JP2007234423A - Contact terminal and connector device for card - Google Patents

Contact terminal and connector device for card Download PDF

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Publication number
JP2007234423A
JP2007234423A JP2006055233A JP2006055233A JP2007234423A JP 2007234423 A JP2007234423 A JP 2007234423A JP 2006055233 A JP2006055233 A JP 2006055233A JP 2006055233 A JP2006055233 A JP 2006055233A JP 2007234423 A JP2007234423 A JP 2007234423A
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solder
contact terminal
soldered
soldering
cut surface
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JP4621609B2 (en
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Toshihisa Matsushita
敏久 松下
Wataru Oguchi
亙 小口
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact terminal in which the tip face of the soldering part can be soldered surely, and a connector device for a card. <P>SOLUTION: The contact terminal 1 is provided with the soldering part 1a that is soldered to a substrate 3, this soldering part 1a has a cut surface 1a1 constituting a non-soldered part in which soldering is not given on a side face 1a3, all the parts including the tip face 1a2 excluding this cut surface 1a1 are constituted of the solder-plating part which are solder-plated, and the cut surface 1a1 is protrusion molded. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子機器の基板等に半田付けされる半田付け部を有するコンタクト端子、及びこのコンタクト端子を備えたカード用コネクタ装置に関する。   The present invention relates to a contact terminal having a soldering portion to be soldered to a substrate or the like of an electronic device, and a card connector device provided with the contact terminal.

この種の従来技術として、特許文献１に示されるものがある。この特許文献１には、半田メッキが施された金属材料から成るプリメッキ材を切断加工することによって、電子機器の基板に半田付けされるリード端子を成形することが開示されている。この従来技術では、上述の切断加工によってリード端子の先端面が、半田メッキが施されない切断面となっている。したがって、この切断面を除いた部分に半田が付けられる。
特開平８−３０６８４４号公報 There exists a thing shown by patent document 1 as this type of prior art. This patent document 1 discloses forming a lead terminal to be soldered to a substrate of an electronic device by cutting a pre-plated material made of a metal material subjected to solder plating. In this prior art, the tip surface of the lead terminal is a cut surface that is not subjected to solder plating by the above-described cutting process. Therefore, solder is applied to the portion excluding the cut surface.
JP-A-8-306844

上述した従来技術は、リード端子の先端面が、半田メッキが施されない切断面から成ることから、この先端面を含む部分に半田が付きにくく、このために不良品を生じる懸念がある。また、この従来技術では、先端面を含む部分に半田付けをしても、実際には半田が付いていない場合があり、この先端面を含む部分に良好な半田付けがなされているかどうかの目視確認が難しい。   In the above-described prior art, the tip surface of the lead terminal is formed of a cut surface that is not subjected to solder plating, so that solder is difficult to adhere to the portion including the tip surface, which may cause defective products. In addition, in this prior art, even if soldering is performed on the portion including the tip surface, there is a case where the solder is not actually attached, and whether or not good soldering is performed on the portion including the tip surface is visually confirmed. Confirmation is difficult.

なお、複数のリード端子が並設され、隣り合うリード端子間のそれぞれの側面においても半田付けされるような場合には、隣り合うリード端子との間で半田ブリッジが形成されてしまう虞がある。したがって、この半田ブリッジによっても不良品となってしまう懸念がある。   In addition, when a plurality of lead terminals are juxtaposed and soldered on each side surface between adjacent lead terminals, a solder bridge may be formed between the adjacent lead terminals. . Therefore, there is a concern that this solder bridge may become a defective product.

本発明は、上述した従来技術における実状からなされたもので、その目的は、半田付け部の先端面に確実に半田を付けることができるコンタクト端子、及びカード用コネクタ装置を提供することにある。   The present invention has been made from the above-described prior art, and an object of the present invention is to provide a contact terminal and a card connector device capable of reliably soldering the front end surface of a soldering portion.

この目的を達成するために、本発明のコンタクト端子は、半田付けされる半田付け部を備え、この半田付け部が、側面に半田メッキが施されない非半田メッキ部を有するとともに、この非半田メッキ部を除く全ての部分が半田メッキを施した半田メッキ部から成ることを特徴としている。   In order to achieve this object, the contact terminal of the present invention includes a soldered portion to be soldered, and the soldered portion has a non-solder plated portion that is not subjected to solder plating on the side surface. All the parts except for the part are composed of solder plated parts subjected to solder plating.

このように構成した本発明のコンタクト端子は、半田付け部の側面に半田メッキが施されない非半田メッキ部を有するものの、この非半田メッキ部を除く先端面を含む全ての部分が半田メッキ部から成ることから、先端面に確実に半田を付けることができる。また、このように先端面が確実に半田付けされるので、この先端面に半田が付けられていれば直ちに、この部分に良好な半田付けがなされていると判断できる。すなわち、この先端面に良好な半田付けがなされているかどうかの目視確認が容易となる。   Although the contact terminal of the present invention configured as described above has a non-solder plated portion that is not subjected to solder plating on the side surface of the soldered portion, all the portions including the tip surface except the non-solder plated portion are from the solder plated portion. Therefore, solder can be reliably attached to the tip surface. Further, since the tip surface is securely soldered in this way, it can be determined that if this tip surface is soldered, this portion is immediately soldered well. That is, it is easy to visually check whether or not the soldering is performed on the front end surface.

なお、複数のコンタクト端子が並設される場合、隣り合うコンタクト端子の半田付け部のそれぞれの側面に非半田メッキ部が配置されるので、それぞれの半田付け部の側面に半田を付ける際の半田ブリッジの発生をこれらの非半田メッキ部によって抑えることができる。   When a plurality of contact terminals are arranged in parallel, a non-solder-plated portion is disposed on each side surface of the soldering portion of adjacent contact terminals, so that solder when soldering is applied to the side surface of each soldering portion. The occurrence of bridging can be suppressed by these non-solder plated portions.

また、本発明のコンタクト端子は、上記コンタクト端子の発明において、上記非半田メッキ部が切断面から成ることを特徴としている。このように構成した本発明のコンタクト端子は、非半田メッキ部を製作上やむを得ない領域に留めることができる。すなわち、半田付けが可能な領域を広く確保することができる。   In the contact terminal according to the present invention, the non-solder plated portion is formed by a cut surface. The contact terminal of the present invention configured as described above can keep the non-solder plated portion in an unavoidable region for manufacturing. That is, it is possible to secure a wide area where soldering is possible.

また、本発明のコンタクト端子は、上記コンタクト端子の発明において、上記切断面を突出形成させたことを特徴としている。このように構成した本発明のコンタクト端子は、複数のコンタクト端子が並設される場合に、それぞれのコンタクト端子の半田付け部の側面に突出形成した切断面すなわち非半田メッキ部が、隣り合うコンタクト端子の半田付け部の側面に最も接近する状態とすることができる。したがって、隣り合うコンタクト端子の半田付け部を互いに接近させるように配設し半田付けした場合でも、これらの隣り合うコンタクト端子の半田付け部間に半田ブリッジが形成されることを切断面によって抑えることができる。また、非半田メッキ部である切断面を側面から突出形成させるようにしたことから、切断面を形成する切断時に切断刃による他の側面部分、すなわち半田メッキ部の損傷を防ぐことができる。   The contact terminal of the present invention is characterized in that, in the invention of the contact terminal, the cut surface is formed to protrude. In the contact terminal of the present invention configured as described above, when a plurality of contact terminals are arranged side by side, a cut surface formed on the side surface of the soldered portion of each contact terminal, that is, a non-solder plated portion is adjacent to the contact terminal. It can be in a state of being closest to the side surface of the soldered portion of the terminal. Therefore, even when the soldering parts of adjacent contact terminals are disposed so as to be close to each other and soldered, the formation of a solder bridge between the soldering parts of these adjacent contact terminals is suppressed by the cut surface. Can do. Further, since the cut surface which is a non-solder plated portion is formed so as to protrude from the side surface, it is possible to prevent damage to the other side surface portion by the cutting blade, that is, the solder plated portion at the time of cutting to form the cut surface.

また、本発明のカード用コネクタ装置は、上述したいずれかのコンタクト端子を備えたことを特徴としている。   The card connector device of the present invention is characterized by including any one of the contact terminals described above.

このように構成した本発明のカード用コネクタ装置は、複数のコンタクト端子の半田付け部のそれぞれが側面に半田メッキが施されない非半田メッキ部を有するものの、非半田メッキ部を除く先端面を含む全ての部分が半田メッキ部から成ることから、これらのコンタクト端子の半田付け部のそれぞれの先端面に確実に半田を付けることができる。また、このようにコンタクト端子の半田付け部のそれぞれの先端面が確実に半田付けされるので、これらの先端面に半田が付けられていれば直ちに、これらの部分に良好な半田付けがなされていると判断できる。すなわち、コンタクト端子の半田付け部のそれぞれの先端面に良好な半田付けがなされているかどうかの目視確認が容易となる。また、コンタクト端子の半田付け部のそれぞれの側面に非半田メッキ部が配置されるので、隣り合うコンタクト端子の半田付け部のそれぞれの側面に半田を付ける際の半田ブリッジの発生を、これらの非半田メッキ部によって抑えることができる。   The card connector device of the present invention configured as described above includes a front end surface excluding the non-solder-plated portion, although each of the soldered portions of the plurality of contact terminals has a non-solder-plated portion that is not subjected to solder plating on the side surface. Since all the parts are composed of solder plated portions, it is possible to reliably solder the respective tip surfaces of the soldered portions of these contact terminals. In addition, since the respective tip surfaces of the soldered portions of the contact terminals are securely soldered in this way, if these tip surfaces are soldered, immediately, good soldering is performed on these portions. Can be judged. In other words, it is easy to visually check whether or not good soldering is performed on the respective tip surfaces of the soldering portions of the contact terminals. In addition, since the non-solder-plated portion is disposed on each side surface of the soldered portion of the contact terminal, the occurrence of a solder bridge when soldering to each side surface of the soldered portion of the adjacent contact terminal is prevented. It can be suppressed by the solder plating part.

本発明のコンタクト端子は、半田付け部の先端面に確実に半田を付けることができ、この先端面の半田付け不良を従来に比べて少なくすることができる。また、このように先端面が確実に半田付けされるので、この先端面の半田付けが良好に行われているかどうかの目視確認が容易となり、従来に比べてコンタクト端子の製作能率を向上させることができる。   The contact terminal of the present invention can surely apply solder to the tip surface of the soldering portion, and the soldering failure of the tip surface can be reduced as compared with the conventional case. In addition, since the tip surface is securely soldered in this way, it is easy to visually check whether the tip surface is well soldered, and the contact terminal manufacturing efficiency can be improved compared to the conventional case. Can do.

また、本発明のカード用コネクタ装置は、複数のコンタクト端子の半田付け部のそれぞれの先端面に確実に半田を付けることができ、これらの先端面の半田付け不良を従来に比べて少なくすることができる。また、このようにコンタクト端子の半田付け部のそれぞれの先端面が確実に半田付けされるので、これらの先端面の半田付けが良好に行われているかどうかの目視確認が容易となり、従来に比べてカード用コネクタ装置の製作能率を向上させることができる。また、隣り合うコンタクト端子の半田付け部のそれぞれの側面に半田を付けた際の半田ブリッジの発生を、それぞれの側面の非半田メッキ部によって抑えることができ、コンタクト端子の半田付けに伴う不良品の発生を少なくすることができる。   Also, the card connector device of the present invention can reliably solder the tip surfaces of the soldered portions of the plurality of contact terminals, and reduce the soldering defects on these tip surfaces compared to the conventional one. Can do. In addition, since the respective tip surfaces of the soldered portions of the contact terminals are reliably soldered in this way, it is easy to visually check whether or not these tip surfaces are well soldered. Thus, the production efficiency of the card connector device can be improved. In addition, the occurrence of solder bridges when soldering each side of the soldered part of adjacent contact terminals can be suppressed by the non-solder-plated parts on each side, resulting in defective products due to contact terminal soldering Can be reduced.

以下，本発明に係るコンタクト端子、及びカード用コネクタ装置を実施するための最良の形態を図に基づいて説明する。   The best mode for carrying out contact terminals and a card connector device according to the present invention will be described below with reference to the drawings.

図１は本発明に係るコンタクト端子の一実施形態が備えられるカード用コネクタ装置の要部を示す平面図、図２は図１のＡ部拡大図、図３は図２のＢ方向から見た図、図４は図１に示すコンタクト端子の一実施形態を基板に半田付けした状態を示す平面図、図５は図１に示すコンタクト端子の一実施形態を基板に半田付けした状態を示す側面図である。   FIG. 1 is a plan view showing a main part of a card connector device provided with an embodiment of a contact terminal according to the present invention, FIG. 2 is an enlarged view of part A in FIG. 1, and FIG. 3 is viewed from the direction B in FIG. 4 is a plan view showing a state where one embodiment of the contact terminal shown in FIG. 1 is soldered to the substrate, and FIG. 5 is a side view showing a state where one embodiment of the contact terminal shown in FIG. 1 is soldered to the substrate. FIG.

図１に示すように、カード用コネクタ装置の要部を構成する部分に、このカード用コネクタ装置に挿入される図示しないカードに設けられる接触部と接続されて、このカードに対する信号の送受信を可能にさせる複数のコンタクト端子１、すなわち本発明の一実施形態であるコンタクト端子１が並設されている。   As shown in FIG. 1, it is connected to a contact portion provided on a card (not shown) inserted into the card connector device at a portion constituting a main part of the card connector device, and signals can be transmitted / received to / from the card. A plurality of contact terminals 1 to be formed, that is, contact terminals 1 according to an embodiment of the present invention are juxtaposed.

これらのコンタクト端子１のそれぞれには、図４，５に示すように立ち下り部１ｂの下端に、電子機器の基板３に半田付けされる半田付け部１ａが備えられている。この半田付け部１ａは、図２，３に示すように、切断面１ａ１と、この切断面１ａ１に連設される先端面１ａ２と、切断面１ａ１が含まれる側面１ａ３とを有している。切断面１ａ１は、例えば側面１ａ３から突出形成させてある。さらに先端面１ａ２と切断面１ａ１とが連設されていることから、切断面１ａ２の突出部分の幅も加わり、先端面１ａ２は幅広に形成されることとなる。また、切断面１ａ１は半田メッキが施されない非半田メッキ部を構成し、先端面１ａ２と、切断面１ａ１を除く側面１ａ３部分は、半田メッキを施した半田メッキ部を構成している。すなわち、本実施形態にあっては、切断面１ａ１を除く半田付け部１ａの全体が半田メッキ部を構成している。   Each of these contact terminals 1 is provided with a soldering portion 1a soldered to the substrate 3 of the electronic device at the lower end of the falling portion 1b as shown in FIGS. As shown in FIGS. 2 and 3, the soldering portion 1a has a cut surface 1a1, a tip surface 1a2 connected to the cut surface 1a1, and a side surface 1a3 including the cut surface 1a1. The cut surface 1a1 is formed so as to protrude from the side surface 1a3, for example. Furthermore, since the front end surface 1a2 and the cut surface 1a1 are connected in series, the width of the protruding portion of the cut surface 1a2 is also added, and the front end surface 1a2 is formed wider. Further, the cut surface 1a1 constitutes a non-solder plated portion not subjected to solder plating, and the tip end surface 1a2 and the side surface 1a3 portion excluding the cut surface 1a1 constitute a solder plated portion subjected to solder plating. That is, in this embodiment, the whole soldering part 1a except the cut surface 1a1 constitutes a solder plating part.

上述のように構成したコンタクト端子１の半田付け部１ａのそれぞれは、図４，５に示すように、例えば先端面１ａ２と、側面１ａ３のうちの切断面１ａ１を除く部分において半田２が付けられて、基板３に半田付けされる。これにより、コンタクト端子１に接続された図示しないカードに、コンタクト端子１を介して外部信号が送受信可能となる。また先端面１ａ２が幅広に形成されていることから、先端面１ａ２に良好な半田付けがなされているかどうかの目視確認が容易となる。   As shown in FIGS. 4 and 5, each of the soldered portions 1a of the contact terminal 1 configured as described above is attached with solder 2 at, for example, the tip surface 1a2 and the portion of the side surface 1a3 excluding the cut surface 1a1. And soldered to the substrate 3. Thereby, an external signal can be transmitted / received to / from a card (not shown) connected to the contact terminal 1 via the contact terminal 1. Moreover, since the front end surface 1a2 is formed wide, it is easy to visually check whether the front end surface 1a2 is well soldered.

図６は本発明に係るコンタクト端子の一実施形態の成形加工を説明する平面図、図７は図６のＣ部拡大図である。   FIG. 6 is a plan view for explaining a molding process of an embodiment of the contact terminal according to the present invention, and FIG. 7 is an enlarged view of a portion C in FIG.

上述したコンタクト端子１の半田付け部１ａのそれぞれは、図６，７に示すように、インサート成形によって合成樹脂５が装着された金属薄板４の半田メッキが全体に施された半田付け部素材６の所定部分を、切断刃によって切断することによって作製される。この切断によって、上述のように半田付け部１ａの側面１ａ３に、非半田メッキ部から成る切断面１ａ１が形成される。   As shown in FIGS. 6 and 7, each of the soldering portions 1 a of the contact terminal 1 described above is a soldering portion material 6 in which the solder plating of the metal thin plate 4 on which the synthetic resin 5 is mounted is performed by insert molding. Is produced by cutting a predetermined portion of the substrate with a cutting blade. By this cutting, the cut surface 1a1 made of the non-solder plated portion is formed on the side surface 1a3 of the soldering portion 1a as described above.

このように構成した本発明の一実施形態に係るコンタクト端子１によれば、側面１ａ３から突出形成された部分に半田メッキが施されない非半田メッキ部、すなわち切断面１ａ１を有するものの、先端面１ａ２が半田メッキ部から成ることから、この先端面１ａ２に確実に半田２を付けることができ、先端面１ａ２の半田付け不良を少なくすることができる。また、このように先端面１ａ２が確実に半田付けされるので、この先端面１ａ２に半田２が付けられていれば直ちに、この部分に良好な半田付けがなされていると判断できる。すなわち、先端面１ａ２に良好な半田付けがなされているかどうかの目視確認が容易になり、このコンタクト端子１の製作能率を向上させることができる。   According to the contact terminal 1 according to the embodiment of the present invention configured as described above, the portion projected from the side surface 1a3 has a non-solder-plated portion where the solder plating is not performed, that is, the cut surface 1a1, but the front end surface 1a2 Since it consists of a solder plating part, the solder 2 can be reliably attached to this front end surface 1a2, and the soldering defect of the front end surface 1a2 can be reduced. In addition, since the front end surface 1a2 is reliably soldered in this way, it can be determined that the soldering is performed well on this portion as soon as the solder 2 is applied to the front end surface 1a2. That is, it is easy to visually check whether or not good soldering is performed on the front end surface 1a2, and the manufacturing efficiency of the contact terminal 1 can be improved.

また、隣り合うコンタクト端子１の半田付け部１ａのそれぞれの側面１ａ３側に非半田メッキ部から成る切断面１ａ１が配置されているので、コンタクト端子１の半田付け部１ａのそれぞれの側面１ａ３に半田２を付けた際の半田ブリッジの発生を、これらの切断面１ａ１によって抑えることができる。   Further, since the cut surface 1a1 made of the non-solder plating portion is disposed on the side surface 1a3 side of the soldering portion 1a of the adjacent contact terminal 1, the solder is applied to each side surface 1a3 of the soldering portion 1a of the contact terminal 1. Generation | occurrence | production of the solder bridge at the time of attaching 2 can be suppressed by these cut surfaces 1a1.

また、非半田メッキ部が切断面１ａ１から成ることから、非半田メッキ部をコンタクト端子１の製作上やむを得ない領域に留めることができる。すなわち、半田付けが可能な領域を広く確保できる。   In addition, since the non-solder plated portion is formed of the cut surface 1a1, the non-solder plated portion can be kept in an unavoidable region for manufacturing the contact terminal 1. That is, it is possible to secure a wide area where soldering is possible.

また、切断面１ａ１を突出形成させたことから、この非半田メッキ部から成る切断面１ａ１が、隣り合うコンタクト端子１の半田付け部１ａの側面１ａ３に最も接近する状態とすることができる。したがって、隣り合うコンタクト端子１の半田付け部１を互いに接近させるように配設し半田付けした場合でも、これらの隣り合うコンタクト端子１の半田付け部１ａ間に半田ブリッジが発生することを切断面１ａ１によって抑えることができる。   Further, since the cut surface 1a1 is formed so as to protrude, the cut surface 1a1 made of this non-solder plated portion can be brought into the state closest to the side surface 1a3 of the soldering portion 1a of the adjacent contact terminal 1. Therefore, even when the soldering portions 1 of the adjacent contact terminals 1 are disposed so as to be close to each other and soldered, it is possible to prevent a solder bridge from occurring between the soldering portions 1a of the adjacent contact terminals 1. It can be suppressed by 1a1.

また、半田付け部１ａの側面１ａ３の切断面１ａ１を除く部分を半田メッキ部に構成し、非半田メッキ部から成る切断面１ａ１を突出形成させるようにしたことから、切断面１ａ１を形成する切断時に、切断刃による切断面１ａ１を除く半田メッキ部から成る側面１ａ３の部分の損傷を防ぐことができる。   In addition, since the portion excluding the cut surface 1a1 of the side surface 1a3 of the soldering portion 1a is configured as a solder plated portion, and the cut surface 1a1 formed of the non-solder plated portion is formed to protrude, the cut that forms the cut surface 1a1 Sometimes, it is possible to prevent damage to the side surface 1a3 formed of the solder plating portion excluding the cut surface 1a1 by the cutting blade.

また、図１に要部を示した本発明に係るカード用コネクタ装置の一実施形態によれば、複数のコンタクト端子１の半田付け部１ａのそれぞれが側面１ａ３に半田メッキが施されない非半田メッキ部から成る切断面１ａ１を有するものの、先端面１ａ２が半田メッキ部から成ることから、これらのコンタクト端子１の半田付け部１ａのそれぞれの先端面１ａ２に確実に半田２を付けることができ、これらの先端面１ａ２の半田付け不良を少なくすることができる。また、このようにコンタクト端子１の半田付け部１ａのそれぞれの先端面１ａ２が確実に半田付けされるので、これらの先端面１ａ２に半田２が付けられていれば直ちに、これらの部分に良好な半田付けがなされていると判断できる。すなわち、コンタクト端子１の半田付け部１ａのそれぞれの先端面１ａ２に良好な半田がなされているかどうかの目視確認が容易となり、このカード用コネクタ装置の製作能率を向上させることができる。   Further, according to one embodiment of the card connector device according to the present invention, the main part of which is shown in FIG. 1, each of the soldering portions 1a of the plurality of contact terminals 1 is not solder-plated so that the side surface 1a3 is not subjected to solder plating. Although the front end surface 1a2 is composed of a solder plating portion, the solder 2 can be reliably attached to the respective front end surfaces 1a2 of the soldering portions 1a of these contact terminals 1, It is possible to reduce soldering defects on the front end surface 1a2. In addition, since the respective end surfaces 1a2 of the soldered portions 1a of the contact terminals 1 are reliably soldered in this way, if the solder 2 is attached to these end surfaces 1a2, these portions are immediately improved. It can be judged that soldering is performed. That is, it is easy to visually check whether or not good solder is applied to the respective end surfaces 1a2 of the soldering portions 1a of the contact terminals 1, and the production efficiency of the card connector device can be improved.

また、コンタクト端子１のそれぞれの半田付け部１ａの側面１ａ３側に非半田メッキ部から成る切断面１ａ１が配置されるので、隣り合うコンタクト端子１の半田付け部１ａの側面１ａ３の切断面１ａ１を除く半田メッキ部から成る部分に半田２を付けた際の半田ブリッジの発生を、非半田メッキ部を構成する切断面１ａ１によって抑えることができ、コンタクト端子１の半田付けに伴う不良品の発生を少なくすることができる。   Further, since the cut surface 1a1 made of the non-solder plating portion is disposed on the side surface 1a3 side of each soldering portion 1a of the contact terminal 1, the cut surface 1a1 of the side surface 1a3 of the soldering portion 1a of the adjacent contact terminal 1 is provided. The occurrence of solder bridges when the solder 2 is applied to the portion consisting of the solder plating portion to be removed can be suppressed by the cut surface 1a1 constituting the non-solder plating portion, and the generation of defective products due to the soldering of the contact terminals 1 can be prevented. Can be reduced.

図８は本発明に係るコンタクト端子の別の実施形態を基板に半田付けした状態を示す平面図、図９は図８に示すコンタクト端子の別の実施形態を基板に半田付けした状態を示す側面図である。   FIG. 8 is a plan view showing a state in which another embodiment of the contact terminal according to the present invention is soldered to the substrate, and FIG. 9 is a side view showing a state in which another embodiment of the contact terminal shown in FIG. 8 is soldered to the substrate. FIG.

これらの図８，９に示す本発明の別の実施形態に係るコンタクト端子７も、半田付け部に、非半田メッキ部を構成する切断面７ａと、半田メッキ部を構成する先端面７ｂ及び側面７ｃとを備えている。すなわち、この別の実施形態も切断面７ａを除く全ての部分を半田メッキ部に構成してある。このコンタクト端子７は、切断面７ａを先端面７ｂから離れた位置にある側面７ｃ部分に突出形成させてある。基板３への半田付けに際しては、例えば先端面７ｂと、切断面７ａを除く側面７ｃの部分に半田２が付けられる。   These contact terminals 7 according to another embodiment of the present invention shown in FIGS. 8 and 9 also have a cut surface 7a constituting a non-solder plated portion, a tip surface 7b constituting a solder plated portion, and a side surface in a soldering portion. 7c. That is, in this other embodiment, all parts except the cut surface 7a are configured as solder plating portions. This contact terminal 7 has a cut surface 7a formed so as to protrude from a side surface 7c located at a position away from the tip surface 7b. When soldering to the substrate 3, for example, the solder 2 is applied to the tip surface 7 b and the side surface 7 c excluding the cut surface 7 a.

このように構成した別の実施形態に係るコンタクト端子７も、側面７ｃに非半田メッキ部から成る切断面７ａを備え、先端面７ｂが半田メッキ部から成ることから、前述した図１〜５に示したコンタクト端子１と同等の作用効果が得られる。また、コンタクト端子７を複数備えたカード用コネクタ装置も、前述したカード用コネクタ装置と同様の作用効果が得られる。   The contact terminal 7 according to another embodiment configured as described above also includes a cut surface 7a made of a non-solder plated portion on the side surface 7c, and the tip end surface 7b made of a solder plated portion. The same effect as that of the contact terminal 1 shown can be obtained. In addition, the card connector device including a plurality of contact terminals 7 can provide the same effects as the card connector device described above.

本発明に係るコンタクト端子の一実施形態が備えられるカード用コネクタ装置の要部を示す平面図である。It is a top view which shows the principal part of the card connector apparatus with which one Embodiment of the contact terminal which concerns on this invention is provided. 図１のＡ部拡大図である。It is the A section enlarged view of FIG. 図２のＢ方向から見た図である。It is the figure seen from the B direction of FIG. 図１に示すコンタクト端子の一実施形態を基板に半田付けした状態を示す平面図である。It is a top view which shows the state which soldered one Embodiment of the contact terminal shown in FIG. 1 to the board | substrate. 図１に示すコンタクト端子の一実施形態を基板に半田付けした状態を示す側面図である。It is a side view which shows the state which soldered one Embodiment of the contact terminal shown in FIG. 1 to the board | substrate. 本発明に係るコンタクト端子の一実施形態の成形加工を説明する平面図である。It is a top view explaining the shaping | molding process of one Embodiment of the contact terminal which concerns on this invention. 図６のＣ部拡大図である。It is the C section enlarged view of FIG. 本発明に係るコンタクト端子の別の実施形態を基板に半田付けした状態を示す平面図である。It is a top view which shows the state which soldered another embodiment of the contact terminal which concerns on this invention to the board | substrate. 図８に示すコンタクト端子の別の実施形態を基板に半田付けした状態を示す側面図である。It is a side view which shows the state which soldered another embodiment of the contact terminal shown in FIG. 8 to the board | substrate.

符号の説明Explanation of symbols

１ コンタクト端子
１ａ 半田付け部
１ａ１ 切断面（非半田メッキ部）
１ａ２ 先端面（半田メッキ部）
１ａ３ 側面
１ｂ 立ち下がり部
２ 半田
３ 基板
７ コンタクト端子
７ａ 切断面（非半田メッキ部）
７ｂ 先端面（半田メッキ部）
７ｃ 側面 1 Contact terminal 1a Soldering part 1a1 Cut surface (non-solder plating part)
1a2 Tip surface (solder plating part)
1a3 Side surface 1b Falling portion 2 Solder 3 Substrate 7 Contact terminal 7a Cut surface (non-solder plated portion)
7b Tip surface (solder plated part)
7c side

Claims (4)

半田付けされる半田付け部を備え、この半田付け部が、側面に半田メッキが施されない非半田メッキ部を有するとともに、この非半田メッキ部を除く全ての部分が半田メッキを施した半田メッキ部から成ることを特徴とするコンタクト端子。   A solder plated portion having a soldered portion to be soldered, and having a non-solder plated portion on which the solder plating is not performed on the side surface, and all portions other than the non-solder plated portion are solder plated. A contact terminal comprising: 上記請求項１記載の発明において、
上記非半田メッキ部が切断面から成ることを特徴とするコンタクト端子。 In the invention of claim 1,
A contact terminal, wherein the non-solder plated portion is formed of a cut surface. 上記請求項２記載の発明において、
上記切断面を突出形成させたことを特徴とするコンタクト端子。 In the invention of claim 2,
A contact terminal having the cut surface protruding. 上記請求項１〜３のいずれか１項記載のコンタクト端子を備えたことを特徴とするカード用コネクタ装置。
A card connector device comprising the contact terminal according to claim 1.
JP2006055233A 2006-03-01 2006-03-01 Contact terminal and card connector device Expired - Fee Related JP4621609B2 (en)

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JP2006055233A JP4621609B2 (en) 2006-03-01 2006-03-01 Contact terminal and card connector device
CNB2007100842048A CN100521373C (en) 2006-03-01 2007-02-27 Contact terminal and connector for cards

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Application Number Priority Date Filing Date Title
JP2006055233A JP4621609B2 (en) 2006-03-01 2006-03-01 Contact terminal and card connector device

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JP2007234423A true JP2007234423A (en) 2007-09-13
JP4621609B2 JP4621609B2 (en) 2011-01-26

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617225U (en) * 1992-07-30 1994-03-04 日本航空電子工業株式会社 Electronic component terminals
JPH09180789A (en) * 1995-12-28 1997-07-11 Alps Electric Co Ltd Terminal structure for electronic parts
JP2001291571A (en) * 2000-04-05 2001-10-19 Kitagawa Ind Co Ltd Electro-conductive material and its manufacturing method
JP2005206942A (en) * 2003-12-26 2005-08-04 Fuji Denshi Kogyo Kk PRESS-BLANKING MATERIAL, AND Sn PLATING TREATMENT METHOD

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617225U (en) * 1992-07-30 1994-03-04 日本航空電子工業株式会社 Electronic component terminals
JPH09180789A (en) * 1995-12-28 1997-07-11 Alps Electric Co Ltd Terminal structure for electronic parts
JP2001291571A (en) * 2000-04-05 2001-10-19 Kitagawa Ind Co Ltd Electro-conductive material and its manufacturing method
JP2005206942A (en) * 2003-12-26 2005-08-04 Fuji Denshi Kogyo Kk PRESS-BLANKING MATERIAL, AND Sn PLATING TREATMENT METHOD

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CN101030674A (en) 2007-09-05
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