JP6133140B2 - Junction structure and manufacturing method thereof - Google Patents

Description

  The present invention relates to a joint structure used at the time of mounting and a manufacturing method thereof.

  In recent years, in the manufacture of LSI and MEMS devices, a chip mounting technique in which a chip is bonded to a pair of chips or a wafer before being divided into chips has been widely used (see Non-Patent Document 1). These chip mounting technologies are called “Chip on chip (CoC)”, “Chip on Wafer (CoW)”, and the like.

  In the above-described chip mounting technology, for example, the chips are bonded to each other via a joint having a protruding structure such as a bump formed on the chip surface, or a ring-shaped convex structure that also serves as a plate or an airtight seal. Connections and structural connections are made. Such a chip mounting technique does not require a peripheral wiring (wire bonding) space and can reduce the chip size as compared with a conventional wire bonding mounting technique.

  By the way, in technologies such as an optical device and a MEMS device, performance greatly varies due to an error in the positional relationship between elements. For this reason, when the chip mounting technique described above is applied to an optical device, a MEMS device, or the like, the alignment accuracy at the time of mounting becomes important. As a technique for improving the accuracy at the time of chip mounting, there is a method for improving accuracy by using a high-precision mounting machine and repeatedly performing proximity and position confirmation between chips until the target accuracy is achieved (see Patent Document 1).

  In addition, a method for mechanically correcting mounting displacement by forming an inclined fitting structure by etching, plating, etc. in addition to the joint at the stage of the wafer process for manufacturing a chip in alignment during mounting. Has also been proposed (see Patent Document 2). In this technique, mounting is performed by aligning chips at a portion of a corresponding fitting structure. At this time, even if the fitting structures are arranged in a slightly displaced state, if a load is applied in the fitting direction, the inclined surfaces of the fitting structures slide against each other and move to the fitting position. And stop. After that, if bonding is performed by a method such as an adhesive or solder, mounting can be performed in a state of being aligned with each other.

  According to the technique of Patent Document 2, it is not necessary to perform special operations such as repeated positioning as compared with Patent Document 1, and can be carried out with an inexpensive mounting apparatus with lower accuracy. In addition, the time required for mounting can be shortened. For this reason, the mounting which performs alignment by the fitting structure has a great advantage as a high-precision mounting method suitable for mass production.

JP 2007-096057 A Japanese Patent Laid-Open No. 07-077634

K. Tanida, M. Umemoto, Y. Tomita, M. Tago, R. Kajiwara, Y. Akiyama, and K. Takahashi, "Au bump interconnection with ultrasonic Flip-Chip bonding in 20 μm Pitch", Japanese Journal of Applied Physics , vol.42, pp.2198-2203, 2003.

  However, the formation of the fitting structure described above requires processing at a wafer process level such as a wet process, an etching process, and a plasma process. For this reason, in the fabrication of delicate devices such as optical devices that require high accuracy with respect to the optical characteristics of the surface and MEMS devices having a microscopic suspended structure, damage to the device due to the above-mentioned processing is individually performed during process design. It is necessary to consider.

  In particular, in the case of a MEMS device that requires a chip-to-chip height (distance) of about 50 μm or more, when forming a mating structure, surface processing with a larger step or thick film plating treatment to obtain a larger height It is necessary to do. For this reason, in order to form a fitting structure, a longer processing time is required compared with a MEMS device having an element film thickness of about several μm, and the possibility of damaging the device is increased.

  In addition, as described above, the mounting technology such as “Chip on chip (CoC)” aims to further reduce the size of the chip. For example, the wiring area for wire bonding in the peripheral portion is reduced. ing. On the other hand, as described above, when the fitting structure is used, a new region for forming the fitting structure is required, which is contrary to the reduction of the chip.

  The present invention has been made to solve the above-described problems, and can be applied to mounting a smaller chip, and can be applied to a device formed on the chip without damaging the fitting structure. The purpose is to enable alignment during mounting.

The bonding structure according to the present invention includes a first substrate, a second substrate to be mounted on the first substrate, and bumps made of a metal material having an upper surface formed at an alignment position of the main surface of the first substrate as a bonding surface. a first joint portion that is provided with a second joint consisting of the bump made of a metal material and the second bonding surface a top surface formed on the alignment portion of the main surface of the substrate, the first joint portion The joint surface extends in the first direction on a plane parallel to the main surface of the first substrate, and has a plurality of groove portions having the same groove width arranged at equal intervals in the direction perpendicular to the first direction on the plane. And a bonding surface of the second bonding portion extends in the second direction on a plane parallel to the main surface of the second substrate and is perpendicular to the second direction on the plane. A second fitting structure of irregularities by a plurality of groove portions of the same groove width arranged at equal intervals in the direction, Bonding surface of the first joining portion and the bonding surface of the second connecting portion, the first fitting structure and are joined fitted and a second mating structure, the first fitting structure and the second mating structure a shall have a relationship in which one is transferring the shape to the other.

In the junction structure, a metal material may be Re Au der.

  In the joint structure, the fitting structure of the first joint portion includes an inclined surface having an inverse tangent or more of the static friction coefficient of the surface of the fitting structure, and the fitting structure of the second joint portion is a surface of the fitting structure. It suffices to provide an inclined surface that is equal to or greater than the arc tangent of the static friction coefficient.

In addition, the manufacturing method of the bonding structure according to the present invention includes a first step of forming a first bonding portion having a bonding surface on the upper surface with a bump made of a metal material at a position where the main surface of the first substrate is aligned, A second step of forming a second bonding portion having a top surface as a bonding surface at a position of alignment of the main surface of the second substrate mounted on the substrate with a bump made of a metal material ; and a bonding surface of the first bonding portion on the first surface First fitting of concavities and convexities by a plurality of groove portions of the same groove width extending in a first direction on a plane parallel to the main surface of the substrate and arranged at equal intervals in a direction perpendicular to the first direction on the plane A third step of forming a mating structure by an imprint method; and a second surface extending in a second direction on a plane parallel to the main surface of the second substrate and extending in a second direction on a bonding surface of the second bonding portion Second fitting of irregularities by a plurality of groove portions having the same groove width arranged at equal intervals in a direction perpendicular to And a fourth step of forming a structure by imprinting, the bonding surface of the first joint portion and the joint surface of the second connecting portion, fitted first mating structure and the second mating structure They are joined, the first fitting structure and the second mating structure, that has become a relationship in which one is transferring the shape to the other.

  The method for manufacturing a joint structure includes a fifth step of forming an alignment recess for alignment at the time of forming the fitting structure on each of the main surface of the first substrate and the main surface of the second substrate. In the third step, A sphere made of an elastic member provided in the alignment portion of the mold substrate used in the imprint method is disposed in the alignment recess of the first substrate, and the sphere is deformed by pressing the mold substrate against the first substrate. In the fourth step, the sphere provided in the alignment portion of the mold substrate used in the imprint method is placed in the alignment recess of the second substrate, and the sphere is deformed by pressing the mold substrate against the second substrate. The imprint method may be performed.

In the method for manufacturing the bonding structure, it is used Au as the metallic material.

  In the manufacturing method of the joint structure, the fitting structure of the first joint portion is formed in a state having an inclined surface equal to or greater than the inverse tangent of the static friction coefficient of the surface of the fitting structure, and the fitting structure of the second joint portion is The surface of the fitting structure may be formed in a state having an inclined surface equal to or greater than the arc tangent of the static friction coefficient.

  As described above, according to the present invention, it can be applied to mounting of a smaller chip, and can be aligned at the time of mounting by a fitting structure without damaging a device formed on the chip. An excellent effect is obtained.

FIG. 1 is a configuration diagram for explaining a joint structure according to an embodiment of the present invention. FIG. 2 is a configuration diagram for explaining a method for manufacturing a joint structure according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram for explaining a joint structure according to an embodiment of the present invention. 1A is a cross-sectional view schematically showing the structure of the joining structure, FIGS. 1B and 1C are perspective views showing a part of the joining structure, and FIGS. 1D and 1E are joining structures. Sectional drawing which shows a part of (f) is a top view which shows a part of joining structure.

  This bonding structure first includes a first substrate 101 and a second substrate 121 mounted on the first substrate 101. In addition, the first substrate 101 includes a first bonding portion 104 having an upper surface formed at an alignment position of the main surface of the first substrate 101 as a bonding surface. Similarly, the second substrate 121 includes a second bonding portion 124 having an upper surface formed at a position where the main surface of the second substrate 121 is aligned as a bonding surface. The first fitting structure 105 and the second fitting structure 125 only need to have a relationship in which one of the shapes is transferred to the other.

  Moreover, the 1st junction part 104 and the 2nd junction part 124 should just be formed in the corresponding alignment location in each of the 1st board | substrate 101 and the 2nd board | substrate 121. FIG. In other words, the corresponding first joint 104 and second joint 124 are joined by joining the first fitting structure 105 and the second fitting structure 125 to each other, thereby joining the first substrate 101 and the second joint. What is necessary is just to arrange | position the 1st junction part 104 and the 2nd junction part 124 so that position alignment with the board | substrate 121 can be performed.

  The first substrate 101 is made of a semiconductor such as silicon (Si). An Au thin film pad 103 made of gold (Au) is formed on the first substrate 101 via a Ti adhesion layer 102 made of titanium (Ti). A first bonding portion 104 is formed on the Au thin film pad 103. Similarly, the second substrate 121 is made of a semiconductor such as Si, for example. Further, an Au thin film pad 123 is formed on the second substrate 121 via a Ti adhesion layer 122. A second bonding portion 124 is formed on the Au thin film pad 123. These constitute, for example, a “CoC” junction.

  The bonding surfaces of the first bonding portions 104 extend in the first direction on a plane parallel to the main surface of the first substrate 101 and are arranged at equal intervals in the direction perpendicular to the first direction on the plane. In addition, the first fitting structure 105 having unevenness by a plurality of groove portions 151 having the same groove width is provided. As shown in FIG. 1B, between the adjacent groove portions 151, there are ridges 152 of the filaments extending in the first direction (y direction). The peaks 152 are also arranged at equal intervals in the direction perpendicular to the first direction (x direction). In the first fitting structure 105, it can be said that a periodic uneven shape having an inclination is formed in a two-dimensional plane wave shape.

  Similarly, the bonding surfaces of the second bonding portions 124 extend in the second direction on a plane parallel to the main surface of the second substrate 121 and are arranged at equal intervals in the direction perpendicular to the second direction on the plane. The uneven | corrugated 2nd fitting structure 125 by the several groove part of the same groove width made is provided. Between adjacent groove parts, it becomes the peak part of the filament extended in a 2nd direction. It can be said that the second fitting structure 125 also has a periodic uneven shape having an inclination formed in a two-dimensional plane wave shape.

  The joint surface of the first joint portion 104 configured as described above and the joint surface of the second joint portion 124 are joined by fitting the first fitting structure 105 and the second fitting structure 125 together. Become. In other words, the 1st fitting structure 105 and the 2nd fitting structure 125 should just be made into the shape which can be mutually fitted. For example, as illustrated in FIGS. 1A, 1 </ b> B, 1 </ b> C, and 1 </ b> D, the first fitting structure 105 and the second fitting structure 125 in the first direction (second direction). The cross-sectional shape of the vertical surface may be a shape represented by a periodic function such as a sin wave shape or a continuous semicircular shape. Moreover, the cross-sectional shape of the surface perpendicular to the first direction (second direction) of the first fitting structure 105 and the second fitting structure 125 is the fitting of the joining portion 104a as shown in FIG. It is better if the mating structure 105a has a triangular wave shape.

  Moreover, the 1st junction part 104 and the 2nd junction part 124 are good to be comprised from the material which can join both directly in the state which fitted the 1st fitting structure 105 and the 2nd fitting structure 125. FIG. . For example, if the first bonding portion 104 and the second bonding portion 124 are made of Au, a natural oxide film or the like is not formed even in the atmosphere. Therefore, the first bonding portion 104 and the second bonding portion 124 are directly bonded by applying a predetermined pressure. It is possible. Moreover, even if the 1st junction part 104 and the 2nd junction part 124 are metals, such as silver (Ag), copper (Cu), and aluminum (Al), a junction surface is made into plasma in what is called a vacuum processing apparatus, for example. After removing the natural oxide film and the like by treatment with the above, it is possible to directly bond by fitting and applying a predetermined pressure.

  Here, the shapes of the first fitting structure 105 and the second fitting structure 125 will be described. First, even if the alignment state of the first joint portion 104 and the second joint portion 124 is shifted to some extent, when the first fitting structure 105 and the second fitting structure 125 are brought into contact with each other, the inclined surface In this case, the state of misalignment can be eliminated by causing the slides to slide together. Therefore, it is important that the surface of the fitting structure is slippery.

  In general, when a load is applied in the vertical direction to two inclined surfaces, whether or not slip occurs between the surfaces is uniquely determined by a static friction coefficient between the two surfaces and an inclination angle. For this reason, when the fitting structure receives a load, in order to cause slipping, the inclination angle of the contact point needs to be greater than a certain angle.

For example, as shown in FIGS. 1D and 1E, the inclination angles θ1 and θ2 are expressed by arctan (μ ₀ ) where the static friction coefficient of the surface of the fitting structure is μ ₀ . When the fitting structure is made of Au, the static friction coefficient of the surface of the fitting structure is μ ₀ = 0.49, and this angle is 26 °. Here, due to the cross-sectional shape of the fitting structure, when the first fitting structure 105 and the second fitting structure 125 are fitted, the fitting structure 105a and the fitting structure 125a are fitted. If the inclination angle of the contact point exceeds 26 °, that is, maximum errors d1 and d2 that can be corrected by this structure are obtained.

For example, as shown in (d) of FIG. 1, represented by formula (1) below the cross-sectional shape, the period p, when the sin function of the amplitude d _0/2, the maximum error d1 has the following formula ( 2).

Specifically, when p = 10 μm, d ₀ = 4 μm, and the cross-sectional shape is the above-described sin function, d1≈3.8 μm. Therefore, when mounting is performed by fitting the first fitting structure 105 and the second fitting structure 125 with the cross-sectional shape sine function having this dimension, a maximum error of 3.8 μm can be corrected. As described above, the fitting structure of each joint is formed in a state having an inclined surface having an inverse tangent or more of the static friction coefficient of the surface of the fitting structure, so that the gap between the first substrate and the second substrate is formed. It is possible to eliminate a certain degree of misalignment. In addition, it cannot be overemphasized that this inclined surface will be in the state which can be anticipated when seeing the joining surface of a junction part upper part from the upper side of the side away from a board | substrate.

Further, for example, as shown in (e) in FIG. 1, the following equation sectional shape (3), represented by (4), the period p, when the triangular wave amplitude d _0/2, the maximum error d2 is The following equation (5) is obtained.

  By the way, as shown in the plan view of FIG. 1F, the joint 112 and the joint 113 may be arranged in the periphery of the chip 110. The chip 110 has a square shape in plan view, and is composed of two sets of opposite sides facing each other. The joint 112 is arranged in the peripheral part on the two sides of one set. In addition, joints 113 are arranged in the peripheral part on the two sides of the other set.

  The extending direction of the groove portion of the joint 112 is parallel to the extending direction of the two sides of one set. Further, the extending direction of the groove portion of the joint portion 113 is parallel to the extending direction of the two sides of the other set. Therefore, the extending direction of the groove portion of the joint portion 112 and the extending direction of the groove portion of the joint portion 113 are perpendicular to each other. By configuring in this way, the chips as described above for both the extending direction (x-axis direction) of the two sides of one set and the extending direction (y-axis direction) of the two sides of the other set. It is possible to correct (cancel) an error during the positioning of the.

  Moreover, it is preferable to form a recess 114 on the chip 110 for alignment during imprinting for forming a fitting structure described later. The concave portion 114 may have a circular cylindrical shape in plan view or a hemispherical shape. Further, the recess 114 may have a rectangular parallelepiped shape in a plan view. Moreover, the depth should just be about 5 micrometers. As will be described later, if the concave portion 114 is formed at a location corresponding to the convex portion (spherical portion) made of an elastic member formed on the mold substrate used for imprinting, the convex portion is fitted into the concave portion 114. Then, the mold substrate and the chip 110 can be aligned.

  Next, the manufacturing method of the junction structure in the embodiment of the present invention will be described with reference to FIG. FIG. 2 is a configuration diagram for explaining a method for manufacturing a joint structure according to an embodiment of the present invention. In FIG. 2, the state of the cross section in the middle process is shown typically.

  First, as shown in FIG. 2A, a first bonding portion 204 having an upper surface as a bonding surface is formed at a position where the main surface of the first substrate 201 is aligned (first step). For example, the first substrate 201 is made of a semiconductor such as Si. Further, an Au thin film pad 203 is formed on the first substrate 201 via a Ti adhesion layer 202, and a first bonding portion 204 is formed on the Au thin film pad 203.

  For example, the Ti adhesion layer 202 and the Au thin film pad 203 may be formed by first depositing Ti on the first substrate 201 by sputtering, vapor deposition, or the like, and depositing Au thereon. The Ti adhesion layer 202 may be about 0.1 μm thick, and the Au thin film pad 203 may be about 0.1 μm thick. On the first substrate 201, a chip function unit such as an integrated device including a MEMS structure, an optical light emitting element, a transistor, a resistor, a capacitor, and a wiring is formed in a region (not shown).

  The first joint portion 204 is a bump made of, for example, Au. For example, a well-known wire bonding apparatus is used to discharge the Au wire tip to melt the metal to form a ball, and then apply the ultrasonic wave to the ball formed at a predetermined pressure with a predetermined pressure on the Au thin film pad 203. The 1st junction part 204 is formed by pressing on a location. During this formation, the first substrate 201 is preferably heated to about 150 ° C. The first joint 204 may have a diameter in plan view of about 10 μm to about 150 μm.

  The first substrate 201 is formed with an alignment recess 205 for alignment with a mold substrate 221 described later. The alignment recess 205 is formed at a location corresponding to the alignment portion 223 of the mold substrate 221. For example, the recess 205 may be formed by a well-known photolithography technique and etching technique. What is necessary is just to form simultaneously with a chip function part. The recess 205 is formed so as not to damage the chip function unit. Further, the recess 205 may be, for example, a circular cylindrical shape in plan view. The recess 205 may be hemispherical. Further, the recess 205 may have a rectangular parallelepiped shape in a plan view. Further, the recess 205 may have a depth of about 5 μm.

  Further, as shown in FIG. 2B, a mold substrate 221 is prepared. On the mold substrate 221, a mold part 222 made of unevenness for forming a fitting structure is formed. For example, the mold part 222 is a plane parallel to the surface of the mold substrate 221, and includes a plurality of groove parts having the same groove width that extend in the same direction and are arranged at equal intervals in a direction perpendicular to the extending direction. Consists of irregularities. The unevenness is formed in the z direction. A spherical body 225 made of an elastic member is fixed to the alignment portion 223 of the mold substrate 221 by an adhesive 224.

  Next, as shown in FIG. 2C, the flat plate 231 is pressed against the upper surface (bonding surface) of the first bonding portion 204 to be flattened. For example, the flat surface of the flat plate 231 made of Si is pressed against the upper surface (bonding surface) of the first bonding portion 204 and deformed under a temperature condition of 450 ° C. or less, so that the upper surface of the first bonding portion 204 is made flat. To do. The load to be pressed may be about 1 N or less per one first joint portion 204. The diameter of the flat surface to be formed may be about 10 μm to about 120 μm.

  Next, as shown in FIG. 2D, the sphere 225 provided in the alignment portion 223 of the mold substrate 221 is disposed in the alignment recess 205 of the first substrate 201. As a result, each mold part 222 of the mold substrate 221 is arranged on the upper surface of each first bonding part 204 formed on the first substrate 201.

  Next, as shown in FIG. 2E, the mold substrate 221 is pressed against the first substrate 201 to transfer the shape of the mold part 222 to the upper surface of the first bonding part 204. At this time, the sphere 225 is deformed so as to be crushed. Thereafter, when the mold substrate 221 is released, the shape of the mold part 222 is transferred to the upper surface (joint surface) of the first joint part 204 as shown in FIG. Is formed. The first fitting structures 206 extend in the first direction on a plane parallel to the main surface of the first substrate 201, and are identical grooves arranged at equal intervals in a direction perpendicular to the first direction on the plane. It has unevenness due to a plurality of grooves having a width.

  When the mold substrate 221 is pressed against the first substrate 201 by the imprint method described above, it may be about 10 N or less per one first bonding portion 204. It is desirable that the load is larger than the load at the time of forming the flat portion.

Note that, in the second substrate (not shown) mounted on the first substrate 201 as well, a second bonding portion is formed, and a plane parallel to the main surface of the second substrate is formed on the bonding surface of the second bonding portion. Formed by the imprint method is an uneven second fitting structure formed by a plurality of grooves having the same groove width and extending in the second direction on the plane and arranged at equal intervals in a direction perpendicular to the second direction on the plane. do it. For example, the shape of the mold part 222 for forming the first fitting structure 206 is the shape of the second fitting structure in the second joint part, and the shape of the mold part used for forming the second fitting structure Is the shape of the first mating structure 206. Therefore, the bonding surface and the bonding surface of the second joint of the first joint portion 204, it is possible to bond fitted first mating structure and the second mating structure.

  As described above, according to the present invention, since the fitting structure is formed on the joint surface of the joint portion, it can be applied to mounting of a smaller chip. Further, according to the present invention, since the fitting structure is formed by the imprint method, the fitting structure can be formed without damaging the device formed on the chip. Can be aligned. Also, according to the imprint method, once a mold substrate is manufactured, a mating structure can be easily formed without requiring a wafer process with a large processing amount such as deep etching or a wet process.

  The present invention is not limited to the embodiment described above, and many modifications and combinations can be implemented by those having ordinary knowledge in the art within the technical idea of the present invention. It is obvious.

  DESCRIPTION OF SYMBOLS 101 ... 1st board | substrate, 102 ... Ti adhesion layer, 103 ... Au thin film pad, 104 ... 1st junction part, 104a ... Joint part, 105 ... 1st fitting structure, 105a ... fitting structure, 110 ... chip | tip, 112, 113 ... Junction part, 114 ... recess, 121 ... second substrate, 122 ... Ti adhesion layer, 123 ... Au thin film pad, 124 ... second joint part, 125 ... second fitting structure, 125a ... fitting structure, 151 ... Groove, 152 ... mountain.

Claims (7)

A first step of forming a first bonding portion having an upper surface as a bonding surface at an alignment position of the main surface of the first substrate with a bump made of a metal material ;
A second step of forming a second bonding portion having a top surface as a bonding surface with a bump made of a metal material at an alignment position of the main surface of the second substrate mounted on the first substrate;
Extending in the first direction on a plane parallel to the main surface of the first substrate and arranged at equal intervals in the direction perpendicular to the first direction on the plane on the bonding surface of the first bonding portion A third step of forming a first fitting structure of irregularities by a plurality of groove portions having the same groove width by an imprint method;
Extending in the second direction on a plane parallel to the main surface of the second substrate and arranged at equal intervals in the direction perpendicular to the second direction on the plane on the joint surface of the second joint portion And a fourth step of forming an uneven second fitting structure by a plurality of grooves having the same groove width by an imprint method,
Wherein the first and the bonding surface and the bonding surface of the second connecting portion of the joint portion, the is the first fitting structure second mating structure and a fitted junction, wherein the first fitting structure the second mating structure, the manufacturing method of the joining structure characterized that you have a relationship that one is transferring the shape to the other. In the manufacturing method of the junction structure according to claim 1,
A fifth step of forming an alignment recess for alignment when forming a fitting structure on each of the main surface of the first substrate and the main surface of the second substrate;
In the third step, a spherical body made of an elastic member provided in an alignment portion of the mold substrate used in the imprint method is disposed in the alignment recess of the first substrate, and the mold substrate is pressed against the first substrate. Performing the imprint method by deforming the sphere,
In the fourth step, the sphere provided in the alignment portion of the mold substrate used in the imprint method is disposed in the alignment recess of the second substrate, and the sphere is pressed by pressing the mold substrate against the second substrate. A method for manufacturing a joint structure, wherein the imprinting method is performed after deformation. In the manufacturing method of the junction structure according to claim 1 or 2,
Method for producing a joint structure characterized by Rukoto using Au as the metallic material. In the manufacturing method of the junction structure according to any one of claims 1 to 3,
The fitting structure of the first joint portion is formed in a state having an inclined surface equal to or greater than the arctangent of the static friction coefficient of the surface of the fitting structure,
The fitting structure of the second joining portion is formed in a state having an inclined surface having an inverse tangent or more of a static friction coefficient of a surface of the fitting structure. A first substrate and a second substrate mounted on the first substrate;
A first bonding portion composed of a bump made of a metal material having an upper surface formed at an alignment portion of the main surface of the first substrate as a bonding surface;
A second bonding portion composed of a bump made of a metal material having an upper surface formed at an alignment position of the main surface of the second substrate as a bonding surface;
The bonding surfaces of the first bonding portions extend in the first direction on a plane parallel to the main surface of the first substrate, and are arranged at equal intervals in the direction perpendicular to the first direction on the plane. Provided with a first fitting structure of irregularities by a plurality of groove portions having the same groove width,
The bonding surfaces of the second bonding portions extend in the second direction on a plane parallel to the main surface of the second substrate, and are arranged at equal intervals in the direction perpendicular to the second direction on the plane. Provided with a second fitting structure of irregularities by a plurality of groove portions of the same groove width,
Wherein the first and the bonding surface and the bonding surface of the second connecting portion of the joint portion, the is the first fitting structure second mating structure and a fitted junction, wherein the first fitting structure bonding structure and a second mating structure, one of which is characterized that you have a relationship to transfer the shape to the other. The joining structure according to claim 5,
Junction structure wherein the metal material is characterized by Au der Rukoto. In the junction structure according to claim 5 or 6,
The fitting structure of the first joint portion includes an inclined surface equal to or greater than the arctangent of the static friction coefficient of the surface of the fitting structure,
The fitting structure of the second joint portion includes an inclined surface having an inverse tangent or more of a static friction coefficient of a surface of the fitting structure.

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