JP2007294913A5 - - Google Patents
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- Publication number
- JP2007294913A5 JP2007294913A5 JP2007074389A JP2007074389A JP2007294913A5 JP 2007294913 A5 JP2007294913 A5 JP 2007294913A5 JP 2007074389 A JP2007074389 A JP 2007074389A JP 2007074389 A JP2007074389 A JP 2007074389A JP 2007294913 A5 JP2007294913 A5 JP 2007294913A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- island
- semiconductor film
- shaped semiconductor
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 42
- 229910021332 silicide Inorganic materials 0.000 claims 24
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 24
- 230000015572 biosynthetic process Effects 0.000 claims 14
- 239000011229 interlayer Substances 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000010936 titanium Substances 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007074389A JP5132169B2 (ja) | 2006-03-31 | 2007-03-22 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006100263 | 2006-03-31 | ||
| JP2006100263 | 2006-03-31 | ||
| JP2007074389A JP5132169B2 (ja) | 2006-03-31 | 2007-03-22 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007294913A JP2007294913A (ja) | 2007-11-08 |
| JP2007294913A5 true JP2007294913A5 (enExample) | 2010-03-25 |
| JP5132169B2 JP5132169B2 (ja) | 2013-01-30 |
Family
ID=38765166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007074389A Expired - Fee Related JP5132169B2 (ja) | 2006-03-31 | 2007-03-22 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5132169B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101453829B1 (ko) * | 2007-03-23 | 2014-10-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그 제조 방법 |
| US8047442B2 (en) * | 2007-12-03 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2009212504A (ja) * | 2008-02-08 | 2009-09-17 | Advanced Lcd Technologies Development Center Co Ltd | 薄膜半導体装置およびその製造方法 |
| US7982272B2 (en) * | 2008-03-26 | 2011-07-19 | Advanced Lcd Technologies Development Center Co., Ltd. | Thin-film semiconductor device and method for manufacturing the same |
| US20110024764A1 (en) * | 2008-03-31 | 2011-02-03 | Tomohiro Kimura | Semiconductor device, method for producing the same, and display device |
| WO2012090799A1 (en) * | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US9653614B2 (en) * | 2012-01-23 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2014130922A (ja) | 2012-12-28 | 2014-07-10 | Toshiba Corp | 半導体装置及びその製造方法 |
| US9324820B1 (en) * | 2014-10-28 | 2016-04-26 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for forming semiconductor structure with metallic layer over source/drain structure |
| US11817485B2 (en) | 2020-06-23 | 2023-11-14 | Taiwan Semiconductor Manufacturing Company Limited | Self-aligned active regions and passivation layer and methods of making the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195789A (ja) * | 1997-10-27 | 1999-07-21 | Sony Corp | 半導体装置およびその製造方法 |
-
2007
- 2007-03-22 JP JP2007074389A patent/JP5132169B2/ja not_active Expired - Fee Related
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