JP2007165745A - Mounting structure, electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve electric reliability of a mounting structure by reducing and stabilizing resistance in a conductive connection portion by improving a conductive connection state between a protruding electrode and a conductor in a mounting structure or an electrooptical device provided with the same. <P>SOLUTION: This electrooptical device 100 is provided with an electronic component 120 provided with protruding electrodes 121, 122; and an electrooptical panel having a substrate having an electrooptical substance arranged thereon and provided with conductors 117, 118 coductively connected to the protruding electrode via conductive particles 132, on the substrate 111. In this device 100, the electronic component is bonded on the substrate by an insulation resin 131, a minute surface uneven shape is provided on the conductors, and the conductors are conductively connected with the conductive particles in a mode in which the conductive particles are engaged with the surface uneven shape. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a mounting structure, an electro-optical device, and an electronic apparatus, and more particularly to a mounting structure suitable for mounting a semiconductor device or other electronic components on a hard substrate such as glass or ceramics.

Generally, when an electronic component such as a semiconductor chip is mounted on a substrate, an electrode of the electronic component formed with a narrow pitch of about several tens of μm and a corresponding conductor such as a wiring pattern on the substrate are provided. An anisotropic conductive material (ACF: Anisotropic Conductive Film / Pas) in which fine conductive particles are mixed in an insulating resin for accurate and reliable conductive connection.
te) is used. For example, by interposing a thin film-like anisotropic conductive material between an electronic component and the substrate and thermocompression bonding the electronic component onto the substrate, the insulating resin softens and the electronic component electrode and the conductor on the substrate The conductive connection between the electrode and the conductor is ensured by being pressed in a state where the conductive particles are interposed between them, and by curing the insulating resin in this state,
The conductive connection is maintained.

For example, Patent Document 1 describes a conductive connection structure 10 using an anisotropic conductive material 14 obtained by mixing conductive particles 16 made of conductive rubber in an insulating resin 15 as shown in FIG. Yes. In this conductive connection structure 10, a wiring layer 19 is formed on the surface of a substrate 11 made of glass or the like, and a semiconductor chip is provided on connection terminals 19 a and 19 b of the wiring layer 19 via an anisotropic conductive material 14. 17 is thermocompression bonded. In this electro-optical device, the protruding electrode 1 of the semiconductor chip 17 is used.
The conductive particles 16 sandwiched between the connection terminals 19a and 19b of the wiring layers 19 and 7a and 17b are in a state of being somewhat elastically deformed. In this way, even if the distance between the substrate 11 and the semiconductor chip 17 is somewhat increased due to thermal expansion of the insulating resin 15, the protruding electrodes 17 a and 17 b and the connection terminals 19 a and 19 a are caused by the elastic restoring force of the conductive particles 16. The conductive connection state of 19b is maintained.

Further, as shown in FIG. 12, the protruding electrodes 27a and 27b of the semiconductor chip 27 are configured by covering an elastically deformable core resin 28 with a conductive thin film 29 such as a metal thin film, and these protruding electrodes 27a and 27b. Is brought into contact with the connection terminals 19a and 19b on the substrate 11 for conductive connection, and an insulating resin material 24 (NCF: Non Conductive Film /
Another conductive connection structure 20 formed by bonding and fixing the semiconductor chip 27 on the substrate 11 by Paste).
Is also known (see, for example, Patent Document 2 below). In this structure, a thin insulating resin material 24 is interposed between the semiconductor chip 27 and the substrate 12, and the semiconductor chip 27 is thermocompression bonded to the substrate 11, whereby the electrodes 27 a and 27 b of the semiconductor chip 27 are formed on the wiring layer 19. Connection terminal 1
The core resin 28 is elastically deformed while being in contact with 9a and 19b, and this state is held and fixed by the insulating resin material 24. Even in this case, even if the distance between the substrate 11 and the semiconductor chip 27 is slightly increased due to thermal expansion of the insulating resin material 24, the protruding electrodes 27a and 27b and the connection terminals 19a and 19b are caused by the elastic restoring force of the core resin 28. The conductive connection state is maintained.
JP 05-182516 A Japanese Patent Laid-Open No. 2005-136402

However, in the mounting method using the anisotropic conductive material, the protruding electrodes 17a and 17b are connected to the connection terminals 19a by applying pressure while heating the semiconductor chip 17 during mounting.
19b, the insulating resin of the anisotropic conductive material 14 softens and flows to the surroundings, and the conductive particles 16 in the anisotropic conductive material 14 also flow to the surroundings. 17b
Since the number of conductive particles 16 interposed between the connection terminals 19a and 19b is reduced, there is a problem that the conductive connection resistance after mounting becomes high or varies.

Further, in the mounting method using the protruding electrodes 27a and 27b provided with the core resin 28 (the protruding body made of resin), the protruding electrodes 27a and 27b are caused by variations in the height of the protruding electrodes 27a and 27b. Since the amount of elastic deformation of the core resin 28 changes depending on the contact state of the connection terminals 19a and 19b, there is a problem that the conductive contact area varies and it is difficult to obtain a stable contact resistance.

Accordingly, the present invention solves the above-described problems, and the problem is that in the mounting structure or the electro-optical device including the mounting structure, the conductive connection portion is improved by improving the conductive connection state between the protruding electrode and the conductor. In other words, the electrical reliability of the mounting structure is improved.

In view of the above problems, a mounting structure according to a first aspect of the present invention includes an electronic component provided with a protruding electrode, and a base provided on a substrate with a conductive conductor conductively connected to the protruding electrode via conductive particles. Have
In the mounting structure in which the electronic component and the base are bonded with an insulating resin, the conductor is provided with a fine surface uneven shape, and the conductive particles are fitted in the surface uneven shape. The conductor and the conductive particles are in conductive contact.

According to this invention, since a fine surface uneven shape is provided on the conductor, a part of the conductive particles is captured by the surface uneven shape at the time of mounting. The conductive contact area can be increased because more conductive particles intervene, and the contact interface can be stabilized by conductive contact of the conductive particles so as to fit into the surface uneven shape. As a result, the conductive contact resistance can be reduced and stabilized. Moreover, since the conductive contact area between the conductor and the conductive particles can be increased by fitting the conductive particles into the surface irregularity shape of the conductor, the conductive contact resistance can be further reduced. It becomes possible. Furthermore, since the residual ratio of the conductive particles between the protruding electrode and the conductor can be increased, the mixing density of the conductive particles can be reduced, so that an electrical short circuit failure between adjacent terminals can be prevented.

According to a second aspect of the present invention, there is provided a mounting structure including an electronic component including a protrusion formed of an elastic member (an elastic material such as resin) and a protruding electrode having an electrode layer formed on the protrusion, and the protrusion A mounting structure in which a conductive body conductively connected to an electrode is provided on a substrate, and the electronic component and the base are bonded to each other with an insulating resin. And the conductive contact surface of the protruding electrode is formed in a fine uneven shape by deforming the protruding body due to the uneven surface shape.

According to this invention, since the fine surface uneven shape is provided on the conductor, the protruding body of the protruding electrode is deformed according to the surface uneven shape, and the conductive contact surface is configured to have a fine uneven shape. Since the conductive contact area can be increased and the contact interface can be stabilized, it is possible to reduce and stabilize the conductive contact resistance.

In the present invention, the conductor is formed on an underlayer having an uneven surface formed on the substrate, and the surface uneven shape is provided reflecting the uneven shape of the surface of the underlayer. Is preferred. According to this, by providing an uneven shape on the surface of the underlayer and forming a conductor on the underlayer, the uneven surface shape of the conductor can be easily formed by reflecting the uneven shape on the surface of the underlayer. Here, the underlying layer is preferably formed by subjecting a photosensitive resin to exposure processing and development processing to form the uneven shape, so that the surface of the uneven shape can be formed with good controllability and low cost.

In the present invention, a concavo-convex shape is formed on the surface of the substrate, the conductor is formed directly on the concavo-convex shape surface of the substrate, and the surface concavo-convex shape is provided reflecting the concavo-convex shape of the surface of the substrate. It is preferable that According to this, by forming a concavo-convex shape on the substrate surface and forming the surface concavo-convex shape on the conductor in a manner reflecting this concavo-convex shape, the surface concavo-convex shape of the conductor can be easily formed and It is possible to directly form a conductor.
Here, the surface of the substrate is preferably formed by performing wet etching (frost treatment) with a predetermined etching solution.

Next, an electro-optical device according to a first aspect of the present invention includes an electronic component having a protruding electrode and a substrate on which an electro-optical material is disposed, and is conductively connected to the protruding electrode through conductive particles. In an electro-optical device in which an electro-optical panel provided with a conductor on the substrate and the electronic component and the substrate are bonded by an insulating resin, the conductor is provided with a fine surface uneven shape, The conductive body and the conductive particles are in conductive contact in a form in which the conductive particles are fitted in a concavo-convex shape.

According to the present invention, since the conductive body is provided with a fine surface irregularity shape, the conductive particles are captured by the surface irregularity shape of the conductor during mounting, so that more and more between the protruding electrode and the conductor. Since the conductive particles are interposed, the conductive contact area can be increased, and the contact interface can be stabilized by fitting the conductive particles into the surface uneven structure. Reduction and stabilization can be achieved. Also,
The conductive contact area between the conductor and the conductive particles can be increased by fitting the conductive particles into the surface irregularity shape of the conductor, so that it is possible to further reduce the conductive contact resistance. Become. Therefore, the stability and reproducibility of the drive potential of the electro-optical panel can be ensured, and the drive quality can be improved. Furthermore, since the mixing density of conductive particles can be reduced, it is possible to prevent the occurrence of an electrical short circuit failure between adjacent terminals.

An electro-optical device according to a second aspect of the invention includes an electronic component including a protruding body formed of an elastic member (elastic material, for example, resin) and a protruding electrode having an electrode layer formed on the protruding body, and an electro-optical device. An electro-optical panel having a substrate on which a substance is disposed and having a conductor conductively connected to the protruding electrode on the substrate, and the electronic component and the substrate bonded together with an insulating resin In the apparatus, the conductor is provided with a fine surface uneven shape, and the projecting body is elastically deformed by the surface uneven shape, whereby the conductive contact surface of the protruding electrode is formed into a fine uneven shape. Features.

According to the present invention, since the conductor is provided with a fine surface uneven shape, the protruding body of the protruding electrode is elastically deformed according to the surface uneven shape, and the conductive contact surface is configured in a fine uneven shape. Since the conductive contact area can be increased and the contact interface can be stabilized, the conductive contact resistance can be reduced and stabilized. Therefore, the stability and reproducibility of the drive potential of the electro-optical panel can be ensured, and the drive quality can be improved.

In the present invention, the conductor is provided in a region where the electro-optic material is not disposed,
In the electro-optic panel, a region of the substrate where the electro-optic material is disposed is provided with a reflective layer having fine surface irregularities, and the reflective layer and at least a part of the conductor are formed of the same layer. It is preferable that According to this, at least a part of the conductor (for example, when the conductor is formed of a plurality of layers, at least one of those layers) is provided in the region where the electro-optical material is disposed. By comprising the same layer as the reflective layer, it is possible to share one or more steps for forming a conductor with a surface irregular shape, thus increasing the number of manufacturing steps and manufacturing costs. Can be suppressed.

In the present invention, a base layer having a concavo-convex surface is respectively formed in a region where the electro-optical material is not disposed and a region where the electro-optical material is disposed in the substrate of the electro-optical panel, The conductor having the surface uneven shape reflecting the uneven shape is provided on the base layer formed in the region where the electro-optic material is not disposed, and the electro-optical material is formed in the region. It is preferable that a reflective layer having a surface uneven shape reflecting the uneven shape is provided on the base layer. According to this, the foundation layer is formed in both the area where the electro-optic substance is not arranged and the area where the electro-optic substance is arranged, and both the surfaces of these foundation layers are provided with uneven shapes, In addition, a conductor having a surface uneven shape reflecting the uneven shape is provided on the base layer in the region where the electro-optical material is not disposed, and on the base layer in the region where the electro-optical material is disposed. Is provided with a reflective layer having a surface uneven shape reflecting the above uneven shape, so that the surface uneven shape of the conductor can be easily formed and a conductor having the surface uneven shape can be formed. Since one or a plurality of steps can be shared, an increase in the number of manufacturing steps and an increase in manufacturing cost can be suppressed.

Next, an electronic apparatus according to the invention includes the electro-optical device according to any of the inventions described above. Examples of such an electronic device include various devices using an electro-optical device as a display body, such as a monitor, a computer device, an electronic timepiece, and a mobile phone.

In addition, as a board | substrate of said each invention, it is preferable that it is a hard board | substrate consisting of glass, ceramics, hard resin, etc. When such a hard substrate is used, a sufficient contact pressure when the above structure is employed can be secured, and the electrical reliability can be further improved.

Next, an embodiment of a conductive connection structure according to the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a schematic perspective view showing the overall configuration of the electro-optical device according to the first embodiment of the invention.
The electro-optical device 100 includes an electro-optical panel 110 and an electronic component (semiconductor device) 120 mounted on a substrate 111 that constitutes the electro-optical panel 120.

The electro-optical panel 110 includes a pair of substrates 111 and 1 made of glass, plastic, or the like.
12 are bonded together with a sealing material 113 at a predetermined interval (3 to 10 μm), and the substrate 111
And 112, an electro-optic material is disposed between them. In the illustrated example, the substrates 111 and 112 are shown.
A liquid crystal display body in which the liquid crystal 114 is sealed inside the sealing material 113 is formed.

Electrodes (not shown) made of a transparent conductor are respectively formed on the inner surfaces of the pair of substrates 111 and 112 facing each other, and by controlling the voltage applied between these electrodes, a planar range (pixels) where the electrodes overlap each other ), The light modulation characteristics of the liquid crystal 114 are appropriately set, and a predetermined display is realized.

Of the pair of substrates 111 and 112, one substrate 111 includes a facing portion 1111 a that faces the other substrate 112 and a protruding portion 111 b that protrudes from the outer shape of the substrate 112. The electrode is formed on the facing portion 111a, and a drive region in which a plurality of pixels are arranged is configured. Note that polarizing plates 115 and 116 are disposed on the outer surfaces of the substrates 111 and 112, respectively (
Pasted).

The electrodes are conductively connected to the drive wiring 117 directly or indirectly. The drive wiring 117 is drawn out to the protruding portion 111 b of the substrate 111. An input wiring 118 is formed on the edge side of the protruding portion 111b of the substrate 111. Drive wiring layer 117
A plurality of connection terminals, which are the ends of the input wiring 118, and a plurality of connection terminals, which are the ends of the input wiring 118, are arranged in the front-rear direction of the drawing.

The drive wiring 117 and the input wiring 118 are configured as a transparent conductor such as ITO, a metal such as Al, Cu, Au, or an alloy thereof, or a laminate of different materials. Also, the electronic component 12
The connection terminal that is conductively connected to 0 may have the same structure as other wiring portions, or may be formed of a different material from other wiring portions, or may have a different structure (for example, Au on the surface).
Etc.) and, as will be described later,
It may be formed on the substrate 111 through an appropriate underlayer.

In addition, a wiring pattern (not shown) of the flexible wiring board 141 mounted on the edge of the protruding portion 111b is conductively connected to the input terminal which is the end of the input wiring 118 opposite to the connection terminal.

The electronic component 120 is, for example, a semiconductor chip, in which an integrated circuit including various elements such as a transistor, a diode, a resistor, and a capacitor is formed on a semiconductor substrate made of silicon (Si) or the like. A plurality of protruding electrodes are formed on the lower surface of the electronic component 120 in the figure, and these protruding electrodes are conductively connected to the drive wiring 117 and the input wiring 118, respectively, so that the electronic component 120 is on the protruding portion 111b of the substrate 111. Has been implemented.

FIG. 2 is a schematic partial longitudinal sectional view schematically showing a part related to the mounting structure in the electro-optical device 100 of the first embodiment. Projecting electrodes 121 and 122 project from the surface of the electronic component 120 (the lower surface in the drawing, the active surface of the semiconductor chip, etc.), respectively. These electrodes 121 and 122 are connected to the connection terminal 117 a of the drive wiring 117 and the connection terminal 11 of the input wiring 118.
A plurality of the terminals are arranged at positions corresponding to 8a and arranged at the same formation pitch as the plurality of connection terminals.

The protruding electrodes 121 and 122 are connected pads 120 provided on the electronic component 120.
a and 120b are conductively connected. In the case of the illustrated example, the protruding electrodes 121 and 122 are formed by depositing a metal such as Ni on the connection pads 120a and 120b by electrolytic plating or the like. Usually, the surfaces of the protruding electrodes 121 and 122 are covered with a surface layer such as Au.

In the present embodiment, the electronic component 120 is mounted on the substrate 111 via the anisotropic conductive material 130. The anisotropic conductive material 130 is an insulating resin 13 made of acrylic resin, epoxy resin, or the like.
1 has a thin film (sheet) shape in which a large number of conductive particles 132 are dispersed. The anisotropic conductive material 130 is electrically conductive by the conductive particles 132 in the thickness direction, but is configured to be insulative by the insulating resin 131 in the planar direction. Here, the conductive particles 132 are preferably formed by coating an elastically deformable resin (not shown) with a conductive metal layer. However, the conductive particles 132 may be composed entirely of metal or conductive. It may be composed of rubber.

The anisotropic conductive material 130 is disposed between the substrate 111 and the semiconductor chip 120, and an insulating resin 131 bonds the substrate 111 and the semiconductor chip 120. The conductive particles 132 are interposed between the connection terminals 117 a and 118 a on the substrate 111 and the electrodes 121 and 122 of the semiconductor chip 120, and both are conductively connected via the conductive particles 132. The conductive particles 132 are elastically deformed and crushed by being sandwiched between the connection terminals 117 a and 118 a and the electrodes 121 and 122. The elastic deformation state of the conductive particles 132 is maintained by the adhesive force of the insulating resin 131.

In the present embodiment, the surface of the connection terminals 117a and 118a is provided with a fine uneven shape. As shown in FIG. 3, the surface uneven shape has a period and a depth at which the conductive particles 132 can be fitted in the concave portions 117 b and 118 b, and is configured in a wave shape as a whole. For example, assuming that the average particle size of the conductive particles 132 (for example, the peak value when the particle size distribution is fitted into a normal distribution (Gaussian distribution)) is about 1 μm, the concave portion 117b,
The curvature radius of 118b is also set to about 1 μm, and the conductive particles 132 elastically deformed in the mounted state can be fitted into the recesses 117b and 118b.

However, the depth of the recesses 117b and 118b needs to be configured to be shallower than the diameter of the conductive particles 132, and the depth is preferably half or less of the diameter of the conductive particles 132. The planar shape of the recesses 117b and 118b may be a circle similar to that of the conductive particles 132, or may be an ellipse or an ellipse. Moreover, you may comprise the recessed parts 117b and 118b as a ditch | groove which has a strip | belt-shaped planar shape.

The above-mentioned surface unevenness shape can be formed by treating a part of the wiring pattern by imprinting (transfer method), sandblasting, etching or the like. Moreover, you may form by the method of 3rd Embodiment or 4th Embodiment mentioned later.

In the above embodiment, the anisotropic conductive material 130 is disposed between the substrate 111 and the electronic component 120 at the time of mounting, and the electronic component 120 is pressed while being heated and pressed onto the substrate 111.
As a result, the insulating resin 131 of the anisotropic conductive material 130 is softened, and the insulating resin disposed between the protruding electrodes 121 and 122 and the connection terminals 117a and 118a flows to the surroundings, and eventually the protruding electrodes 121 and 122 and The connection terminals 117a and 118a are indirectly conductively connected with the conductive particles 132 interposed therebetween. The conductive particles 132 are pressed against the electronic component 120 and elastically deformed into a slightly crushed shape. At this time, the conductive particles 132 are fitted in the concave and convex portions 117b and 118b of the surface irregularities of the connection terminals 117a and 118a.

During the mounting described above, in the process in which the protruding electrodes 121 and 122 approach the connection terminals 117a and 118a, the conductive particles 13 are discharged at the stage where the insulating resin 131 flows and is discharged.
2 also moves together with the insulating resin 131, but in the case of this embodiment, a part of the conductive particles 132 is finally captured by the concave and convex portions 117b and 118b of the surface unevenness of the connection terminals 117a and 118a. The number of conductive particles 132 remaining between the electrodes 121 and 122 and the connection terminals 117a and 118a is increased as compared with the conventional case.

In the experiments by the inventors of the present application, in the mounting by the conventional method, the protruding electrodes 121 and 122 and the connection terminals 117a and 1 are used with reference to the density of the conductive particles 132 in the anisotropic conductive material 130.
In contrast to the ratio of the number of conductive particles interposed between 18a (residual rate) of about 10 to 15%, in the present embodiment, the residual rate can be greatly increased to 40 to 50%. It was.

Further, since the conductive particles 132 are fitted to the surface irregularities of the connection terminals 117a and 118a, the contact area between the connection terminals 117a and 118a and the conductive particles 132 is also increased, and thus the conductive connection is also achieved. The resistance of the part is reduced. As a result, in the present embodiment, the resistance of the conductive connection portion is reduced as compared with the conventional case, and the reproducibility of the resistance value is improved.

Furthermore, in this embodiment, since the residual rate of the conductive particles 132 can be increased as described above, the mixing density of the conductive particles 132 in the anisotropic conductive material 130 can be reduced. There is an advantage that the occurrence of an electrical short circuit failure between adjacent terminals due to the conductive particles 132 can be prevented.

In the above-described embodiment, the electro-optical device 100 in which the electronic component 120 such as a semiconductor chip is mounted on the substrate 111 constituting the electro-optical panel 110 has been described. However, the above-described configuration is not limited to the electro-optical device. The present invention can be applied to various mounting structures for mounting semiconductor chips and other electronic components on various substrates. However, the mounting method using the anisotropic conductive material 130 is a connection terminal (conductor) formed on a hard substrate such as glass, ceramics, or hard resin.
This configuration is particularly suitable when an electronic component (semiconductor device) is mounted.

[Second Embodiment]
Next, a second embodiment according to the present invention will be described with reference to FIGS. 4 and 5. 4 is a partial longitudinal sectional view schematically showing a mounting structure used in the electro-optical device of the second embodiment, and FIG. 5 is an enlarged partial longitudinal sectional view showing an enlarged conductive contact portion.

In the second embodiment, only the electronic component 120 ′ and the mounting structure of the electronic component 120 ′ are different from the first embodiment, and the other structure, that is, the configuration of the electro-optical panel 110 is the same as that of the first embodiment. Therefore, the description regarding the same structure is abbreviate | omitted. In addition, each part having the same structure as that of the first embodiment cited in the following description is denoted by the same reference numeral as that of the first embodiment.

In the electronic component 120 ′ of the present embodiment, protrusions 121 a ′ and 122 a ′ made of resin that is an elastic member are formed on the surface (the lower surface in the drawing, an active surface in the case of a semiconductor chip),
Protruding electrodes 121 ′ and 122 ′ having electrode layers 121 b ′ and 122 b ′ disposed on the surfaces of these protrusions are provided. The electrode layers 121b 'and 122b' are conductively connected to the connection pads 120a 'and 120b' exposed on the surface, and the connection pads 120a.
It is formed in a strip shape so as to extend at least to the tops of the protrusions 121a ′ and 122a ′ formed beside a ′ and 120b ′.

The material constituting the protrusions 121a 'and 122a' can be any resin,
In particular, an acrylic resin, a phenol resin, a silicone resin, a polyimide resin, a silicone-modified polyimide resin, an epoxy resin, or the like can be used. Protruding bodies 121a ′, 122
In view of facilitating production, a ′ is preferably composed of a photosensitive resin. As the photosensitive resin, an acrylic resin whose shape can be controlled depending on exposure conditions is most preferable for facilitating patterning. The resin is an example of an elastic member, and is not limited to the above material as long as it is an elastic material having elastic characteristics suitable for a mounting structure.

Further, as the material structure of the electrode layers 121b 'and 122b', a structure in which Au is laminated on Ti-W, a structure in which Au is laminated on Cr, or the like is preferably used. However, Au,
A structure in which various metals (alloys) such as Ti-W, Cu, Ni, Pd, Al, Cr, Ti, W, Ni-V, and lead-free solder are formed as a single layer, or a structure in which these are laminated in an appropriate combination. Can also be used.

The protruding electrodes 121 'and 122' are in direct conductive contact with the connection terminals 117a and 118a in a pressurized state, and are elastically deformed in such a manner that the protrusions 121a 'and 122a' are crushed. In this state, the electronic component 120 ′ and the substrate 11 are separated by the insulating resin 131 ′.
1 is held by being bonded and fixed.

In the second embodiment, as in the first embodiment, since the connection terminals 117a and 118a are provided with surface irregularities, the protrusions 121a 'and 122a' are connected to the connection terminals 117a.
, 118a is elastically deformed according to the surface irregularity shape, and as a result, the protruding electrodes 121 ', 122'
The conductive contact surfaces of the electrode layers 121b ′ and 122b ′ and the connection terminals 117a and 118a are formed in an uneven shape.

More specifically, as shown in FIG. 5, the electrode layers 121 b ′ and 122 b ′ are uneven (wavy) due to elastic deformation of the protrusions 121 a ′ and 122 a ′ according to the surface unevenness of the connection terminals 117 a and 118 a. And is in a state of being fitted into the concave and convex portions 117b and 118b having an uneven surface shape. Therefore, the adhesion between the protruding electrodes 121 ′, 122 ′ and the connection terminals 117a, 118a is enhanced, and the conductive contact area between the electrode layers 121b ′, 122b ′ and the connection terminals 117a, 118a is increased. Reduction of conductive connection resistance and reproducibility of the resistance value are improved.

[Third Embodiment]
Next, a third embodiment according to the present invention will be described with reference to FIG. FIG. 6 is a schematic partial cross-sectional view showing the structure of the connection terminals 117a ′ and 118a ′ on the substrate 111 of the electro-optical device of the third embodiment. Since this embodiment has substantially the same configuration as that of the first embodiment except for the structure of the connection terminals 117a ′ and 118a ′, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. To do.

In the present embodiment, the underlying layers 117c ′ and 118c ′ having a fine uneven shape on the surface.
Is formed on the substrate 111, and the thin film connection terminals 1 are formed on the underlayers 117c 'and 118c'.
By forming the films 17a 'and 118a', surface irregularities reflecting the above irregularities are formed on the surfaces of the connection terminals 117a 'and 118a'.

Various materials can be used as the underlayers 117c ′ and 118c ′.
By using a photosensitive resin such as an acrylic resin, the uneven shape can be easily provided by exposure / development processing. For example, a smooth wavy uneven shape can be formed by exposing with a proximity exposure apparatus using an exposure mask in which a large number of fine openings are dispersed. By using such a structure, the connection terminals 117a ′ and 118a ′ are used.
The surface uneven shape can be easily formed, and the controllability to the surface uneven shape can be improved, so that the surface uneven shape can be optimized in order to improve the conductive connection state.

In the illustrated example, only the connection terminals 117a ′ and 118a ′ are used as the base layers 117c ′ and 118a.
Although formed on c ′, other wiring portions of the drive wiring 117 and the input wiring 118 may also be formed on the base layer. In this case, it is sufficient to form the uneven shape only in the connection terminal formation region.

[Fourth Embodiment]
Next, a fourth embodiment according to the present invention will be described with reference to FIG. FIG. 7 is a schematic partial sectional view showing the structure of the connection terminals 117a ″ and 118a ″ on the substrate 111 ″ of the electro-optical device of the fourth embodiment. In this embodiment, the substrate 111 ″ and the connection terminals 117a ″ are shown. , 11
Except for the structure of 8a ″, the configuration is almost the same as that of the first embodiment.

In the present embodiment, a surface portion 111c ″ having a fine uneven shape is formed on the surface of the substrate 111 ″, and connection terminals 117a ″ and 118a ″ in the form of thin films are formed on the surface portion 111c ″. The terminals 117a "and 118a" are provided with surface irregularities reflecting the above irregularities.

Examples of the method of providing the surface portion 111c ″ on the substrate 111 ″ include a method of performing wet etching with an etching solution, and a method of spraying fine particles on the substrate surface (sand blasting). In particular, when the substrate is formed of glass, it is possible to easily provide fine irregularities by a known method called etching, frosting, or tapestry using an etching solution containing hydrofluoric acid. It is.

“Fifth Embodiment”
Next, a fifth embodiment according to the present invention will be described with reference to FIG. In this embodiment, the basic configuration of the electro-optical panel and the electronic component is configured in the same manner as in the first embodiment, and the connection terminal structure is configured in the same manner as in the second or third embodiment. Portions corresponding to those of the embodiment are denoted by the same reference numerals, and description of similar configurations is omitted.

In the electro-optical panel 110, wiring and switching elements (three-terminal non-linear elements such as TFT and two-terminal non-linear elements such as TFD) are appropriately formed on the inner surface of the substrate 111 (the surface facing the substrate 112). An element wiring layer 111d formed through the gap is provided. From the element wiring layer 111d, the drive wiring 117 'is drawn out toward the mounting region. A base layer 111e formed of the same material as the base layers 117c ′ and 118c ′ in the same process is provided thereon. A fine concavo-convex shape is formed on the surface of the base layer 111e, and this concavo-convex shape is formed by the same method as the concavo-convex shape of the base layers 117c ′ and 118c ′.

A reflective layer 111 made of Ag, Al, Cr, or an appropriate alloy is formed on the base layer 111e.
f is formed. This reflective layer 111f has a reflective surface for reflecting external light incident from the substrate 112 side, and has a scattering reflective surface having a fine surface uneven shape reflecting the uneven shape of the underlayer 111e. is doing.

The reflective layer 111f may be simultaneously formed on the base layers 117c ′ and 118c ′ to constitute at least a part of the connection terminals 117a ′ and 118a ′. In this case, the connection terminals 117a ′ and 118a ′ are formed of only a metal layer or a stacked body in which another layer is stacked on the metal layer. Note that wiring portions other than the connection terminals in the drive wirings 117 ′ and 118 ′ may be formed in the same process using the same material as the reflective layer.

In the illustrated example, the reflective layer 111f is provided so that there is a region not formed in the pixel G. That is, in the pixel G, a region where the reflective layer 111f is not formed becomes a transmissive display region, and a region where the reflective layer 111f is formed constitutes a reflective display region. That is, the electro-optical panel 110 in the illustrated example is a transflective liquid crystal display. However, a reflective liquid crystal display in which the reflective layer 111f is formed on the entire pixel G may be configured.

An electrode 111g made of a transparent conductor such as ITO is provided on the reflective layer 111f. In the illustrated example, the electrode 111g is a pixel electrode that is conductively connected to the switching element. In addition, a drive wiring 117 'and an input wiring 118' are formed in the same process using the same material as the electrode 111g. Further, an alignment film 111h made of polyimide resin or the like is provided on the electrode 111g.

On the other hand, on the inner surface of the substrate 112 (the surface facing the substrate 111), a plurality of colored layers 112a are arranged corresponding to the pixels G, and a transparent protective film 112b is formed thereon. An electrode 112c made of a transparent conductor such as ITO is provided on the protective film 112b.
An alignment film 112d is formed on 12c.

In the present embodiment, the base layers 117c ′ and 118c ′ are formed on the projecting portion 111b, and the base layer 111e is formed in the drive region (display region) in which the pixels G are arranged in the same process. Reflecting the concave and convex shapes of the base layer 111e and the base layers 117c ′ and 118c ′, the scattering reflective surface of the reflective layer 111g and the surface concave and convex shapes of the connection terminals 117a ′ and 118a ′ are configured. It is only necessary to change the formation pattern of the formation, and it is not necessary to increase the man-hours.

Further, since the connection terminals 117a ′ and 118a ′ can be formed in the step of forming the electrode 111g and the reflective layer 111f, it is not necessary to increase the number of man-hours. Therefore, in this embodiment, even if the surface unevenness is formed on the connection terminal, it is possible to suppress an increase in manufacturing steps and manufacturing costs.

[Electronics]
Finally, an example of an electronic apparatus according to the present invention will be described with reference to FIGS. FIG. 10 shows a notebook personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer 200 is connected to a main body 201 having a plurality of operation buttons 201a and other operation devices 201b, and the main body 201, and a display screen 202a.
And a display unit 202 including In the case of the illustrated example, the main body unit 201 and the display unit 202 are configured to be openable and closable. The electro-optical device 100 described above is built in the display unit 202, and a desired display image is displayed on the display screen 202a. in this case,
A display control circuit for controlling the electro-optical device 100 is provided inside the personal computer 200. The display control circuit is configured to send an image signal and other input data and a predetermined control signal to the electro-optical device 100 to determine the operation mode.

FIG. 10 shows a mobile phone which is another embodiment of the electronic apparatus according to the invention. A cellular phone 300 shown here includes an operation unit 301 including a plurality of operation buttons 301a and 301b and a mouthpiece, and a display unit 302 including a display screen 302a and a mouthpiece. The electro-optical device 100 is incorporated inside. The display image formed by the electro-optical device 100 can be viewed on the display screen 302a of the display unit 302. In this case, a display control circuit that controls the electro-optical device 100 is provided inside the mobile phone 300. The display control circuit includes the electro-optical device 100.
A video signal and other input data and a predetermined control signal are sent to the apparatus to determine the operation mode.

Note that the electronic apparatus is not limited to the one on which the electro-optical device 100 according to the first embodiment is mounted, and for example, may be configured as one on which any of the electro-optical devices according to the other embodiments described above is mounted. In addition to the electro-optical device, any electronic device may be used as long as a mounting structure in which an electronic component such as a semiconductor chip is mounted on a certain substrate. For example, as the electronic apparatus according to the present invention, there are a liquid crystal television, a car navigation device, an electronic notebook, a calculator, a workstation, a videophone, a POS terminal, a projector, and the like in addition to the illustrated examples.

Note that the present invention is not limited to the illustrated examples described above, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described embodiment, an electro-optical device including a liquid crystal display is configured, but an apparatus including various electro-optical panels such as an organic electroluminescence device, an electrophoretic display device, and a plasma display device is employed. Can do.

The schematic perspective view which shows typically the whole structure of 1st Embodiment which concerns on this invention. The fragmentary longitudinal cross-section which shows the mounting structure part of the embodiment. The expanded partial longitudinal cross-sectional view which expands and shows the conductive contact part of the embodiment. The fragmentary longitudinal cross-section which shows the mounting structure part of 2nd Embodiment. The expanded partial longitudinal cross-sectional view which expands and shows the electroconductive connection part of 2nd Embodiment. The fragmentary longitudinal cross-section which shows the structure of the mounting area | region on the board | substrate of 3rd Embodiment. The fragmentary longitudinal cross-section which shows the structure of the mounting area | region on the board | substrate of 4th Embodiment. The fragmentary longitudinal cross-section which shows the mounting area vicinity of 5th Embodiment. 1 is a schematic perspective view illustrating a computer device that is an embodiment of an electronic apparatus according to the invention. 1 is a schematic perspective view showing a mobile phone that is an embodiment of an electronic apparatus according to the invention. The schematic longitudinal cross-sectional view which shows typically the mounting structure using the conventional ACF. The schematic longitudinal cross-sectional view which shows typically the mounting structure using the conventional NCF.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Electro-optical apparatus, 110 ... Electro-optical panel, 111, 112 ... Board | substrate, 113 ... Sealing material, 120 ... Electronic component, 121, 122 ... Projection electrode, 130 ... Anisotropic conductive material, 131 ...
Insulating resin, 132 ... conductive particles, 117 ... drive wiring, 118 ... input wiring, 117a, 11
8a: Connection terminal

Claims (9)

An electronic component having a protruding electrode; and a base provided on a substrate with a conductor conductively connected to the protruding electrode through conductive particles. The electronic component and the base are made of an insulating resin. In the bonded mounting structure,
The conductor is provided with a fine surface irregularity shape, and the conductor and the conductive particle are in conductive contact in such a manner that the conductive particle fits into the surface irregularity shape. Structure. An electronic component having a projecting body formed of an elastic member and a projecting electrode having an electrode layer formed on the projecting body, and a base body provided on a substrate with a conductor conductively connected to the projecting electrode. In the mounting structure in which the electronic component and the base are bonded with an insulating resin,
The conductive body is provided with a fine surface uneven shape, and the projecting body is deformed by the surface uneven shape, whereby the conductive contact surface of the protruding electrode is formed into a fine uneven shape. Structure. The conductor is formed on an underlayer having an uneven surface formed on the substrate, and the surface uneven shape is provided reflecting the uneven shape of the surface of the underlayer. The mounting structure according to claim 1 or 2. An uneven shape is formed on the surface of the substrate, the conductor is formed directly on the uneven surface of the substrate, and the uneven surface shape is provided reflecting the uneven shape of the surface of the substrate. The mounting structure according to claim 1 or 2. An electro-optical panel having an electronic component having a protruding electrode and a substrate on which an electro-optic material is disposed, and a conductor electrically connected to the protruding electrode through conductive particles on the substrate. And in the electro-optical device in which the electronic component and the substrate are bonded by an insulating resin,
The electrical conductor is provided with a fine surface irregularity shape, and the electrical conductor and the conductive particle are in conductive contact with each other in such a manner that the conductive particle fits into the surface irregularity shape. Optical device. An electronic component comprising a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body, and a substrate on which an electro-optic material is disposed, and is conductively connected to the protruding electrode. In an electro-optical device in which the conductive member provided on one of the substrates is bonded to the electronic component and the substrate with an insulating resin,
The conductor is provided with a fine uneven surface, and the protrusion is deformed by the uneven surface, whereby the conductive contact surface of the protruding electrode is formed into a fine uneven shape. Optical device. The conductor is provided in a region where the electro-optical material is not disposed, and a reflective layer having a fine surface uneven shape is provided in the region of the substrate of the electro-optical panel where the electro-optical material is disposed. The electro-optical device according to claim 5, wherein the reflective layer and at least a part of the conductor are formed of the same layer. A base layer having a concavo-convex surface is formed in a region where the electro-optical material is not disposed and a region where the electro-optical material is disposed in the substrate of the electro-optical panel, and the electro-optical material is disposed. On the base layer formed in a region where the electro-optic material is disposed, the conductor having the surface uneven shape reflecting the uneven shape is provided on the base layer formed in a non-region. 7. The electro-optical device according to claim 5, further comprising a reflective layer having a surface uneven shape reflecting the uneven shape. An electronic apparatus comprising the electro-optical device according to claim 5.

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