JP2007265145A - Non-contact communication medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily obtain a configuration capable of selecting a communication frequency in a non-contact type IC label, which can make a communication by selectively using a plurality of frequencies. <P>SOLUTION: A bow tie antenna part 120 for allowing an IC chip 110 to make the communication in 2.45 GHz and a meander antenna part 130 for allowing the IC chip 110 to make the communication in a UHF band frequency by being connected to the bow tie antenna part 120 are formed on a base substrate 140, and a label 150 is stuck to connection parts 131a and 131b between the bow tie antenna part 120 and the meander antenna part 130 so as to cover them. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact communication medium such as a non-contact type IC card or a non-contact type IC label that can communicate in a non-contact state, and more particularly to a non-contact communication medium that can communicate using a plurality of frequencies selectively. .

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.

  In information management using such a card, label, or tag, a non-contact type equipped with an IC capable of writing and reading information in a non-contact state on the card, label, or tag. IC cards, non-contact type IC labels, and non-contact type IC tags are rapidly spreading due to their excellent convenience.

  In a non-contact type IC card, a non-contact type IC label, and a non-contact type IC tag that can write and read information in a non-contact state, in recent years, in order to ensure downsizing and a communicable distance, 900 MHz to 1000 MHz. Fine IC chips that perform communication using the UHF band and the 2.45 GHz frequency band have begun to be used.

  When such a fine IC chip is used, the communicable distance of the IC chip can be extended by connecting a conductive antenna to the IC chip.

  7A and 7B are diagrams illustrating an example of a non-contact type IC tag on which an IC chip that performs communication using a frequency band of 2.45 GHz is mounted. FIG. 7A is a top view, and FIG. It is AA 'sectional drawing shown in FIG.

  As shown in FIG. 7, the present configuration example includes two strip-like conductors 420a and 420b formed on a base substrate 440 made of resin, paper, or the like so as to be arranged in series with each other at a predetermined interval. An antenna portion 420 is formed, and an IC chip 410 capable of writing and reading information in a non-contact state is mounted so as to be connected to the two conductors 420a and 420b. One end of the two conductors 420a and 420b are feed points 421a and 421b, and the IC chip 410 is connected to the feed points 421a and 421b.

  In the non-contact type IC tag 400 configured as described above, the antenna unit 420 is caused by radio waves from the information writing / reading device by being brought close to an information writing / reading device (not shown) provided outside. This current is supplied to the IC chip 410 via the feeding points 421a and 421b, so that information can be written from the information writing / reading device to the IC chip 410 in a non-contact state, or the IC chip The information written in 410 is read by the information writing / reading device.

In a contactless communication medium such as the contactless IC tag 400 described above, the frequency at which information is written and read is set to the above-described UHF band of 900 MHz to 1000 MHz, 2.45 GHz, or 13.56 MHz. . The difference between these frequencies is determined by the function of the IC chip and the shape of the antenna, but an IC chip that can handle a plurality of frequencies is mounted, and antennas that correspond to different frequencies are connected to the IC chip. Patent Document 1 discloses a non-contact communication medium that performs communication by selectively using a plurality of frequency bands by selectively using an antenna. In the non-contact communication medium disclosed in Patent Document 1, a cut line is formed on a sheet base material on which an antenna is formed, and a part of the antenna is cut using the cut line, thereby The antenna is selectively used.
JP 2005-284516 A

  As described above, when a cut line is formed on the sheet base material so that a part of the antenna can be cut, a cut line is also formed on the antenna. Disconnection may occur. Also, for example, when the cut line is formed so that the cut portion and the tie portion of the perforated cut portion and the tie portion are increased so that the cut portion does not reach the antenna, the sheet base material is cut using the cut line. There is a possibility that the cut portion will deviate from the cut line and a notch will be cut into an unintended portion.

  Therefore, by adjusting the shape of the cut line, it may be possible to avoid disconnection of the antenna or cutting into unintended parts, but if the antenna arrangement or shape is complicated, Since it is difficult to adjust the shape of the line, it is preferable that the communication frequency be selected more easily.

  An object of the present invention is to provide a non-contact communication medium capable of selectively using a plurality of frequencies and capable of easily realizing a configuration capable of selecting a communication frequency. To do.

In order to achieve the above object, the present invention provides:
In a non-contact communication medium in which an IC chip capable of communicating at the first and second frequencies is mounted on a base substrate,
A first antenna portion formed on the base substrate for the IC chip to communicate at the first frequency;
A second antenna that is connected to the first antenna portion and formed on the base substrate, and is connected to the first antenna portion, so that the IC chip communicates at the second frequency. And
It has a sticking member stuck on the base substrate so as to cover at least a part of a connection portion of the first antenna part and the second antenna part.

  In the present invention configured as described above, in a state where the adhesive member is attached to the base substrate, the IC chips mounted on the base substrate are connected to each other and formed on the base substrate. Communication is performed at the second frequency via the first antenna unit and the second antenna unit. And when a sticking member peels from a base base material, the part covered with the sticking member among the connection parts of a 1st antenna part and a 2nd antenna part accompanies peeling of a sticking member. As a result, the IC chip communicates at the first frequency only through the first antenna unit.

  As described above, when writing or reading information to or from the IC chip using the second frequency, the adhesive member is left attached to the base substrate, and the information about the IC chip is used using the first frequency. When writing or reading is performed, the sticking member is peeled off from the base substrate. Therefore, the communication frequency of the IC chip can be changed simply by peeling off the sticking member from the base substrate.

Specifically, the first antenna portion is made of a metal foil laminated on the base substrate,
It is conceivable that the second antenna portion is made of a conductive ink applied on the base substrate.

  As described above, in the present invention, the frequency used for communication of the IC chip changes between the state where the adhesive member is attached to the base substrate and the state where the adhesive member is peeled off from the base substrate. The communication frequency of the IC chip can be changed simply by peeling the sticking member from the base substrate, and a configuration capable of selecting the communication frequency can be easily realized.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact communication medium of the present invention, where FIG. 1A is a front view, FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. ) Is a cross-sectional view along the line BB ′ shown in FIG.

  In this embodiment, as shown in FIG. 1, on a base substrate 140 made of resin or the like, two conductors 120a and 120b having an isosceles triangle shape connect straight vertices formed by equal sides of an isosceles triangle. Is formed with a bow tie antenna portion 120 as a first antenna portion that is arranged so that each of the vertices is perpendicular to each of the bases of the isosceles triangle and the vertices have a gap. An IC chip 110 capable of writing and reading information in a non-contact state is mounted and configured so as to be connected to the two conductors 120a and 120b. The two conductors 120a and 120b have feeding points 121a and 121b at opposite vertices, and the IC chip 110 is connected to the feeding points 121a and 121b. Further, the conductors 120a and 120b constituting the bow-tie antenna unit 120 have conductors 130a and 130b extending in a zigzag shape at one vertex of two vertices on the base side of the isosceles triangle, respectively, in a direction away from the conductors 120a and 120b. Are connected via connection parts 131a and 131b, and a meander antenna part 130 serving as a second antenna part is formed from the two conductors 130a and 130b. Then, on the surface side of the base substrate 140 on which the bow tie antenna unit 120 and the meander antenna unit 130 are formed, the connection unit 131a covers the two connection units 131a and 131b of the bow tie antenna unit 120 and the meander antenna unit 130. , 131b, a label 150 serving as a sticking member is stuck. The label 150 is configured by applying an adhesive 152 to one surface of a label base material 151 made of paper, resin, or the like.

  The IC chip 110 is capable of writing and reading information in any frequency band of the first frequency of 2.45 GHz and the second frequency of 900 MHz to 1000 MHz in the UHF band.

  The conductors 120a and 120b constituting the bow tie antenna unit 120 have lengths from the feeding points 121a and 121b to the bases of the isosceles triangles, and information is written to and read from the IC chip 110 in a frequency band of 2.45 GHz. Such a length, that is, a length that resonates at a frequency of 2.45 GHz, and further, a broadband is realized by the shape of an isosceles triangle. The conductors 120a and 120b are formed by laminating metal foils on the base substrate 140, and are formed on the base substrate 140 by etching.

  The lengths of the conductors 130a and 130b constituting the meander antenna unit 130 from the feeding points 121a and 121b to the ends opposite to the connection parts 131a and 131b through the conductors 120a and 120b are information on the IC chip 110, respectively. Is long enough to be written and read in the UHF band of 900 MHz to 1000 MHz, that is, resonates with the UHF band of 900 MHz to 1000 MHz. The conductors 130a and 130b are made of conductive ink applied on the base substrate 140 by printing.

  Below, the manufacturing method of the non-contact type IC tag 100 comprised as mentioned above is demonstrated.

  First, a conductive metal made of, for example, copper or silver is deposited on one surface of the base substrate 140, and a conductor layer is laminated.

  Next, on the conductor layer laminated on the base substrate 140, masking is performed in accordance with the shape of the conductors 120a and 120b, and then etching is performed to form the conductor layer in the shape of the conductors 120a and 120b. Then, the bow tie antenna unit 120 including the conductors 120a and 120b is formed on the base substrate 140.

  Next, a conductive ink containing conductive particles is applied onto the base substrate 140 on which the bow tie antenna unit 120 is formed, and the conductors 130a and 130b are printed to form the meander antenna unit 130. Here, the conductive ink for printing the conductors 130a and 130b is mainly composed of conductive particles and a binder resin, and the printed conductive ink is dried and fixed on the base substrate 140. Conductors 130a and 130b are formed on the substrate. In addition, when binder itself has electroconductivity, it is not necessary to make a binder contain electroconductive particle. At this time, the end portions of the conductors 130a and 130b on the conductor 120a and 120b side are extended onto the conductors 120a and 120b, thereby forming connection portions 131a and 131b with the conductors 120a and 120b.

  Next, a conductive adhesive is applied on the power feeding points 121a and 121b of the base substrate 140, and the IC chip 110 is electrically connected to the conductors 120a and 120b by the conductive adhesive. Mount and fix to.

  Thereafter, the label 150 is pasted over the connection portions 131a and 131b so as to cover the two connection portions 131a and 131b of the bow tie antenna unit 120 and the meander antenna unit 130.

  Below, the usage method of the non-contact type IC tag 100 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of using the non-contact type IC tag 100 shown in FIG.

  First, as shown in FIG. 2A, in the state where the label 150 is adhered to the base substrate 140, the conductor 120a and the conductor 130a are connected by the connecting portion 131a, and the conductor 120b and the conductor Since 130b is connected by the connection part 131b, the bow-tie antenna part 120 and the meander antenna part 130 formed on the base substrate 140 are in a connected state. Here, the length from the feed points 121a and 121b of the bow tie antenna unit 120 to the end of the meander antenna unit 130 opposite to the connection units 131a and 131b via the connection units 131a and 131b is information on the IC chip 110. In this state, writing and reading of information to and from the IC chip 110 are performed in the UHF band of 900 MHz to 1000 MHz. become. That is, when writing and reading information to and from the IC chip 110 in the UHF band of 900 MHz to 1000 MHz, the label 150 is used in a state of being attached to the base substrate 140 as shown in FIG. It will be.

  From this state, when the label 150 attached to the base substrate 140 is peeled off, the label 150 and the label 150 are peeled from the base substrate 140 on the surface of the region where the label 150 is attached. A peeling force is generated. Here, a part of the conductor 130a is formed in this region, but since the conductor 130a is formed by printing coated with conductive ink, the fixing force with respect to the base substrate 140 has the peeling force described above. Accordingly, as shown in FIG. 2B, a part of the conductor 130 a is peeled off from the base substrate 140 together with the label 150 by this peeling force.

  When the label 150 is completely peeled from the base substrate 140, as shown in FIG. 2 (c), the conductor 150a, 130b formed on the base substrate 140 is formed in the region where the label 150 has been attached. The part which had been peeled off from the base substrate 140 together with the label 150, whereby the conductors 120a and 120b and the conductors 130a and 130b are disconnected. In this state, the conductors 120a and 120b constituting the bow tie antenna unit 120 and the conductors 130a and 130b constituting the meander antenna unit 130 are disconnected from each other. This is performed only through the bow tie antenna unit 120 connected to the IC chip 110 at the points 121a and 121b. The conductors 120a and 120b constituting the bow tie antenna unit 120 have lengths from the feeding points 121a and 121b to the bases of the isosceles triangles, and information is written to and read from the IC chip 110 in a frequency band of 2.45 GHz. Thus, in this state, information is written to and read from the IC chip 110 in the 2.45 GHz frequency band. That is, when writing and reading information to / from the IC chip 110 in the 2.45 GHz frequency band, as shown in FIG. 2 (c), the label 150 should be peeled off from the base substrate 140. become.

  As described above, in this embodiment, when information is written to or read from the IC chip 110 using a frequency in the UHF band of 900 MHz to 1000 MHz, the label 150 is kept adhered to the base substrate 140 and is 2.45 GHz. When the information is written to or read from the IC chip 110 using the frequency band, the label 150 is peeled off from the base substrate 140. Therefore, the IC chip 110 is simply peeled off from the base substrate 140. The communication frequency can be changed.

  In this embodiment, when the label 150 is peeled off from the base substrate 140, the conductors 130a and 130b formed on the base substrate 140 are formed in the region where the label 150 is attached. Although all the parts are peeled off from the base substrate 140 together with the label 150, the conductors 130a and 130b formed on the base substrate 140 are made of conductive ink, so the label 150 is peeled off from the base substrate 140. When the label 150 is peeled off from the base substrate 140, the portion formed in the region where the label 150 is attached is broken by the peeling force of the label 150. In some cases, only a part thereof may be peeled off from the base substrate 140 together with the label 150. Even in such a case, the bow tie antenna unit 120 and the meander antenna unit 130 are disconnected, and thus writing and reading of information to and from the IC chip 110 are performed in a frequency band of 2.45 GHz.

  In this embodiment, the conductors 120a and 120b constituting the bow tie antenna unit 120 are formed on the base substrate 140 by etching, and the conductors 130a and 130b constituting the meander antenna unit 130 are printed on the base substrate 140. Although formed, the method of forming the conductors 120a, 120b, 130a, and 130b is not limited to this, and any method may be used as long as the connection portion 131a is destroyed when the label 150 is peeled from the base substrate 140. .

  In the present embodiment, the dipole type in which the two conductors 130a and 130b configuring the meander antenna unit 130 are respectively connected to the conductors 120a and 120b configuring the bow tie antenna unit 120 has been described as an example. It is also conceivable to realize a monopole type in which one meander-shaped conductor is connected to one of the conductors 120a and 120b constituting the portion 120. In that case, a label may be attached to one connection portion between one of the conductors 120a and 120b constituting the bow tie antenna portion 120 and the meander-shaped conductor.

(Second Embodiment)
FIGS. 3A and 3B are diagrams showing a second embodiment of the non-contact communication medium of the present invention, in which FIG. 3A is a front view and FIG. 3B is a cross-sectional view taken along line AA ′ shown in FIG.

  As shown in FIG. 3, this embodiment includes a communication antenna 211, and writing and reading of information are performed in a UHF band of 2.45 GHz that is a first frequency and 900 MHz to 1000 MHz that is a second frequency. An IC chip 210 capable of any frequency band is mounted on a base substrate 240 made of resin or the like, and becomes a first antenna portion so as to surround the IC chip 210 on three sides of the IC chip 210. An antenna unit 220 is formed on the base substrate 240. Further, conductors 230a and 230b extending in a zigzag shape in a direction away from the IC chip 210 are connected to the antenna unit 220 via connection units 231a and 231b provided on two corners of the antenna 220. A meander antenna portion 230 serving as a second antenna portion is formed from the two conductors 230a and 230b. Then, on the surface side of the base substrate 240 where the antenna part 220 and the meander antenna part 230 are formed, the connection parts 231a and 231b cover the two connection parts 231a and 231b of the antenna part 220 and the meander antenna part 230. A label 250 serving as a sticking member is stuck on. The label 250 is configured by applying an adhesive 252 to one surface of a label substrate 251 made of paper, resin, or the like.

  The shape of the antenna unit 220 resonates with the antenna 211 provided in the IC chip 210, so that information is written to and read from the IC chip 210 in a frequency band of 2.45 GHz, that is, 2 It has a shape that resonates at a frequency of 45 GHz. The antenna unit 220 is formed by laminating metal foils on the base substrate 240, and is formed on the base substrate 240 by etching.

  When the conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 through the connection units 231a and 231b, information is written to and read from the IC chip 210 at 900 MHz to 1000 MHz. The length is the same as that used in the UHF band, that is, the length resonates with the UHF band frequency of 900 MHz to 1000 MHz. The conductors 230a and 230b are made of conductive ink applied on the base substrate 240 by printing.

  Below, the manufacturing method of the non-contact-type IC tag 200 comprised as mentioned above is demonstrated.

  First, a conductive metal made of, for example, copper or silver is deposited on one surface of the base substrate 240, and a conductor layer is laminated.

  Next, on the conductor layer laminated on the base substrate 240, masking is performed in accordance with the shape of the antenna part 220, and then etching is performed to pattern the conductor layer into the shape of the antenna part 220. The antenna part 220 is formed on the base substrate 140.

  Next, conductive ink containing conductive particles is applied onto the base substrate 240 on which the antenna unit 220 is formed, and the conductors 230a and 230b are printed to form the meander antenna unit 230. Here, the conductive ink for printing the conductors 230a and 230b is the same as that shown in the first embodiment. At this time, the ends of the antenna unit 220 of the conductors 230a and 230b are extended onto the antenna unit 220, thereby forming the connection units 231a and 231b with the antenna unit 220.

  Next, the IC chip 210 is mounted in a region surrounded by the antenna portion 220 of the base substrate 240 and fixed with an adhesive or the like.

  Thereafter, the label 250 is pasted over the connecting portions 231a and 231b so as to cover the two connecting portions 231a and 231b of the antenna unit 220 and the meander antenna unit 230.

  Below, the usage method of the non-contact type IC tag 200 mentioned above is demonstrated.

  FIG. 4 is a diagram for explaining a method of using the non-contact type IC tag 200 shown in FIG.

  First, as shown in FIG. 4A, in the state where the label 250 is attached to the base substrate 240, the antenna part 220 and the conductors 230a and 230b are connected by the connection parts 231a and 231b, respectively. The antenna unit 220 and the meander antenna unit 230 formed on the base substrate 240 are connected to each other. Here, when the lengths of the conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 through the connection units 231a and 231b, writing and reading of information with respect to the IC chip 210 is performed in 900 MHz to 1000 MHz. Since the length is such that it is performed in the UHF band, in this state, information is written to and read from the IC chip 210 in the UHF band of 900 MHz to 1000 MHz. That is, when writing and reading information to and from the IC chip 210 in the UHF band of 900 MHz to 1000 MHz, the label 250 is used in a state of being attached to the base substrate 240 as shown in FIG. It will be.

  From this state, when the label 250 attached to the base substrate 240 is peeled off, the surface of the region of the base substrate 240 where the label 250 is attached is peeled from the base substrate 240 together with the label 250. A peeling force is generated. Here, a part of the conductor 230a is formed in this region, but since the conductor 230a is formed by printing coated with conductive ink, the fixing force with respect to the base substrate 240 has the peeling force described above. Accordingly, as shown in FIG. 4B, a part of the conductor 230 a is peeled off from the base substrate 240 together with the label 250 by this peeling force.

  When the label 250 is completely peeled from the base substrate 240, as shown in FIG. 4 (c), the conductor 250a, 230b formed on the base substrate 240 is formed in the region where the label 250 is adhered. The part which had been peeled off from the base substrate 240 together with the label 250, whereby the antenna section 220 and the conductors 230a and 230b are disconnected. In this state, since the antenna unit 220 and the conductors 230a and 230b constituting the meander antenna unit 230 are disconnected, information is written to and read from the IC chip 210 with the antenna 211 provided on the IC chip 210. This is performed only through the antenna unit 220 that resonates with the antenna 211. The antenna unit 220 is shaped so that information is written to and read from the IC chip 210 in the 2.45 GHz frequency band by resonating with the antenna 211 provided in the IC chip 210. In this case, information is written to and read from the IC chip 210 in the 2.45 GHz frequency band. That is, when writing and reading information to / from the IC chip 210 in the 2.45 GHz frequency band, as shown in FIG. 4C, the label 250 should be peeled off from the base substrate 240. become.

  As described above, in this embodiment, when information is written to or read from the IC chip 210 using a UHF band frequency of 900 MHz to 1000 MHz, the label 250 is kept adhered to the base substrate 240 and is 2.45 GHz. When the information is written to or read from the IC chip 210 using the frequency band, the label 250 is peeled off from the base substrate 240. Therefore, the IC chip 210 is simply peeled off from the base substrate 240. The communication frequency can be changed.

  In this embodiment, when the label 250 is peeled off from the base substrate 240, the conductors 230a and 230b formed on the base substrate 240 are formed in the region where the label 250 is attached. Although all the parts are peeled off from the base substrate 240 together with the label 250, the conductors 230a and 230b formed on the base substrate 240 are made of conductive ink, so the label 250 is peeled off from the base substrate 240. When the label 250 is peeled off from the base substrate 240, the portion formed in the region where the label 250 is attached is broken by the peeling force of the label 250. In some cases, only a part thereof may be peeled off from the base substrate 240 together with the label 250. Even in that case, since the antenna unit 220 and the meander antenna unit 230 are disconnected, information is written to and read from the IC chip 210 in the 2.45 GHz frequency band.

  In this embodiment, the antenna unit 220 is formed on the base substrate 240 by etching, and the conductors 230a and 230b constituting the meander antenna unit 230 are formed on the base substrate 240 by printing. The method of forming 220 and the conductors 230a and 230b is not limited to this, and any method may be used as long as the connection portion 231a is broken when the label 250 is peeled off from the base substrate 240.

  In this embodiment, the dipole type in which the two conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 has been described as an example. However, one meander-shaped conductor is provided in the antenna unit 220. It can also be realized as a connected monopole type. In that case, a label may be attached to one connecting portion between the antenna portion 220 and the meander-shaped conductor.

(Third embodiment)
5A and 5B are diagrams showing a third embodiment of the non-contact communication medium of the present invention, in which FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view taken along line AA ′ shown in FIG. (C) is BB 'sectional drawing shown to (a).

  In the present embodiment, as shown in FIG. 5, a straight line connecting two vertices 320 a and 320 b having an isosceles triangle shape on a base substrate 340 made of resin or the like and having apexes formed by equal sides of the isosceles triangle. Is formed with a bow tie antenna section 320 serving as a first antenna section which is arranged so that each of the vertices is perpendicular to each of the bases of the isosceles triangle and the vertices have a gap. An IC chip 310 capable of writing and reading information in a non-contact state is mounted and configured so as to be connected to the two conductors 320a and 320b. The two conductors 320a and 320b have feeding points 321a and 321b at opposite vertices, and the IC chip 310 is connected to the feeding points 321a and 321b. Further, the conductors 320a and 320b constituting the bow tie antenna unit 320 have conductors 330a and 330b extending in a zigzag shape at one vertex of two vertices on the base side of the isosceles triangle, respectively, in a direction away from the conductors 320a and 320b. Are connected via connection portions 331a and 331b, and a meander antenna portion 330 serving as a second antenna portion is formed from the two conductors 330a and 330b. And the label 350 used as a sticking member is affixed on the whole surface in which the bow-tie antenna part 320 and the meander antenna part 330 of the base base material 340 were formed. The label 350 is configured by applying an adhesive 352 to the entire surface of one side of a label substrate 351 made of paper, resin, or the like.

  The IC chip 310 is capable of writing and reading information in any frequency band of the first frequency of 2.45 GHz and the second frequency of 900 MHz to 1000 MHz in the UHF band.

  The conductors 320a and 320b constituting the bow tie antenna unit 320 each have a length from the feeding points 321a and 321b to the base of the isosceles triangle, and information is written to and read from the IC chip 310 in a frequency band of 2.45 GHz. Such a length, that is, a length that resonates at a frequency of 2.45 GHz, and further, a broadband is realized by the shape of an isosceles triangle. The conductors 320a and 320b are formed by laminating metal foil on the base substrate 340, and are formed on the base substrate 340 by etching.

  The conductors 330a and 330b constituting the meander antenna unit 330 have lengths from the feeding points 321a and 321b to the ends opposite to the connection parts 331a and 331b through the conductors 320a and 320b, respectively. Is long enough to be written and read in the UHF band of 900 MHz to 1000 MHz, that is, resonates with the UHF band of 900 MHz to 1000 MHz. The conductors 330a and 330b are made of conductive ink applied on the base substrate 340 by printing.

  Below, the manufacturing method of the non-contact type IC tag 300 comprised as mentioned above is demonstrated.

  First, a conductive metal made of, for example, copper or silver is deposited on one surface of the base substrate 340, and a conductor layer is laminated.

  Next, on the conductor layer laminated on the base substrate 340, masking is performed in accordance with the shape of the conductors 320a and 320b, and then etching is performed to form the conductor layer in the shape of the conductors 320a and 320b. Then, the bow tie antenna section 320 made of the conductors 320a and 320b is formed on the base substrate 340.

  Next, a conductive ink containing conductive particles is applied onto the base substrate 340 on which the bow tie antenna unit 320 is formed, and the conductors 330a and 330b are printed to form the meander antenna unit 330. Here, the conductive ink for printing the conductors 330a and 330b is the same as that shown in the first embodiment. At this time, the ends of the conductors 330a and 330b on the side of the conductors 320a and 320b are extended onto the conductors 320a and 320b, thereby forming connection portions 331a and 331b with the conductors 320a and 320b.

  Next, a conductive adhesive is applied on the power feeding points 221a and 221b of the base substrate 240, and the IC chip 210 is electrically connected to the conductors 220a and 220b by the conductive adhesive. Mount and fix to.

  Thereafter, a label 350 is attached to the entire surface of the base substrate 340 on which the bow tie antenna unit 320 and the meander antenna unit 330 are formed.

  Below, the usage method of the non-contact type IC tag 300 mentioned above is demonstrated.

  FIG. 6 is a view for explaining a method of using the non-contact type IC tag 300 shown in FIG.

  First, as shown in FIG. 6A, in the state where the label 350 is attached to the base substrate 340, the conductor 320a and the conductor 330a are connected by the connecting portion 331a, and the conductor 320b and the conductor Since 330b is connected by the connection part 331b, the bow-tie antenna part 320 and the meander antenna part 330 formed on the base base material 340 are connected. Here, the length from the feeding points 321a and 321b of the bow tie antenna unit 320 to the end of the meander antenna unit 330 opposite to the connection units 331a and 331b via the connection units 331a and 331b is information on the IC chip 310. In this state, information is written to and read from the IC chip 310 in the UHF band of 900 MHz to 1000 MHz. become. That is, when writing and reading information to and from the IC chip 310 in the UHF band of 900 MHz to 1000 MHz, the label 350 is used with being attached to the base substrate 340 as shown in FIG. It will be.

  When the label 350 attached to the base substrate 340 is peeled from this state, the label 350 of the base substrate 340 is peeled from the base substrate 340 together with the label 350 on the surface to which the label 350 is attached. A peeling force is generated. Here, conductors 320a and 320b constituting the bow tie antenna part 320 and conductors 330a and 330b constituting the meander antenna part 330 are formed on the surface of the base substrate 340 where the label 350 is attached. However, since the conductors 330a and 330b constituting the meander antenna unit 330 are formed by printing with conductive ink applied thereto, the fixing force with respect to the base substrate 340 and the cohesive force of the conductors 330a and 330b itself are described above. Accordingly, as shown in FIG. 6B, the conductors 330a and 330b are broken by the peeling force and peeled from the base base material 340 together with the portions remaining on the base base material 340 and the label 350. Separate into parts.

  On the other hand, since the conductors 320a and 320b constituting the bow tie antenna portion 320 are formed on the base base material 340 by etching, the fixing force to the base base material 340 and the cohesive force of the conductors 320a and 320b themselves are based on the above-described peeling force. Thus, even when the label 350 is peeled off from the base substrate 340, it remains in the base substrate 340 without being broken by the peeling force.

  When the label 350 is completely peeled from the base substrate 340, the bow tie antenna unit 320 remains on the base substrate 340 and the meander antenna unit 330 is destroyed, as shown in FIG. It exists in the state connected to the IC chip 310 on the base substrate 340. In this state, information is written to and read from the IC chip 310 only through the bow tie antenna unit 320 connected to the IC chip 310 at the feeding points 321a and 321b. The conductors 320a and 320b constituting the bow tie antenna unit 320 each have a length from the feeding points 321a and 321b to the base of the isosceles triangle, and information is written to and read from the IC chip 310 in a frequency band of 2.45 GHz. Therefore, in this state, writing and reading of information with respect to the IC chip 310 are performed in a frequency band of 2.45 GHz. That is, when writing and reading information to / from the IC chip 310 in the 2.45 GHz frequency band, as shown in FIG. 6C, the label 350 is used with the label 350 peeled off. become.

  As described above, in this embodiment, when information is written to or read from the IC chip 310 using a UHF band frequency of 900 MHz to 1000 MHz, the label 350 is kept attached to the base substrate 340 and is 2.45 GHz. When the information is written into or read from the IC chip 310 using the frequency band, the label 350 is peeled off from the base substrate 340. Therefore, the IC chip 310 is simply peeled off from the base substrate 340. The communication frequency can be changed.

  In this embodiment, the label 350 with the adhesive 352 applied to the entire surface of one surface of the label base 351 is applied to the entire surface of the base base 340 on which the bow tie antenna unit 320 and the meander antenna unit 330 are formed. Is attached to one side of the label base material 351, for example, with a label coated with an adhesive such as a striped shape, the bow tie antenna unit 320 and the meander antenna of the base base material 340. It is also possible to adopt a configuration in which the part 330 is attached to the entire surface where the part 330 is formed. In that case, by sticking the label 350 to the base substrate 340 so that the region where the adhesive 352 of the label 350 is applied faces the connecting portions 331a and 331b, the one shown in the first embodiment A similar effect will occur.

  In the above-described three embodiments, in the state where the labels 150, 250, and 350 are attached to the base base materials 140, 240, and 340, the IC chip 110, Information can be written to and read from 210 and 310, and in a state where labels 150, 250, and 350 are peeled off from base materials 140, 240, and 340, IC chips 110 and 210 using a frequency of 2.45 GHz. , 310 can be written to and read from, but the frequency at which information can be written to and read from the IC chips 110, 210, 310 is not limited to these. The state where 250 and 350 are attached, and the base substrate 140 In the 240 and 340 in a state in which the label 150, 250, 350 has been peeled off, as long as the writing and reading of data to the IC chip 110, 210 and 310 the frequency which is different possible.

  In addition, the shape of the antenna formed as the first antenna portion or the second antenna portion on the base substrate 140, 240, 340 is not limited to the above-described three embodiments, and can be set as appropriate.

  In the above-described three embodiments, the non-contact type IC tags 100, 200, and 300 have been described as examples of the non-contact communication medium. However, the non-contact type IC label, the non-contact type IC card, etc. Needless to say, the present invention can be applied.

It is a figure which shows 1st Embodiment of the non-contact communication medium of this invention, (a) is a surface view, (b) is AA 'sectional drawing shown to (a), (c) is (a) It is BB 'sectional drawing shown to). It is a figure for demonstrating the usage method of the non-contact-type IC tag shown in FIG. It is a figure which shows 2nd Embodiment of the non-contact communication medium of this invention, (a) is a surface figure, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the usage method of the non-contact-type IC tag shown in FIG. It is a figure which shows 3rd Embodiment of the non-contact communication medium of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c). FIG. 4 is a cross-sectional view taken along the line BB ′ shown in FIG. It is a figure for demonstrating the usage method of the non-contact-type IC tag shown in FIG. It is a figure which shows an example of the non-contact-type IC tag by which the IC chip which communicates using a 2.45 GHz frequency band is mounted, (a) is a top view, (b) is A shown to (a). It is -A 'sectional drawing.

Explanation of symbols

100, 200, 300 Non-contact IC tag 110, 210, 310 IC chip 120, 320 Bowtie antenna section 120a, 120b, 130a, 130b, 230a, 230b, 320a, 320b, 330a, 330b Conductors 121a, 121b, 321a, 321b Feed point 130, 230, 330 Meander antenna part 131a, 131b, 231a, 231b, 331a, 331b Connection part 140, 240, 340 Base substrate 150, 250, 350 Label 151, 251, 351 Label substrate 152, 252, 352 Adhesive 211 Antenna 220 Antenna

Claims (1)

In a non-contact communication medium in which an IC chip capable of communicating at the first and second frequencies is mounted on a base substrate,
A first antenna portion formed on the base substrate for the IC chip to communicate at the first frequency;
A second antenna that is connected to the first antenna portion and formed on the base substrate, and is connected to the first antenna portion, so that the IC chip communicates at the second frequency. And
A non-contact communication medium comprising an adhesive member attached to the base substrate so as to cover at least a part of a connection portion between the first antenna part and the second antenna part.

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