JP2007269009A5 - - Google Patents

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Publication number
JP2007269009A5
JP2007269009A5 JP2007020905A JP2007020905A JP2007269009A5 JP 2007269009 A5 JP2007269009 A5 JP 2007269009A5 JP 2007020905 A JP2007020905 A JP 2007020905A JP 2007020905 A JP2007020905 A JP 2007020905A JP 2007269009 A5 JP2007269009 A5 JP 2007269009A5
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JP
Japan
Prior art keywords
liquid discharge
layer
wiring layer
discharge head
liquid
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Application number
JP2007020905A
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Japanese (ja)
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JP4822353B2 (en
JP2007269009A (en
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Priority to JP2007020905A priority Critical patent/JP4822353B2/en
Priority claimed from JP2007020905A external-priority patent/JP4822353B2/en
Publication of JP2007269009A publication Critical patent/JP2007269009A/en
Publication of JP2007269009A5 publication Critical patent/JP2007269009A5/ja
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Publication of JP4822353B2 publication Critical patent/JP4822353B2/en
Expired - Fee Related legal-status Critical Current
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Claims (9)

液体吐出するために利用されるエネルギーを発生する液体吐出エネルギー発生素子と、液体を吐出する液体吐出口と、該液体吐出口に連通する液体流路と、前記液体吐出エネルギー発生素子を駆動するための電気回路と、外部と電気信号を授受するための第一の電極パッドと、前記電気回路をテストするための第二の電極パッドと、を有する液体吐出ヘッドの製造方法であって、
前記第一の電極パッドの一部となる第一の配線層と、前記第二の電極パッドである第二の配線層とが形成された基板を用意する第1工程と、
前記第二の配線層の上に、前記第二の配線層を被覆する保護層を設ける第2工程と、
前記第一の配線層の表面に無電解めっき法により金属膜を形成して前記第一の電極パッドとする第3工程と、
前記第3工程の後に、前記保護層を除去する第4工程と、
前記第4工程の後に、前記第二の配線層の上に、前記第二の配線層を被覆する樹脂からなる層を設ける第5工程と、
を有する液体吐出ヘッドの製造方法。
Driving the liquid discharge energy generating element for generating energy used for discharging liquid, and a liquid discharge port for discharging liquid, a liquid flow path communicating with the liquid discharge port, the liquid discharge energy generating elements and an electric circuit for, there in the first electrode pad, manufacturing method of a liquid discharge head that having a second electrode pad, for testing the electric circuit for exchanging with the outside electric signal And
A first step of preparing a substrate on which a first wiring layer that is a part of the first electrode pad and a second wiring layer that is the second electrode pad are formed ;
On the second wiring layer, and a second step of forming a protective layer covering the front Stories second wiring layer,
A third step of forming a metal film on the surface of the first wiring layer by electroless plating to form the first electrode pad ;
A fourth step of removing the protective layer after the third step ;
A fifth step of providing a layer made of a resin covering the second wiring layer on the second wiring layer after the fourth step;
A method of manufacturing a liquid discharge head having
前記第5工程の後にさらに前記液体流路の壁を形成する部材である流路壁形成部材を前記基板上に設ける第6工程を行うことを特徴とする請求項1に記載の液体吐出ヘッドの製造方法。 Said fifth after step, further liquid discharge head according to claim 1, the flow path wall forming member is a member forming a wall of the liquid flow path and performing a sixth step of forming on said substrate Manufacturing method. 前記樹脂からなる層は、前記基板と前記流路壁形成部材との密着層として用いられることを特徴とする請求項2に記載の液体吐出ヘッドの製造方法。The method for manufacturing a liquid discharge head according to claim 2, wherein the resin layer is used as an adhesion layer between the substrate and the flow path wall forming member. 前記樹脂からなる層は、熱可塑性のポリエーテルアミド樹脂からなることを特徴とする請求項1乃至請求項3のいずれかに記載の液体吐出ヘッドの製造方法。 A layer made of the resin, the manufacturing method of the liquid discharge head according to any of claims 1 to 3, characterized in that it consists of thermoplastic polyetheramide resin. 前記第一の配線層および前記第二の配線層は、それぞれアルミニウムもしくはアルミニウム合金のいずれかからなる請求項1乃至請求項4のいずれかに記載の液体吐出ヘッドの製造方法。 5. The method of manufacturing a liquid discharge head according to claim 1, wherein each of the first wiring layer and the second wiring layer is made of aluminum or an aluminum alloy. 前記金属膜は、前記第一の配線層上に、無電解ニッケル・リン層、無電解置換金層および無電解還元金層をこの順に設けて形成することを特徴とする請求項1乃至請求項5のいずれかに記載の液体吐出ヘッドの製造方法。 The metal film, the the first wiring layer, electroless nickel-phosphorous layer, claims 1 to an electroless substitution gold layer and electroless reduced gold layer and forming provided in this order 6. A method for producing a liquid discharge head according to any one of 5 above. 記保護層は、スクリーン印刷によって形成されることを特徴とする請求項1乃至請求項6のいずれかに記載の液体吐出ヘッドの製造方法。 Prior Symbol protective layer, the manufacturing method of the liquid discharge head according to any of claims 1 to 6, characterized in that it is formed by screen printing. 前記保護層は前記金属膜を形成する部分を除いて設けられていることを特徴とする請求項1乃至請求項7のいずれかに記載の液体吐出ヘッドの製造方法。 The protective layer, the manufacturing method of the liquid discharge head according to any of claims 1 to 7, characterized in that it is provided with the exception of the portion forming the metal film. 液体吐出するために利用されるエネルギーを発生する液体吐出エネルギー発生素子と、液体を吐出する液体吐出口と、該液体吐出口に連通する液体流路と、前記液体吐出エネルギー発生素子を駆動するための電気回路と、を有る液体吐出ヘッドであって、
第一の配線層無電解ニッケル・リン層、無電解置換金層および無電解還元金層をこの順に設けて形成される、外部と電気信号を授受するための第一の電極パッドと、
第二の配線層で形成される、前記電気回路をテストするための第二の電極パッドと、
前記第二の配線層の上に樹脂からなる密着層を介して形成される、前記液体流路を形成するための流路壁形成部材と、
を含む液体吐出ヘッド。
Driving the liquid discharge energy generating element for generating energy used for discharging liquid, and a liquid discharge port for discharging liquid, a liquid flow path communicating with the liquid discharge port, the liquid discharge energy generating elements and an electric circuit for, a liquid discharge head have a,
A first electrode pad for exchanging electrical signals with the outside, formed by providing a first wiring layer , an electroless nickel / phosphorous layer, an electroless displacement gold layer and an electroless reduced gold layer in this order ;
A second electrode pad for testing the electrical circuit formed of a second wiring layer ;
A flow path wall forming member for forming the liquid flow path, which is formed on the second wiring layer via an adhesive layer made of a resin ;
Including a liquid discharge head.
JP2007020905A 2006-03-09 2007-01-31 Liquid discharge head and manufacturing method thereof Expired - Fee Related JP4822353B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007020905A JP4822353B2 (en) 2006-03-09 2007-01-31 Liquid discharge head and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006064167 2006-03-09
JP2006064167 2006-03-09
JP2007020905A JP4822353B2 (en) 2006-03-09 2007-01-31 Liquid discharge head and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2007269009A JP2007269009A (en) 2007-10-18
JP2007269009A5 true JP2007269009A5 (en) 2010-03-18
JP4822353B2 JP4822353B2 (en) 2011-11-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007020905A Expired - Fee Related JP4822353B2 (en) 2006-03-09 2007-01-31 Liquid discharge head and manufacturing method thereof

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JP (1) JP4822353B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5202373B2 (en) * 2008-06-16 2013-06-05 キヤノン株式会社 Inkjet recording head substrate, inkjet recording head substrate manufacturing method, inkjet recording head, and inkjet recording apparatus
US8291576B2 (en) * 2008-06-18 2012-10-23 Canon Kabushiki Kaisha Method of manufacturing liquid ejection head
JP6066612B2 (en) * 2012-08-06 2017-01-25 キヤノン株式会社 Liquid discharge head and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4168558B2 (en) * 1999-11-29 2008-10-22 カシオ計算機株式会社 Integrated circuit board
JP3772886B2 (en) * 2003-12-22 2006-05-10 ブラザー工業株式会社 Printed circuit board and inkjet head

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