed at 1 to 5 m / min.

The preferred embodiment of the present invention has been described above. However, the present invention is not limited to this. For example, although the ejection hole is provided on the etching plate member 42, a slit or the like is used instead of the ejection hole. It is possible to adopt various shapes.
Moreover, in the said Example, although etching liquid was used as a liquid for lubrication, water and other liquids can also be used.

  Furthermore, the present invention is not limited to an etching process, but for example, when a film carrier tape for mounting an electronic component needs to be transported in a processing apparatus in a plating process, etc. Various modifications can be made without departing from the object of the present invention, such as use of a film carrier tape for transporting at a uniform transport speed.

FIG. 1 is a front view of an etching apparatus for a film carrier tape for mounting electronic components according to the present invention. FIG. 2 is an end view taken along line II-II in FIG. 3 is a top view of the etching device for the film carrier tape for mounting electronic components in FIG. FIG. 4 is a top view of an etching plate member of an etching apparatus for a film carrier tape for mounting electronic components according to the present invention. FIG. 5 is a side view of the etching plate member of FIG. 6 is a cross-sectional view taken along line IV-IV of the etching plate member of FIG. FIG. 7 is an enlarged view of a portion A in FIG. FIG. 8 is a schematic view for explaining the operation of the etching apparatus for the film carrier tape for mounting electronic components according to the present invention. FIG. 9 is a schematic view of a conventional TAB tape etching apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Etching processing apparatus 12 Roll 14 Etching process chamber 16 Etching liquid discharge apparatus 18 Etching liquid transport pipe 22 Etching liquid discharge nozzle 26 Etching liquid storage tank 28 Etching liquid supply pipe 30 Recovery pipe 34 Etching liquid supply pipe 40 Etching plate 42 Etching plate member 43 etching plate upper surface 44 ejection hole 45 taper part 46 cavity part

Claims (4)

An electronic component mounting film carrier tape transport device for transporting continuously supplied electronic component mounting film carrier tape,
The electronic component mounting film carrier tape comprises a transport plate that runs on the upper surface,
An apparatus for transporting a film carrier tape for mounting electronic components, wherein ejection holes for ejecting a lubricating liquid are formed in the transport plate on a running surface side of the transport plate for transporting the film carrier tape for mounting electronic components.   2. The transport of the film carrier tape for mounting electronic components according to claim 1, wherein the ejection holes are formed from a plurality of ejection holes spaced apart from each other across the width direction of the film carrier tape for mounting electronic components. apparatus.   3. The electronic component mounting according to claim 1, wherein the ejection holes are formed from a plurality of ejection holes spaced apart from each other over a longitudinal direction of a film carrier tape for mounting electronic components. Film carrier tape transport device. An electronic component mounting film carrier tape transport method for transporting continuously supplied electronic component mounting film carrier tape,
The film carrier tape for mounting electronic components is ejected from the transport plate on which the film carrier tape for mounting electronic components travels on the upper surface to the running surface side of the etching plate of the film carrier tape for mounting electronic components, A method for transporting a film carrier tape for mounting an electronic component, wherein the film carrier tape is run.

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