JP2007258521A5 - - Google Patents

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Publication number
JP2007258521A5
JP2007258521A5 JP2006082278A JP2006082278A JP2007258521A5 JP 2007258521 A5 JP2007258521 A5 JP 2007258521A5 JP 2006082278 A JP2006082278 A JP 2006082278A JP 2006082278 A JP2006082278 A JP 2006082278A JP 2007258521 A5 JP2007258521 A5 JP 2007258521A5
Authority
JP
Japan
Prior art keywords
coil
element body
hole portion
insulating wall
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006082278A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007258521A (ja
JP5082271B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006082278A priority Critical patent/JP5082271B2/ja
Priority claimed from JP2006082278A external-priority patent/JP5082271B2/ja
Priority to US11/909,756 priority patent/US8248200B2/en
Priority to CN2007800005291A priority patent/CN101326597B/zh
Priority to PCT/JP2007/055535 priority patent/WO2007119426A1/ja
Publication of JP2007258521A publication Critical patent/JP2007258521A/ja
Publication of JP2007258521A5 publication Critical patent/JP2007258521A5/ja
Application granted granted Critical
Publication of JP5082271B2 publication Critical patent/JP5082271B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006082278A 2006-03-24 2006-03-24 チップコイルとその製造方法 Expired - Fee Related JP5082271B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006082278A JP5082271B2 (ja) 2006-03-24 2006-03-24 チップコイルとその製造方法
US11/909,756 US8248200B2 (en) 2006-03-24 2007-03-19 Inductance component
CN2007800005291A CN101326597B (zh) 2006-03-24 2007-03-19 感应器件
PCT/JP2007/055535 WO2007119426A1 (ja) 2006-03-24 2007-03-19 インダクタンス部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006082278A JP5082271B2 (ja) 2006-03-24 2006-03-24 チップコイルとその製造方法

Publications (3)

Publication Number Publication Date
JP2007258521A JP2007258521A (ja) 2007-10-04
JP2007258521A5 true JP2007258521A5 (de) 2009-04-02
JP5082271B2 JP5082271B2 (ja) 2012-11-28

Family

ID=38632445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006082278A Expired - Fee Related JP5082271B2 (ja) 2006-03-24 2006-03-24 チップコイルとその製造方法

Country Status (2)

Country Link
JP (1) JP5082271B2 (de)
CN (1) CN101326597B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5359842B2 (ja) * 2009-12-11 2013-12-04 Ｔｄｋ株式会社 積層型コモンモードフィルタ
KR101862409B1 (ko) * 2011-12-22 2018-07-05 삼성전기주식회사 칩 인덕터 및 칩 인덕터 제조방법
JP6265031B2 (ja) * 2014-04-25 2018-01-24 住友電装株式会社 コア片及びリアクトル
KR101681406B1 (ko) * 2015-04-01 2016-12-12 삼성전기주식회사 코일 전자부품 및 그 제조방법
US10269481B2 (en) 2016-05-27 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked coil for wireless charging structure on InFO package
KR101994754B1 (ko) 2017-08-23 2019-07-01 삼성전기주식회사 인덕터
JP7140481B2 (ja) 2017-09-25 2022-09-21 日東電工株式会社 インダクタおよびその製造方法
CN112424889A (zh) * 2018-07-25 2021-02-26 味之素株式会社 磁性糊料
KR102617535B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2986520B2 (ja) * 1990-07-31 1999-12-06 ティーディーケイ株式会社 電子部品及びその製造方法
JPH04101403A (ja) * 1990-08-21 1992-04-02 Tdk Corp 電子部品及びその製造方法
JP2003158017A (ja) * 2001-11-21 2003-05-30 Jhc Osaka:Kk トランス

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