JP2007165744A - Semiconductor device, mounting structure, electrooptical device, method of manufacturing semiconductor device, method of manufacturing mounting structure, method of manufacturing electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure or a manufacturing method capable of easily realizing small pitch of an electrode in a projection electrode provided with a projection made of a resin, and suppressing prolonging of manufacturing processes and an increase in manufacturing cost. <P>SOLUTION: This semiconductor device is provided with a protruding electrode 120B having a protrusion 124 formed of a resin and an electrode layer 125 formed on the protrusion. The protrusion has a shape in which a plurality of mount-like protrusions 124a are integrally coupled in such a mode that one parts of circumferential portions 124b thereof are connected, and is formed in such a way that the plurality of protruding electrodes are provided by forming the conductive layer is formed on each of the protrusions. Connection portions 124v each formed by connecting adjacent protruding portions are arranged between the electrode layers each provided on these protruding portions. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a semiconductor device, a mounting structure, an electro-optical device, a method for manufacturing a semiconductor device, a method for manufacturing a mounting structure, a method for manufacturing an electro-optical device, and an electronic apparatus, and more particularly to a semiconductor device and other electronic components. The present invention relates to a structure and manufacturing method of a protruding electrode that is suitable when provided.

In general, as a method of mounting a driving IC on a liquid crystal display body, a bump (bump) electrode is formed on the driving IC by plating or the like, and a wiring pattern formed on a glass substrate constituting the liquid crystal display body, By applying pressure while heating the driving IC via an anisotropic conductive material (ACF or ACP), the protruding electrode is conductively connected to the wiring pattern with the conductive particles in the anisotropic conductive material sandwiched therebetween, In addition, a method called COG mounting in which the driving IC is bonded onto the glass substrate with an insulating resin in an anisotropic conductive material is widely known.

However, in recent years, since the number of electrodes has increased with the increase in definition of the liquid crystal display, the electrode interval of the driving IC has become smaller (narrower pitch).
There is a problem in that an electrical short circuit in which conductive particles are interposed between adjacent protruding electrodes is likely to occur, resulting in increased mounting defects.

Therefore, instead of the mounting method using the anisotropic conductive material, as shown in FIGS. 13 to 15, a resin is formed on the substrate 1 of the driving IC formed with the pad 2 and the insulating film 3. There has been proposed a method of forming a protruding electrode 4 and forming a protruding electrode by forming an electrode layer 5 made of a metal thin film or the like on the protruding body 4 (see, for example, Patent Document 1 below). In this method, the bump electrode is brought into contact with the wiring pattern formed on the glass substrate and pressed, and the driving IC is bonded to the substrate with the insulating resin 8 to perform mounting without using conductive particles. Therefore, even if the pitch is reduced, a short circuit between adjacent electrodes can be prevented.

Further, as shown in FIGS. 14 and 15, by configuring the surface of the protrusion 4 to have a convex curved surface, it is easy to measure the elastic deformation of the protrusion at the time of mounting, and the connection reliability is inspected. Proposed electrode structures and semiconductor device manufacturing methods that can be easily performed have been proposed (for example, see Patent Document 2 below). In this method, when the protrusion 4 is formed into a hemispherical shape or a semi-cylindrical shape, and the protrusion is elastically deformed by a pressing force during mounting, the protruding electrode and the wiring on the substrate 6 to be mounted Since the contact portion with the pattern 7 changes from a point contact state or a line contact state to a surface contact state, the conductive connection state can be easily known by looking at the shape of the contact portion.
JP-A-2-272737 Japanese Patent Laid-Open No. 2005-136402

However, in the method using the protruding electrode provided with the protruding body made of the aforementioned resin,
In order to secure the above-mentioned elastic deformation amount of the projecting body and to obtain sufficient connection reliability, it is necessary that the height of the protruding electrode is usually about 10 to 20 μm. For this reason, one electrode layer is formed for each protrusion, as in the protruding electrode disclosed in Patent Document 1 and the hemispherical protruding electrode disclosed in Patent Document 2 (see FIG. 13A). When using projecting electrodes, the spacing (pitch) between the projecting electrodes
Has to be set to at least twice the above height, and there is a problem in that there is a limit to narrowing the pitch of the electrodes.

Further, a protruding electrode provided with a semi-cylindrical protrusion disclosed in Patent Document 2 (FIG. 13B).
Unlike the above, when the projecting body is formed in an extended shape and a plurality of electrode layers are formed on one projecting body as in the above, the electrode differs depending on the height of the projecting electrode. The interval is not constrained. However, if a protruding body exists between the electrode layers during mounting, the protruding electrode is not easily deformed and the fluidity of the insulating resin is hindered. To reduce the pitch of the electrodes, it is described in Patent Document 2. As described above, it is necessary to remove part or all of the protrusions 4 between the electrode layers 5 by oxygen plasma etching or the like, which causes a problem that the manufacturing process takes a long time and the manufacturing cost increases.

Therefore, the present invention solves the above-mentioned problems, and the object thereof is to easily realize a narrow pitch of the electrode in the protruding electrode provided with the protruding body made of resin, and to increase the manufacturing process time and manufacturing. The object is to realize a structure or manufacturing method capable of suppressing an increase in cost.

In view of such a situation, the semiconductor device of the present invention is a semiconductor device including a protruding body formed of an elastic member (elastic material, for example, resin) and a protruding electrode having an electrode layer formed on the protruding body. The projecting body has a shape in which a plurality of mountain-shaped projecting portions are integrally connected in a form in which a part of their peripheral portions is connected, and the electrode layer is formed on each of the projecting portions. A plurality of the protruding electrodes are provided, and a connecting portion in which the adjacent protruding portions are connected to each other is disposed between the electrode layers provided in the adjacent protruding portions, respectively. It is characterized by.

According to the present invention, with respect to a projecting body having a shape in which a plurality of mountain-shaped projecting parts are integrally coupled in a form in which their peripheral parts are connected, an electrode layer is formed on each projecting part to project By using electrodes, the pitch between the electrodes can be shortened to reduce the pitch, and the elastic deformation of the protruding electrodes during mounting can be facilitated, and the fluidity of the insulating resin between the protruding electrodes Can be secured. In addition, since each of the plurality of protrusions is formed in a mountain shape, the entire circumference of the apex is inclined downward, so that even if the distance between the protrusions is close, elastic deformation or insulation of the protrusions There is an advantage that the fluidity of the resin is hardly hindered.

The mountain shape means a shape having an inclined surface around the entire top, such as a hemispherical shape, a semi-spheroid shape, a cone shape, a truncated cone shape, a pyramid shape, a truncated pyramid shape, or a convex curved surface shape.

In this invention, it is preferable that the said protrusion part has a top part on a convex curve. According to this, the protruding electrode constituted by the protruding portion and the electrode layer formed thereon has a gentle slope near the top due to the protruding portion having a convex-curved top. It is easy to ensure a conductive contact area when receiving pressure due to conductive contact, and the contact area with the conductor rapidly increases according to the amount of elastic deformation of the protrusion, so that the stability and reproducibility of the conductive connection state is improved. In addition, it is possible to easily inspect the conductive connection state by confirming the shape of the contact surface.

In the present invention, the protrusions are preferably arranged in a straight line. By arranging the protruding portions in a straight line, the protruding electrodes can be formed in a linear shape, and thus, for example, the protruding electrodes can be formed corresponding to a plurality of pad portions arranged in the electronic component.

In the present invention, the protrusions are preferably arranged in a staggered manner. By arranging the protrusions in a staggered manner, the pitch of the protruding electrodes can be more easily reduced.

Next, the mounting structure of the present invention includes an electronic component including a protruding body formed of an elastic member (elastic material, for example, resin) and a protruding electrode having an electrode layer formed on the protruding body, and the protrusion. In a mounting structure comprising a substrate provided with a conductor in conductive contact with an electrode, and an insulating resin that bonds the electronic component and the substrate, the projecting body has a plurality of mountain-shaped projecting portions at the periphery thereof. A plurality of protruding electrodes are provided adjacent to each other by forming the conductive layer on each of the plurality of projecting portions. The connecting portion formed by connecting the protruding portions is disposed between the electrode layers provided on the adjacent protruding portions, respectively.

In addition, an electro-optical device according to the present invention includes an electronic component including a protruding body formed of an elastic member (elastic material, for example, resin) and a protruding electrode having an electrode layer formed on the protruding body, and an electro-optical material. An electro-optical device comprising: a substrate having a substrate disposed thereon; and an electro-optical panel provided with a conductor that is in conductive contact with the protruding electrode on the substrate; and an insulating resin that bonds the electronic component and the substrate. The projecting body has a shape in which a plurality of mountain-shaped projecting portions are integrally coupled in a form in which a part of their peripheral portions is connected, and the conductive layer is formed on each of the projecting portions. A plurality of the protruding electrodes are provided, and a connecting portion in which the adjacent protruding portions are connected to each other is provided between the electrode layers provided in the adjacent protruding portions, respectively. Characterized by being arranged To.

Furthermore, the method for manufacturing a semiconductor device according to the present invention provides a method for manufacturing a semiconductor device having a protrusion formed by an elastic member and an electrode layer formed on the protrusion. A projecting body forming step of forming the projecting body integrally connected in a partially connected manner, and an electrode layer forming step of forming the electrode layer on each of the plurality of projecting portions, The connecting portion formed by connecting the adjacent projecting portions is arranged between the electrode layers respectively provided on the adjacent projecting portions.

According to the present invention, in the protrusion forming step, a plurality of protrusions are formed in a form integrally connected in a form in which a part of their peripheral portions are connected, and then the electrode layer is formed on the protrusions. Therefore, it is possible to reduce the pitch of the protruding electrodes. In addition, although the peripheral portions of the plurality of protruding portions are connected, the top portions are independent from each other, so that the electrode layer is formed in order to facilitate the elastic deformation of the protruding electrodes and ensure the fluidity of the insulating resin. It is not necessary to provide a process for removing part or all of the region between the electrode layers later, or even if the process is provided, the processing time can be reduced, so that the number of manufacturing steps can be reduced or the manufacturing time can be reduced. You can plan.

In the present invention, it is preferable that the protruding body is formed in a mountain shape. According to this, since each protrusion part is formed in mountain shape, shaping | molding of the protrusion in a protrusion formation process becomes easy. For example, the protrusions can be formed very easily by a simple method with good mass productivity, such as a photolithography method or an imprint method (transfer method), rather than a low-productivity method such as a dry etching method.

In the present invention, it is preferable that the method further includes a step of removing a part or all of a region between the protruding portions in the protruding body after the electrode layer forming step. By further providing a step of removing part or all of the region between the protruding portions after the electrode layer forming step, the elastic deformation of the protruding electrode can be further facilitated and the fluidity of the insulating resin can be further increased. Can do. Further, since the protrusion is provided with the recess from the beginning, the processing time of the process can be shortened.

Further, the method for manufacturing a mounting structure according to the present invention includes an electronic component including a protruding body formed of a resin and a protruding electrode having an electrode layer formed on the protruding body, and an electrically conductive contact with the protruding electrode. In a manufacturing method of a mounting structure comprising a substrate provided with a body and an insulating resin that bonds the electronic component and the substrate, a plurality of protrusions are connected to the electronic component and a part of their peripheral portions is connected. A projecting body forming step of forming the projecting bodies integrally connected with each other, an electrode layer forming step of forming the electrode layer on each of the plurality of projecting portions, and the projecting electrodes are electrically connected to the conductor. An electronic component mounting step of mounting the electronic component on the substrate so as to be connected, and the connecting portion formed by connecting the adjacent protruding portions to the adjacent protruding portion Each provided Characterized by comprising arranged between the electrode layers.

Furthermore, the electro-optical device manufacturing method of the present invention includes a projecting body formed of a resin and a projecting electrode having an electrode layer formed on the projecting body, and an electro-optic material. In a method for manufacturing an electro-optical device, comprising: an electro-optical panel having a substrate, and an electro-optical panel including a conductor that is in conductive contact with the protruding electrode; and an insulating resin that bonds the electronic component and the substrate. A projecting body forming step of forming the projecting body having a shape in which a plurality of projecting sections are integrally connected to the electronic component in a form in which a part of their peripheral portions is connected, and the electrodes on the projecting sections respectively. An electrode layer forming step of forming a layer, and an electronic component mounting step of mounting the electronic component on the substrate so that the protruding electrode is conductively connected to the conductor, and the protrusions adjacent to each other Parts are connected Connecting portion made is characterized by comprising disposed between the adjacent composed respectively provided on the protruding portion formed by the electrode layer.

Next, an electro-optical device according to the present invention includes the above-described electro-optical device. Examples of the electronic device include a mobile phone, a portable information terminal, an electronic watch, a television device, and a projector.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a partial plan view showing the structure of a protruding electrode according to the present invention, FIG. 2 is a sectional view taken along the line II-II in FIG. 1, and FIG.

Examples of the substrate on which the protruding electrode according to the present invention is formed include various electronic components and semiconductor devices. In particular, in the following description, aluminum is formed on a substrate 121 composed of a semiconductor substrate made of silicon single crystal or the like. Etc., so as to expose the pad 122 composed of
An example in which the surface other than the pad 122 is covered with an insulating film 123 made of a silicon oxide film or the like is illustrated.

In the present embodiment, the projecting body 124 is provided at a portion different from the portion where the pad 122 is formed on the substrate 121 so as to protrude from the surface of the substrate 121 by a resin which is an elastic member. The protrusion 124 can be made of any resin, and in particular, an acrylic resin, a phenol resin, a silicone resin, a polyimide resin, a silicone-modified polyimide resin,
An epoxy resin or the like can be used. The protrusion 124 is preferably made of a photosensitive resin in order to facilitate manufacture. As the photosensitive resin, an acrylic resin whose shape can be controlled depending on exposure conditions is most preferable for facilitating patterning. In addition, as long as it has an elastic characteristic required in a mounting structure, not only said resin but other arbitrary elastic materials can be used.

The projecting body 124 of the present embodiment has a shape in which a plurality of projecting parts 124a are connected in a manner in which a part of their peripheral parts is connected. Each protrusion 124a is formed in a mountain shape, and each has a top. Here, the mountain shape refers to a shape in which an inclined surface exists around the entire top. Therefore, the projecting body 124 of the present embodiment is configured in a so-called mountain range. In the case of the illustrated example, the protruding portion 124a is formed in a hemispherical shape, and the hemispherical peripheral portion is connected to the adjacent protruding portion 124a by a part (connecting portion) 124b of the peripheral portion. Further, the protrusion 124 has a shape in which a plurality of protrusions 124a are linearly arranged in a line.

An electrode layer 125 is formed on the protruding body 124. The electrode layer 125 is configured to be conductively connected to the pad 2 and disposed on the top of the protrusion 124a, and is formed as a strip-shaped thin film (strip) extending from the top of the pad 2 to at least the top of the protrusion 124a. Has been. As a material configuration of the electrode layer 125, a structure in which Au is laminated on Ti-W, a structure in which Au is laminated on Cr, or the like is preferably used. However, Au, Ti-W, C
Various metals (alloys) such as u, Ni, Pd, Al, Cr, Ti, W, Ni-V, lead-free solder
It is also possible to use a structure in which a single layer is formed, or a structure in which these are stacked in an appropriate combination.

In the present embodiment, the plurality of electrode layers 125 are formed on the projecting body 124, whereby the plurality of protruding electrodes 120B corresponding to each electrode layer are configured. Each electrode layer 125 is a protrusion 12.
It is comprised so that it may each be arrange | positioned on the top part of the some protrusion part 124a of four. In particular,
In the illustrated example, the electrode layer 125 is formed on all the protruding portions 124 a of the protruding body 124. Note that the troughs 124v provided between the adjacent protrusions 124 are disposed between the adjacent electrode layers 125.

As shown in FIG. 3, the protruding electrode 120B is conductively connected to conductors (wiring pattern, driving wiring and input wiring described later) 117 and 118 formed on the substrate 111 to be mounted. Although this board | substrate 111 is not specifically limited, In this embodiment, it is preferable that they are hard substrates, such as a glass substrate, a semiconductor substrate, a ceramic substrate, a hard resin substrate. Since the substrate material itself is not easily elastically deformed with these hard substrates, it is effective to provide the protruding electrode 120B provided with the protruding body 124 made of the elastically deformable resin in order to obtain a conductive connection state stably and with good reproducibility. Is.

At the time of mounting, the protruding electrode 120B is brought into contact with the conductors 117 and 118, and the protrusion 124 is elastically deformed by applying pressure. In this state, the substrates 121 and 111
Insulating resin 128 is introduced between and fixed. As the insulating resin 128, a fluid insulating resin material (NCP) may be used, or a semi-solid sheet-like insulating resin material (NCF) is interposed between the substrates 121 and 111, You may use in the aspect softened and fluidized by heating and pressurization. That is, the substrate 121 is disposed on the substrate 111 through the semi-solid insulating resin material, and pressurizing while heating the substrate 121, so that the insulating resin material is softened and the electrode layer 125 of the protruding electrode 120B becomes conductive. Conductively connected to the bodies 117, 118;
Each projecting portion 124a of the projecting body 124 is in an elastically deformed state, and in this state, the insulating resin 128 is thermally cured, so that the conductive connection state is maintained by the adhesive force of the insulating resin 128.

4 is an enlarged cross-sectional view showing the cross-sectional shape of the protruding electrode 120B before mounting, and FIG. 5 is an enlarged cross-sectional view showing the cross-sectional shape of the protruding electrode 120B after mounting. As shown in FIG. 4, the protrusion 124a of the present embodiment has substantially the same size and shape as the conventional hemispherical protrusion of the protruding electrode, and the height of the protrusion 124a is h. Projection 1 viewed in the direction in which electrodes 120B are arranged
Assuming that the width of 24a is w, the width w is normally about twice the height h and w to 2h. Here, the general value of the height h is about 10 to 20 μm. In the conventional structure, since the spacing in the arrangement direction of the protruding electrodes is limited by the width of the hemispherical protruding body, the arrangement pitch of the protruding electrodes is greater than the width of the protruding body, that is, twice the height h of the protruding body. It was more than that.

In the present embodiment, a protrusion 124 is formed by integrally connecting a plurality of protrusions 124a in such a manner that peripheral edges thereof are connected, and an electrode layer 125 is formed for each protrusion 124a to form a protruding electrode 120B. Therefore, even if the shape and size of the protruding portion 124a are set in the same manner as the conventional protruding body, the arrangement pitch P of the protruding electrodes 120B is less than the width w of the protruding portion 124a. For example, the arrangement pitch P can be less than the width w and not less than the height h, and not less than the height h.

Further, since the protrusions 124a are formed in a mountain shape, as shown in FIGS. 1 and 2, the entire periphery of the top 120p of the protruding electrode 120B is configured as an inclined surface. Elastic deformation is likely to occur in the arrangement direction of the protruding electrodes 120B,
Since the mode of elastic deformation at the time of mounting is isotropic, the effect that it is easy to ensure the ease of elastic deformation can be obtained even if the interval between the protruding electrodes 120B is narrowed. For the same reason, the gap between the adjacent protrusions 124a formed on the valley 124v of the protrusion 124 is on the line connecting the tops 120p of the protruding electrodes 120B as shown in the plan view of FIG. Although not shown, it is configured to open from the planar position of the horizontal line in FIG. 1) to the direction (upper and lower sides in FIG. 1) orthogonal to the arrangement direction of the protrusions 124a, and therefore the insulating resin 128 at the time of mounting. The fluidity between the projecting electrodes 120B becomes good, the insulating resin 128 is smoothly discharged from the region between the projecting electrodes 120B, and the conductive contact state between the projecting electrode 120B and the conductors 117 and 118 can be reliably obtained. is there.

In particular, in the illustrated example, the protrusion 124a is formed in a hemispherical shape, so that the inclination of the surface of the protrusion near the top 120p is small, and thus a large conductive contact area can be reliably obtained by pressing, and the protrusion Since the elastic deformation shape of 124a is also stable, a reliable conductive connection state can be realized with good reproducibility. Such an effect can be obtained not only when the protruding portion 124a is formed in a hemispherical shape but also when a protruding portion having various convex curved surfaces such as a semi-spheroid shape is formed. In order to obtain the effect of such a shape, the protruding portion 124 is basically used.
It is sufficient that only the top of a has the above shape.

As shown in FIG. 4, before mounting, the top 120p of the protruding electrode 120B and the protruding body 124 are provided.
There is a height difference δh between the valley portion 124v and the valley portion 124v. The larger the height difference δh, the easier the elastic deformation of the protruding electrode 120B during mounting and the better the fluidity of the insulating resin 128. However, if the protrusion 124a has the same shape, the height difference δh increases. Projection electrode 1
The arrangement pitch of 20B is also increased. Therefore, the height difference δh is preferably in the range of 1/3 to 2/3 of the height h of the protrusion 124, for example, and is most preferably about half of the height h.

As shown in FIG. 5, after the mounting, the protruding electrode 120B is pressed against the conductors 117 and 118, so that the protruding portion 124a is elastically deformed so as to be crushed, and the top portion 120p.
Is flattened. As a result, the top portion 120p of the protruding electrode 120B and the valley portion 12 of the protruding body 124 are obtained.
The height difference δh ′ from 4v is smaller than the height difference δh. The height difference δh ′ after mounting is preferably in the range of 3/12 to 7/12 of the height h, for example.

Next, a method for manufacturing the protruding electrode 120B according to the present invention will be described with reference to FIG. In this embodiment, as shown in FIG. 6A, first, a resin layer 124A made of a photosensitive resin is formed on a substrate having a substrate 121 such as a semiconductor substrate by a spin coating method, a printing method, or the like. Next, the resin layer 124A is exposed using a mask (not shown), and is patterned by development processing, baking processing, or the like to form the protrusions 124 as shown in FIG. 6B. In this patterning process, the protrusions 124 are not only left in the shape of an island or a frame as in the prior art, but also formed into a shape in which a plurality of protrusions 124a are integrally connected in such a manner that their peripheral edges 124b are connected. To do.

The exposure pattern using a mask or the like may have a shape in which a plurality of portions corresponding to the plurality of protrusions 124a are connected, or a shape in which a plurality of portions corresponding to the plurality of protrusions 124a are provided discretely. Good. In particular, in the latter case, it is possible to form the protrusions 124a in a mountain shape by intentionally blurring the exposure pattern by proximity exposure or the like so that the exposure intensity is appropriately distributed. Further, by adjusting the exposure intensity using a halftone mask, the mountain shape of the protruding portion 124a can be formed.

The patterning step is not limited to the photolithography method described above, and can be performed by other methods. For example, an imprint method (transfer method) is applied to the resin layer 124A, and the resin layer 12
It is also possible to form 4A into the above shape by a mold. Further, the resin layer 124A is configured to remain only at a position corresponding to the protruding portion 124a, and then the remaining resin layer is softened / flowed by heating or the like so that the peripheral portions of the protruding portion 124a are connected to each other. It may be.

The above patterning process can be basically performed in the same process time as the conventional patterning process. That is, it is only necessary to change the exposure pattern or the mold shape, and it is not necessary to change the process itself.

Next, as illustrated in FIG. 6C, the electrode layer 125 is formed on each protrusion 124 a of the protrusion 124. These electrode layers 125 are formed by depositing a metal layer or other conductive layer by an appropriate film forming method such as an evaporation method, a sputtering method, a CVD method, or an electroless plating method, and then selectively using a mask or the like. It can be formed by removing (patterning) unnecessary portions. The electrode layer 125 is formed so as to be disposed on at least the top of the protruding portion 124a. In general, the electrode layer 125 is configured to be conductively connected to the pad 122 shown in FIG.

In the present embodiment, the protruding electrode 12 composed of the protruding portion 124a and the electrode layer 125 as described above.
A plurality of 0Bs are provided for the integral protrusions 124. These protruding electrodes 120B
An electronic component (for example, a semiconductor device) including the above may be mounted on the substrate 111 as shown in FIG.

However, in this case, the valleys 124v between the protrusions 124a in the protrusions 124 are not formed sufficiently deep, and the protrusions 124a are not easily elastically deformed during mounting, and the valleys 124v between the protrusions 124a. There is a possibility that the conductive contact state may be deteriorated due to insufficient flow of the insulating resin 128 due to insufficient upper gap. Therefore, after the above step, a step of removing a part or all of the region between the protruding portions 124a in the protruding body 124 is provided, and a concave groove 124u is formed in the above region as shown in FIG. Also good. This step is performed by, for example, plasma processing by irradiating the substrate 121 with oxygen gas plasma, other dry etching methods, wet etching methods, or the like. In particular, in the oxygen plasma treatment, a resin material can be etched while a metal material has a low etching rate, so that a sufficient selection ratio can be secured. Therefore, the treatment can be performed without a mask (using the electrode layer 125 as a mask). It is.

In this case, a step of providing the concave groove 124u is required separately, but originally the protruding portion 124 is provided.
Since the trough part 124v is provided between a, the processing time of the said process can be reduced significantly compared with the conventional method.

7 to 9 are schematic perspective views (a) and schematic plan views of various examples of the projecting body according to this embodiment.
b). The protrusion 124 shown in FIG. 7 has the shape described above, and shows an example in which a plurality of hemispherical protrusions 124a are integrally connected, and these protrusions 124a are arranged in a straight line. Further, the protrusion 124 ′ shown in FIG. 8 has a plurality of semi-cylindrical protrusions 1.
An example in which 24a 'is arranged in a straight line is shown. Furthermore, the protrusion 124 ″ shown in FIG. 9 shows an example in which a plurality of hemispherical protrusions 124a ″ are integrally connected and the protrusions 124a ′ are arranged in a staggered manner. In addition, the arrangement | sequence aspect of a some protrusion part is not restricted only to what was arranged in the above 1 line, For example, you may arrange | position so that it may become a 2 or more row | line | column. Moreover, it may be arranged not only in a linear shape but also in a curved shape.

FIG. 10 shows an electronic component (semiconductor device) 120 having the protruding electrode 120B described above.
1 is a schematic perspective view showing a configuration example of a mounting structure formed on 1 or an electro-optical device. The electro-optical device 100 includes an electro-optical panel 110 and an electronic component 120. The electro-optical panel 110 is formed by bonding a pair of substrates 111 and 112 made of glass, synthetic resin, or the like with a sealant 113 so as to have a predetermined interval (about 3 to 10 μm).
The electro-optic material is disposed between the two. In the illustrated example, the substrates 111 and 112 are shown.
A liquid crystal display body in which a liquid crystal 114 is sealed in a region closed by a sealing material 113 between them is configured.

Drive electrodes (not shown) are formed on the inner surfaces of the substrates 111 and 112, and the light modulation characteristics can be controlled for each pixel by applying a predetermined electric field to the liquid crystal 114 by these drive electrodes. The pixels are arranged in a matrix, for example, in a display area set inside the sealing material 113. Polarizing plates 115 and 116 are disposed (attached) on the outer surfaces of the substrates 111 and 112.

The substrate 111 is provided with a facing portion 111a that faces the substrate 112 and a protruding portion 111b that protrudes outward from the outer shape of the substrate 112, and the driving electrodes constituting the above-described pixels are arrayed on the facing portion 111a. In addition, a plurality of drive wirings 117 that are directly or indirectly connected to the drive electrodes are drawn out from the projecting portion 111b. A plurality of input wirings 118 are formed at the end of the overhanging portion 111b.

The electronic component 120 is formed by forming the plurality of protruding electrodes 120B described above on the surface (the lower surface in FIG. 10). Typically, the plurality of protruding electrodes 1 are formed on the active surface of the semiconductor substrate.
This is a semiconductor device (semiconductor chip) in which 20B are arranged. The electronic component 120 is mounted on the surface of the projecting portion 111b, and each protruding electrode 120B is conductively connected to the drive wiring 117 and the input wiring 118, respectively.

The input wiring 118 has an input terminal (not shown) at the end of the overhang 111b, and these input terminals are conductively connected to the wiring pattern of the flexible wiring board 131 mounted on the end of the overhang 111b.

In the present embodiment, since the electronic component 120 includes the plurality of protruding electrodes 120B formed at a narrow pitch as described above, the high-definition electro-optical panel 110 increases the number of drive wirings 117. Even if it has, it is possible to configure the electro-optical device 100 (mounting structure) with high electrical reliability without short circuit failure or conduction failure.

Next, an example of an electronic apparatus according to the present invention will be described with reference to FIGS. FIG. 11 shows a notebook personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer 200 is connected to a main body 201 having a plurality of operation buttons 201a and other operation devices 201b, and the main body 201, and a display screen 202a.
And a display unit 202 including In the case of the illustrated example, the main body unit 201 and the display unit 202 are configured to be openable and closable. The above-described liquid crystal device 100 is built in the display unit 202, and a desired display image is displayed on the display screen 202a. In this case, a display control circuit for controlling the liquid crystal device 100 is provided inside the personal computer 200. This display control circuit is configured to send a video signal and other input data and a predetermined control signal to the liquid crystal device 100 to determine its operation mode.

FIG. 12 shows a mobile phone which is another embodiment of the electronic apparatus according to the invention. A cellular phone 300 shown here includes an operation unit 301 including a plurality of operation buttons 301a and 301b and a mouthpiece, and a display unit 302 including a display screen 302a and a mouthpiece. The liquid crystal device 100 is incorporated inside. The display image formed by the liquid crystal device 100 can be viewed on the display screen 302a of the display unit 302. In this case, a display control circuit for controlling the liquid crystal device 100 is provided in the mobile phone 300. This display control circuit is configured to send a video signal and other input data and a predetermined control signal to the liquid crystal device 100 to determine its operation mode.

Note that the mounting structure, the semiconductor device, the electro-optical device, and the manufacturing method of the protruding electrode according to the present invention are not limited to the illustrated examples described above, and do not depart from the gist of the present invention. Of course, various changes can be made. For example, the electro-optical device according to each of the above embodiments has been described as including an electro-optical panel that constitutes a liquid crystal display. However, in the present invention, not only the liquid crystal display but also an organic electroluminescence device, an electrophoretic display, and plasma. Various electro-optical panels such as a display panel can be used.

The schematic plan view which shows the structure of the protruding electrode of embodiment. Sectional arrow figure which shows the structure of the protruding electrode of embodiment. The schematic longitudinal cross-sectional view which shows the mounting structure of the bump electrode and conductor of embodiment. The expanded sectional view which shows the structure of the protruding electrode before mounting of embodiment. The expanded sectional view showing the mounting structure after mounting of an embodiment. Process sectional drawing which shows the manufacturing method of the bump electrode of embodiment. The perspective view (a) and top view (b) which show the shape of the protrusion of embodiment. The perspective view (a) and top view (b) which show another example of the shape of the protrusion of embodiment. The perspective view (a) and top view (b) which show another example of a shape of the protrusion of embodiment. 1 is a schematic perspective view schematically showing an overall configuration of an electro-optical device according to an embodiment. 1 is a schematic perspective view illustrating an example of an electronic apparatus according to an embodiment. FIG. 6 is a schematic perspective view illustrating another example of the electronic apparatus of the embodiment. Partial top view (a) and (b) which shows a part of semiconductor device which forms the conventional protruding electrode. The schematic longitudinal cross-sectional view which shows the structure of the conventional protruding electrode. The expanded partial sectional view which shows the mounting structure of the semiconductor device provided with the conventional protruding electrode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Electro-optical device, 110 ... Electro-optical panel, 111 ... Board | substrate, 120 ... Electronic component (semiconductor device), 120B ... Projection electrode, 120p ... Top part, 121 ... Substrate, 122 ... Pad, 1
23 ... Insulating film, 124 ... Projection, 124a ... Projection, 124b ... Periphery (connection), 12
4v ... Valley, 125 ... Electrode layer

Claims (11)

In a semiconductor device provided with a protruding electrode having a protrusion formed by an elastic member and an electrode layer formed on the protrusion,
The projecting body has a shape in which a plurality of mountain-shaped projecting parts are integrally coupled in a form in which a part of their peripheral parts is connected,
A plurality of the protruding electrodes are provided by forming the electrode layer on each of the plurality of protruding portions,
The semiconductor device according to claim 1, wherein the connecting portion formed by connecting the adjacent projecting portions is disposed between the electrode layers respectively provided on the adjacent projecting portions.   The semiconductor device according to claim 1, wherein the protrusion has a convex curved top. The semiconductor device according to claim 1, wherein the protrusions are arranged in a straight line. The semiconductor device according to claim 1, wherein the projecting portions are arranged in a staggered pattern. An electronic component including a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body, a substrate including a conductor in conductive contact with the protruding electrode, the electronic component, and the electronic component In a mounting structure comprising an insulating resin that adheres to a substrate,
The projecting body has a shape in which a plurality of mountain-shaped projecting parts are integrally coupled in a form in which a part of their peripheral parts is connected,
A plurality of the protruding electrodes are provided by forming the electrode layer on each of the plurality of protruding portions,
A mounting structure in which adjacent projecting portions are connected to each other are arranged between the electrode layers respectively provided on the adjacent projecting portions. An electronic component having a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body, and a substrate on which an electro-optic material is disposed, and the protruding electrode is provided on the substrate. In an electro-optical device comprising: an electro-optical panel including a conductor in conductive contact; and an insulating resin that bonds the electronic component and the substrate.
The projecting body has a shape in which a plurality of mountain-shaped projecting parts are integrally coupled in a form in which a part of their peripheral parts is connected,
A plurality of the protruding electrodes are provided by forming the electrode layer on each of the plurality of protruding portions,
An electro-optical device, wherein a connecting portion formed by connecting adjacent projecting portions is disposed between the electrode layers respectively provided on the adjacent projecting portions. In a method of manufacturing a semiconductor device including a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body,
A projecting body forming step of forming the projecting body having a shape in which a plurality of projecting sections are integrally coupled in a manner in which a part of their peripheral edge portions is connected;
An electrode layer forming step of forming the electrode layer on each of the plurality of protrusions;
Comprising
A connection part formed by connecting the adjacent projecting parts is disposed between the electrode layers provided on the adjacent projecting parts, respectively. . The method for manufacturing a semiconductor device according to claim 7, further comprising a step of removing a part or all of a region between the protruding portions of the protruding body after the electrode layer forming step. An electronic component including a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body, a substrate including a conductor in conductive contact with the protruding electrode, the electronic component, and the electronic component In a manufacturing method of a mounting structure comprising an insulating resin for bonding a substrate,
A projecting body forming step of forming the projecting body having a shape in which a plurality of projecting sections are integrally connected to the electronic component in a mode in which a part of the peripheral edge portions is connected;
An electrode layer forming step of forming the electrode layer on each of the plurality of protrusions;
An electronic component mounting step of mounting the electronic component on the substrate so that the protruding electrode is conductively connected to the conductor;
Comprising
The connection structure formed by connecting the adjacent projecting portions is disposed between the electrode layers respectively provided on the adjacent projecting portions. Method. An electronic component having a protruding body formed of an elastic member and a protruding electrode having an electrode layer formed on the protruding body, and a substrate on which an electro-optic material is disposed, and the protruding electrode is provided on the substrate. In an electro-optical device manufacturing method, comprising: an electro-optical panel including a conductor in conductive contact; and an insulating resin that bonds the electronic component and the substrate.
A projecting body forming step of forming the projecting body having a shape in which a plurality of projecting sections are integrally connected to the electronic component in a mode in which a part of the peripheral edge portions is connected;
An electrode layer forming step of forming the electrode layer on each of the plurality of protrusions;
An electronic component mounting step of mounting the electronic component on the substrate so that the protruding electrode is conductively connected to the conductor;
Comprising
An electro-optical device comprising: a connecting portion formed by connecting adjacent projecting portions disposed between the electrode layers respectively provided on the adjacent projecting portions; Production method. An electronic apparatus comprising the electro-optical device according to claim 6.

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