JP2005107176A - Non-contact type ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent non-contact type IC label from being easily reused when it is peeled off from an article or the like after it is pasted onto the article or the like and used, regardless of the mechanical strength of the members which constitute a circuit. <P>SOLUTION: A resin sheet 116 in which an antenna 112 and land sections 114 are formed and an IC chip 111 connected to the antenna 112 is mounted, and a film substrate 118 in which a bridge 117 is formed to form an electrically conductive pattern to write and read information to and from the IC chip 111 in a non-contact manner by being coupled to the antenna 112 are adhered by an adhesive layer 120b at a relative position such that the land sections 114 and land sections 115 are electrostatically coupled. On the back surface of the film substrate 118, an adhesive layer 120c having tacky power that is stronger than the tack power of an adhesive layer 120a and the adhesive layer 120b is laminated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a non-contact type IC label capable of writing and reading information in a non-contact state.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and the product or the like is managed using the label.

  In information management using such a card or label, a non-contact type IC card or a non-contact type in which an IC chip capable of writing and reading information in a non-contact state on the card or label is mounted. Type IC labels are rapidly spreading due to their excellent convenience.

  5A and 5B are diagrams showing a configuration example of a conventional non-contact type IC label. FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In this conventional example, as shown in FIG. 5, an antenna 512 made of a coiled conductive material and a contact 513 made of a conductive material are formed on one surface of a base substrate 514 made of a resin sheet or the like. An IC chip 511 capable of writing and reading information from the outside in a non-contact state via the antenna 512 is mounted, and a bridge 517 made of a conductive material is formed on the other surface of the base substrate 514. The inlet 510 is sandwiched between two adhesive layers 520a and 520b, and a surface sheet 530 that protects the inlet 510 and prints information on the surface is laminated on one adhesive layer 520a. A release paper 540 is laminated on the adhesive layer 520b. Note that both ends of the antenna 512 are connected to both ends of the bridge 517 via front and back conductive portions 516 formed by mechanically caulking the base substrate 514 from the front and back, respectively, and the contacts 513 are connected to the antenna 512. The IC chip 511 is connected to the contact point 513 to form a circuit including the antenna 512, the contact point 513, the bridge 517, and the IC chip 511.

  In the non-contact type IC label 500 configured as described above, the release paper 540 is peeled off and attached to an article or the like by the adhesive layer 520b, and is attached to an information writing / reading device (not shown) provided outside. By bringing them close to each other, a current flows through the antenna 512 due to electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 511 via the contact 513. Information is written to the IC chip 511 from the reading device, or information written to the IC chip 511 is read by the information writing / reading device.

  Here, the non-contact type IC label 500 as described above needs to be prevented from being illegally reused after being attached to an article or the like and used.

  Therefore, a release agent layer is provided so as to include a region facing the IC chip on the back surface of the surface sheet, and thus, when peeled from an article or the like, the antenna and the IC chip can be mechanically disconnected. A type IC label is considered (for example, see Patent Document 1).

  In addition, a technique is considered in which a pressure-sensitive adhesive layer bonded to an article or the like is foamed by heating, and thereby leaves a trace when the label attached to the article or the like is peeled off by heating (for example, , See Patent Document 2).

  In addition, a transferable pattern layer is formed on the surface of the article or the like so that the pattern is transferred to the article or the like when attached to the article or the like and then only the pattern is peeled off from the article or the like. A technique for leaving a trace of separation by leaving is considered (for example, see Patent Document 3).

By using such a technology, a non-contact type IC label that is used by being affixed to an article etc. is peeled off from the article etc. and affixed to another article etc. and used illegally. The illegal use of the IC label is prevented.
JP 2000-57292 A JP 2003-147297 A JP-A-9-197968

  However, as described above, a release agent layer is provided so as to include a region facing the IC chip on the back surface of the top sheet, thereby mechanically disconnecting the antenna and the IC chip when peeled off from an article or the like. In the case where the mechanical strength of the member for connecting the antenna and the IC chip is strong, when the non-contact type IC label is peeled from the article, the antenna and the IC chip are not mechanically disconnected and are not in contact with each other. There is a case where the entire mold IC label is peeled off from the article, and thereafter the non-contact IC label peeled off from the article may be used illegally.

  In addition, the adhesive layer that is bonded to the article or the like is foamed by heating, or a transferable pattern layer is formed on the sticking surface of the article or the like, and the pattern is attached to the article or the like when attached to the article or the like. In the case of being transferred, a trace can be left when peeled off from an article or the like, but it is not possible to prevent the non-contact type IC label from being used illegally after being peeled off from the article.

  The present invention has been made in view of the problems of the conventional techniques as described above, and is used after being attached to an article or the like, regardless of the mechanical strength of members constituting the circuit. An object of the present invention is to provide a non-contact type IC label that can be easily prevented from being reused when peeled off.

In order to achieve the above object, the present invention provides:
A first member on which an IC chip connected to the first conductive pattern is mounted and a first conductive pattern is formed;
A first pressure-sensitive adhesive layer is laminated on one surface, a second pressure-sensitive adhesive layer is laminated on the other surface, and electrically coupled to the first conductive pattern, thereby preventing non-contact from the IC chip. A second member on which a second conductive pattern for forming a conductive pattern for writing and reading information in a contact state is formed;
It has a shape that covers the first and second members, and has at least a top sheet in which a third pressure-sensitive adhesive layer is laminated on one surface,
The first member and the second member are bonded by the first pressure-sensitive adhesive layer at a relative position such that the first conductive pattern and the second conductive pattern are electrostatically coupled,
The top sheet and the first member are bonded by the third pressure-sensitive adhesive layer,
The second pressure-sensitive adhesive layer has a stronger adhesive force than the first and third pressure-sensitive adhesive layers.

  The first and second conductive patterns may include conductive regions formed to face each other.

  Further, the second conductive pattern is formed using a transparent conductive agent.

A first member on which a first conductive pattern is formed;
A first adhesive layer is laminated on one surface, a second conductive pattern is formed on the other surface, and a second member on which an IC chip connected to the second conductive pattern is mounted; ,
It has a shape that covers the first and second members, and has at least a top sheet in which a third pressure-sensitive adhesive layer is laminated on one surface,
The first member and the second member are bonded to each other by the first pressure-sensitive adhesive layer at a relative position where the first conductive pattern and the second conductive pattern are electrostatically coupled to each other. Thus, a conductive pattern for writing and reading information in a non-contact state with respect to the IC chip is formed by the first conductive pattern and the second conductive pattern,
The top sheet and the first member are bonded by the third pressure-sensitive adhesive layer,
The second pressure-sensitive adhesive layer has a stronger adhesive force than the first and third pressure-sensitive adhesive layers.

  In the present invention configured as described above, a first conductive pattern is formed and an IC chip connected to the first conductive pattern is mounted when an attempt is made to peel off the article after being attached to the article. Only the first member is peeled off and electrically coupled to the first conductive pattern, thereby forming a second conductive pattern for writing and reading information in a non-contact state with respect to the IC chip. The second member on which the conductive pattern is formed is left without being peeled from the article. As a result, the conductive pattern for writing and reading information in a non-contact state with respect to the IC chip is electrically disconnected, and it becomes impossible to write and read information on the non-contact type IC label. .

  In this way, regardless of the mechanical strength of the components that make up the circuit, the non-contact type IC label can be reused simply by peeling the non-contact type IC label from the product etc. after being affixed to the product etc. Is impossible.

  Further, if the first and second conductive patterns are each provided with a conductive region so as to face each other, and the resonance frequency of the non-contact type IC label is adjusted by this conductive region, the first member And the second member are separated from each other, and when the conductive regions do not face each other or the interval between the conductive regions changes, the resonance frequency of the non-contact type IC label changes, and information is written and read. Is impossible.

  Further, if the second conductive pattern is formed using a transparent conductive agent, the first member and the second member are separated from each other, and only the second member remains attached to the article or the like. Even in this case, it is difficult to recognize the second conductive pattern from the outside.

  As described above, in the present invention, the first conductive pattern is formed, the first member on which the IC chip connected to the first conductive pattern is mounted, and the first adhesive on one surface. The adhesive layer is laminated, the second adhesive layer is laminated on the other side, and electrically coupled to the first conductive pattern, thereby writing and reading information in a non-contact state with respect to the IC chip. A second member on which a second conductive pattern for forming a conductive pattern for forming is formed, and a shape that covers the first and second members, and a third pressure-sensitive adhesive layer on one surface And the first member and the second member at the relative positions where the first conductive pattern and the second conductive pattern are electrostatically coupled to each other. Adhered by the adhesive layer, the top sheet and the first member Since the second pressure-sensitive adhesive layer is bonded by the third pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer has a stronger adhesive force than the first and third pressure-sensitive adhesive layers, regardless of the mechanical strength of the members constituting the circuit. After the non-contact type IC label is affixed to an article or the like and then used, the non-contact type IC label can be made in a state where it cannot be reused simply by peeling the non-contact type IC label from the article or the like.

  Further, in the structure in which the first and second conductive patterns have conductive regions formed so as to face each other, these conductive regions do not face each other, or the interval between the conductive regions changes. In this case, the resonance frequency of the non-contact type IC label changes, and information can be written and read out.

  In the case where the second conductive pattern is formed using a transparent conductive agent, the first member and the second member are separated from each other, and only the second member is used as an article or the like. Even in the case where the second conductive pattern remains attached, it is difficult to recognize the second conductive pattern from the outside, and thereby the non-contact type IC using the second member remaining attached to the article or the like. The possibility of unauthorized use of the label can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC label according to the present invention. FIG. 1A is a diagram showing an internal structure, and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. (C) is the figure which looked at the resin sheet 116 shown to (a) from the surface, (d) is the figure which looked at the film base material 118 shown to (a) from the surface.

  In this embodiment, as shown in FIG. 1, the resin sheet 116 on which the IC chip 111 connected to the contact 113 is mounted, and the antenna 112, the contact 113, and the land portion 114 as the first conductive pattern are formed. A first pressure-sensitive adhesive layer 120b is laminated on one surface, and a second pressure-sensitive adhesive layer 120c is laminated on the other surface, and are electrically coupled to the antenna 112, the contact 113 and the land portion 114, thereby providing an IC chip. A bridge 117 and a land 115, which are second conductive patterns for forming a conductive pattern for writing and reading information in a non-contact state with respect to 111, are formed on the surface on which the adhesive layer 120b is laminated. The film base 118, and the resin sheet 116 and the film base 118 are covered with the third pressure-sensitive adhesive layer 120 on one surface. And a release paper 140 that is releasably bonded by the pressure-sensitive adhesive layers 120a and 120c. The resin sheet 116 and the film substrate 118 are composed of a land portion 114 and a land portion 115. Are bonded by the adhesive layer 120b at a relative position so as to be electrostatically coupled to each other through the resin sheet 116 and the adhesive layer 120b, and the IC chip 111 is mounted on the resin sheet 116. In the surface, it adhere | attaches with the surface sheet 130 by the adhesive layer 120a. The resin sheet 116, the IC chip 111, the antenna 112, the contact 113, and the land portion 114 constitute a first member, and the film base 118, the bridge 117, and the land portion 115 constitute a second member. Yes. Further, on the surface of the resin sheet 116 where the IC chip 111 is not mounted, an adhesive layer 120a is laminated in a region where the film base 118 is not adhered. Further, the land portions 114 are formed at both ends of the coiled antenna 112 so that the land portions 114 are electrostatically coupled to the land portions 115 when facing the land portions 115 through the resin sheet 116 and the adhesive layer 120b. It has a predetermined area. Further, the contact 113 is provided so as to disconnect the antenna 112 in the middle of the circulation of the antenna 112. By mounting the IC chip 111 on the contact 113, one of the two land portions 114 is connected to the one land portion 114. A coiled loop is formed with the other land portion 114 as the start point and the end point as the end point. The land portions 115 are formed at both ends of the bridge 117, and have a predetermined area so as to be electrostatically coupled to the land portions 114 when facing the land portions 114 through the resin sheet 116 and the adhesive layer 120b. have. Moreover, about the adhesive force of the adhesive layers 120a-120c, the adhesive force of the adhesive layer 120c is the strongest, and the adhesive force of the adhesive layer 120b is the weakest. For this reason, in the adhesive layer 120b, what has the adhesive force of a pseudo | simulation adhesion degree should just be.

  In the non-contact type IC label 100 configured as described above, the land portions 114 formed at both ends of the antenna 112 and the land portions 115 formed at both ends of the bridge 117 form the resin sheet 116 and the adhesive layer 120b. Therefore, a capacitor having the land portion 114 and the land portion 115 as both electrodes is formed, and the land portion 114 and the land portion 115 are electrostatically coupled to each other. A circuit including the antenna 112, the contact 113, the bridge 117, and the IC chip 111 is formed with a capacitance determined by the area 115 and the material and thickness of the resin sheet 116 and the adhesive layer 120 b. . Here, the length and the number of turns of the antenna 112 have capacitance determined by the area of the land portions 114 and 115 and the material and thickness of the resin sheet 116 and the adhesive layer 120b. When a circuit composed of the bridge 117 and the IC chip 111 is formed, it is designed in advance so as to tune to a predetermined frequency at which information can be written to and read from the IC chip 111 through the antenna 112 in a non-contact state. ing. Therefore, in the non-contact type IC label 100 configured as described above, the release paper 140 is peeled off and attached to an article or the like by the adhesive layers 120a and 120c, and an information writing / reading device (externally provided) ( When close to (not shown), current flows to the antenna 112 and the bridge 117 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 111 via the contact 113, so that it is in a non-contact state. The information writing / reading device writes information to the IC chip 111, or the information written to the IC chip 111 is read by the information writing / reading device.

  Below, the manufacturing method of the non-contact type IC label 100 mentioned above is demonstrated.

  First, the antenna 112, the contact 113, and the land portion 114 are formed on the resin sheet 116 by etching, printing, or the like.

  Further, the bridge 117 and the land portion 115 are formed on the film base material 118 by etching or printing, and the adhesive layer 120b is laminated on the surface of the film base material 118 where the bridge 117 and the land portion 115 are formed. At the same time, the pressure-sensitive adhesive layer 120 c is laminated on the opposite surface of the film substrate 118.

  Next, the resin sheet 116 and the film base 118 are adhered to each other at such a relative position that the land portion 114 and the land portion 115 are electrostatically coupled to each other through the resin sheet 116 and the adhesive layer 120b. The adhesive layer 120b bonds the surface of the resin sheet 116 on which the IC chip 111 is mounted and the top sheet 130 by the adhesive layer 120a.

  Thereafter, the area where the film substrate 118 is bonded is masked to further laminate the adhesive layer 120a on the back surface of the top sheet 130 and the resin sheet 116, and the release paper 140 is pasted to complete the non-contact type IC label 100. . In the case where the size of the topsheet 130 is considerably larger than the size of the resin sheet 116, the topsheet 130 and the backside of the topsheet 130 and the resin sheet 116 are not further laminated with the adhesive layer 120a. The non-contact type IC label 100 can be affixed to an article or the like using only the pressure-sensitive adhesive layer 120a laminated on the back surface of the product.

  Hereinafter, an operation when the above-described non-contact type IC label 100 is peeled off from a state where it is affixed to an article or the like will be described.

  FIG. 2 is a diagram showing a state where the non-contact type IC label 100 shown in FIG. 1 is peeled off from a state where it is stuck on an article or the like.

  When the non-contact type IC label 100 attached to the article 150 is to be peeled off from the article 150, first, the non-contact type IC label 100 is peeled off from the article 150 through the adhesive layer 120b (FIG. 2A). .

  Thereafter, when the area peeled off from the article 150 reaches the area where the film base 118 is adhered, the adhesive force of the pressure-sensitive adhesive layer 120c laminated on the surface of the film base 118 attached to the article 150 is The adhesive strength of the pressure-sensitive adhesive layer 120b laminated on the opposite surface of the film substrate 118 and the pressure-sensitive adhesive layer 120a laminated on the top sheet 130 is stronger, and the adhesive strength of the pressure-sensitive adhesive layer 120b is pressure-sensitive adhesive. Since the adhesive strength of the layer 120a is weaker, the film substrate 118 and the resin sheet 116 are peeled off via the pressure-sensitive adhesive layer 120b while the film substrate 118 is stuck to the article 115 side (FIG. 2B). ).

  In this state, since the resin sheet 116 and the film base 118 are peeled off, an electrostatic is caused between the land portion 114 formed on the resin sheet 116 and the land portion 115 formed on the film base 118. As a result, the antenna 112 and the contact 113 formed on the resin sheet 116 and the bridge 117 formed on the film base 118 are electrically disconnected, so that the antenna 112, the contact 113, and the bridge are disconnected. The circuit composed of 117 and the IC chip 111 is disconnected.

  This makes it impossible to write information to and read information from the IC chip 111. Therefore, after the non-contact type IC label 100 attached to the article 150 is peeled off from the article 150, information can be written to and read from the IC chip 111. Reading cannot be performed, and unauthorized use of the non-contact type IC label 100 is prevented. When the resin sheet 116 and the film base 118 are brought into contact again after the resin sheet 116 and the film base 118 are peeled from each other, the resin sheet 116, the film base 118, and the adhesive layer 120b are interposed. Between the land portion 114 and the land portion 115 in the state where the resin sheet 116 and the film base material 118 are peeled from each other and the state where the resin sheet 116 and the film base material 118 come into contact again. Is very small but different. Here, as described above, the writing and reading of information with respect to the IC chip 111 are performed by the length and the number of turns of the antenna 112, the areas of the land portions 114 and 115, the material and thickness of the resin sheet 116 and the adhesive layer 120b. Therefore, after the resin sheet 116 and the film base 118 are peeled from each other, the resin sheet 116 and the film base 118 are brought into contact with each other again. In this case, information cannot be written to or read from the non-contact type IC label 100. Further, even when the two land portions 114 are connected by some connecting agent after the non-contact type IC label 100 is peeled off from the article 150, the resonance frequency of the antenna 112, the length and the number of turns of the antenna 112, and the land Since the frequency adjusted by the area determined by the area of the portions 114 and 115 and the capacitance determined by the material and thickness of the resin sheet 116 and the adhesive layer 120b is different, writing information to the non-contact type IC label 100 And reading is impossible.

  If the bridge 117 and the land portion 115 formed on the film base 118 are formed using a transparent conductive agent such as a conductive polymer, the non-contact type IC label 100 is peeled from the article 150 and the film base 118 is formed. Since only the bridge portion 117 and the land portion 115 are difficult to recognize from the outside even when only the film 150 remains attached to the article 150, the film base material 118 left attached to the article 150 is removed. The possibility of unauthorized use of the non-contact type IC label 100 can be reduced. If the film base 118 is also made of a transparent material, it can be difficult to recognize that the film base 118 remains on the article 150.

  Further, if the adhesive layer 120c is foamed by heating as described in Patent Document 2, a trace can be left when the adhesive layer 120c is peeled off by heating.

  In the present embodiment, a contact 113 is provided on the resin sheet 116 so as to disconnect the antenna 112 in the middle of the circuit of the antenna 112, and the IC chip 111 is mounted on the contact 113, whereby two land portions are provided. 114, a coiled loop is formed with one land portion 114 as a starting point and the other land portion 114 as an end point. On the resin sheet 116, one land portion 114 is the starting point and the other land portion 114 is the starting point. It is also conceivable that a coiled loop having the end portion 114 as an end point is formed only by the antenna 112, a contact is provided on the film substrate 118 so as to disconnect the bridge 117, and the IC chip 111 is mounted on this contact. It is done.

(Second Embodiment)
FIGS. 3A and 3B are diagrams showing a second embodiment of the non-contact type IC label of the present invention, wherein FIG. 3A is a diagram showing an internal structure, and FIG. 3B is a cross-sectional view taken along line AA ′ shown in FIG. (C) is the figure which looked at the resin sheet 116 shown to (a) from the surface, (d) is the figure which looked at the film base material 118 shown to (a) from the surface.

  In this embodiment, as shown in FIG. 3, an antenna 212, a contact 213, a land 214, and a capacity adjustment pattern 219a, which are first conductive patterns, are formed, and an IC chip 211 connected to the contact 213 is mounted. The first adhesive layer 220b is laminated on one surface of the resin sheet 216, and the second adhesive layer 220c is laminated on the other surface, and the antenna 212, the contact 213, the land portion 214, and the capacity adjustment pattern A capacitance adjusting pattern 219b and a land pattern which are second conductive patterns for forming a conductive pattern for writing and reading information to and from the IC chip 211 in a non-contact state by being electrically coupled to the 219a. The part 215 includes a film base 218 formed on the surface on which the pressure-sensitive adhesive layer 220b is laminated, a resin sheet 216, and a film. A top sheet 230 having a shape covering the base material 218 and having a third pressure-sensitive adhesive layer 220a laminated on one surface, and a release paper 240 that is releasably bonded by the pressure-sensitive adhesive layers 220a and 220c. The resin sheet 216 and the film base 218 are configured such that the land part 214, the land part 215, and the capacity adjustment patterns 219a and 219b face each other through the resin sheet 216 and the adhesive layer 220b, respectively. The resin sheet 216 is bonded to the surface sheet 230 by the pressure-sensitive adhesive layer 220a on the surface on which the IC chip 211 is mounted. The resin sheet 216, the IC chip 211, the antenna 212, the contact point 213, the land part 214, and the capacity adjustment pattern 219a constitute a first member, and the film base 218, the capacity adjustment pattern 219b, and the land part 215. To the second member. In addition, on the surface of the resin sheet 216 where the IC chip 211 is not mounted, an adhesive layer 220a is laminated in a region where the film base 218 is not bonded. The land portion 214 is formed to be connected to the coiled antenna 212 and the capacity adjustment pattern 219a. When the land portion 214 faces the land portion 215 via the resin sheet 216 and the adhesive layer 220b, the land portion 215 is formed. And has a predetermined area so as to be electrostatically coupled. The land portion 215 is formed to be connected to the capacity adjustment pattern 219b. When the land portion 215 faces the land portion 214 via the resin sheet 216 and the adhesive layer 220b, the land portion 215 is electrostatically coupled to the land portion 214. Have a predetermined area. Moreover, about the adhesive force of the adhesive layers 220a-220c, the adhesive force of the adhesive layer 220c is the strongest, and the adhesive force of the adhesive layer 220b is the weakest. For this reason, the pressure-sensitive adhesive layer 220b only needs to have a pressure-adhesive strength of about pseudo adhesion.

  Here, the capacity adjustment patterns 219a and 219b will be described.

  The resonance frequency f of the non-contact type IC label 200 is determined by the inductance L of the antenna 212 and the capacitance C of the antenna 212 (f = 1 / 2π√LC), but it is necessary to adjust this resonance frequency f in the manufacturing process. There is. Therefore, a plurality of capacity adjustment patterns 219a and 219b are provided so as to face each other via the resin sheet 216 and the adhesive layer 220b, and a capacitor is formed by the capacity adjustment pattern 219a and the capacity adjustment pattern 219b. Among the plurality of capacitance adjustment patterns 219a and 219b, the number of capacitance adjustment patterns 219a and 219b connected to the land portions 214 and 215 is limited by cutting the capacitance patterns 219a and 219b. As a result, the number of capacitance adjustment patterns 219a and 219b that form capacitors in a state of being connected to the land portions 214 and 215 is arbitrarily set, and the capacitance C of the antenna 212 is adjusted. Note that the capacitance adjustment patterns 219a and 219b do not necessarily have a plurality of patterns, and the capacitance C of the antenna 212 is adjusted by the capacitance adjustment patterns 219a and 219b so as to correspond to the resonance frequency f. It only has to be configured.

  In the non-contact type IC label 200 configured as described above, the land portion 214 connected to the antenna 212 and the capacity adjustment pattern 219a and the land portion 215 connected to the capacity adjustment pattern 219b include the resin sheet 216 and Since they are opposed to each other via the adhesive layer 220b, a capacitor having both the land portion 214 and the land portion 215 as both electrodes is formed, and the land portion 214 and the land portion 215 are electrostatically coupled. , Having an electrostatic capacity determined by the area of the land portions 214, 215 and the material and thickness of the resin sheet 216 and the adhesive layer 220b, comprising the antenna 212, the contact 213, and the IC chip 211, and for capacity adjustment A circuit in which the capacity of the antenna 212 is adjusted is formed by the patterns 219a and 219b.

  Thereby, in the non-contact type IC label 200 configured as described above, the release paper 240 is peeled off and attached to the article or the like by the adhesive layers 220a and 220c, and the information writing / reading device provided outside is provided. When approaching (not shown), a current flows to the antenna 212 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 211 via the contact 213, so that in a non-contact state, Information is written to the IC chip 211 from the information writing / reading device, and information written to the IC chip 211 is read by the information writing / reading device.

  Below, the manufacturing method of the non-contact type IC label 200 mentioned above is demonstrated.

  First, the antenna 212, the contact point 213, the land portion 214, and the capacity adjustment pattern 219a are formed on the resin sheet 216 by etching or printing.

  Further, the capacity adjustment pattern 219b and the land portion 215 are formed on the film base material 218 by etching, printing, or the like, and further, the surface of the film base material 218 on which the capacity adjustment pattern 219b and the land portion 215 are formed. The pressure-sensitive adhesive layer 220b is laminated, and the pressure-sensitive adhesive layer 220c is laminated on the opposite surface of the film substrate 218.

  Next, the resin sheet 216 and the film base 218 are statically moved by the land portion 214, the land portion 215, and the capacity adjustment patterns 219a, 219b facing each other through the resin sheet 216 and the adhesive layer 220b, respectively. The adhesive layer 220b is bonded at a relative position where the electric coupling is performed, and the surface of the resin sheet 216 on which the IC chip 211 is mounted and the surface sheet 230 are bonded by the adhesive layer 220a.

  Thereafter, the area where the film base material 218 is bonded is masked to further laminate the adhesive layer 220a on the back surface of the top sheet 230 and the resin sheet 216, and the release paper 240 is pasted to complete the non-contact type IC label 200. . When the size of the topsheet 230 is considerably larger than the size of the resin sheet 216, the topsheet 230 can be obtained without further laminating the adhesive layer 220a on the backside of the topsheet 230 and the resin sheet 216. The non-contact type IC label 200 can be affixed to an article or the like using only the pressure-sensitive adhesive layer 220a laminated on the back surface of the product.

  Hereinafter, an operation when the above-described non-contact type IC label 200 is peeled off from a state where it is affixed to an article or the like will be described.

  FIG. 4 is a diagram showing a state where the non-contact type IC label 200 shown in FIG. 3 is peeled off from a state where it is stuck on an article or the like.

  When the non-contact type IC label 200 attached to the article 250 is to be peeled off from the article 250, first, the non-contact type IC label 200 is peeled off from the article 250 through the adhesive layer 220b (FIG. 4A). .

  Thereafter, when the area peeled off from the article 250 reaches the area where the film base 218 is adhered, the adhesive force of the pressure-sensitive adhesive layer 220c laminated on the surface of the film base 218 attached to the article 250 is The adhesive strength of the pressure-sensitive adhesive layer 220b laminated on the opposite surface of the film substrate 218 and the pressure-sensitive adhesive layer 220a laminated on the top sheet 230 is stronger, and the adhesive strength of the pressure-sensitive adhesive layer 220b is a pressure-sensitive adhesive. Since the adhesive strength of the layer 220a is weaker, the film base 218 and the resin sheet 216 are peeled off via the pressure-sensitive adhesive layer 220b while the film base 218 is stuck to the article 215 side (FIG. 4B). ).

  In this state, since the resin sheet 216 and the film base 218 are peeled off, an electrostatic charge is generated between the land part 214 formed on the resin sheet 216 and the land part 215 formed on the film base 218. As a result, the capacity adjustment pattern 219b formed on the film base 218 and the capacity adjustment pattern 219a formed on the resin sheet 216 are electrically disconnected, and the capacity adjustment pattern is thereby formed. The capacity of the antenna 212 is not adjusted by 219a and 219b. In addition, the capacity adjustment patterns 219a and 219b are not opposed to each other. Here, as described above, the resonance frequency of the non-contact type IC label 200 is the distance (thickness) when the resin sheet 216 and the film base material 218 are pseudo-bonded to each other. Since the capacitance is set based on the capacitance adjusted by the adjustment pattern 219b, the capacitance C of the antenna 212 is different when the capacitance adjustment pattern 219a and the capacitance adjustment 219b are not opposed to each other. The resonance frequency of the contact IC label 200 changes, and communication with an information writing / reading device provided externally becomes impossible. Therefore, in the state where the resin sheet 216 and the film substrate 218 are peeled from each other, the resonance frequency is different even when the part peeled from the article 250 is brought close to the information writing / reading device. Information cannot be written to or read from the contact IC label 200.

  This makes it impossible to write and read information to and from the IC chip 211. Therefore, after the non-contact type IC label 200 attached to the article 250 is peeled off from the article 250, writing and reading of information to and from the IC chip 211 is possible. Reading cannot be performed, and unauthorized use of the non-contact type IC label 200 is prevented. When the resin sheet 216 and the film base 218 are brought into contact again after the resin sheet 216 and the film base 218 are peeled from each other, the resin sheet 216, the film base 218, and the pressure-sensitive adhesive layer 220b are interposed. In the state where the resin sheet 216 and the film substrate 218 are peeled from each other, and the resin sheet 216 and the film substrate 218 come into contact again, the capacity adjustment pattern 218a and the capacity adjustment pattern The distance from 218b is small but different. Here, as described above, the resonance frequency of the non-contact type IC label 200 is the distance (thickness) in the state in which the resin sheet 216 and the film base 218 are pseudo-bonded to each other, and the capacity adjustment pattern 219a. Since it is set based on the capacity adjusted by the capacity adjustment pattern 219b, if the distance between the capacity adjustment pattern 219a and the capacity adjustment pattern 219b is different even if it is small, the capacity adjustment pattern 219a and the capacity The capacitance C of the capacitor constituted by the adjustment pattern 219b is different, the resonance frequency of the non-contact type IC label 200 is changed, and communication is performed with an information writing / reading device provided outside. It becomes impossible. Therefore, even when the resin sheet 216 and the film base 218 are brought into contact again after the resin sheet 216 and the film base 218 are peeled from each other, information can be written to and read from the non-contact type IC label 200. It becomes impossible. Moreover, the same effect can be acquired by providing the pattern which adjusts the capacity | capacitance of sharpness (Q value) in the resin sheet 216 and the film base material 218 instead of the pattern which adjusts the capacity | capacitance C, respectively.

  If the capacity adjustment pattern 219b and the land portion 215 formed on the film base 218 are formed using a transparent conductive agent such as a conductive polymer, the non-contact type IC label 200 is peeled off from the article 250, and the film Even when only the base material 218 remains attached to the article 250, it is difficult to recognize the capacity adjustment pattern 219b and the land portion 215 from the outside, and therefore remains in the state attached to the article 250. The possibility of unauthorized use of the non-contact type IC label 200 using the film substrate 218 can be reduced. If the film base 218 is also made of a transparent material, it can be difficult to recognize that the film base 218 remains on the article 250.

  Further, if the adhesive layer 220c is foamed by heating as described in Patent Document 2, a trace can be left when the adhesive layer 220c is peeled off by heating.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c () Is the figure which looked at the resin sheet shown to (a) from the surface, (d) is the figure which looked at the film base material shown to (a) from the surface. It is a figure which shows a state in case the non-contact type IC label shown in FIG. 1 is peeled off from the state affixed on articles | goods etc. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c () Is the figure which looked at the resin sheet shown to (a) from the surface, (d) is the figure which looked at the film base material shown to (a) from the surface. It is a figure which shows a state in case the non-contact type IC label shown in FIG. 3 is peeled off from the state affixed on articles | goods etc. It is a figure which shows one structural example of the conventional non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

100, 200 Non-contact type IC label 111, 211 IC chip 112, 212 Antenna 113, 213 Contact 114, 115, 214, 215 Land part 116, 216 Resin sheet 117 Bridge 118, 218 Film substrate 120a, 120b, 220a, 220b Adhesive layer 130, 230 Top sheet 140 Release paper 150 Article 219a, 219b Capacity adjustment pattern

Claims (4)

A first member on which an IC chip connected to the first conductive pattern is mounted and a first conductive pattern is formed;
A first pressure-sensitive adhesive layer is laminated on one surface, a second pressure-sensitive adhesive layer is laminated on the other surface, and electrically coupled to the first conductive pattern, thereby preventing non-contact from the IC chip. A second member on which a second conductive pattern for forming a conductive pattern for writing and reading information in a contact state is formed;
It has a shape that covers the first and second members, and has at least a top sheet in which a third pressure-sensitive adhesive layer is laminated on one surface,
The first member and the second member are bonded by the first pressure-sensitive adhesive layer at a relative position such that the first conductive pattern and the second conductive pattern are electrostatically coupled,
The top sheet and the first member are bonded by the third pressure-sensitive adhesive layer,
The non-contact type IC label, wherein the second pressure-sensitive adhesive layer has a stronger adhesive force than the first and third pressure-sensitive adhesive layers. The non-contact type IC label according to claim 1,
The non-contact type IC label, wherein the first and second conductive patterns have conductive regions formed to face each other. In the non-contact type IC label according to claim 1 or 2,
The non-contact type IC label, wherein the second conductive pattern is formed using a transparent conductive agent. A first member on which a first conductive pattern is formed;
A first adhesive layer is laminated on one surface, a second conductive pattern is formed on the other surface, and a second member on which an IC chip connected to the second conductive pattern is mounted; ,
It has a shape that covers the first and second members, and has at least a top sheet in which a third pressure-sensitive adhesive layer is laminated on one surface,
The first member and the second member are bonded to each other by the first pressure-sensitive adhesive layer at a relative position where the first conductive pattern and the second conductive pattern are electrostatically coupled to each other. Thus, a conductive pattern for writing and reading information in a non-contact state with respect to the IC chip is formed by the first conductive pattern and the second conductive pattern,
The top sheet and the first member are bonded by the third pressure-sensitive adhesive layer,
The non-contact type IC label, wherein the second pressure-sensitive adhesive layer has a stronger adhesive force than the first and third pressure-sensitive adhesive layers.

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