JP2007266629A - 画像表示装置 - Google Patents
画像表示装置 Download PDFInfo
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- JP2007266629A JP2007266629A JP2007160782A JP2007160782A JP2007266629A JP 2007266629 A JP2007266629 A JP 2007266629A JP 2007160782 A JP2007160782 A JP 2007160782A JP 2007160782 A JP2007160782 A JP 2007160782A JP 2007266629 A JP2007266629 A JP 2007266629A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
【解決手段】 半導体発光素子を光源として光を放出する光源部と、入射した光の強度を画素毎に調節して透過光として透過させ、もしくは遮蔽する調光部と、入射した光を受けて、強度スペクトルが異なる光を放出する波長変換部と、を備え、前記半導体発光素子は、発光スペクトルのピーク波長が青色領域にある発光素子であり、前記波長変換部は、所定の画素パターンに従って配置された2種類の蛍光体と1種類の透光体とを備え、前記2種類の蛍光体は、それぞれ、前記入射した光を赤或いは緑の波長帯の可視光に変換する蛍光体であり、前記1種類の透光体は、前記透過光を透過するものとして構成されていることを特徴とする画像表示装置を提供する。
【選択図】図1
Description
本発明によれば、通常の液晶表示装置と比較して視野角が極めて広く、画面を斜め方向から観察しても、映像を明瞭に認識することができる画像表示装置を提供することができる。
光源部20は、前述した画像表示装置10bと同様に、紫外線領域において発光する半導体発光素子を光源として備える。その発光層の材料としては、例えば前述した窒化ガリウムを用いることが望ましい。
波長変換部または波長選択部40は、光源部20から入射した光の波長を適宜変換し、あるいは選択して調光部30に出力する。調光部30は、波長変換部40から入射された光の光量を画素毎に調節して、所定の画像を形成し、画像表示装置50の観察面から出力する。
さらに、高輝度のRGB光を得ることにより、既存の白色光源を置き換えることができる。
20 光源部
22 光源
23 ロッド・レンズ
24 基板
25 取り付け部
26 導光板または導光部
28 反射板
29 拡散板
30 調光部
40 波長変換部または波長選択部
31 偏光板
32 基板
34 透明電極
35 スイッチング素子
36 液晶
38 共通電極
39 偏光板
42 基板
44 蛍光体、透過窓
60 フィルタ
62 遮光材
66 導光部
70 可動鏡
72 可動鏡
74 可動レンズ
76 反射鏡
77 リフレクタ
78 集光レンズ
80 投写レンズ
90 スクリーン
110 発光素子
112 波長変換材
114 電極
116 ワイア
120 実装部材
124 反射板
122 実装部材
130 樹脂
210 発光素子
222、450 実装部材
230、830 樹脂
250 波長変換物質
312、412 基板
314、414 バッファ層
316 n型コンタクト層
318、418 n型クラッド層
320、420 活性層
322、422 p型クラッド層
324、426 p型コンタクト層
326 p側電極
334 n側電極
500、510、520、600、610 発光素子
620、700、710、720、810、910 発光素子
920 実装部材
930 樹脂
Claims (3)
- 半導体発光素子を光源として光を放出する光源部と、
入射した光の強度を画素毎に調節して透過光として透過させ、もしくは遮蔽する調光部と、
入射した光を受けて、強度スペクトルが異なる光を放出する波長変換部と、
を備え、
前記半導体発光素子は、発光スペクトルのピーク波長が青色領域にある発光素子であり、
前記波長変換部は、所定の画素パターンに従って配置された2種類の蛍光体と1種類の透光体とを備え、前記2種類の蛍光体は、それぞれ、前記入射した光を赤或いは緑の波長帯の可視光に変換する蛍光体であり、前記1種類の透光体は、前記透過光を透過するものとして構成されていることを特徴とする画像表示装置。 - 前記波長変換部における前記2種類の蛍光体は、前記青色領域において吸収励起ピークを有する蛍光体であることを特徴とする請求項1に記載の画像表示装置。
- 前記調光部は、透光性基板の上に前記画素毎に形成されたスイッチング素子を有する液晶セルを有し、前記画素毎に前記液晶セルに印加する電圧を制御することにより前記透過光の強度を調節するものとして構成されたことを特徴とする請求項1または2に記載の画像表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007160782A JP2007266629A (ja) | 2007-06-18 | 2007-06-18 | 画像表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007160782A JP2007266629A (ja) | 2007-06-18 | 2007-06-18 | 画像表示装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11273423A Division JP2000081847A (ja) | 1999-09-27 | 1999-09-27 | 画像表示装置及び発光装置 |
Publications (1)
Publication Number | Publication Date |
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JP2007266629A true JP2007266629A (ja) | 2007-10-11 |
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JP2007160782A Pending JP2007266629A (ja) | 2007-06-18 | 2007-06-18 | 画像表示装置 |
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JP (1) | JP2007266629A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100942526B1 (ko) | 2007-12-11 | 2010-02-12 | 포항공과대학교 산학협력단 | 광변환 발광소자 및 그 제조방법 |
KR20140004882A (ko) * | 2012-07-03 | 2014-01-14 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51109798A (ja) * | 1975-03-20 | 1976-09-28 | Matsushita Electric Ind Co Ltd | Ekishohyojisochi |
JPS57204515A (en) * | 1981-06-11 | 1982-12-15 | Seiko Epson Corp | Liquid crystal display body |
JPS60149028A (ja) * | 1984-01-13 | 1985-08-06 | Ricoh Co Ltd | 液晶カラ−表示装置 |
JPS62194228A (ja) * | 1986-02-20 | 1987-08-26 | Matsushita Electric Ind Co Ltd | 発光型表示装置 |
JPS62194227A (ja) * | 1986-02-20 | 1987-08-26 | Matsushita Electric Ind Co Ltd | 発光型表示装置 |
US4830469A (en) * | 1987-02-13 | 1989-05-16 | U.S. Philips Corporation | Liquid crystalline color display cell having a phosphorescent substrate and U.V.-absorbing dichroic dye |
JPH0412323A (ja) * | 1990-05-01 | 1992-01-16 | Fujitsu Ltd | カラー液晶表示パネル |
JPH0799345A (ja) * | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH07176794A (ja) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | 面状光源 |
JPH087614A (ja) * | 1994-06-17 | 1996-01-12 | Nichia Chem Ind Ltd | 面状光源 |
JPH0973807A (ja) * | 1995-09-06 | 1997-03-18 | Nichia Chem Ind Ltd | 面状光源 |
JPH0980434A (ja) * | 1995-09-12 | 1997-03-28 | Idemitsu Kosan Co Ltd | カラー表示装置 |
-
2007
- 2007-06-18 JP JP2007160782A patent/JP2007266629A/ja active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51109798A (ja) * | 1975-03-20 | 1976-09-28 | Matsushita Electric Ind Co Ltd | Ekishohyojisochi |
JPS57204515A (en) * | 1981-06-11 | 1982-12-15 | Seiko Epson Corp | Liquid crystal display body |
JPS60149028A (ja) * | 1984-01-13 | 1985-08-06 | Ricoh Co Ltd | 液晶カラ−表示装置 |
JPS62194228A (ja) * | 1986-02-20 | 1987-08-26 | Matsushita Electric Ind Co Ltd | 発光型表示装置 |
JPS62194227A (ja) * | 1986-02-20 | 1987-08-26 | Matsushita Electric Ind Co Ltd | 発光型表示装置 |
US4830469A (en) * | 1987-02-13 | 1989-05-16 | U.S. Philips Corporation | Liquid crystalline color display cell having a phosphorescent substrate and U.V.-absorbing dichroic dye |
JPH0412323A (ja) * | 1990-05-01 | 1992-01-16 | Fujitsu Ltd | カラー液晶表示パネル |
JPH0799345A (ja) * | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH07176794A (ja) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | 面状光源 |
JPH087614A (ja) * | 1994-06-17 | 1996-01-12 | Nichia Chem Ind Ltd | 面状光源 |
JPH0973807A (ja) * | 1995-09-06 | 1997-03-18 | Nichia Chem Ind Ltd | 面状光源 |
JPH0980434A (ja) * | 1995-09-12 | 1997-03-28 | Idemitsu Kosan Co Ltd | カラー表示装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100942526B1 (ko) | 2007-12-11 | 2010-02-12 | 포항공과대학교 산학협력단 | 광변환 발광소자 및 그 제조방법 |
KR20140004882A (ko) * | 2012-07-03 | 2014-01-14 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
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