JP2007234895A - Substrate conveyance device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate conveyance device capable of conveying a substrate efficiently even when the number of lots is increased. <P>SOLUTION: The substrate conveyance device 1 is provided in the manufacturing line of a semiconductor device to convey substrates to a plurality of individual treatment stations for different processes. The device is equipped with a plurality of conveyance means 2 arranged respectively between two sets of treatment stations for effecting before and after processes mutually to convey the substrates W between two sets of treatment stations, while respective conveyance means 2 are constituted between two sets of treatment stations so as to convey the substrates into one direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate transfer device in a production line for semiconductor devices such as electronic devices and MEMS (micromachines).

Conventionally, as this type of substrate transfer device, a device is known in which a travel path is formed by a common transport guide rail or the like across a plurality of work areas, and a workpiece is automatically transported by running a transport vehicle on the travel path. (See Patent Document 1). In this substrate transport device, transport control is performed so that the substrate is transported to a desired work area in response to a transport request, and the transport vehicle that has arrived at the transport destination transports the product by delivering the product to the stocker in each work area. Is going.
JP-A-6-206149

  By the way, the substrate in the conventional semiconductor factory is conveyed to each work area as a unit of 25 sheets / lot, for example. However, in recent years, there is an increasing demand for shortening the lead time due to the high-mix low-volume production, and the reduction of the lot size and ultimately the single wafer conveyance (1 sheet / 1 lot) have been proposed. In this case, when the substrate transport apparatus is used, a plurality of work areas share a traveling path, so that there is a problem that the substrate is stagnated in the traveling path due to an increase in the number of lots accompanying a reduction in lot size.

  An object of the present invention is to provide a substrate transfer apparatus that can efficiently transfer a substrate even when the number of lots increases.

  The substrate transfer apparatus according to the present invention is disposed between two processing stations that perform the processes before and after each other in a substrate transfer apparatus that transfers a substrate to a plurality of process stations for each process provided in a semiconductor device manufacturing line. And a plurality of transfer means for transferring the substrate between the two processing stations.

  According to this configuration, since the dedicated transfer means is provided between the two processing stations that perform the preceding and following processes, the substrate can be efficiently transferred without stagnation in the transfer path due to the increase in the number of lots accompanying the reduction in the lot size. It can be carried out.

  In this case, it is preferable that each transport unit transports the substrate in one direction between the two processing stations.

  According to this configuration, since the substrate is not transported in the reverse direction, the substrate transport efficiency can be improved and the transport control can be simplified.

  In this case, each processing station has a plurality of processing apparatuses for performing the same type of processing, and further includes a plurality of substrate transfer means for transferring the substrates between the plurality of processing apparatuses and the respective transport means. It is preferable.

  According to this configuration, the conveying means can be shared by a plurality of processing apparatuses that perform the same type of processing. Thereby, the tact time of each processing station can be adjusted by the number of processing devices.

  In this case, it is preferable that each substrate transfer means has a buffer for stocking a plurality of substrates.

  According to this configuration, by storing the substrate in the buffer, the waiting time (waiting time) of the processing device in the subsequent process can be shortened due to insufficient supply of the substrate due to the fluctuation in the operating rate of the previous process. The apparatus can be operated efficiently.

  In this case, it is preferable that each transport unit transports the substrates one by one.

  According to this configuration, since the substrates are processed and transferred one by one at the processing station, it is possible to cope with the high-mix low-volume production.

  In this case, it is preferable that each transport unit transports the substrate in a state where the substrate is accommodated in the pod.

  According to this configuration, the substrate can be transported to each processing station in a clean state, and damage to the substrate due to transport can be effectively prevented. Thereby, the clean area can be extremely reduced.

  In this case, it is preferable that each transport means is a ceiling suspension type belt conveyor.

  According to this configuration, the work floor can be used effectively.

  Hereinafter, a substrate transfer apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. This substrate transfer device is for transferring a substrate between processing stations in a production line of a semiconductor device such as an electronic device MEMS, and this substrate transfer device is for transferring a single wafer of a semiconductor wafer, for example.

  The semiconductor device manufacturing line shown in FIG. 1 includes a cleaning station 61 including three cleaning devices 81 for cleaning the semiconductor wafer W, and two resist forming devices 82 for forming a resist pattern on the surface of the semiconductor wafer W. A resist station 62, an inspection station 63 comprising three inspection devices 83 for confirming the resist pattern on the surface of the semiconductor wafer W with a microscope, and two etching devices each for performing solvent treatment using the resist pattern as a mask. 84, 85, 86, and three etching stations 64, 65, 66 divided according to the type of solvent, and a plurality of (total five) substrate transfer apparatuses 1 that connect the stations of the respective preceding and following processes. I have.

  In the vicinity of the cleaning station 61, a loading stocker 67 is disposed for accommodating a plurality of unprocessed semiconductor wafers W in a FOUP 91 (front open integrated pod) and loading them in a batch. In the vicinity, an unloading stocker 68 is installed which accommodates a plurality of processed semiconductor wafers W in the FOUP 91 and unloads them in a batch. The loading stocker 67 is provided with a transfer robot, which will be described later, and the loading robot directly transfers the FOUP 91 from the loading stocker 67 to the load port 21 of each cleaning device 81. Similarly, each unloading stocker 68 is provided with a transfer robot, and the transfer robot directly transfers the FOUP 91 from the load port 21 of each etching apparatus 84, 85, 86 to the unloading stocker 68.

  As shown in FIG. 3, the FOUP 91 is provided in a rectangular box main body 94 for accommodating the semiconductor wafer W, and openable on the front surface (right side in the drawing) of the box main body 94, and the inside of the box main body 94 is sealed in a clean state. A lid 92 that protrudes from the box main body 94 and a gripping protrusion 93 for transferring the FOUP 91. Inside the box main body 94, a plurality of comb-like grooves (four steps in this embodiment) 94a are formed on both side walls so as to face each other. The semiconductor wafer W is set so that the peripheral edge portion is inserted into the pair of grooves 94a, so that it is accommodated in the FOUP 91 so as not to damage the chip forming portion, and the gripping protrusion 93 is handled by a robot or the like. Reprinted.

  In the FOUP 91, four semiconductor wafers W can be accommodated. However, in the present embodiment, the semiconductor wafers W are accommodated one by one and conveyed (single wafer conveyance). As a result, the semiconductor wafers W are processed one by one at each processing station and transferred, so that it is possible to cope with the high-mix low-volume production.

  Subsequently, each substrate transfer apparatus 1 will be described with reference to FIG. 2. Since the basic structures of all the substrate transfer apparatuses 1 are the same, the substrate transfer between the cleaning station 61 and the resist station 62 will be described below. The description will be given by taking the device 1 as an example. The substrate transfer apparatus 1 is disposed between the two stations 61 and 62, and includes three belt conveyors 2 (transfer means) for transferring the FOUP 91 between the stations 61 and 62, and three cleaning apparatuses 81 including the cleaning station 61. The FOUP 91 is transferred between the belt conveyor 2 and the conveyor 2, and the transfer side transfer device 3 a having a buffer for stocking the FOUP 91, between the two registration devices 82 of the registration station 62 and the belt conveyor 2. And a transfer destination side transfer device 3b having a buffer for stocking the FOUP 91, and a control device (not shown) for overall control thereof. Although details will be described later, the transfer source side transfer device 3a and the transfer destination side transfer device 3b each have a plurality of stock shelves 32 for stocking the FOUP 91. A buffer for stocking the semiconductor wafer W is configured.

  The belt conveyor 2 is of the ceiling type, and includes a feed belt 11 on which a FOUP (semiconductor wafer W) 91 is placed and conveyed, a drive pulley 12 and a driven pulley 13 on which the feed belt 11 is stretched, and a drive. A drive motor (not shown) for driving the pulley 12 to rotate. The frames for supporting the pulleys 12 and 13 are supported by a pair of arms 14 and 14 suspended from the ceiling in the work floor. The belt conveyor 2 is supported from the ceiling by the pair of arms 14 and 14. It is supported so as to be suspended (see FIG. 4A). In addition, you may make it comprise the belt conveyor 2 with a floor installation type. With these configurations, the work floor can be used effectively. Moreover, it is good also as a structure which replaces with the belt conveyor 2 and adsorb | sucks FOUP91 with a vacuum suction type pick-up apparatus, and picks up and conveys.

  The belt conveyor 2 of this embodiment is configured to convey the FOUP 91 in one direction between the stations. Thereby, since it does not convey in the reverse direction, the conveyance efficiency of the FOUP 91 can be increased, and the conveyance control can be simplified. Needless to say, it may be configured to send in both directions.

  When the FOUP 91 is selectively transported from one transport start position to a plurality of (three) transport end positions, such as between the inspection station 63 and the etching stations 64, 65, 66. As shown in FIG. 6, one main belt conveyor 2a and two (a plurality of) secondary belt conveyors 2b extending from the intermediate position of the main belt conveyor 2a at different angles are provided, and FOUP 91 is provided at the intermediate position. Is provided with a direction control guide 15 for distributing. The direction control guide 15 rotates in the extending direction of the belt conveyors 2a and 2b to continue the conveyance of the FOUP 91 conveyed on the main belt conveyor 2a as it is, and any one of the auxiliary belt conveyors 2b. The angle changes when leading to.

  The direction control guide 15 includes a guide main body 14, a rotating shaft 15 fixed to the guide main body, and a motor (not shown) connected to the rotating shaft, and the motor is connected to the control device. Based on the transport control signal, the control device rotates the direction control guide 15 along the belt conveyors 2a and 2b that are transport destinations of the FOUP 91. The FOUP 91 conveyed on the main belt conveyor 2a is conveyed as it is when the direction control guide 15 is directed to the main belt conveyor 2a, and the desired sub belt is directed to the sub belt conveyor 2b. It is guided by the conveyor 2b, transferred to the auxiliary belt conveyor 2b and conveyed. It is preferable that the control signal controls the direction control guide 15 using the ID mounted on the FOUP 91 as an identification mark.

  As shown in FIGS. 2, 4 and 5, the transfer source side transfer device 3a transfers the FOUP 91 from each load port 21 of the three cleaning devices 81 to one load port 21 for transfer. A loading robot (not shown), a lifter unit 31 that moves up and down between the load port 21 for transfer and the stock shelf 32 while holding the FOUP 91, and a plurality of stock shelves 32 that receive the FOUP 91 from the lifter unit 31. The elevator unit 34 that transfers the FOUP 91 to the belt conveyor 2 via the stock shelf 32, and the housing 4 that accommodates the lifter unit 31, the plurality of stock shelves 32, and the elevator unit 34. In this case, the plurality of stock shelves 32 that circulate in the housing 4 by the elevator unit 34 also serve as buffers for stocking the plurality of FOUPs (semiconductor wafers W) 91). By storing the FOUP 91 in the buffer, due to insufficient supply of the FOUP 91 due to fluctuations in the operating rate of the previous process, the waiting time (waiting time) of the processing apparatus in the subsequent process can be shortened and the processing apparatus can be operated efficiently. be able to.

  The housing 4 is formed in a box shape and is fixed to the ceiling in a suspended state. A lower surface opening for the transfer operation of the lifter unit 31 is formed on the lower surface of the housing 4. In addition, a substantially rectangular transfer opening into which the FOUP 91 is inserted on the transfer start side of the belt conveyor 2 is formed on the side surface of the housing 4 on the registration station 62 side.

  The transfer robot is disposed between the three cleaning devices 81 and the load port 21 facing the lifter unit 31, and the FOUP 91 processed by the three cleaning devices 81 is loaded into the load port facing the lifter unit 31. 21. As a result, one belt conveyor 2 is shared by the three cleaning devices 81. The number of cleaning devices 81 is determined based on the tact time of processing at the cleaning station 61.

  The lifter unit 31 handles the FOUP 91 placed on the load port 21 and transfers it to the stock shelf 32 (see FIG. 4A). The lifter unit 31 is horizontally mounted on the upper part in the housing 4, and extends between a transfer position where the FOUP 91 faces the stock shelf 32 and a home position located directly above the load port 21. And a lifter 42 that travels on the guide rail 41.

  The lifter 42 includes a handling portion 43 that handles the FOUP 91 via the gripping protrusion 93 and a lifter body 45 that suspends the handling portion 43 via a pair of belts 44, 44. The main body 45 incorporates a hoist mechanism and the like, and raises and lowers the handling portion 43 between a lower end position facing the load port 21 and an upper end position contacting the lifter main body 45. That is, the lifter unit 31 receives the FOUP 91 from the load port 21, raises it to the height position of the uppermost stock shelf 32, further moves laterally to the position of the stock shelf 32, and delivers it to the stock shelf 32.

Each stock shelf 32 is composed of a pair of shelf plates 32a facing each other with a gap slightly wider than the width of the belt conveyor 2, and a FOUP 91 is horizontally mounted so as to pass between the pair of shelf plates 32a. Placed.
On the other hand, the elevator unit 34 horizontally moves one of the eight shelves 32a of the eight sets of stock shelves 32 in a horizontal position and the other eight shelves 32a of the eight sets of stock shelves 32 horizontally. A right unit that circulates in a posture and a drive unit that drives both units synchronously are configured. Eight sets of stock shelves 32 are fixed to the elevator unit 34 at equal intervals, and each stock shelf 32 is circulated by the elevator unit 34 from the receiving position of the FOUP 91 in a downward, forward, upward, and backward direction. Then, processing is performed beyond the belt conveyor 2 at the time of the descent, and the FOUP 91 is delivered so as to be left on the belt conveyor 2. Although only one FOUP 91 is shown in the figure, in the actual control operation by the control device, the stock shelf 32 is appropriately circularly moved in the forward and reverse directions by the elevator unit 34 so that the FOUP 91 is stocked on a plurality of stock shelves 32. However, it is transferred to the belt conveyor 2 one by one. In addition, the conveyance destination side transfer apparatus 3b has the same apparatus structure, and is operated in the reverse procedure to the conveyance source side transfer apparatus 3a.

  Here, a series of transport operations of the FOUP 91 between the cleaning station 61 and the registration station 62 will be described. Based on the control command from the control device, the lifter main body 45 waiting at the home position is driven, the handling unit 43 is lowered to the lower end position, and the FOUP 91 placed on the load port 21 of the cleaning device 81 is handled ( (See FIG. 4 (a)).

  The lifter unit 31 raises the FOUP 91 to the rising end position while handling it (see FIG. 4B). Subsequently, the FOUP 91 is moved horizontally from the home position to the transfer position (see FIG. 5A). When the FOUP 91 reaches the upper part (transfer position) of the uppermost stock shelf 32, the lifter unit 31 slightly lowers the FOUP 91 and transfers it to the stock shelf 32 (places it: FIG. 5B). reference). When the FOUP 91 is placed on the stock shelf 32, the elevator unit 34 is driven to lower the stock shelf 32 and deliver the FOUP 91 to the belt conveyor 2 (see FIGS. 5C and 5D).

  The FOUP 91 transferred to the belt conveyor 2 is transferred to the transfer end position (transfer destination side transfer device 3b of the registration station 62) by driving the belt conveyor 2. The FOUP 91 transported to the transport end position is transferred to the stock shelf 32 of the registration station 62 and stocked as appropriate, and then transferred to the load port 21 of the registration device 82 by the lifter unit 31.

  Next, a series of transfer operations in the production line for the semiconductor wafer W shown in FIG. 1 will be described. The plurality of FOUPs 91 accommodated in the carry-in stocker 67 are taken out from the carry-in stocker 67 by the transfer robot and transferred in order to the load ports 21 of the three cleaning devices 81. In each cleaning device 81, the semiconductor wafer W is taken out from the FOUP 91 transferred to each load port 21 and cleaned. The semiconductor wafers W that have been subjected to the cleaning process are again accommodated in the FOUP 91 and transferred to the load port 21 of the central cleaning apparatus 81 in order by the transfer robot.

  The FOUPs 91 transferred to the load port 21 are sequentially transferred toward the two registration devices 82 by the belt conveyor 2 via the transfer source side transfer device 3a. In each resist device 82, a resist pattern is formed on the surface of the semiconductor wafer W. Subsequently, the FOUP 91 is sequentially conveyed from the registration device 82 to the inspection device 83 by the belt conveyor 2. When the inspection of the resist pattern of the semiconductor wafer W is completed in the inspection apparatus 83, each FOUP 91 is guided to the direction control guide 15 by using the ID mounted thereon as an identification mark, and is sent to the three etching stations 64, 65 and 66, respectively. Sorted and conveyed.

  The FOUP 91 transferred to the etching stations 64, 65, 66 is subjected to a desired solvent treatment on the semiconductor wafer W by the etching devices 84, 85, 86. Then, each semiconductor wafer W that has been subjected to the solvent treatment is again accommodated in the FOUP and transferred to the unloading stocker 68 by the transfer robot. In this way, the semiconductor wafer W is transferred.

  As described above, according to the substrate transfer apparatus 1 of the present embodiment, the dedicated belt conveyor 2 is provided between the two processing stations that perform the preceding and following processes. Therefore, in the transfer path due to an increase in the number of lots due to single wafer transfer or the like. The FOUP 91 can be efficiently transported without stagnation.

It is a whole schematic diagram of the manufacturing line of a semiconductor device. It is a schematic diagram of the board | substrate conveyance apparatus between a washing | cleaning station and a resist station. It is a side view of FOUP. (A) And (b) is operation | movement explanatory drawing of a conveyance source transfer apparatus. (A), (b), (c) and (d) are operation | movement explanatory drawings of a conveyance source transfer apparatus. It is operation | movement explanatory drawing of a direction control guide.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate transfer apparatus 2 ... Transfer mechanism 91 ... FOUP W ... Semiconductor wafer

Claims (7)

In a substrate transfer apparatus for transferring a substrate to a plurality of processing stations according to processes provided in a semiconductor device production line
A substrate transfer apparatus, comprising a plurality of transfer means disposed between two process stations that perform the preceding and following processes, and transferring the substrate between the two process stations.   The substrate transfer apparatus according to claim 1, wherein each of the transfer units transfers the substrate in one direction between the two processing stations. Each processing station has a plurality of processing devices for performing the same type of processing,
The substrate transfer apparatus according to claim 1, further comprising a plurality of substrate transfer means for transferring the substrate between the plurality of processing apparatuses and the transfer means.   4. The substrate transfer apparatus according to claim 3, wherein each of the substrate transfer means has a buffer for stocking a plurality of the substrates.   5. The substrate transfer apparatus according to claim 1, wherein each of the transfer means transfers the substrates one by one.   6. The substrate transfer apparatus according to claim 1, wherein each of the transfer means transfers the substrate in a state where the substrate is accommodated in a pod.   7. The substrate transfer apparatus according to claim 1, wherein each of the transfer means is a ceiling-type belt conveyor.

Images