JP2007318109A5 - - Google Patents

Download PDF

Info

Publication number
JP2007318109A5
JP2007318109A5 JP2007115524A JP2007115524A JP2007318109A5 JP 2007318109 A5 JP2007318109 A5 JP 2007318109A5 JP 2007115524 A JP2007115524 A JP 2007115524A JP 2007115524 A JP2007115524 A JP 2007115524A JP 2007318109 A5 JP2007318109 A5 JP 2007318109A5
Authority
JP
Japan
Prior art keywords
region
isolation region
element isolation
layer
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007115524A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007318109A (ja
JP5271504B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007115524A priority Critical patent/JP5271504B2/ja
Priority claimed from JP2007115524A external-priority patent/JP5271504B2/ja
Publication of JP2007318109A publication Critical patent/JP2007318109A/ja
Publication of JP2007318109A5 publication Critical patent/JP2007318109A5/ja
Application granted granted Critical
Publication of JP5271504B2 publication Critical patent/JP5271504B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007115524A 2006-04-28 2007-04-25 半導体装置の作製方法 Expired - Fee Related JP5271504B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007115524A JP5271504B2 (ja) 2006-04-28 2007-04-25 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006126993 2006-04-28
JP2006126993 2006-04-28
JP2007115524A JP5271504B2 (ja) 2006-04-28 2007-04-25 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007318109A JP2007318109A (ja) 2007-12-06
JP2007318109A5 true JP2007318109A5 (enExample) 2010-06-17
JP5271504B2 JP5271504B2 (ja) 2013-08-21

Family

ID=38851656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007115524A Expired - Fee Related JP5271504B2 (ja) 2006-04-28 2007-04-25 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5271504B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102153034B1 (ko) * 2009-12-04 2020-09-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN105789321B (zh) * 2010-03-26 2019-08-20 株式会社半导体能源研究所 半导体装置的制造方法
KR20130102581A (ko) 2010-09-03 2013-09-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전계 효과 트랜지스터 및 반도체 장치의 제조 방법
TWI567985B (zh) * 2011-10-21 2017-01-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
CN103077948B (zh) * 2011-10-25 2015-09-30 旺宏电子股份有限公司 记忆体结构及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0715770A1 (en) * 1993-09-03 1996-06-12 National Semiconductor Corporation Planar isolation method for use in fabrication of microelectronics
JPH0832072A (ja) * 1994-07-13 1996-02-02 Fuji Xerox Co Ltd 半導体装置
JPH1187545A (ja) * 1997-07-08 1999-03-30 Sony Corp 半導体不揮発性記憶装置およびその製造方法

Similar Documents

Publication Publication Date Title
JP2009231824A5 (ja) 半導体装置
DE602008003796D1 (de) Tors mit einem oxidhalbleiter
TWI256072B (en) Semiconductor integrated circuits with stacked node contact structures and methods of fabricating such devices
JP2009033145A5 (enExample)
JP2010258442A5 (ja) 溝の形成方法、および電界効果トランジスタの製造方法
JP2012151460A5 (ja) 半導体装置
JP2009088134A5 (ja) 半導体装置
JP2017199901A5 (ja) 半導体装置
JP2011054949A5 (ja) 半導体装置
JP2011119675A5 (enExample)
JP2003347543A5 (enExample)
JP2010157702A5 (ja) 半導体装置
JP2009157354A5 (enExample)
JP2009283496A5 (enExample)
JP2006313906A5 (enExample)
JP2015126085A5 (enExample)
JP2010219511A5 (ja) 半導体装置
TW200629526A (en) Semiconductor device
JP2013211538A5 (enExample)
JP2006303459A5 (enExample)
TW200715566A (en) Display device and method of manufacturing the same
TW200742141A (en) Organic transistor and method for manufacturing the same
JP2010219515A5 (enExample)
TW200734780A (en) Display device and manufacturing method therefor
JP2007318109A5 (enExample)