JP2005241858A - Electrooptical device, electronic apparatus, and method for manufacturing electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device in which the fixing strength of resin spacers to a substrate is high even when the resin spacers for controlling a distance between substrates are protruded from the substrate, and provide an electronic apparatus using the electrooptical device and a method for manufacturing the electrooptical device. <P>SOLUTION: In the electrooptical device 1a, a number of resin spacers 9 composed of a photosensitive resin are interposed between an element substrate 10 and a counter substrate 20. The resin spacer 9 is equipped with a nearly truncated pyramid shaped base part 91 and a columnar part 92 extending from the tip portion of the base part 91 and directed to the counter substrate 20 with a nearly constant width in a prism shape. Thereby, fixing strength of the resin spacer 9 toward the element substrate 10 is high. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electro-optical device in which an electro-optical material and a spacer are interposed between a pair of substrates, an electronic apparatus including the electro-optical device, and a method for manufacturing the electro-optical device.

  In a liquid crystal device which is a typical electro-optical device, liquid crystal as an electro-optical material is held between a pair of substrates, and the substrate interval needs to be controlled in order to define the layer thickness of the liquid crystal. For this reason, conventionally, when bonding a pair of substrates, a large number of granular spacers are dispersed on one substrate, and these granular spacers are interposed between the substrates to control the substrate interval (for example, Patent Document 1).

Further, a columnar resin spacer may be formed on one substrate, and the tip of the resin spacer may be brought into contact with the other substrate to control the substrate interval (see, for example, Patent Document 2).
JP 2004-45703 A JP 2003-344838 A

  Among such spacers, granular spacers generally have a low compressive strength. For this reason, the tolerance with respect to a pressing load is weak, and there exists a problem that a board | substrate space | interval will fluctuate easily when a pressing load is applied. In contrast, columnar resin spacers generally have a high compressive strength. For this reason, even when the substrate is pressed, such a load is supported without deformation of the resin spacer. Therefore, there is an advantage that the resistance to the pressing load is strong and the substrate interval is maintained even when the pressing load is applied. In addition, unlike the powder spacer, the columnar resin spacer can be formed at a predetermined position on the substrate, so that the alignment of the liquid crystal is not disturbed at the display opening from which display light is emitted in each pixel. There are advantages.

  However, in the case of a columnar resin spacer, since the height dimension and thickness are different, there is a problem that if the resin spacer is peeled from the substrate and turned sideways, the substrate interval cannot be controlled. However, if the resin spacer is made thicker in order to increase the fixing strength to the substrate, there is a problem that the amount of display light is reduced because it protrudes from the display opening where display light is emitted from each pixel. Further, if the resin spacer is made thick in order to increase the fixing strength to the substrate, there is a problem that the liquid crystal easily foams when the environmental temperature changes. In other words, the columnar resin spacer has a high compressive strength, and therefore, when the temperature drops and the liquid crystal shrinks in a state in which the liquid crystal is sealed between the substrates, the interval between the substrates is prevented from being narrowed. There is a problem that the liquid crystal easily foams due to the negative pressure in between.

  In view of the above problems, an object of the present invention is to use an electro-optical device having a high fixing strength of a resin spacer with respect to a substrate even when the resin spacer for controlling the substrate interval is protruded from the substrate, and the electro-optical device. Is to provide the electronic equipment that was.

  Another object of the present invention is to provide an electro-optical device in which the amount of display light does not decrease even if the resin spacer for controlling the substrate interval is protruded from the substrate and the fixing strength of the resin spacer to the substrate is increased. An object of the present invention is to provide an electronic apparatus using an electro-optical device.

  Furthermore, the subject of this invention is providing the manufacturing method of the electro-optical apparatus which can form said resin spacer efficiently.

  In order to solve the above-described problem, in the present invention, a first substrate, a second substrate disposed opposite to the first substrate, and the first substrate and the second substrate are held. And a plurality of substrate spacing control resin spacers protruding from the first substrate and contacting the second substrate, the resin spacers on the first substrate It is a protrusion provided with a substantially conical surface or a substantially spherical side surface that makes the ground contact area wider than the contact area with the second substrate.

  In the present invention, the resin spacer for controlling the gap between the substrates formed on the first substrate is a protrusion having a substantially conical surface or a substantially spherical side surface, and has a ground contact area on the first substrate. It is wider than the contact area with the second substrate. For this reason, even when the resin spacer for controlling the substrate interval is protruded from the first substrate, the resin spacer is firmly fixed to the first substrate, so that it is possible to prevent the resin spacer from peeling off and changing the substrate interval. can do.

  In the present invention, the resin spacer includes a base having a substantially truncated pyramid shape or a substantially truncated cone shape whose thickness continuously decreases from the first substrate side toward the second substrate, and a tip portion of the base portion. And a columnar portion extending toward the second substrate with a substantially constant thickness. With this configuration, a resin spacer having a large fixed strength can be formed in a narrow region as compared with the case where the whole is a truncated cone shape or a truncated pyramid shape. It doesn't stick out. Therefore, even if the fixing strength of the resin spacer to the substrate is increased, the amount of display light does not decrease.

  In the present invention, the resin spacer protrudes in a substantially hemispherical shape, a conical shape, or a pyramid shape from the first substrate toward the second substrate, or the resin spacer extends from the first substrate. A configuration that protrudes in a substantially truncated cone shape or a substantially truncated pyramid shape toward the second substrate can be employed. Even in this configuration, the resin spacer does not peel from the first substrate because the bottom area of the resin spacer is large. Further, with such a structure, since the compressive strength of the resin spacer itself is large, even when the resin spacer is formed so as to cover the pixel switching element, the pixel switching element is not damaged. Therefore, since the pixel switching element formation region can be used as the resin spacer formation region, the resin spacer does not protrude into the display opening region of each pixel. Therefore, even if the fixing strength of the resin spacer to the substrate is increased, the amount of display light does not decrease.

  In the present invention, on the first substrate, as the resin spacer, a first protrusion protruding in a substantially hemispherical shape, a conical shape, or a pyramid shape toward the second substrate; and It is preferable that a second protrusion protruding in a substantially truncated cone shape or a substantially truncated pyramid shape is formed. If the resin spacer has such a shape, since the bottom area of the resin spacer is large, the resin spacer does not peel from the first substrate. Further, with such a structure, since the compressive strength of the resin spacer itself is large, even when the resin spacer is formed so as to cover the pixel switching element, the pixel switching element is not damaged. Therefore, since the pixel switching element formation region can be used as the resin spacer formation region, the resin spacer does not protrude into the display opening region of each pixel. Therefore, even if the fixing strength of the resin spacer to the substrate is increased, the amount of display light does not decrease. Further, since the first protrusion (resin spacer) protrudes in a substantially hemispherical shape, a conical shape, or a pyramid shape toward the second substrate, the tip portion has a low compressive strength, whereas the second protrusion Since the (resin spacer) protrudes in a substantially truncated cone shape or a substantially truncated pyramid shape, the compression strength is high. Therefore, if the first protrusion and the second protrusion are formed at an appropriate ratio, the substrate is allowed to deform to some extent when the electro-optic material contracts due to a temperature change, and a pressing load is applied to the substrate. In addition, since it is possible to prevent fluctuations in the substrate interval beyond a predetermined level, it is possible to improve the reliability of the electro-optical device, such as preventing a short circuit between the electrodes. In other words, when the electro-optic material is held in a state where the electro-optic material is held between the substrates and the volume of the electro-optic material is shrunk, the substrate is pushed by the substrate and elastically deformed as much as the interval between the substrates is reduced. Since the pressure state does not occur, the electro-optic material does not foam. Further, when the substrate is pressed, the second protrusion supports such a pressing load. Accordingly, since the substrate is not further deformed, the resistance against the pressing load is strong, and the distance between the substrates is maintained even when the pressing load is applied.

  In the present invention, it is preferable that the resin spacer is formed in a region avoiding a display opening from which display light is emitted in each pixel. For example, it is formed in a wiring region that does not directly contribute to display. The resin spacer may be formed so as to cover a pixel switching element formed in each pixel on the first substrate.

  In the present invention, a first substrate, a second substrate disposed opposite to the first substrate, an electro-optic material held between the first substrate and the second substrate, A method of manufacturing an electro-optical device having a plurality of substrate spacing control resin spacers protruding from a first substrate and in contact with the second substrate, wherein a photosensitive resin is applied to a surface side of the first substrate. In the step of forming the resin spacer by performing exposure and development after coating, through an exposure mask having a partial light-transmitting portion in which the light transmittance continuously changes from the light-shielding portion toward the light-transmitting portion. The photosensitive resin is exposed to light and exposed through the partial light transmitting portion, so that the grounding area on the first substrate is wider than the contact area with the second substrate as the resin spacer. Protrusions with a substantially conical surface or a substantially spherical side surface And wherein the Rukoto. When the photosensitive resin is exposed through an exposure mask having a partially transparent portion whose translucency changes continuously, the photosensitive resin exposed through the partially transparent portion is soluble in a developer. Since it changes continuously, a conical surface and a spherical surface can be efficiently formed after development.

  The electro-optical device according to the present invention is used in an electronic apparatus such as a mobile phone or a mobile computer.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing to be referred to, the scale may be different for each layer or each member in order to make the size recognizable on the drawing.

[Embodiment 1]
(Overall configuration of electro-optical device)
FIG. 1 is a block diagram showing an electrical configuration of an electro-optical device to which the present invention is applied. 2A and 2B are a schematic perspective view of the electro-optical device to which the present invention is applied as viewed from the element substrate side, and a cross-section when the electro-optical device is cut in the Y direction at a portion passing through the pixel electrode. It is explanatory drawing shown typically. FIG. 3 is a cross-sectional view showing a pixel configuration of the electric device according to the present invention. In FIG. 3, a cross section when the electro-optical device is cut along a diagonal line of a pixel indicated by an AA ′ line in FIG. 4A described later so that each element formed in each pixel appears. It is shown in the figure.

  The electro-optical device 1a shown in FIG. 1 is an active matrix type liquid crystal device using a TFD (Thin Film Diode) as a pixel switching element, and a plurality of scanning lines 51a when two intersecting directions are defined as an X direction and a Y direction. Extends in the X direction (row direction), and a plurality of data lines 52a extend in the Y direction (column direction). A pixel 53a is formed at a position corresponding to each intersection of the scanning line 51a and the data line 52a. In the pixel 53a, a liquid crystal layer 54a and a TFD element 56a (nonlinear element) for pixel switching are connected in series. ing. Each scanning line 51a is driven by a scanning line driving circuit 57a, and each data line 52a is driven by a data line driving circuit 58a.

  In constructing such an electro-optical device 1a, in this embodiment, as shown in FIGS. 2A and 2B, an element substrate 10 (first substrate) and a counter substrate 20 (second substrate) Are bonded together by a sealing material 30, and a liquid crystal 19 as an electro-optical material is sealed in a region surrounded by both substrates and the sealing material 30. The sealing material 30 is formed in a substantially rectangular frame shape along the edge of the counter substrate 20, but a part thereof is opened to enclose the liquid crystal. For this reason, after the liquid crystal 19 is sealed, the opening is sealed with the sealing material 31.

  The element substrate 10 has an overhanging region 10a that protrudes from the edge of the counter substrate 20 to one side in a state of being bonded to the counter substrate 20 and the sealing material 30. Wiring pattern 8 (signal line) connected to 52a and scanning line 51a extends. A large number of conductive particles having conductivity are dispersed in the sealing material 30. The conductive particles are, for example, plastic particles plated with metal or conductive resin particles. And the wiring pattern formed in each of the opposing board | substrates 20 is provided with the function to conduct | electrically_connect between board | substrates. For this reason, in this embodiment, the first IC 4 that outputs an image signal to the data line 52a and the two second ICs 5 that output the scanning signal to the scanning line 51a are COG-mounted in the overhanging region 10a of the element substrate 10. In addition, the flexible substrate 7 is connected to the edge of the overhanging region 10 a of the element substrate 10.

  Although a polarizing plate, a retardation plate, and the like are disposed so as to face the electro-optical device 1a, illustration and description thereof are omitted because they are not directly related to the present invention.

  2B and 3, the element substrate 10 and the counter substrate 20 are plate members having light transmissivity, such as glass and quartz. A plurality of data lines 52a, a pixel switching TFD element (not shown), a pixel electrode 34a, an alignment film 12, and the like described above are formed on the inner surface (the liquid crystal 19 side) surface of the element substrate 10. Yes. A light shielding film 21 called a black matrix or a black stripe is formed on the inner substrate (liquid crystal 19 side) surface of the counter substrate 20 so as to avoid a region facing the pixel electrode 34a, and a region facing the pixel electrode 34a. The color filters 22 of R (red), G (green), and B (blue) are formed in a predetermined arrangement. In addition, a surface of the counter substrate 20 on which the light shielding film 21 and the color filter 22 are formed is coated with a planarization layer 23 for planarization and protection. Scanning lines 51a are formed on the surface of the planarizing layer 23, and an alignment film 24 is formed on those surfaces.

(Configuration of TFD element)
4A and 4B are explanatory diagrams of a TFD element used as a pixel switching element in the electro-optical device shown in FIG.

4A and 4B, the element substrate 10 has a base layer 14 formed on the surface thereof, and the TFD element 56a includes a first TFD element 33a and a second TFD element 33b formed on the base layer 14. These two TFD element elements constitute a so-called back-to-back structure. Therefore, in the TFD element 56a, the current-voltage nonlinear characteristic is symmetric in both positive and negative directions. The underlayer 14 is made of, for example, tantalum oxide (Ta ₂ O ₅ ) having a thickness of about 50 to 200 nm to improve the adhesion of the TFD element 56 a and prevent diffusion of impurities from the element substrate 10. Is provided. The first TFD element 33a and the second TFD element 33b include a first metal layer 32a, an insulating layer 32b formed on the surface of the first metal layer 32a, and a second metal layer formed on the surface of the insulating film 32b so as to be separated from each other. It is comprised by the metal layers 32c and 32d. The first metal layer 32a is formed of, for example, a tantalum single film or a tantalum alloy film having a thickness of about 100 to 500 nm, and the insulating layer 32c is formed by oxidizing the surface of the first metal layer 32a by, for example, an anodic oxidation method. Is a tantalum oxide (Ta ₂ O ₅ ) having a thickness of 10 to 35 nm. The second metal layers 32c and 32d are formed to a thickness of about 50 to 300 nm by a metal film such as chromium (Cr). The second metal layer 32c becomes the data line 52a as it is, and the other second metal layer 32d is connected to a pixel electrode 34a made of a transparent conductive material such as ITO (Indium Tin Oxide).

(Control of board interval)
FIG. 5 is an explanatory diagram showing the effect of the electro-optical device to which the present invention is applied.

  In the electro-optical device 1a of the present embodiment, the layer thickness of the liquid crystal 19 is controlled by the distance between the element substrate 10 and the counter substrate 20. For this reason, in this embodiment, as shown in FIGS. 3 and 4A and 4B, in the element substrate 10, a region away from the pixel electrode 53 a, for example, a position where the data line 52 a passes, A resin spacer 9 is formed at a position facing the light shielding film 21 of the counter substrate 20, and the alignment film 12 is formed on the upper layer side of the resin spacer 9.

  In this embodiment, the resin spacer 9 has a substantially truncated pyramid-shaped base 91 whose thickness is continuously reduced from the element substrate 10 toward the counter substrate 20, and a substantially constant thickness from the distal end portion of the base 91. And a columnar portion 92 extending in a prismatic shape toward the counter substrate 20.

  For this reason, in this embodiment, even when the resin spacer 9 for controlling the substrate interval is protruded from the element substrate 10, the resin spacer 9 has a high fixing strength with respect to the element substrate 10. Occurrence of flaws that fluctuate can be prevented.

(Comparison between this embodiment, a modified example, and a conventional example)
In the present embodiment, as shown in FIG. 5, the resin spacer 9 has been described as having a substantially pyramidal base portion 91 and a prismatic columnar portion 92, but the base portion 91 has a truncated cone shape. Alternatively, the columnar portion 92 may be cylindrical. Further, as the resin spacer 9, two or more types of resin spacers 9 having different thicknesses of the prismatic columnar portions 92 may be formed on the same element substrate 10.

  In view of increasing the bottom area of the resin spacer 9 on the element substrate 10 and increasing its fixing strength, as shown in FIG. 5B, the resin spacer 9 has a truncated pyramid or truncated cone shape. 9A or a resin spacer 9B having a pyramid shape or a cone shape as shown in FIG. 5C. Further, as shown in FIG. 5D, a hemispherical resin spacer 9C may be used. Even when any of these resin spacers 9, 9A, 9B, 9C is used, the bottom area on the element substrate 10 is smaller than that of the resin spacer 9X having a constant thickness, as shown in FIG. There is an advantage that the compressive strength of the resin spacer can be set to an appropriate value according to the side surface shape while ensuring the fixing strength by widening. That is, in the case of the resin spacer 9X shown by a solid line in FIG. 5E, the bottom area on the element substrate 10 is narrow, so the fixing strength is small. On the other hand, when the thickness is increased as shown by a one-dot chain line in FIG. 5E, the fixing strength to the element substrate 10 can be increased, but the compressive strength is excessively increased. As a result, when the temperature drops and the liquid crystal 19 shrinks in volume with the liquid crystal 19 sealed between the substrates, the gap between the substrates is prevented from becoming narrow, and the liquid crystal 19 becomes negative pressure between the substrates. 19 may foam.

  Further, the resin spacer 9 of this embodiment shown in FIG. 5A is compared with the resin spacers 9A, 9B, 9C (modified example of this embodiment) shown in FIGS. 5B, 5C, and 5D. There are the following advantages. First, in the case of the resin spacer 9 shown in FIG. 5A, since the base 91 spreads from the middle position of the columnar portion 92, when the taper angle of the side surface portion of the base 91 is the same, FIG. Compared to what is shown, the base 91 need not be unnecessarily widened. Therefore, even when the base 91 is widened, the base 91 does not protrude into the pixel display opening area (on the pixel electrode 34a). Further, in the case of the resin spacers 9A, 9B, and 9C shown in FIGS. 5B, 5C, and 5D, if the compression strength is further increased while the fixing strength to the element substrate 10 is left as it is, a similar relationship is obtained. A form that is enlarged while maintaining or a form in which the taper is loosened is adopted, and as a result, the bottom area on the element substrate 10 is enlarged. However, in the case of the resin spacer 9 shown in FIG. 5A, the shape of the base 91 and the columnar portion 92 can be changed independently, so that the compressive strength can be further increased while maintaining the fixing strength to the element substrate 10 as it is. In order to increase the degree of freedom of design, the shape of the base portion 91 is left as it is, and the columnar portion 92 may be thickened. Therefore, even when only the columnar portion 92 is thickened to increase the compressive strength, the base portion 91 does not need to be enlarged, so that there is an advantage that the resin spacer 9 does not protrude into the display opening region of the pixel.

(Method of manufacturing electro-optical device 1a)
FIG. 6 is a process diagram showing a method for manufacturing the electro-optical device shown in FIG. FIG. 7 is a process cross-sectional view of the resin spacer forming process in the manufacturing process of the electro-optical device according to the present embodiment. In FIG. 7, various components on the element substrate are omitted.

  In manufacturing the electro-optical device 1a according to the present embodiment, the element substrate forming process including the active element forming process P11 to the sealing material printing process P16 and the scanning line forming process P21 to the granular spacer spraying process P24 illustrated in FIG. It is performed separately from the substrate forming step. In addition, many of the processes described below are performed in the state of a large-area original substrate capable of obtaining a large number of element substrates 10 and counter substrates 20, and after the original substrates are bonded together, they are cut. Now, an example using the element substrate 10 and the counter substrate 20 cut to a predetermined size will be described.

  First, in the element substrate forming process, in the active element forming process SP11, the data line 52a, the wiring pattern 8, the TFD element 56a, and the like are formed by a known method such as a film forming process, a photo etching process, and an anodizing process. .

  Next, in the pixel electrode formation step P12, the pixel electrode 23a is formed from ITO, and an ITO film is formed at the end of the wiring pattern 8 to form a pad.

  Next, in the resin spacer formation process P13, the resin spacer 9 described with reference to FIG. 3 is formed by using a photolithography technique. Here, although either a negative type or a positive type may be used as the photosensitive resin, an example of manufacturing the resin spacer 9 using the negative type photosensitive resin will be described with reference to FIG.

  In this embodiment, as shown in FIG. 7A, a negative photosensitive resin 98 such as an acrylic resin is applied on the element substrate 10 by using a spin coat method or the like, and then the photosensitive resin 98 is exposed with an exposure mask 930. To expose. Here, the exposure mask 930 includes a light shielding portion 931 at a portion where the photosensitive resin 98 is to be removed, and a light transmitting portion 933 at a region where the photosensitive resin 98 is to be left as the columnar portion 92. Further, the exposure mask 930 includes a partial light transmitting portion 932 between the light shielding portion 931 and the light transmitting portion 933, and the partial light transmitting portion 932 transmits light from the light shielding portion 931 toward the light transmitting portion 933. The degree is continuously higher. For this reason, when the photosensitive resin 98 is exposed with the exposure mask 930, the exposure amount is continuously changed in the partial light transmitting portion 932. Accordingly, when the photosensitive resin 98 is developed, the dissolution rate of the photosensitive resin 98 varies depending on the exposure amount in the exposed portion through the partial light transmitting portion 932. Therefore, as shown in FIG. The resin spacer 9 in which the columnar portion 92 extends from the base portion 91 having the above is formed. With such a method, since the photosensitive resin coating process, the exposure process, and the development process are performed only once, productivity can be improved. Another advantage is that only one exposure mask is required. Furthermore, the resin spacer 9 of any form shown to FIG. 5 (A)-(D) can be formed only by changing the translucent pattern of the partial translucent part 92. FIG.

  After the multistage resin spacers 9 are formed in this way, as shown in FIG. 6 again, after the alignment film 21 is formed in the alignment film formation process P14, the alignment film 21 is rubbed in the rubbing treatment process P15. Processing or other orientation processing is performed.

  Next, in the sealing material printing process P16, as shown in FIG. 2, the sealing material 30 is annularly applied by a dispenser, screen printing, or the like. Note that an opening for injecting liquid crystal is formed in a part of the sealing material 30.

  Separately from the element substrate forming process described above, in the counter substrate forming process, first, in the counter electrode forming process P21, the scanning line 51a (counter electrode) is formed following the light shielding film 21 and the color filter 22, and then the alignment film. In the formation step P22, the alignment film 24 is formed, and then in the rubbing treatment step P23, the alignment film 24 is subjected to a rubbing treatment or other alignment treatment.

  In the bonding step P31, the element substrate 10 and the counter substrate 20 are aligned, the sealing material 30 is sandwiched therebetween, the substrates 10 and 20 are bonded together, and then in the sealing material curing step P32, The sealing material 30 is cured by ultraviolet curing or other methods. Thus, after the empty panel structure is formed, in the liquid crystal injection step P33, the liquid crystal is injected under reduced pressure from the liquid crystal injection opening to the inside of the panel, and then in the inlet sealing step P34, the sealing material 31 is injected. The opening is sealed with. Thereafter, in the mounting step P35, the ICs 4 and 5 and the flexible substrate 7 are mounted on the element substrate 10 with an anisotropic conductive material to complete the electro-optical device 1a.

[Embodiment 2]
The basic configuration of the electro-optical device of this embodiment is the same as that of Embodiment 1, and only the form of the resin spacer is different. Therefore, the description of the common portions is omitted.

  FIGS. 8A and 8B are a plan view showing a position where a resin spacer is formed in the electro-optical device of this embodiment, and a cross-sectional view taken along the line BB ′. FIG. 9 is an explanatory view showing, in an enlarged manner, a resin spacer formed in the electro-optical device of this embodiment.

  As shown in FIGS. 8A, 8B, and 9, in the electro-optical device 1a of the present embodiment, a resin spacer is provided in a region where the TFD element 56a is formed as a region avoiding the pixel electrode 53a on the element substrate 10. 9A and 9C are formed, and the alignment film 12 is formed on the upper layer side of the resin spacer 9.

  Here, both the hemispherical resin spacer 9C (first protrusion) and the truncated pyramid-shaped or truncated cone-shaped resin spacer 9A (second protrusion) are formed on the element substrate 10.

  Since such resin spacers 9A and 9C have a large bottom area on the element substrate 10, the fixing strength to the element substrate 10 is large. Therefore, it is possible to prevent the occurrence of a problem that the resin spacer 9 is peeled off and the distance between the substrates varies.

  In addition, if the resin spacer 9A having a truncated pyramid shape or a truncated cone shape and the resin spacer 9C having a hemispherical shape, the resin spacers 9A and 9C have a high compressive strength, so that the resin spacers 9A and 9C cover the TFD element 56a. Even if formed, the TFD element 56a is not damaged. Therefore, since the formation region of the TFD element 56a can be used as the formation region of the resin spacers 9A and 9C, the resin spacers 9A and 9C do not protrude onto the pixel electrode 34a (display opening region of each pixel). Therefore, even if the fixing strength of the resin spacers 9A and 9C with respect to the element substrate 10 is increased, the amount of display light does not decrease.

  Furthermore, in this embodiment, resin spacers 9A and 9C having different compressive strengths are formed. That is, since the resin spacer 9C has a substantially hemispherical shape, the compression strength of the tip portion is small, whereas the resin spacer 9A protrudes in a substantially truncated cone shape or a substantially truncated pyramid shape, so that the resin spacer 9C is compared with the resin spacer 9C. Compressive strength is high. Therefore, if the resin spacers 9A and 9C are formed at an appropriate ratio, unlike the case where only the resin spacer 9A or only the resin spacer 9C is formed, the substrate is deformed to some extent when the liquid crystal 19 contracts due to a temperature change. It is possible to prevent the substrate interval from changing more than a predetermined level when a pressing load is applied to the substrate. That is, when the liquid crystal 19 is held in the state where the liquid crystal 19 is held between the substrates and the liquid crystal 19 contracts in volume, the substrate is pushed by the substrate and elastically deformed as much as the interval between the substrates is reduced. Therefore, the liquid crystal 19 does not foam. Further, when the substrate is pressed, the resin spacer 9A supports such a pressing load. Therefore, since the substrate is not further deformed, the resistance to the pressing load is strong, and the distance between the substrates is maintained even when the pressing load is applied. The reliability of 1a can be improved.

  In this embodiment, a hemispherical resin spacer 9C is used as a resin spacer (first protrusion) with low compressive strength, and a substantially truncated cone shape or a truncated pyramid shape as a resin spacer (second protrusion) with high compressive strength. However, a resin spacer 9C having a substantially conical shape or a substantially pyramidal shape as shown in FIG. 5C is used together with the resin spacer 9C as a resin spacer (first protrusion) having a low compressive strength. May be.

[Other embodiments]
The above embodiment is an example in which the present invention is applied to an active matrix liquid crystal device using TFD as a non-linear element. The present invention may be applied to an apparatus. The present invention is not limited to a liquid crystal device, and the present invention is applied to any electro-optical device as long as the electro-optical material is held between a pair of substrates and the distance between the substrates needs to be controlled. be able to.

[Application example to electronic equipment]
The electro-optical device to which the present invention is applied can be used as a display unit in various electronic devices such as a mobile phone and a mobile computer.

1 is a block diagram illustrating an electrical configuration of an electro-optical device to which the present invention is applied. (A) and (B) are schematic perspective views of an electro-optical device to which the present invention is applied as viewed from the element substrate side, and a schematic cross section when the electro-optical device is cut in the Y direction at a portion passing through a pixel electrode. It is explanatory drawing shown in. It is sectional drawing which shows the pixel structure of the electric apparatus which concerns on Embodiment 1 of this invention. FIG. 3 is an explanatory diagram of a TFD element used as a pixel switching element in the electro-optical device shown in FIG. 2. FIG. 10 is a diagram illustrating a modification of the electro-optical device to which the present invention is applied and an effect specific to the first embodiment. FIG. 6 is a process diagram illustrating the method for manufacturing the electro-optical device according to the first embodiment of the invention. FIG. 5 is a process cross-sectional view of a resin spacer forming process in the electro-optical device manufacturing process according to Embodiment 1 of the present invention. FIG. 6 is a plan view showing a position where a resin spacer is formed in an electro-optical device according to Embodiment 2 of the present invention, and a cross-sectional view taken along the line BB ′. It is explanatory drawing which expands and shows the resin spacer formed in the electro-optical apparatus which concerns on Embodiment 2 of this invention.

Explanation of symbols

1a electro-optical device, 9 resin spacer, 9A resin spacer (second protrusion), 9B resin spacer (first protrusion), 9C resin spacer (first protrusion), 10 element substrate (first substrate), 19 Liquid crystal (electro-optic material), 20 counter substrate (second substrate), 91 base, 92 columnar portion

Claims (9)

A first substrate; a second substrate disposed opposite the first substrate; an electro-optic material held between the first substrate and the second substrate; and the first substrate A plurality of substrate spacer control resin spacers protruding from the second substrate and coming into contact with the second substrate,
The resin spacer is a protrusion having a substantially conical surface or a substantially spherical side surface that makes a ground contact area on the first substrate wider than a contact area with the second substrate. Electro-optical device characterized.   2. The resin spacer according to claim 1, wherein the resin spacer includes a base having a substantially truncated pyramid shape or a substantially truncated cone shape whose thickness is continuously reduced from the first substrate side toward the second substrate, and a tip of the base portion. An electro-optical device comprising: a columnar portion extending from the portion toward the second substrate with a substantially constant thickness.   2. The electro-optical device according to claim 1, wherein the resin spacer protrudes in a substantially hemispherical shape, a conical shape, or a pyramid shape from the first substrate toward the second substrate.   2. The electro-optical device according to claim 1, wherein the resin spacer protrudes from the first substrate toward the second substrate in a substantially truncated cone shape or a substantially truncated pyramid shape.   2. The first protrusion protruding in a substantially hemispherical shape, a conical shape, or a pyramid shape toward the second substrate as the resin spacer on the first substrate, and the second substrate. And a second protrusion protruding substantially in the shape of a truncated cone or substantially in the shape of a truncated pyramid.   6. The electro-optical device according to claim 1, wherein the resin spacer is formed in a region avoiding a display opening from which display light is emitted in each pixel.   7. The electro-optical device according to claim 6, wherein the resin spacer is formed so as to cover a pixel switching element formed in each pixel on the first substrate.   An electronic apparatus comprising the electro-optical device defined in any one of claims 1 to 7. A first substrate; a second substrate disposed opposite to the first substrate; an electro-optic material held between the first substrate and the second substrate; and the first substrate. And a plurality of substrate spacer control resin spacers protruding from the second substrate and abutting against the second substrate.
In the step of applying the photosensitive resin to the surface side of the first substrate and then performing exposure and development to form the resin spacer, the light transmittance continuously changes from the light shielding portion toward the light transmitting portion. The photosensitive resin is exposed through an exposure mask having a partially transparent portion, and the ground area on the first substrate is set as the resin spacer by the exposure through the partially transparent portion. A method of manufacturing an electro-optical device, comprising: forming a protrusion having a substantially conical surface or a substantially spherical side surface that is wider than a contact area with the second substrate.

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