JP2007288652A - High-frequency transmission line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a high-frequency transmission line applicable to a higher frequency, enabling a highly reliable junction of a substrate in the structure which avoids wet spreading of soldering while junctioning the substrate. <P>SOLUTION: The high-frequency transmission line comprises: a substrate 20; an engraved area 30 formed at least in one surface of the substrate 20; a first signal line conductor 41 formed in the bottom of the engraved area 30; a first ground conductor 32a formed in a first side face of the engraved area 30 substantially parallel to the extending direction of the first signal line conductor 41; and a second ground conductor 32b formed in a second side face of the engraved area 30 substantially parallel to the extending direction of the first signal line conductor 41. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a high-frequency transmission line having low loss and high reliability.

  In the conventional silicon substrate stacked high-frequency package structure, the coplanar lines formed on the front and back surfaces of the silicon substrate are connected by VIA holes formed in the silicon substrate, and a part of this coplanar line is formed on the surface of another silicon substrate. By connecting the coplanar lines using bumps or the like, transmission of a high-frequency signal in the direction perpendicular to the substrate when the silicon substrates are stacked has been realized (for example, see Non-Patent Document 1).

  Also, a method has been proposed in which a cavity with a slope is provided on the back surface of the silicon substrate and a coplanar line is formed on the bottom surface and the slope portion of the cavity, thereby shortening the length of the VIA hole and obtaining good high frequency characteristics (for example, , See Patent Document 1).

A. Margomenos1, et al, “Ultra-Wideband Three Dimensional Transitions for On-Wafer Packages”, 2004 34th European Microwave Conference pp. 645-648 US Patent No. 6696645 (Fig-7, Fig-8)

  However, in the conventional silicon substrate laminated high frequency package structure, when a coplanar line formed on one silicon substrate and a coplanar line formed on the other silicon substrate are connected using high-fluidity solder bumps, two silicon Since the solder bumps are sandwiched between the board surfaces, the pressed-off direction of the pressed solder bumps is only parallel to the board surface. There is. Therefore, the distance between the signal line conductor bump and the ground bump needs to be a certain distance or more.

  On the other hand, when transmitting high-frequency signals, if the distance between the ground bumps formed on both sides of the signal line conductor bumps is about half or more of the wavelength, it is unnecessary in addition to the coplanar line mode that is originally intended to be transmitted. Therefore, it is desirable that the gap between the ground bumps is as narrow as possible. For this reason, for example, when transmitting a signal having a relatively high frequency such as a millimeter wave, in order to avoid short-circuit between the bumps, the distance between the ground bumps separated by a certain distance or more is a distance of 1/2 or more of the wavelength. There is a problem that good high-frequency signals cannot be transmitted.

  The present invention has been made to solve the above-described problems, and has a structure capable of avoiding the spread of solder during board bonding, and can achieve high-reliability bonding and can be applied to higher frequencies. The purpose is to realize a transmission line.

  The high-frequency transmission line according to the present invention includes a substrate, a digging portion formed on at least one surface of the substrate, a first signal line conductor formed on a bottom surface of the digging portion, and the first signal line. A first ground conductor formed on the first side surface of the digging portion that is substantially parallel to the extending direction of the conductor, and a second of the digging portion that is substantially parallel to the extending direction of the first signal line conductor. And a second ground conductor formed on the side surface.

  In addition, a high-frequency transmission line according to another invention includes a first substrate, a digging portion formed on a first surface of the first substrate, and a bottom surface of the digging portion or being integrated with the bottom surface. Formed on the first side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor, and the first signal line conductor formed on the bottom surface of the digging portion. The first ground conductor, the second ground conductor formed on the second side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor, the first ground conductor and the electric And a third ground conductor formed on the first surface of the first substrate and electrically connected to the second ground conductor, and the first surface of the first substrate. The fourth ground conductor formed on the first signal line conductor and electrically connected to the first signal line conductor And a second signal line conductor provided on a part or the entire surface of the protrusion, a second substrate, and a first surface of the second substrate facing the first surface of the first substrate. A third signal line conductor formed on one surface and a fifth ground conductor formed on the first surface of the second substrate so as to be substantially parallel to the extending direction of the third signal line conductor. A sixth ground conductor formed on the first surface of the second substrate so as to be substantially parallel to the extending direction of the third signal line conductor; the second signal line conductor; A first connection conductor that electrically connects three signal line conductors, a second connection conductor that electrically connects the third ground conductor and the fifth ground conductor, and the fourth connection conductor. A ground conductor and a third connection conductor for electrically connecting the sixth ground conductor are provided.

  According to the present invention, it is possible to realize a highly reliable joining and to realize a high-frequency transmission line applicable to a higher frequency by a structure that can avoid the wetting and spreading of the solder during board joining.

Embodiment 1 FIG.
1 and 2 are views showing the structure of a high-frequency transmission line according to Embodiment 1 of the present invention. FIG. 1 is a perspective view, and FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. . In the figure, a signal line conductor 11 and ground conductors 12a and 12b are provided on the surface of the lower substrate 10, and a coplanar line is formed by the signal line conductor 11 and the ground conductors 12a and 12b. In FIG. 1, the ground conductors 12a and 12b are not electrically connected, but may have electrical connection on the lower substrate surface. Further, the upper substrate 20 is provided with a digging portion 30, and ground conductors 32 a and 32 b are provided on the side surfaces of the digging portion 30. Here again, the ground conductors 32 a and 32 b may be electrically connected via the bottom surface of the digging portion 30. On the lower surface of the upper substrate 20, a ground conductor 22a in contact with the ground conductor 32a formed on the side surface of the digging portion 30 and a ground conductor 22b in contact with the ground conductor 32b formed on the side surface of the digging portion 30 are provided. Yes.

  The digging portion 30 is provided with a protruding portion 33 formed by leaving a part of the substrate, and a signal line conductor pattern 31 is provided on the surface of the protruding portion 33. In addition, a signal line conductor 41 formed so as to be substantially parallel to the ground conductors 32 a and 32 b formed on the side surface of the digging portion 30 is provided on the bottom surface of the digging portion 30. In the upper substrate 20, high-frequency transmission lines are formed by the signal line conductors 31 and 41 and the ground conductors 22a, 22b, 32a, and 32b.

  In FIG. 1, the ground conductors 12 a and 12 b are not electrically connected, but may be electrically connected on the surface of the lower substrate 10. Moreover, although the high-frequency transmission line in which the signal line conductors 11 and 41 are extended in the same direction is shown, the present invention is not limited to this, and the extending directions of the signal line conductors 11 and 41 may be different. Furthermore, any dielectric substrate or semiconductor substrate may be used for the upper substrate 20 and the lower substrate 10, and representative examples include a silicon substrate, a ceramic substrate, and a resin substrate.

  1 can be realized by using a wet etching method or a dry etching method such as reactive ion etching when a silicon-based substrate is used as the upper substrate 20, for example. Further, when the upper substrate 20 uses a plastic material, it can be realized by injection molding using a mold. The manufacturing method of the digging part 30 and the protrusion part 33 is not restricted to the said example, What kind of method may be employ | adopted if the same shape can be manufactured.

  FIG. 3 shows a cross-sectional view of a state in which the lower substrate 10 and the upper substrate 20 shown in FIG. As shown in FIG. 3, the signal line conductor 11 provided on the lower substrate 10 and the signal line conductor 31 provided on the upper substrate 20 are electrically connected via a solder 23. Further, although not shown, the ground conductor 12a and the ground conductor 22a shown in FIG. 1 can be electrically connected using a connecting solder, and similarly, the ground conductor 12b and the ground conductor 22b are connected. Electrical connection can be made using solder.

  With the above configuration, the transmission line constituted by the signal line conductor 41 and the ground conductors 32a and 32b has the ground conductors 32a and 32b extending in the depth direction of the digging portion 30. The current distribution concentrated on the end of the ground conductor in the coplanar line can be relaxed, and the conductor loss in the transmission line can be reduced. Furthermore, since the electric field distribution can be concentrated in the dug 30 compared to the conventional coplanar line, a transmission line that is less susceptible to the dielectric loss of the substrate 20 can be obtained, and a transmission line with lower loss can be realized. can do.

  In addition, the high-frequency signal propagation path in the substrate thickness direction in the upper substrate 20 has a highly continuous transmission line shape similar to the strip line shape constituted by the signal line conductors 31 and 41 and the ground conductors 32a and 32b. Propagation of high-frequency signals in the substrate thickness direction can be performed satisfactorily. Furthermore, since the digging portion 30 is provided, the propagation path in the substrate thickness direction of the upper substrate 20 is hardly affected by the dielectric loss of the substrate, so that a transmission line with lower loss can be realized.

  Further, by providing the ground conductor 22a on the lower surface of the upper substrate 20, the surface facing the ground conductor 12a provided on the surface of the lower substrate 10 can be widened. The electrical connection between the ground conductor 32a formed on the side surface of the portion 30 and the ground conductor 12a can be easily realized through the ground conductor 22a and the connecting solder. Similarly, by providing the ground conductor 22b, the electrical connection between the ground conductor 32b and the ground conductor 12b can be easily realized through the ground conductor 22b and connecting solder.

  In addition, with the above configuration, when the upper substrate 10 and the lower substrate 20 are connected by solder, the signal line conductor connecting solder 23 is formed along the signal line conductor 31 formed on the surface of the protrusion 33. Since it can be made to flow in the substrate thickness direction, wetting and spreading of the solder 23 in the substrate surface direction can be avoided. Therefore, a short circuit between the signal line conductor connection solder and the ground connection solder, or a short circuit between the signal line conductor connection solder and the ground conductor pattern, which has been a problem in the prior art for connecting the coplanar lines formed on the substrate surface. As a result, the interval W between the ground conductors 32a and 32b shown in FIG. 1 can be reduced.

  In the high-frequency transmission line as shown in FIG. 1, in addition to the coplanar line mode, which is the basic mode, various higher-order modes are generated. Each higher-order mode has its own cutoff frequency. At a frequency lower than the off-frequency, the higher-order mode itself is generated. However, when propagating in the line traveling direction, it attenuates exponentially, so that it does not significantly affect the transmission in the coplanar line mode. On the other hand, when transmitting a signal with a frequency higher than the cut-off frequency for the higher-order mode, this higher-order mode becomes a propagation mode, and the influence of this higher-order mode appears remarkably, and transmission in the coplanar line mode, which is the main transmission mode. There is a problem that characteristics deteriorate.

  In FIG. 1, when the interval W between the ground conductors 32a and 32b becomes ½ or more of the wavelength corresponding to the frequency of the input high-frequency signal, the higher-order mode occurs, so the interval W between the ground conductors 32a and 32b. A large value means that the upper limit frequency at which a high-frequency signal can be satisfactorily transmitted is low. As described above, in the configuration as shown in FIG. 1, it is possible to prevent the solder from spreading when the lower substrate 10 and the upper substrate 20 are joined, and to reduce the interval W between the ground conductors 32a and 32b. Therefore, it is possible to suppress the propagation of the higher-order mode up to a higher frequency and to transmit a good high-frequency signal.

  As described above, in the high-frequency transmission line structure according to the first embodiment, it is a structure that can avoid the wetting and spreading of the solder when the upper substrate 20 and the lower substrate 10 are joined together, and can realize highly reliable joining. Thus, a high-frequency transmission line applicable to higher frequencies can be realized.

Embodiment 2. FIG.
4 and 5 are views showing the structure of a high-frequency transmission line according to Embodiment 2 of the present invention, FIG. 4 is a perspective view, and FIG. 5 is a cross-sectional view taken along the line BB ′ in FIG. . In the configuration of the second embodiment shown in FIGS. 4 and 5, the signal line conductor 61 that forms the coplanar line provided on the upper surface of the upper substrate 20 and the configuration of the first embodiment shown in FIG. A ground conductor 62 formed so as to be substantially parallel to the extending direction of the signal line conductor 61 is further provided. The signal line conductor 61 and the signal line conductor 41 are electrically connected by the signal line conductor column 51 penetrating the upper substrate 20. It is connected to the. The ground conductor 62 and the ground conductor 22a are electrically connected by a ground conductor column 52a penetrating the upper substrate 20, and the ground conductor 62 and the ground conductor 22b are coupled by a ground conductor column 52b penetrating the upper substrate 20. Electrically connected. Here, the ground conductor 62 may be separated from the ground conductor 22a and the ground conductor 22b instead of being integrated.

  In FIG. 4, a signal line conductor 11 and ground conductors 12a and 12b are provided on the surface of the lower substrate 10, and a coplanar line is formed by the signal line conductor 11 and the ground conductors 12a and 12b. In FIG. 4, the ground conductors 12a and 12b are not electrically connected, but may have an electrical connection on the lower substrate surface. Further, the upper substrate 20 is provided with a digging portion 30, and ground conductors 32 a and 32 b are provided on the side surfaces of the digging portion 30. Here again, the ground conductors 32 a and 32 b may be electrically connected via the bottom surface of the digging portion 30. On the lower surface of the upper substrate 20, a ground conductor 22a in contact with the ground conductor 32a formed on the side surface of the digging portion 30 and a ground conductor 22b in contact with the ground conductor 32b formed on the side surface of the digging portion 30 are provided. Yes.

  The digging portion 30 is provided with a protruding portion 33 formed by leaving a part of the substrate, and a signal line conductor pattern 31 is provided on the surface of the protruding portion 33. In addition, a signal line conductor 41 formed so as to be substantially parallel to the ground conductors 32 a and 32 b formed on the side surface of the digging portion 30 is provided on the bottom surface of the digging portion 30. A coplanar line formed by the signal line conductor 61 and the ground conductor 62 is provided on the upper surface of the upper substrate 20. The signal line conductor 61 and the signal line conductor 41 are electrically connected by a signal line conductor column 51 formed inside the upper substrate 20. The ground conductor 62 and the ground conductor 22a are electrically connected by a ground conductor column 52a, and the ground conductor 62 and the ground conductor 22b are electrically connected by a ground conductor column 52b. Here, when using a plurality of ground conductor columns 52a or 52b as shown in FIG. 4, the pitch p of the ground conductor columns 52a and 52b and the interval W2 between the ground conductor columns 52a and 52b are set to the frequency of the high-frequency signal to be transmitted. A half or less of the corresponding wavelength is desirable. In the upper substrate 20, the signal line conductors 31, 41, 61 and the signal line conductor column 51, the ground conductors 22a, 22b, 32a, 32b, 62 and the ground conductor columns 52a, 52b form a high frequency transmission line.

  4 shows the high-frequency transmission line in which the signal line conductors 11, 41, 61 are extended in the same direction, the present invention is not limited to this, and the extension directions of the signal line conductors 41, 61 may be different, for example. .

  Further, the signal line conductor column 51 and the ground conductor columns 52a and 52b shown in FIG. 4 can be produced by providing a conductor pattern on the inner wall of the through hole provided in the substrate. Further, the inside of the through hole may be filled with a conductive material. The through hole can be produced by various etching methods, and in addition to this, machining or laser processing may be used. In FIG. 4, the signal line conductor column 51 and the ground conductor columns 52a and 52b have a cylindrical shape, but the shape is not limited to this, and a rectangular column shape may be used.

  FIG. 6 is a cross-sectional view showing a state in which the lower substrate 10 and the upper substrate 20 shown in FIG. The signal line conductor 11 provided on the lower substrate 10 and the signal line conductor 31 provided on the upper substrate 20 are electrically connected via the solder 23. In addition, although not shown, the ground conductor 12a and the ground conductor 22a shown in FIG. 4 can be electrically connected using the connecting solder, and similarly, the ground conductor 12b and the ground conductor 22b use the connecting solder. Can be electrically connected.

  With the structure of the high-frequency transmission line shown in FIGS. 4, 5, and 6, a high-frequency signal input to a coplanar line composed of a signal line conductor 61 and a ground conductor 62 formed on the upper surface of the upper substrate 20 10 can be output to a coplanar line composed of the signal line conductor 11 and the ground conductors 12a and 12b formed on the surface of the high frequency circuit 10 provided on the upper surface of the upper substrate 20 and another circuit provided on the lower substrate 10. High frequency circuit can be connected.

  In the high-frequency transmission line as shown in FIG. 4, a parallel plate mode is generated between the ground conductor 62 formed on the upper surface of the upper substrate 20 and the ground conductor 22 a or 22 b formed on the lower surface of the upper substrate 20. It can cause signal transmission to deteriorate. By using the ground conductor columns 52a and 52b as described above, the ground conductor 62 and the ground conductor 22a or 22b are short-circuited, and further, the pitch p of the ground conductor columns 52a and 52b is ½ or less, Propagation in the parallel plate mode can be suppressed, and good high-frequency signal transmission can be performed.

  As described above, the high-frequency transmission line structure according to the second embodiment has the high-frequency circuit formed on one substrate by joining two substrates in addition to the effects shown in the first embodiment. In addition, connection with a high-frequency circuit formed on the other substrate can be realized with good high-frequency characteristics.

Embodiment 3 FIG.
7 and 8 are views showing the structure of a high-frequency transmission line according to Embodiment 3 of the present invention. FIG. 7 is a perspective view, and FIG. 8 is a cross-sectional view taken along the line CC ′ in FIG. . In the configuration of the third embodiment shown in FIGS. 7 and 8, the signal line conductor 13a is provided on the surface of the lower substrate 10 in place of the signal line conductor 11 as compared with the configuration of the second embodiment shown in FIG. 13b and 14 and the signal line conductors 13a, 13b and 14 and the ground conductors 12a and 12b form a coplanar line. On the upper substrate 20 side, instead of the signal line conductor 41, signal line conductors 43a, 43b, 44 are provided so as to be substantially parallel to the ground conductors 32a, 32b formed on the side surface of the digging portion 30. ing.

  In FIG. 7, signal line conductors 13a, 13b, 14 and ground conductors 12a, 12b are provided on the surface of the lower substrate 10, and the coplanar lines are formed by the signal line conductors 13a, 13b, 14 and the ground conductors 12a, 12b. Is formed. In FIG. 7, the ground conductors 12 a and 12 b are not electrically connected, but may be electrically connected on the surface of the lower substrate 10. Here, the line length d1 of the signal line conductor 14 is preferably about ¼ of the wavelength corresponding to the frequency of the high-frequency signal to be transmitted. Further, the upper substrate 20 is provided with a digging portion 30, and ground conductors 32 a and 32 b are provided on the side surfaces of the digging portion 30. Here again, the ground conductors 32 a and 32 b may be electrically connected via the bottom surface of the digging portion 30. On the lower surface of the upper substrate 20, a ground conductor 22a in contact with the ground conductor 32a formed on the side surface of the digging portion 30 and a ground conductor 22b in contact with the ground conductor 32b formed on the side surface of the digging portion 30 are provided. Yes.

  The digging portion 30 is provided with a protruding portion 33 formed by leaving a part of the substrate, and a signal line conductor pattern 31 is provided on the surface of the protruding portion 33. Further, signal line conductors 43 a, 43 b, 44 formed so as to be substantially parallel to the ground conductors 32 a, 32 b formed on the side surface of the digging portion 30 are provided on the bottom surface of the digging portion 30. Here, the line length d2 of the signal line conductor 44 is desirably about ¼ of the wavelength corresponding to the frequency of the high-frequency signal to be transmitted. A coplanar line formed by the signal line conductor 61 and the ground conductor 62 is provided on the upper surface of the upper substrate 20. The signal line conductor 61 and the signal line conductor 43 b are electrically connected by a signal line conductor column 51 formed inside the upper substrate 20.

  The ground conductor 62 and the ground conductor 22a are electrically connected by a ground conductor column 52a, and the ground conductor 62 and the ground conductor 22b are electrically connected by a ground conductor column 52b. Here, as shown in FIG. 7, when a plurality of ground conductor columns 52a or 52b are used, the pitch p of the ground conductor columns 52a and 52b and the interval W2 between the ground conductor columns 52a and 52b are the frequencies of the high-frequency signal to be transmitted. It is desirable that the wavelength be equal to or less than ½ of the wavelength corresponding to. In the upper substrate 20, the signal line conductors 31, 43a, 43b, 44, 61 and the signal line conductor column 51, the ground conductors 22a, 22b, 32a, 32b, 62 and the ground conductor columns 52a, 52b form a high frequency transmission line. Has been.

  In FIG. 7, the signal line conductors 13a, 13b, 14, 43a, 43b, 44, and 61 are shown as high-frequency transmission lines extending in the same direction. However, the present invention is not limited to this. For example, the signal line conductors 43b and 61 The stretching direction may be different.

  The signal line conductor column 51 and the ground conductor columns 52a and 52b shown in FIG. 7 can be produced by providing a conductor pattern on the inner wall of the through hole provided in the substrate. Further, the inside of the through hole may be filled with a conductive material. The through hole can be produced by various etching methods, and in addition to this, machining or laser processing may be used. In FIG. 7, the signal line conductor column 51 and the ground conductor columns 52a and 52b have a cylindrical shape, but the shape is not limited to this, and a rectangular column shape may be used.

  FIG. 9 shows a cross-sectional view of a state in which the lower substrate 10 and the upper substrate 20 shown in FIG. The signal line conductor 13 b provided on the lower substrate 10 and the signal line conductor 31 provided on the upper substrate 20 are electrically connected via the solder 23. In addition, although not shown, the ground conductor 12a and the ground conductor 22a shown in FIG. 7 can be electrically connected using a connecting solder, and similarly, the ground conductor 12b and the ground conductor 22b use a connecting solder. Can be electrically connected.

  In the high-frequency transmission line shown in FIG. 7, the characteristic impedance of the line when the high-frequency signal is transmitted through the signal line conductor column 51 may be different from the characteristic impedance of the coplanar line on the upper surface of the substrate 20, which causes an impedance mismatch. There is. Similarly, when a high-frequency signal is transmitted through the signal line conductor 31, an impedance mismatch may be caused. Due to these impedance mismatches, the reflection coefficient of the high-frequency signal increases, which causes the transmission characteristics of the high-frequency signal to deteriorate.

  In FIG. 7, a signal line conductor 44 having a different line width is inserted between the signal line conductors 43a and 43b, and the wavelength corresponding to the frequency of the high frequency signal transmitted through the line length d2 of the signal line conductor 44 is about 1 /. By setting it to 4, it can be operated as an impedance transformer. Similarly, a signal line conductor 14 having a different line width is inserted between the signal line conductors 13a and 13b. By setting it to 4, it can be operated as an impedance transformer. As a result, reflection due to the impedance mismatch is reduced, and good high-frequency signal transmission is possible.

  Here, in FIG. 7, the line width of the signal line conductor 44 or 14 constituting the impedance transformer is narrower than that of the front and rear signal line conductors 43a, 43b or 13a, 13b, and is higher than that of the front and rear lines. For example, the line width of the signal line conductor 44 or 14 may be made wider than that of the front and rear signal line conductors 43a, 43b or 13a, 13b, and a low impedance line may be used. Further, here, an example is shown in which the line width is adjusted in order to increase or decrease the impedance. However, the present invention is not limited to this, and as an impedance adjustment method, for example, the ground conductors 32a, 32b, or 12a are used. , 12b may be partially moved away from or close to the signal line conductor, and a part of the upper substrate 20 and the lower substrate 10 may be removed to change the effective dielectric constant of the line. The impedance value may be adjusted.

  As described above, the high-frequency transmission line structure according to the third embodiment can obtain the reflection amount due to the impedance mismatch of the high-frequency transmission line in addition to obtaining the respective effects shown in the first and second embodiments. Therefore, the high-frequency circuits formed on the plurality of substrates can be connected with good high-frequency signal characteristics.

It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 1 of this invention. It is the sectional view on the AA 'line in FIG. FIG. 3 is a cross-sectional view showing a state in which a lower substrate 10 and an upper substrate 20 shown in FIG. It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 2 of this invention. FIG. 5 is a sectional view taken along line BB ′ in FIG. 4. FIG. 6 is a cross-sectional view illustrating a state in which the lower substrate 10 and the upper substrate 20 illustrated in FIG. It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 3 of this invention. It is CC 'sectional view taken on the line in FIG. FIG. 9 is a cross-sectional view illustrating a state in which the lower substrate 10 and the upper substrate 20 illustrated in FIG.

Explanation of symbols

  10 lower substrate, 11 signal line conductor, 12a, 12b ground conductor, 13a, 13b, 14 signal line conductor, 20 upper substrate, 22a, 22b ground conductor, 23 solder, 30 dug, 31 signal line conductor, 32a, 32b ground conductor, 33 protrusion, 41 signal line conductor, 43a, 43b, 44 signal line conductor, 51 signal line conductor column, 52a, 52b ground conductor column, 61 signal line conductor, 62 ground conductor.

Claims (8)

A substrate,
A dug formed in at least one surface of the substrate;
A first signal line conductor formed on the bottom surface of the digging portion;
A first ground conductor formed on a first side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor;
A high-frequency transmission line comprising: a second ground conductor formed on a second side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor. In the high frequency transmission line according to claim 1,
A protrusion that is in contact with or integrated with the bottom surface of the digging portion;
A high-frequency transmission line, further comprising: a second signal line conductor electrically connected to the first signal line conductor and provided on a part of or the entire surface of the protrusion. In the high frequency transmission line according to claim 2,
A third ground conductor electrically connected to the first ground conductor and formed on the substrate surface;
A high-frequency transmission line, further comprising: a fourth ground conductor electrically connected to the second ground conductor and formed on the substrate surface. In the high frequency transmission line according to claim 3,
The digging portion is formed on a first surface of the substrate;
A third signal line conductor formed on a second surface opposite to the first surface of the substrate;
A fifth ground conductor formed on the second surface so as to be substantially parallel to the extending direction of the third signal line conductor;
A sixth ground conductor formed on the second surface so as to be substantially parallel to the extending direction of the third signal line conductor;
A fourth signal line conductor that penetrates the substrate and electrically connects the first signal line conductor and the third signal line conductor;
A seventh ground conductor that penetrates the substrate and electrically connects the third ground conductor and the fifth ground conductor;
The high-frequency transmission line further comprising: an eighth ground conductor that penetrates the substrate and electrically connects the fourth ground conductor and the sixth ground conductor. A first substrate;
A dug formed in the first surface of the first substrate;
A protrusion that is in contact with or integrated with the bottom surface of the digging portion;
A first signal line conductor formed on the bottom surface of the digging portion;
A first ground conductor formed on a first side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor;
A second ground conductor formed on a second side surface of the digging portion that is substantially parallel to the extending direction of the first signal line conductor;
A third ground conductor electrically connected to the first ground conductor and formed on the first surface of the first substrate;
A fourth ground conductor electrically connected to the second ground conductor and formed on the first surface of the first substrate;
A second signal line conductor electrically connected to the first signal line conductor and provided on a part of or the entire surface of the protrusion;
A second substrate;
A third signal line conductor formed on a first surface of the second substrate facing the first surface of the first substrate;
A fifth ground conductor formed on the first surface of the second substrate so as to be substantially parallel to the extending direction of the third signal line conductor;
A sixth ground conductor formed on the first surface of the second substrate so as to be substantially parallel to the extending direction of the third signal line conductor;
A first connection conductor that electrically connects the second signal line conductor and the third signal line conductor;
A second connection conductor for electrically connecting the third ground conductor and the fifth ground conductor;
A high-frequency transmission line comprising: a fourth connection conductor that electrically connects the fourth ground conductor and the sixth ground conductor. In the high frequency transmission line according to claim 5,
A fourth signal line conductor formed on a second surface opposite to the first surface of the first substrate;
A seventh ground conductor formed on the second surface and formed substantially parallel to the extending direction of the fourth signal line conductor;
An eighth ground conductor formed on the second surface and formed substantially parallel to the extending direction of the fourth signal line conductor;
A fifth signal line conductor passing through the first substrate and electrically connecting the first signal line conductor and the fourth signal line conductor;
A ninth ground conductor that penetrates through the first substrate and electrically connects the third ground conductor and the seventh ground conductor;
A high-frequency transmission line, further comprising: a tenth ground conductor penetrating the first substrate and electrically connecting the fourth ground conductor and the eighth ground conductor. In the high frequency transmission line according to claim 4 or 5,
A first transmission line composed of the first signal line conductor, the first ground conductor, and the second ground conductor; the third signal line conductor; the fifth ground conductor; A high-frequency transmission line, further comprising at least one impedance transformer in at least one of the second transmission lines composed of six ground conductors. In the high frequency transmission line according to claim 6,
A first transmission line composed of the first signal line conductor, the first ground conductor, and the second ground conductor; the third signal line conductor; the fifth ground conductor; At least one of a second transmission line composed of six ground conductors and a third transmission line composed of the fourth signal line conductor, the seventh ground conductor, and the eighth ground conductor. The high-frequency transmission line, further comprising at least one impedance transformer in the one transmission line.

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