JP2007266555A - Manufacturing method for bump bonding laminate - Google Patents

Manufacturing method for bump bonding laminate Download PDF

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JP2007266555A
JP2007266555A JP2006093279A JP2006093279A JP2007266555A JP 2007266555 A JP2007266555 A JP 2007266555A JP 2006093279 A JP2006093279 A JP 2006093279A JP 2006093279 A JP2006093279 A JP 2006093279A JP 2007266555 A JP2007266555 A JP 2007266555A
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bump
bumps
bonding
manufacturing
contact
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JP4661657B2 (en
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Kimiji Kayukawa
君治 粥川
Akira Tanahashi
棚橋　　昭
Ryuichiro Abe
竜一郎 阿部
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/14104—Disposition relative to the bonding areas, e.g. bond pads, of the semiconductor or solid-state body
    • H01L2224/1411—Disposition relative to the bonding areas, e.g. bond pads, of the semiconductor or solid-state body the bump connectors being bonded to at least one common bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/171—Disposition
    • H01L2224/17104—Disposition relative to the bonding areas, e.g. bond pads
    • H01L2224/17106—Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area
    • H01L2224/17107—Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area the bump connectors connecting two common bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81194—Lateral distribution of the bump connectors

Abstract

<P>PROBLEM TO BE SOLVED: To prevent displacement at the time of contact of bumps, in a method for manufacturing a bump bonding laminate, formed by providing the bumps to one surface of a first bonding member and one surface of a second bonding member facing the former surface, and by bringing ends of the bumps of the respective bonding members into contact with each other to connect. <P>SOLUTION: An end 21a of a first bump 21 and an end 22a of a second bump 22 which is the counter side of the first bump 21 are made into a form having periodical irregularity. Then both the bumps 21 and 22 are so made into contact with each other that the irregular parts of the ends 21a and 22a of both the bumps 21 and 22 engage with each other. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

本発明は、２つの接合部材をバンプを介して接合するバンプ接合体の製造方法に関し、たとえば、半導体チップと配線基板とをバンプを介して接続してなる接合体の製造方法に関する。   The present invention relates to a method for manufacturing a bump bonded body in which two bonding members are bonded via bumps. For example, the present invention relates to a method for manufacturing a bonded body in which a semiconductor chip and a wiring board are connected via bumps.

この種のバンプ接合体は、半導体チップなどの第１の接合部材の一面と、配線基板などの第２の接合部材の一面とを対向させるとともに、これら両接合部材の間に設けられた複数個のバンプを介して接合される（たとえば、特許文献１参照）。   In this type of bump bonded body, one surface of a first bonding member such as a semiconductor chip is opposed to one surface of a second bonding member such as a wiring board, and a plurality of bump bonding bodies are provided between the two bonding members. Are joined via bumps (see, for example, Patent Document 1).

この場合、第１の接合部材の一面に複数個の第１のバンプを設け、第２の接合部材の一面のうちそれぞれの第１のバンプと対向する位置に第２のバンプを設ける。これらバンプは、通常ワイヤボンディング装置を用いて形成される。そして、それぞれの第１のバンプの先端部とこれに対向する第２のバンプの先端部とを接触させ、超音波接合や熱圧着などにより両バンプを電気的に接続する。
特開平１１−８２７０号公報 In this case, a plurality of first bumps are provided on one surface of the first bonding member, and second bumps are provided at positions facing the first bumps on one surface of the second bonding member. These bumps are usually formed using a wire bonding apparatus. And the front-end | tip part of each 1st bump and the front-end | tip part of the 2nd bump which opposes this are contacted, and both bumps are electrically connected by ultrasonic bonding, thermocompression bonding, etc.
Japanese Patent Laid-Open No. 11-8270

しかしながら、従来のバンプ接合体の製造方法においては、バンプそのものが微小であり、また、バンプの高さばらつきやバンプ先端部の傾斜などにより、それぞれの第１のバンプと第２のバンプとを接触させたときに、横滑りが発生し、接合装置の精度以上にバンプ同士の位置ずれが生じるという問題が発生していた。   However, in the conventional method of manufacturing a bump bonded body, the bump itself is very small, and the first bump and the second bump are brought into contact with each other due to variations in the height of the bump or the inclination of the bump tip. When this is done, side slip occurs, causing a problem that the bumps are displaced more than the accuracy of the bonding apparatus.

本発明は、上記問題に鑑みてなされたものであり、第１の接合部材の一面およびこれに対向する第２の接合部材の一面にそれぞれバンプを設け、それぞれの接合部材のバンプの先端部を接触させて接続してなるバンプ接合体の製造方法において、バンプの接触時における位置ずれを防止することを目的とする。   The present invention has been made in view of the above problems, and bumps are provided on one surface of the first bonding member and one surface of the second bonding member opposite to the first bonding member, and the tip ends of the bumps of the respective bonding members are provided. An object of the manufacturing method of a bump bonded body formed by contact is to prevent positional displacement at the time of bump contact.

上記目的を達成するため、本発明は、第１のバンプ（２１）の先端部（２１ａ）および第１のバンプ（２１）の相手側である第２のバンプ（２２）の先端部（２２ａ）を周期的な凹凸を有する形状とした後、これら両バンプ（２１、２２）の先端部（２１ａ、２２ａ）の凹凸部をかみ合わせるように両バンプ（２１、２２）を接触させ、接続を行うようにしたことを、第１の特徴とする。   In order to achieve the above object, the present invention provides a front end portion (21a) of the first bump (21) and a front end portion (22a) of the second bump (22) which is the counterpart of the first bump (21). After forming a shape having periodic irregularities, both bumps (21, 22) are brought into contact with each other so as to engage the irregularities of the tip portions (21a, 22a) of both bumps (21, 22), and connection is made. This is the first feature.

それによれば、両バンプ（２１、２２）の先端部（２１ａ、２２ａ）に周期的な凹凸を形成し、両バンプ（２１、２２）の凹凸部同士をかみ合わせるように両バンプ（２１、２２）を接触させるため、両バンプ（２１、２２）の接触時における位置ずれを防止することができる。   According to this, both bumps (21, 22) are formed so as to form periodic irregularities at the tip portions (21a, 22a) of both bumps (21, 22) and to engage the irregularities of both bumps (21, 22). ) In contact with each other, it is possible to prevent positional deviation when both bumps (21, 22) are in contact.

この製造方法において、両バンプ（２１、２２）の先端部（２１ａ、２２ａ）を上記の凹凸を有する形状とすることは、表面に上記凹凸を有する形状が設けられた部材（１００）を用い、この部材（１００）の当該表面を、それぞれのバンプ（２１、２２）の先端部（２１ａ、２２ａ）に押しつけて当該先端部（２１ａ、２２ａ）を変形させることにより行うことができる。   In this manufacturing method, the tip (21a, 22a) of both bumps (21, 22) is formed into the shape having the above irregularities using a member (100) provided with the shape having the above irregularities on the surface. The surface of the member (100) can be pressed by pressing the front end portions (21a, 22a) of the respective bumps (21, 22) to deform the front end portions (21a, 22a).

また、本発明は、互いに接続される第１のバンプ（２１）と第２のバンプ（２２）との組において、第１のバンプ（２１）および第２のバンプ（２２）の少なくとも一方のバンプを複数個のものとし、これら第１および第２のバンプ（２１、２２）を互いにかみ合った状態となるように接触させることを、第２の特徴とする。   In the present invention, in the set of the first bump (21) and the second bump (22) connected to each other, at least one of the first bump (21) and the second bump (22) is used. The second feature is that the first and second bumps (21, 22) are brought into contact with each other so as to be engaged with each other.

それによれば、接続されるべき第１のバンプ（２１）と第２のバンプ（２２）との少なくとも一方を複数個として、両バンプ（２１、２２）をかみ合わせることにより、両バンプ（２１、２２）が係止された状態で接触するため、両バンプ（２１、２２）の接触時における位置ずれを防止することができる。   According to this, by making at least one of the first bump (21) and the second bump (22) to be connected into a plurality and engaging both the bumps (21, 22), both bumps (21, Since the contact is made in a state where 22) is locked, it is possible to prevent a positional shift when both the bumps (21, 22) are in contact.

なお、特許請求の範囲およびこの欄で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。   In addition, the code | symbol in the parenthesis of each means described in a claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各図相互において、互いに同一もしくは均等である部分には、説明の簡略化を図るべく、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, parts that are the same or equivalent to each other are given the same reference numerals in the drawings for the sake of simplicity.

（第１実施形態）
図１は、本発明の第１実施形態に係るバンプ接合体１０の概略断面構成を示す図である。このバンプ接合体は、２つの接合部材１１、１２同士をバンプ２１、２２を介して電気的・機械的に接続してなる。 (First embodiment)
FIG. 1 is a diagram showing a schematic cross-sectional configuration of a bump bonded body 10 according to the first embodiment of the present invention. This bump bonded body is formed by electrically and mechanically connecting two bonding members 11 and 12 via bumps 21 and 22.

図１において下側に位置する第１の接合部材１１は、プリント基板やセラミック基板、およびフレキシブル基板などの配線基板または回路基板、シリコンＩＣ基板、あるいは、一般的なフリップチップやＩＣチップなどの半導体チップなどである。   The first bonding member 11 located on the lower side in FIG. 1 is a printed circuit board, a ceramic substrate, and a wiring substrate or circuit substrate such as a flexible substrate, a silicon IC substrate, or a general semiconductor such as a flip chip or IC chip. Such as a chip.

また、上側に位置する第２の接合部材１２は、第１の接合部材１１と同様のものにできるが、たとえば半導体チップなどである。本例では、第１の接合部材１１、第２の接合部材１２ともにシリコン半導体よりなる半導体チップである。   The second bonding member 12 located on the upper side can be the same as the first bonding member 11, but is, for example, a semiconductor chip. In this example, both the first bonding member 11 and the second bonding member 12 are semiconductor chips made of a silicon semiconductor.

これら両接合部材１１、１２は、ともに対向する一面１１ａ、１２ａが接合面として構成されており、それぞれの接合部材１１、１２の一面１１ａ、１２ａには、金などからなる複数個のバンプ２１、２２が設けられている。   Both the joining members 11 and 12 are configured such that one surface 11a and 12a facing each other is a joining surface, and on one surface 11a and 12a of each joining member 11 and 12, a plurality of bumps 21 made of gold or the like, 22 is provided.

ここで、第１の接合部材１１の一面１１ａに設けられた第１のバンプ２１に対し、第２の接合部材１２においては、その一面１２ａのうちそれぞれの第１のバンプ２１と対向する位置に第２のバンプ２２が設けられている。   Here, with respect to the first bump 21 provided on the one surface 11 a of the first bonding member 11, the second bonding member 12 has a position facing the first bump 21 on the one surface 12 a. A second bump 22 is provided.

これら両バンプ２１、２２は、ワイヤボンディング装置を用いた公知のバンプ形成法、たとえばスタッドバンプやメッキ法などにより形成される。また、バンプ２１、２２の材質としては、金、Ｃｕ、Ａｌなど一般的なバンプ材料が挙げられるが、典型的には、金を主成分とする金バンプが挙げられる。   These bumps 21 and 22 are formed by a known bump forming method using a wire bonding apparatus, for example, a stud bump or a plating method. In addition, examples of the material of the bumps 21 and 22 include common bump materials such as gold, Cu, and Al. Typically, gold bumps mainly composed of gold are used.

そして、両バンプ２１、２２同士は、超音波接合や熱圧着により、互いに金属接合されている。こうして、両接合部材１１、１２は、バンプ２１、２２を介して機械的・電気的に接続されている。   The bumps 21 and 22 are metal-bonded to each other by ultrasonic bonding or thermocompression bonding. Thus, both the joining members 11 and 12 are mechanically and electrically connected via the bumps 21 and 22.

次に、本実施形態に係るバンプ接合体１０の製造方法について、図２、図３を参照して説明する。図２（ａ）および（ｂ）は、本製造方法における接合工程を示す概略断面図である。   Next, a method for manufacturing the bump bonded body 10 according to the present embodiment will be described with reference to FIGS. 2 (a) and 2 (b) are schematic cross-sectional views showing a bonding step in the present manufacturing method.

また、図３（ａ）は、本製造方法におけるバンプ加工工程を示す斜視図であり、図３（ｂ）は、（ａ）中の凹凸部材１００の表面の拡大図である。なお、図３では、第１の接合部材１１の第１のバンプ２１を加工する場合を示しているが、第２の接合部材１２の第２のバンプ２２の加工方法も、これと同様である。   FIG. 3A is a perspective view showing a bump processing step in the manufacturing method, and FIG. 3B is an enlarged view of the surface of the concavo-convex member 100 in FIG. Note that FIG. 3 shows a case where the first bump 21 of the first bonding member 11 is processed, but the processing method of the second bump 22 of the second bonding member 12 is the same as this. .

まず、本製造方法においては、バンプ形成工程として、第１の接合部材１１の一面１１ａに複数個の第１のバンプ２１を設けるとともに、第１の接合部材１１の一面１１ａに対向させる第２の接合部材１２の一面１２ａのうちそれぞれの第１のバンプ２１と対向する位置に第２のバンプ２２を設ける。これら両バンプ２１、２２の形成方法としては、上述したスタッドバンプ法などを採用できる。   First, in this manufacturing method, as a bump forming step, a plurality of first bumps 21 are provided on one surface 11a of the first bonding member 11, and the second bonding surface 11a is opposed to the one surface 11a of the first bonding member 11. The second bumps 22 are provided at positions facing the first bumps 21 on the one surface 12 a of the bonding member 12. As a method for forming these bumps 21 and 22, the stud bump method described above can be adopted.

このようにして形成される両バンプ２１、２２の個々の形状は、一般的なものであり、図２（ａ）に示されるように、たとえば、バンプ２１、２２の根元部すなわち接合部材１１、１２側の部位から先端部２１ａ、２２ａに向かって次第に細くなった円柱形状をなすものになる。   The individual shapes of both the bumps 21 and 22 formed in this way are general, and as shown in FIG. 2A, for example, the base portions of the bumps 21 and 22, that is, the bonding members 11, A cylindrical shape that gradually becomes thinner from the 12 side portion toward the distal end portions 21a and 22a is formed.

次に、本製造方法においては、バンプ加工工程として、第１のバンプ２１の先端部２１ａおよび第２のバンプ２２の先端部２２ａを周期的な凹凸を有する形状となるように加工する。   Next, in this manufacturing method, as the bump processing step, the front end portion 21a of the first bump 21 and the front end portion 22a of the second bump 22 are processed so as to have a periodic uneven shape.

具体的には、図３に示されるように、表面に凹凸を有する形状が設けられた部材としての凹凸部材１００を用いる。この凹凸部材１００は、たとえばセラミックやシリコンあるいは鉄系金属などバンプ２１、２２よりも硬い材質よりなる板材であり、その一面に凹凸形状が形成されている。   Specifically, as shown in FIG. 3, a concavo-convex member 100 is used as a member having a surface having a concavo-convex shape. The concavo-convex member 100 is a plate material made of a material harder than the bumps 21, 22, such as ceramic, silicon, or iron-based metal, and an concavo-convex shape is formed on one surface thereof.

ここで、この凹凸形状は、凹部と凸部とが周期をもって繰り返し形成されたものであり、本例では、特に図３（ｂ）に示されるように、四角錐形状いわゆるピラミッド形状の凹凸となっている。この凹凸の周期は例えば５μｍ以下のものにでき、凹凸の高さ（凸部と凹部との高さの差）はたとえば５μｍ程度にできる。   Here, this uneven shape is formed by repeatedly forming concave and convex portions with a period, and in this example, as shown in FIG. 3B in particular, it is a quadrangular pyramid shape so-called pyramid-shaped unevenness. ing. The period of the unevenness can be set to 5 μm or less, for example, and the height of the unevenness (the difference in height between the convex part and the concave part) can be set to, for example, about 5 μm.

そして、バンプ加工工程では、図３（ａ）に示されるように、この凹凸部材１００の凹凸形状となっている側の一面を、第１のバンプ２１の先端部２１ａに押しつけて当該先端部２１ａを変形させる。   Then, in the bump processing step, as shown in FIG. 3A, the one surface of the uneven member 100 on the side having the uneven shape is pressed against the tip portion 21 a of the first bump 21, and the tip portion 21 a. Deform.

具体的には、凹凸部材１００の凹凸面が第１の接合部材１１の一面１１ａに対向するように、凹凸部材１００を第１の接合部材１１の上に載せ、凹凸部材１００の上から荷重を加えるなどによって加圧する。   Specifically, the uneven member 100 is placed on the first bonding member 11 so that the uneven surface of the uneven member 100 faces the one surface 11 a of the first bonding member 11, and a load is applied from above the uneven member 100. Pressurize by adding.

それにより、第１のバンプ２１の先端部２１ａには、当該凹凸部材１００の凹凸形状が転写される。そして、第１のバンプ２１の先端部２１ａの凹凸形状は図示しないけれども、図３に示される凹凸部材１００の凹凸形状と実質的に同様の周期的な凹凸を有する形状となる。また、この凹凸部材１００によるバンプの加工は、第２のバンプ２２に対しても同様に行う。   Thereby, the concavo-convex shape of the concavo-convex member 100 is transferred to the tip 21 a of the first bump 21. And although the uneven | corrugated shape of the front-end | tip part 21a of the 1st bump 21 is not illustrated, it becomes a shape which has the periodic unevenness | corrugation substantially the same as the uneven | corrugated shape of the uneven | corrugated member 100 shown by FIG. Further, the bump processing by the concavo-convex member 100 is similarly performed on the second bump 22.

また、このバンプ加工工程では、凹凸部材１００により、各接合部材１１、１２における複数個のバンプ２１、２２の全部を一度に加圧する。このとき、バンプ２１、２２が形成されている接合部材１１、１２を載せているステージ（図示せず）と、凹凸部材１００との平行度を調整することにより、バンプ２１、２２の高さばらつきを修正することが可能となる。   Further, in this bump processing step, the concavo-convex member 100 presses all of the plurality of bumps 21 and 22 in each of the joining members 11 and 12 at a time. At this time, the height variation of the bumps 21 and 22 is adjusted by adjusting the parallelism between the stage (not shown) on which the bonding members 11 and 12 on which the bumps 21 and 22 are formed and the uneven member 100 are adjusted. Can be corrected.

このようにして、バンプ加工工程を行った後、図２（ａ）に示されるように、第１の接合部材１１と第２の接合部材１２とを互いの一面１１ａ、１２ａにて対向させる。第１のバンプ２１と第２のバンプ２２との位置合わせを行う。   Thus, after performing a bump processing process, as FIG. 2 (a) shows, the 1st joining member 11 and the 2nd joining member 12 are made to oppose on one surface 11a, 12a mutually. The first bump 21 and the second bump 22 are aligned.

そして、図２（ｂ）に示されるように、それぞれの第１のバンプ２１の先端部２１ａと第２のバンプ２２の先端部２２ａとを、加圧しながら接触させる。このとき、各バンプ２１、２２の先端部２１ａ、２２ａには、周期的な凹凸形状が形成されているため、対向する両先端部２１ａ、２２ａの凹凸部がかみ合うように接触がなされる。   Then, as shown in FIG. 2 (b), the tip 21 a of each first bump 21 and the tip 22 a of the second bump 22 are brought into contact with each other while being pressurized. At this time, the tip portions 21a and 22a of the bumps 21 and 22 are formed with a periodic uneven shape, and therefore contact is made so that the uneven portions of the opposite tip portions 21a and 22a are engaged.

そして、両接合部材１１、１２が例えば図２（ｂ）中の左右方向にずれる、すなわち横滑りしようとした場合でも、対向する両先端部２１ａ、２２ａの凹凸部がかみ合って引っかかった状態となっているため、バンプ接触時における横滑りは極力防止できる。   Then, even when both the joining members 11 and 12 are shifted in the left-right direction in FIG. 2B, for example, when they are about to slip, the concavities and convexities of the opposing tip portions 21a and 22a are engaged and caught. Therefore, the side slip at the time of bump contact can be prevented as much as possible.

こうして、両バンプ２１、２２の先端部２１ａ、２２ａを接触させた状態で、超音波接合や熱圧着などにより両バンプ２１、２２を電気的に接続する。超音波接合では、両バンプ２１、２２を押しつけ合うように加圧しながら超音波を印加する。また、熱圧着では、両バンプ２１、２２を押しつけ合うように加圧しながら加熱する。   In this way, both the bumps 21 and 22 are electrically connected by ultrasonic bonding, thermocompression bonding, or the like with the tip portions 21a and 22a of the bumps 21 and 22 in contact with each other. In ultrasonic bonding, ultrasonic waves are applied while pressing the bumps 21 and 22 together. In thermocompression bonding, the bumps 21 and 22 are heated while being pressed against each other.

このようにして、両バンプ２１、２２は金属接合され、電気的・機械的に接続され、バンプ２１、２２を介して、両接合部材１１、１２が電気的・機械的に接続され、バンプ接合体１０ができあがる。なお、両バンプ２１、２２の接合が完了した状態では、両バンプ２１、２２の先端部２１ａ、２２ａは、接触前の状態よりも押しつぶされて変形した形となる。   In this way, both the bumps 21 and 22 are metal-bonded and electrically and mechanically connected, and both the bonding members 11 and 12 are electrically and mechanically connected via the bumps 21 and 22 to be bump-bonded. The body 10 is completed. In the state where the bonding of both the bumps 21 and 22 is completed, the tip portions 21a and 22a of both the bumps 21 and 22 are crushed and deformed as compared with the state before the contact.

ところで、従来のこの種のバンプ接合体の製造方法においては、バンプ接合における最大の懸念点の１つとして、位置ずれが挙げられる。この位置ずれが生じる原因として、（ａ）各バンプの高さばらつきにより、各バンプに均一に加圧できないため、位置ずれが生じること、（ｂ）バンプの先端部が傾斜しているために、互いのバンプが接触した際に位置ずれを生じることなどが挙げられる。   By the way, in the conventional manufacturing method of this kind of bump joined object, position shift is mentioned as one of the biggest concerns in bump joining. As a cause of this positional deviation, (a) because each bump cannot be uniformly pressed due to the height variation of each bump, the positional deviation occurs, and (b) the tip of the bump is inclined. For example, misalignment occurs when the bumps contact each other.

特に、スタッドバンプにて金バンプを形成する場合は、各バンプの高さばらつきが生じやすく、また、バンプの先端部は傾斜した面となっていることが一般的である。加えて、バンプ接合時に超音波振動を加える場合においては、その振動による位置ずれが生じやすい。   In particular, when gold bumps are formed by stud bumps, variations in the height of each bump are likely to occur, and the tip of the bump is generally inclined. In addition, when ultrasonic vibration is applied at the time of bump bonding, positional deviation due to the vibration is likely to occur.

このような問題に対して、本実施形態の製造方法では、両バンプ２１、２２の先端部２１ａ、２２ａに周期的な凹凸を形成している。そして、形成された凹凸は、バンプ２１、２２同士の接合時において、互いの凹部と凸部が噛み合うように接触する。   With respect to such a problem, in the manufacturing method of the present embodiment, periodic irregularities are formed on the tip portions 21a and 22a of both the bumps 21 and 22. And the formed unevenness | corrugation contacts so that a mutual recessed part and convex part may mesh | engage at the time of joining of bumps 21 and 22.

このとき、凹凸を乗り越えるようにバンプ２１、２２同士が相対的に移動することはまず起こらないため、本実施形態によれば、両バンプ２１、２２の接触時における位置ずれを防止することができる。   At this time, since the bumps 21 and 22 do not move relative to each other so as to get over the unevenness, according to the present embodiment, it is possible to prevent the positional deviation when the bumps 21 and 22 are in contact with each other. .

（第２実施形態）
図４および図５は、本発明の第２実施形態に係るバンプ接合体の製造方法を示す図であり、図４は接合前の各接合部材１１、１２を示す斜視図、図５は両バンプ２１、２２を接触させた状態において接合部材１１、１２を透過して両バンプ２１、２２の平面的な位置関係を表す図である。なお、図５では、識別のため、便宜上、第1のバンプ２１にハッチングを施してある。 (Second Embodiment)
4 and 5 are views showing a method for manufacturing a bump bonded body according to a second embodiment of the present invention. FIG. 4 is a perspective view showing the bonding members 11 and 12 before bonding, and FIG. FIG. 6 is a diagram illustrating a planar positional relationship between both bumps 21 and 22 through the bonding members 11 and 12 in a state where 21 and 22 are in contact with each other. In FIG. 5, the first bumps 21 are hatched for convenience of identification.

本製造方法は、上記第１実施形態における凹凸形状を形成するバンプ加工工程を行わずに、上記位置ずれを防止するものであり、以下、上記第１実施形態の製造方法との相違点を中心に述べることとする。   This manufacturing method is to prevent the displacement without performing the bump processing step for forming the uneven shape in the first embodiment. Hereinafter, the difference from the manufacturing method of the first embodiment will be mainly described. It will be described in the following.

本実施形態の製造方法では、図４に示されるように、バンプ形成工程において、互いに接続される第１のバンプ２１と第２のバンプ２２との組において、第１のバンプ２１および第２のバンプ２２の一方のバンプを複数個のものとする。   In the manufacturing method according to the present embodiment, as shown in FIG. 4, in the bump forming step, the first bump 21 and the second bump 22 in the set of the first bump 21 and the second bump 22 connected to each other. One bump of the bump 22 is assumed to be plural.

図４に示される例では、図中の丸で囲んだＡ部における第１のバンプ２１、第２のバンプ２２が、互いに接続される組を構成しており、この組において、第２のバンプ２２を３個のものとしている。   In the example shown in FIG. 4, the first bump 21 and the second bump 22 in the circled portion A in the drawing constitute a set connected to each other. In this set, the second bump The number 22 is three.

例えば、この３個の第２のバンプ２２は３角形の頂点を構成するように配置されており、この３個の第２のバンプ２２の間に、これに対応する第１のバンプ２１の先端部２１ａが丁度入り込むようになっている。   For example, the three second bumps 22 are arranged to form a triangular apex, and the tip of the first bump 21 corresponding to the three second bumps 22 is arranged between the three second bumps 22. The part 21a just enters.

本製造方法では、このように各接合部材１１、１２にバンプ２１、２２を形成した後、第１の接合部材１１と第２の接合部材１２とを互いの一面１１ａ、１２ａにて対向させ、第１のバンプ２１と第２のバンプ２２との位置合わせを行う。   In this manufacturing method, after forming the bumps 21 and 22 on the bonding members 11 and 12 as described above, the first bonding member 11 and the second bonding member 12 are opposed to each other on one surface 11a and 12a, The first bump 21 and the second bump 22 are aligned.

そして、それぞれの第１のバンプ２１の先端部２１ａと第２のバンプ２２の先端部２２ａとを、加圧しながら接触させる。このとき、互いに接続される第１のバンプ２１と第２のバンプ２２との組においては、図５に示されるように、３個の第２のバンプ２２の間に、第１のバンプ２１の先端部２１ａが入り込んだ状態となり、この状態で両バンプ２１、２２が接触する。   And the front-end | tip part 21a of each 1st bump 21 and the front-end | tip part 22a of the 2nd bump 22 are made to contact, pressing. At this time, in the set of the first bump 21 and the second bump 22 connected to each other, as shown in FIG. 5, the first bump 21 is interposed between the three second bumps 22. The tip 21a enters the state, and the bumps 21 and 22 come into contact with each other in this state.

なお、図５においては、１個同士の接続されるべき第１のバンプ２１と第２のバンプ２２とは、識別のため便宜上ずらして示してあるが、実際には、これら両バンプ２１、２２は、丁度重なり合うように接触するものである。   In FIG. 5, the first bump 21 and the second bump 22 to be connected to each other are shown as being shifted for convenience of identification. Are in contact so that they just overlap.

そして、本製造方法における両バンプ２１、２２の接触の際には、接続されるべき第１のバンプ２１と第２のバンプ２２とで、複数個とした第２のバンプ２２の間に第１のバンプ２１の先端部２１ａが入り込んだ形となり、両バンプ２１、２２がかみ合って係止された状態で接触する。そのため、バンプ接触時における横滑りは極力防止できる。   When the bumps 21 and 22 are brought into contact with each other in the manufacturing method, the first bump 21 and the second bump 22 to be connected are arranged between the plurality of second bumps 22. The tip 21a of the bump 21 enters, and the bumps 21 and 22 are brought into contact with each other while being engaged and locked. Therefore, a side slip at the time of bump contact can be prevented as much as possible.

その後は、本製造方法においても、上記実施形態と同様に、両バンプ２１、２２の先端部２１ａ、２２ａを接触させた状態で、超音波接合や熱圧着などにより両バンプ２１、２２を電気的に接続する。   Thereafter, also in the present manufacturing method, the bumps 21 and 22 are electrically connected by ultrasonic bonding, thermocompression bonding, or the like with the tip portions 21a and 22a of the bumps 21 and 22 in contact with each other as in the above embodiment. Connect to.

このとき、３個の第２のバンプ２２と１個の第１のバンプ２１とでは、互いの先端部２１ａ、２２ａは、図５に示されるように、当該先端部２１ａ、２２ａの周辺部で接触するものであり、この接触部にて接続が行われる。   At this time, in the three second bumps 22 and the one first bump 21, the tip portions 21a and 22a of each other are the peripheral portions of the tip portions 21a and 22a as shown in FIG. Contact is made, and the connection is made at this contact portion.

こうして、本実施形態によっても、両バンプ２１、２２は電気的・機械的に接続され、バンプ２１、２２を介して、両接合部材１１、１２が電気的・機械的に接続されたバンプ接合体ができあがる。   Thus, also in this embodiment, the bumps 21 and 22 are electrically and mechanically connected, and the joint members 11 and 12 are electrically and mechanically connected via the bumps 21 and 22. Is completed.

そして、本実施形態の製造方法によれば、上述したように、複数個の第２のバンプ２２の間に他方の第１のバンプ２１の先端部２１ａが入り込んで、かみ合った状態で接触するため、両バンプ２１、２２の接触時における位置ずれを防止することができる。   According to the manufacturing method of the present embodiment, as described above, the tip portion 21a of the other first bump 21 enters between the plurality of second bumps 22 and contacts in a meshed state. In addition, it is possible to prevent the displacement of the bumps 21 and 22 when they are in contact.

なお、図４、図５に示される例では、第２のバンプ２２を３個とし、これに接続される第１のバンプ２１を１個のものとしたが、本実施形態においては、これとは逆に、第２のバンプ２２を１個のものとし、これに接続される第１のバンプ２１を３個のものとしてもよい。   In the example shown in FIGS. 4 and 5, the number of the second bumps 22 is three and the number of the first bumps 21 connected to the number is one, but in the present embodiment, Conversely, the number of the second bumps 22 may be one, and the number of the first bumps 21 connected thereto may be three.

また、複数個としてた一方のバンプの間に他方のバンプの先端部が入り込んだ形となって両バンプ２１、２２が係止された状態で接触するならば、複数個とする一方のバンプの個数は２個でもよいし、４個以上でもよい。   Further, if the bumps 21 and 22 are brought into contact with each other in a state where the tip of the other bump is inserted between the bumps of the plurality of bumps, the bumps of the plurality of bumps The number may be two, or four or more.

（第３実施形態）
上記第２実施形態では、互いに接続される第１のバンプ２１と第２のバンプ２２との組において、これら両バンプ２１、２２の一方のバンプを複数個のものとし、他方を１個のものとしたが、両方のバンプ２１、２２を複数個としてもよい。 (Third embodiment)
In the second embodiment, in the set of the first bump 21 and the second bump 22 connected to each other, one of the bumps 21 and 22 is plural, and the other is one. However, a plurality of both bumps 21 and 22 may be provided.

つまり、接続される組において、第１および第２の両バンプ２１、２２の両方を複数個のものとした場合でも、一方のバンプと他方のバンプとがかみ合った状態で接触し、位置ずれを防止できるようになっていればよい。   That is, even when the first and second bumps 21 and 22 are plural in the connected set, one bump and the other bump are in contact with each other and the positional deviation is caused. It only needs to be able to prevent it.

本発明の第３実施形態は、そのような第１および第２の両バンプ２１、２２の両方を複数個のものとした場合を提供するものである。   The third embodiment of the present invention provides a case where both the first and second bumps 21 and 22 are plural.

図６および図７は、本発明の第３実施形態に係るバンプ接合体の製造方法を示す図であり、図６は接合前の各接合部材１１、１２を示す斜視図、図７は両バンプ２１、２２を接触させた状態において接合部材１１、１２を透過して両バンプ２１、２２の平面的な位置関係を表す図である。なお、図７では、識別のため、便宜上、第1のバンプ２１にハッチングを施してある。   6 and 7 are views showing a method for manufacturing a bump bonded body according to a third embodiment of the present invention. FIG. 6 is a perspective view showing each of the bonding members 11 and 12 before bonding, and FIG. FIG. 7 is a diagram illustrating a planar positional relationship between both bumps 21 and 22 through the bonding members 11 and 12 in a state where 21 and 22 are in contact with each other. In FIG. 7, the first bumps 21 are hatched for convenience of identification.

ここでは、図６に示されるように、バンプ形成工程において、互いに接続される第１のバンプ２１と第２のバンプ２２との組において、第１のバンプ２１および第２のバンプ２２の両方を２個のものとした組を設ける。   Here, as shown in FIG. 6, in the bump forming step, both the first bump 21 and the second bump 22 are set in the set of the first bump 21 and the second bump 22 connected to each other. Two sets are provided.

そして、このようにバンプ２１、２２が形成された各接合部材１１、１２を、バンプ２１、２２を介して対向させ、それぞれの第１のバンプ２１の先端部２１ａと第２のバンプ２２の先端部２２ａとを、加圧しながら接触させる。   Then, the bonding members 11 and 12 on which the bumps 21 and 22 are formed in this way are opposed to each other through the bumps 21 and 22, and the leading end portion 21 a of each first bump 21 and the leading end of the second bump 22 are arranged. The part 22a is brought into contact with pressure.

このとき、本製造方法においては、図７に示されるように、接続される第１および第２のバンプ２１、２２をともに２個とした組において、一方の２個のバンプを結ぶ線と他方の２個のバンプを結ぶ線とが十字形状となるように重ねる。なお、図７においても、上記図５と同様の理由で、１個同士の接続されるべき第１のバンプ２１と第２のバンプ２２とは、識別のため便宜上ずらして示してある。   At this time, in this manufacturing method, as shown in FIG. 7, in the set in which both the first and second bumps 21 and 22 to be connected are two, the line connecting one of the two bumps and the other Are overlapped so that the line connecting the two bumps becomes a cross shape. In FIG. 7 as well, for the same reason as in FIG. 5, the first bump 21 and the second bump 22 that are to be connected to each other are shown shifted for convenience.

そして、この十字形状が形成された状態で、両バンプ２１、２２の先端部２１ａ、２２ａ同士が接触するため、２個同士の両バンプ２１、２２の組によって横滑りが防止された状態となる。その後は、本実施形態においても、超音波接合や熱圧着などによる両バンプ２１、２２の接続を行い、バンプ接合体ができあがる。   Since the tip portions 21a and 22a of the bumps 21 and 22 are in contact with each other in a state where the cross shape is formed, the side slip is prevented by the pair of the two bumps 21 and 22. Thereafter, also in this embodiment, the bumps 21 and 22 are connected by ultrasonic bonding, thermocompression bonding, or the like, and a bump bonded body is completed.

そして、本実施形態の製造方法によれば、２個同士の両バンプ２１、２２の組における両バンプ２１、２２のかみ合いによって、両バンプ２１、２２の接触時における位置ずれを防止することができる。   And according to the manufacturing method of this embodiment, the position shift at the time of contact of both the bumps 21 and 22 can be prevented by the engagement of both the bumps 21 and 22 in the set of two bumps 21 and 22 between two. .

（他の実施形態）
なお、第１の接合部材１１、第２の接合部材１２ともに半導体チップであること以外にも、例えば、両接合部材１１、１２の一方が配線基板で他方が半導体チップであったり、あるいは、両方とも配線基板であってもよい。 (Other embodiments)
In addition to the fact that both the first bonding member 11 and the second bonding member 12 are semiconductor chips, for example, one of the bonding members 11 and 12 is a wiring board and the other is a semiconductor chip, or both Both may be wiring boards.

また、第１の接合部材、第２の接合部材としては、それぞれの接合面にバンプが形成されるものであるならば上記実施形態に示されるものに限定されるものではなく、たとえば、接合部材としては、パッケージやリードフレームなどであってもよい。   Moreover, as a 1st joining member and a 2nd joining member, if a bump is formed in each joining surface, it will not be limited to what is shown by the said embodiment, For example, a joining member For example, a package or a lead frame may be used.

また、バンプ２１、２２の先端部２１ａ、２２ａに形成される周期的な凹凸形状としては、凹部と凸部とが一定の周期をもって繰り返し形成されたものであればよく、上記図３に示したようなピラミッド形状の凹凸以外にも、たとえば球面形状、柱状の凹凸などであってもよい。これら種々の凹凸形状は、上記凹凸部材の凹凸形状を変えることで実現可能である。   Further, the periodic uneven shape formed on the tip portions 21a and 22a of the bumps 21 and 22 may be any shape in which the concave portions and the convex portions are repeatedly formed with a constant cycle, as shown in FIG. In addition to such pyramidal irregularities, for example, spherical or columnar irregularities may be used. These various uneven shapes can be realized by changing the uneven shape of the uneven member.

本発明の第１実施形態に係るバンプ接合体の概略断面図である。It is a schematic sectional drawing of the bump bonded object concerning a 1st embodiment of the present invention. 第１実施形態の製造方法における接合工程を示す概略断面図である。It is a schematic sectional drawing which shows the joining process in the manufacturing method of 1st Embodiment. （ａ）は、第１実施形態の製造方法におけるバンプ加工工程を示す図であり、（ｂ）は（ａ）中の凹凸部材の表面の拡大図である。(A) is a figure which shows the bump process process in the manufacturing method of 1st Embodiment, (b) is an enlarged view of the surface of the uneven | corrugated member in (a). 本発明の第２実施形態に係るバンプ接合体の製造方法における接合前の各接合部材を示す斜視図である。It is a perspective view which shows each joining member before joining in the manufacturing method of the bump zygote concerning a 2nd embodiment of the present invention. 第２実施形態における両バンプを接触させた状態の両バンプの平面的な位置関係を表す図である。It is a figure showing the planar positional relationship of both the bumps of the state which made both bumps contact in 2nd Embodiment. 本発明の第３実施形態に係るバンプ接合体の製造方法における接合前の各接合部材を示す斜視図である。It is a perspective view which shows each joining member before joining in the manufacturing method of the bump zygote concerning a 3rd embodiment of the present invention. 第３実施形態における両バンプを接触させた状態の両バンプの平面的な位置関係を表す図である。It is a figure showing the planar positional relationship of both the bumps of the state which made both bumps contact in 3rd Embodiment.

符号の説明Explanation of symbols

１１…第１の接合部材、１１ａ…第１の接合部材の一面、
１２…第２の接合部材、１２ａ…第２の接合部材の一面、
２１…第１のバンプ、２１ａ…第１のバンプの先端部、
２２…第２のバンプ、２２ａ…第２のバンプの先端部、１００…凹凸部材。 11 ... 1st joining member, 11a ... One surface of 1st joining member,
12 ... 2nd joining member, 12a ... One surface of 2nd joining member,
21 ... 1st bump, 21a ... The front-end | tip part of 1st bump,
22 ... 2nd bump, 22a ... tip part of 2nd bump, 100 ... uneven | corrugated member.

Claims (4)

第１の接合部材（１１）の一面（１１ａ）に複数個の第１のバンプ（２１）を設け、前記第１の接合部材（１１）の前記一面（１１ａ）に対向させる第２の接合部材（１２）の一面（１２ａ）のうちそれぞれの前記第１のバンプ（２１）と対向する位置に第２のバンプ（２２）を設け、
前記第１の接合部材（１１）と前記第２の接合部材（１２）とを互いの一面（１１ａ、１２ａ）にて対向させ、
それぞれの前記第１のバンプ（２１）の先端部（２１ａ）と前記第２のバンプ（２２）の先端部（２２ａ）とを接触させて電気的に接続してなるバンプ接合体の製造方法において、
前記第１のバンプ（２１）の先端部（２１ａ）および前記第２のバンプ（２２）の先端部（２２ａ）を周期的な凹凸を有する形状とした後、
前記両バンプ（２１、２２）の先端部（２１ａ、２２ａ）の凹凸部をかみ合わせるように前記両バンプ（２１、２２）を接触させ、接続を行うようにしたことを特徴とするバンプ接合体の製造方法。 A second bonding member provided with a plurality of first bumps (21) on one surface (11a) of the first bonding member (11) and facing the one surface (11a) of the first bonding member (11). A second bump (22) is provided at a position facing the first bump (21) of one surface (12a) of (12),
The first joining member (11) and the second joining member (12) are opposed to each other on one surface (11a, 12a),
In the method for manufacturing a bump bonded body, wherein the tip end portion (21a) of each of the first bumps (21) and the tip end portion (22a) of the second bump (22) are brought into contact and electrically connected. ,
After making the tip (21a) of the first bump (21) and the tip (22a) of the second bump (22) into a shape having periodic irregularities,
Bump bonded body characterized in that the bumps (21, 22) are brought into contact with each other so as to engage the concave and convex portions of the tip portions (21a, 22a) of the bumps (21, 22). Manufacturing method. 前記両バンプ（２１、２２）の先端部（２１ａ、２２ａ）を前記凹凸を有する形状とすることは、
表面に前記凹凸を有する形状が設けられた部材（１００）を用い、この部材（１００）の前記表面を、それぞれの前記バンプ（２１、２２）の先端部（２１ａ、２２ａ）に押しつけて当該先端部（２１ａ、２２ａ）を変形させることにより行うことを特徴とする請求項１に記載のバンプ接合体の製造方法。 Making the tip portions (21a, 22a) of the bumps (21, 22) have the irregularities,
A member (100) having a surface with the irregularities is used, and the surface of the member (100) is pressed against the tip (21a, 22a) of each bump (21, 22). The method for manufacturing a bump bonded body according to claim 1, wherein the method is performed by deforming the portions (21 a, 22 a). 前記第１の接合部材（１１）の一面（１１ａ）に複数個の第１のバンプ（２１）を設け、前記第１の接合部材（１１）の前記一面（１１ａ）に対向させる第２の接合部材（１２）の一面（１２ａ）のうちそれぞれの前記第１のバンプ（２１）と対向する位置に第２のバンプ（２２）を設け、
前記第１の接合部材（１１）と前記第２の接合部材（１２）とを互いの一面（１１ａ、１２ａ）にて対向させ、
それぞれの前記第１のバンプ（２１）の先端部（２１ａ）と前記第２のバンプ（２２）の先端部（２２ａ）とを接触させて電気的に接続してなるバンプ接合体の製造方法において、
互いに接続される前記第１のバンプ（２１）と前記第２のバンプ（２２）との組において、前記第１のバンプ（２１）および前記第２のバンプ（２２）の少なくとも一方のバンプを複数個のものとして、当該第１および第２のバンプ（２１、２２）が互いにかみ合った状態となるように接触させることを特徴とするバンプ接合体の製造方法。 A plurality of first bumps (21) are provided on one surface (11a) of the first bonding member (11), and the second bonding is made to face the one surface (11a) of the first bonding member (11). A second bump (22) is provided at a position facing the first bump (21) of one surface (12a) of the member (12),
The first joining member (11) and the second joining member (12) are opposed to each other on one surface (11a, 12a),
In the method for manufacturing a bump bonded body, wherein the tip end portion (21a) of each of the first bumps (21) and the tip end portion (22a) of the second bump (22) are brought into contact and electrically connected. ,
In the set of the first bump (21) and the second bump (22) connected to each other, a plurality of at least one of the first bump (21) and the second bump (22) are provided. A method for manufacturing a bump bonded body, characterized in that the first and second bumps (21, 22) are brought into contact with each other so as to be engaged with each other. 前記第１および前記第２のバンプ（２１、２２）として、金よりなる金バンプを用いることを特徴とする請求項１ないし３のいずれか１つに記載のバンプ接合体の製造方法。 The method of manufacturing a bump bonded body according to any one of claims 1 to 3, wherein gold bumps made of gold are used as the first and second bumps (21, 22).
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324386A (en) * 2006-06-01 2007-12-13 Fujitsu Ltd Semiconductor device, and its manufacturing method
JP2009212492A (en) * 2008-03-03 2009-09-17 Samsung Electro-Mechanics Co Ltd Method of manufacturing package substrate, and method of manufacturing semiconductor package
JP2009266898A (en) * 2008-04-22 2009-11-12 Panasonic Electric Works Co Ltd Semiconductor element mounting structure
JP2010541244A (en) * 2007-09-28 2010-12-24 テッセラ，インコーポレイテッド Flip chip interconnect with double posts
JP2011192895A (en) * 2010-03-16 2011-09-29 Zycube:Kk Method for mounting semiconductor chip
JP2011192894A (en) * 2010-03-16 2011-09-29 Zycube:Kk Method for mounting semiconductor device
JP2013115135A (en) * 2011-11-25 2013-06-10 Internatl Business Mach Corp <Ibm> Creation of combination of studs used for high-precision alignment between multiple chips
US9030001B2 (en) 2010-07-27 2015-05-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
US9496236B2 (en) 2010-12-10 2016-11-15 Tessera, Inc. Interconnect structure
JP2017028156A (en) * 2015-07-24 2017-02-02 新光電気工業株式会社 Mounting structure and manufacturing method therefor
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10535626B2 (en) 2015-07-10 2020-01-14 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
JP2020149992A (en) * 2019-03-11 2020-09-17 浜松ホトニクス株式会社 Semiconductor device and method of manufacturing the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465846A (en) * 1990-07-06 1992-03-02 Nec Corp Method and jig for forming metal protrusion forming
JPH05235061A (en) * 1991-08-28 1993-09-10 Hitachi Ltd Electronic circuit joining device and method, solder ball, and aligning mark
JPH05235099A (en) * 1992-02-21 1993-09-10 Toshiba Corp Circuit device mounting semiconductor
JPH06310565A (en) * 1993-04-20 1994-11-04 Fujitsu Ltd Flip-chip bonding method
JPH0870019A (en) * 1994-08-30 1996-03-12 Casio Comput Co Ltd Connector structure of electronic parts and connection thereof
JPH09330933A (en) * 1996-06-12 1997-12-22 Matsushita Electric Ind Co Ltd Formation of bump electrode part
JP2001068509A (en) * 1999-08-25 2001-03-16 Matsushita Electric Ind Co Ltd Semiconductor mounting method and semiconductor device
JP2003526937A (en) * 2000-03-10 2003-09-09 チップパック，インク． Flip chip bonding structure
WO2005069364A1 (en) * 2004-01-13 2005-07-28 Matsushita Electric Industrial Co., Ltd. Mounted board, electronic component mounting method, electronic component, and wiring board

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465846A (en) * 1990-07-06 1992-03-02 Nec Corp Method and jig for forming metal protrusion forming
JPH05235061A (en) * 1991-08-28 1993-09-10 Hitachi Ltd Electronic circuit joining device and method, solder ball, and aligning mark
JPH05235099A (en) * 1992-02-21 1993-09-10 Toshiba Corp Circuit device mounting semiconductor
JPH06310565A (en) * 1993-04-20 1994-11-04 Fujitsu Ltd Flip-chip bonding method
JPH0870019A (en) * 1994-08-30 1996-03-12 Casio Comput Co Ltd Connector structure of electronic parts and connection thereof
JPH09330933A (en) * 1996-06-12 1997-12-22 Matsushita Electric Ind Co Ltd Formation of bump electrode part
JP2001068509A (en) * 1999-08-25 2001-03-16 Matsushita Electric Ind Co Ltd Semiconductor mounting method and semiconductor device
JP2003526937A (en) * 2000-03-10 2003-09-09 チップパック，インク． Flip chip bonding structure
WO2005069364A1 (en) * 2004-01-13 2005-07-28 Matsushita Electric Industrial Co., Ltd. Mounted board, electronic component mounting method, electronic component, and wiring board

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324386A (en) * 2006-06-01 2007-12-13 Fujitsu Ltd Semiconductor device, and its manufacturing method
US8884448B2 (en) 2007-09-28 2014-11-11 Tessera, Inc. Flip chip interconnection with double post
JP2010541244A (en) * 2007-09-28 2010-12-24 テッセラ，インコーポレイテッド Flip chip interconnect with double posts
US8558379B2 (en) 2007-09-28 2013-10-15 Tessera, Inc. Flip chip interconnection with double post
JP2009212492A (en) * 2008-03-03 2009-09-17 Samsung Electro-Mechanics Co Ltd Method of manufacturing package substrate, and method of manufacturing semiconductor package
JP2009266898A (en) * 2008-04-22 2009-11-12 Panasonic Electric Works Co Ltd Semiconductor element mounting structure
JP2011192895A (en) * 2010-03-16 2011-09-29 Zycube:Kk Method for mounting semiconductor chip
JP2011192894A (en) * 2010-03-16 2011-09-29 Zycube:Kk Method for mounting semiconductor device
US9397063B2 (en) 2010-07-27 2016-07-19 Tessera, Inc. Microelectronic packages with nanoparticle joining
US9030001B2 (en) 2010-07-27 2015-05-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
US9496236B2 (en) 2010-12-10 2016-11-15 Tessera, Inc. Interconnect structure
JP2013115135A (en) * 2011-11-25 2013-06-10 Internatl Business Mach Corp <Ibm> Creation of combination of studs used for high-precision alignment between multiple chips
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9818713B2 (en) 2015-07-10 2017-11-14 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10535626B2 (en) 2015-07-10 2020-01-14 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10892246B2 (en) 2015-07-10 2021-01-12 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US11710718B2 (en) 2015-07-10 2023-07-25 Adeia Semiconductor Technologies Llc Structures and methods for low temperature bonding using nanoparticles
JP2017028156A (en) * 2015-07-24 2017-02-02 新光電気工業株式会社 Mounting structure and manufacturing method therefor
JP2020149992A (en) * 2019-03-11 2020-09-17 浜松ホトニクス株式会社 Semiconductor device and method of manufacturing the same

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