JP2007227192A - 試料保持装置および荷電粒子線装置 - Google Patents
試料保持装置および荷電粒子線装置 Download PDFInfo
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- JP2007227192A JP2007227192A JP2006047672A JP2006047672A JP2007227192A JP 2007227192 A JP2007227192 A JP 2007227192A JP 2006047672 A JP2006047672 A JP 2006047672A JP 2006047672 A JP2006047672 A JP 2006047672A JP 2007227192 A JP2007227192 A JP 2007227192A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/026—Shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/204—Means for introducing and/or outputting objects
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】試料保持装置が複数の電極を有し、当該複数の電極の一部を上下動させる移動機構を備える。また、当該移動機構は前記複数の電極の一部を試料の導入経路から離脱させるように下降させる。さらに前記試料保持装置は試料の位置決め部材を有し、試料の搭載後に試料の位置決めを行う。
【選択図】図2
Description
12bはウエハ2から離れていてもよい。
14aへの入力も兼ねており、移動電極13aは下がり、移動チャックピン12aは退避位置で保持されている。ここで移動電極13aはウエハと干渉しない位置まで下がればよい。搬送ロボット3のアームがロードロック室5から退避すると、アクチュエータ27によってパレット26を矢印aの方向に下降させ、ウエハ2をホルダ6に設けた支持台28に載せる。このときウエハ2が置かれる位置は固定ピン11a,11bと移動チャックピン12aのほぼ中間位置でよい。
12aは試料の位置決めに使用し、試料の保持を静電チャックに置き換えればよい。固定ピン11a,11bおよび移動チャックピン12aの主な目的を位置決め用にすることで、移動チャックピン12a用の引きばね17aの張力はウエハを位置決めするのに十分な力に弱めることができる。
11bおよび移動チャックピン12aの断面形状を先端が細くなるようにテーパ形状にすることができる。その結果ウエハ上昇時にピン11a,11b,12aとの摩擦によって生じる初塵のリスクが低減され、移動アンチャックピン12bを保持装置から除くことも可能である。
Claims (4)
- 電子源と、前記電子ビームの照射方向に対し垂直な方向に移動される試料を保持する試料台と、当該試料に負の電圧を印加するための負電圧印加電源を備えた走査電子顕微鏡において、
前記試料を前記試料の移動方向に沿って導入する試料導入機構と、
前記試料の側方であって当該試料を包囲するように配置されると共に、負の電圧が印加される複数の電極と、
当該複数の電極の一部を前記試料の導入軌道から離脱させるように、当該複数の電極の一部を下降させる移動機構を備えたことを特徴とする荷電粒子線装置。 - 試料を配置するための試料指示部と、前記試料の側方であって当該試料を包囲するように形成された負電圧印加電極を備えた試料保持装置において、
前記試料保持装置の負電圧印加電極は、複数の電極から構成され、当該複数の電極の一部を前記試料の延長線上から離脱するように下降させる移動機構を備えたことを特徴とする試料保持装置。 - 請求項1又は請求項2において、前記複数の電極の一部は、ウエハ面に平行に設けられた所定の軸を中心に回転することにより下降上昇することを特徴とする荷電粒子線装置または試料保持装置。
- 請求項1及び2の試料保持装置において、前記試料保持装置が昇降機構を有することを特徴とする試料保持装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006047672A JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
US11/699,066 US7772567B2 (en) | 2006-02-24 | 2007-01-29 | Specimen holding device and charged particle beam device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006047672A JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
Publications (3)
Publication Number | Publication Date |
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JP2007227192A true JP2007227192A (ja) | 2007-09-06 |
JP2007227192A5 JP2007227192A5 (ja) | 2008-07-10 |
JP4875905B2 JP4875905B2 (ja) | 2012-02-15 |
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JP2006047672A Active JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
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US (1) | US7772567B2 (ja) |
JP (1) | JP4875905B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017027028A (ja) * | 2015-07-15 | 2017-02-02 | ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングSuss MicroTec Lithography GmbH | ウエハ照明ユニット用スペーサー変位装置、及びウエハ照明ユニット |
JP2020009880A (ja) * | 2018-07-06 | 2020-01-16 | 株式会社日立ハイテクマニファクチャ&サービス | 基板保持具及び走査型電子顕微鏡装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4766156B2 (ja) * | 2009-06-11 | 2011-09-07 | 日新イオン機器株式会社 | イオン注入装置 |
JP6054728B2 (ja) * | 2012-12-10 | 2016-12-27 | 日本電子株式会社 | 試料位置決め装置および荷電粒子線装置 |
KR102194145B1 (ko) * | 2014-06-05 | 2020-12-23 | 삼성디스플레이 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
KR102398067B1 (ko) * | 2014-11-05 | 2022-05-13 | 삼성디스플레이 주식회사 | 정전 척 |
EP3038131A1 (en) * | 2014-12-22 | 2016-06-29 | FEI Company | Improved specimen holder for a charged particle microscope |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62102524A (ja) * | 1985-10-29 | 1987-05-13 | Canon Inc | マスクチエンジヤ− |
JPH02142045A (ja) * | 1988-11-24 | 1990-05-31 | Hitachi Ltd | 荷電粒子線応用装置 |
JPH05258703A (ja) * | 1991-05-30 | 1993-10-08 | Nippon K L Ee Kk | 電子ビーム検査方法とそのシステム |
JPH08288363A (ja) * | 1995-04-14 | 1996-11-01 | Kokusai Electric Co Ltd | 移載装置 |
JP2000149845A (ja) * | 1998-11-17 | 2000-05-30 | Hitachi Ltd | 試料の保持方法,試料の保持装置、および荷電粒子線装置 |
JP2004343148A (ja) * | 2004-08-30 | 2004-12-02 | Dainippon Screen Mfg Co Ltd | 基板搬入・搬出装置及びこれを用いた基板処理装置 |
Family Cites Families (4)
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US4733091A (en) * | 1984-09-19 | 1988-03-22 | Applied Materials, Inc. | Systems and methods for ion implantation of semiconductor wafers |
US6509564B1 (en) * | 1998-04-20 | 2003-01-21 | Hitachi, Ltd. | Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method |
US6903338B2 (en) | 2003-01-30 | 2005-06-07 | Kla-Tencor Technologies Corporation | Method and apparatus for reducing substrate edge effects in electron lenses |
US7138629B2 (en) * | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
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2006
- 2006-02-24 JP JP2006047672A patent/JP4875905B2/ja active Active
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- 2007-01-29 US US11/699,066 patent/US7772567B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62102524A (ja) * | 1985-10-29 | 1987-05-13 | Canon Inc | マスクチエンジヤ− |
JPH02142045A (ja) * | 1988-11-24 | 1990-05-31 | Hitachi Ltd | 荷電粒子線応用装置 |
JPH05258703A (ja) * | 1991-05-30 | 1993-10-08 | Nippon K L Ee Kk | 電子ビーム検査方法とそのシステム |
JPH08288363A (ja) * | 1995-04-14 | 1996-11-01 | Kokusai Electric Co Ltd | 移載装置 |
JP2000149845A (ja) * | 1998-11-17 | 2000-05-30 | Hitachi Ltd | 試料の保持方法,試料の保持装置、および荷電粒子線装置 |
JP2004343148A (ja) * | 2004-08-30 | 2004-12-02 | Dainippon Screen Mfg Co Ltd | 基板搬入・搬出装置及びこれを用いた基板処理装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017027028A (ja) * | 2015-07-15 | 2017-02-02 | ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングSuss MicroTec Lithography GmbH | ウエハ照明ユニット用スペーサー変位装置、及びウエハ照明ユニット |
JP2020009880A (ja) * | 2018-07-06 | 2020-01-16 | 株式会社日立ハイテクマニファクチャ&サービス | 基板保持具及び走査型電子顕微鏡装置 |
JP6994437B2 (ja) | 2018-07-06 | 2022-01-14 | 株式会社日立ハイテク | 基板保持具及び走査型電子顕微鏡装置 |
Also Published As
Publication number | Publication date |
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US20070210261A1 (en) | 2007-09-13 |
US7772567B2 (en) | 2010-08-10 |
JP4875905B2 (ja) | 2012-02-15 |
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