JP4875905B2 - 試料保持装置および荷電粒子線装置 - Google Patents
試料保持装置および荷電粒子線装置 Download PDFInfo
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- JP4875905B2 JP4875905B2 JP2006047672A JP2006047672A JP4875905B2 JP 4875905 B2 JP4875905 B2 JP 4875905B2 JP 2006047672 A JP2006047672 A JP 2006047672A JP 2006047672 A JP2006047672 A JP 2006047672A JP 4875905 B2 JP4875905 B2 JP 4875905B2
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- sample
- wafer
- charged particle
- particle beam
- holding device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/026—Shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/204—Means for introducing and/or outputting objects
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
12bはウエハ2から離れていてもよい。
12aは試料の位置決めに使用し、試料の保持を静電チャックに置き換えればよい。固定ピン11a,11bおよび移動チャックピン12aの主な目的を位置決め用にすることで、移動チャックピン12a用の引きばね17aの張力はウエハを位置決めするのに十分な力に弱めることができる。
11bおよび移動チャックピン12aの断面形状を先端が細くなるようにテーパ形状にすることができる。その結果ウエハ上昇時にピン11a,11b,12aとの摩擦によって生じる初塵のリスクが低減され、移動アンチャックピン12bを保持装置から除くことも可能である。
Claims (6)
- 電子源と、
前記電子源から照射される電子線の照射方向に対して垂直な方向に移動される試料を保持する試料台と、
前記試料に負電圧を印加する負電圧印加電源を備えた荷電粒子線装置において、
前記試料を当該試料の移動方向に沿って導入する試料導入機構と、
前記試料を包囲するように前記試料の側方に配置され、かつ、負電圧が印加された複数の電極と、
当該複数の電極の一部を、前記試料の導入軌道から離脱させるように下降させる移動機構を備えたことを特徴とする荷電粒子線装置。 - 試料を保持する試料保持部と、
前記試料を包囲するように前記試料の側方に形成された負電圧印加電極を備えた試料保持装置において、
前記負電圧印加電極は、複数の電極から構成され、
当該複数の電極の一部を、前記試料が保持された状態における前記試料の表面の延長線上から離脱するように下降させる移動機構を備えたことを特徴とする試料保持装置。 - 請求項1に記載された荷電粒子線装置において、
当該複数の電極の一部は、
前記試料の表面に平行に設けられた所定の軸を中心に回転することにより下降上昇することを特徴とする荷電粒子線装置。 - 請求項2に記載された試料保持装置において、
当該複数の電極の一部は、
前記試料の表面に平行に設けられた所定の軸を中心に回転することにより下降上昇することを特徴とする試料保持装置。 - 請求項1に記載された荷電粒子線装置において、
前記試料台は、前記試料を昇降させる昇降機構を備えたことを特徴とする荷電粒子線装置。 - 請求項2に記載された試料保持装置において、
前記試料保持部は、前記試料を昇降させる昇降機構を備えたことを特徴とする試料保持装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006047672A JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
US11/699,066 US7772567B2 (en) | 2006-02-24 | 2007-01-29 | Specimen holding device and charged particle beam device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006047672A JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007227192A JP2007227192A (ja) | 2007-09-06 |
JP2007227192A5 JP2007227192A5 (ja) | 2008-07-10 |
JP4875905B2 true JP4875905B2 (ja) | 2012-02-15 |
Family
ID=38477993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006047672A Active JP4875905B2 (ja) | 2006-02-24 | 2006-02-24 | 試料保持装置および荷電粒子線装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7772567B2 (ja) |
JP (1) | JP4875905B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4766156B2 (ja) * | 2009-06-11 | 2011-09-07 | 日新イオン機器株式会社 | イオン注入装置 |
JP6054728B2 (ja) * | 2012-12-10 | 2016-12-27 | 日本電子株式会社 | 試料位置決め装置および荷電粒子線装置 |
KR102194145B1 (ko) * | 2014-06-05 | 2020-12-23 | 삼성디스플레이 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
KR102398067B1 (ko) * | 2014-11-05 | 2022-05-13 | 삼성디스플레이 주식회사 | 정전 척 |
EP3038131A1 (en) * | 2014-12-22 | 2016-06-29 | FEI Company | Improved specimen holder for a charged particle microscope |
NL2015170B1 (en) * | 2015-07-15 | 2017-02-01 | Suss Microtec Lithography Gmbh | Spacer displacement device for a wafer illumination unit and wafer illumination unit. |
JP6994437B2 (ja) * | 2018-07-06 | 2022-01-14 | 株式会社日立ハイテク | 基板保持具及び走査型電子顕微鏡装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4733091A (en) * | 1984-09-19 | 1988-03-22 | Applied Materials, Inc. | Systems and methods for ion implantation of semiconductor wafers |
JPS62102524A (ja) * | 1985-10-29 | 1987-05-13 | Canon Inc | マスクチエンジヤ− |
JP2821153B2 (ja) * | 1988-11-24 | 1998-11-05 | 株式会社日立製作所 | 荷電粒子線応用装置 |
JP3148353B2 (ja) * | 1991-05-30 | 2001-03-19 | ケーエルエー・インストルメンツ・コーポレーション | 電子ビーム検査方法とそのシステム |
JPH08288363A (ja) * | 1995-04-14 | 1996-11-01 | Kokusai Electric Co Ltd | 移載装置 |
US6509564B1 (en) * | 1998-04-20 | 2003-01-21 | Hitachi, Ltd. | Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method |
JP4218093B2 (ja) * | 1998-11-17 | 2009-02-04 | 株式会社日立製作所 | 試料の保持方法,試料の保持装置、および荷電粒子線装置 |
US6903338B2 (en) | 2003-01-30 | 2005-06-07 | Kla-Tencor Technologies Corporation | Method and apparatus for reducing substrate edge effects in electron lenses |
US7138629B2 (en) * | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
JP4111939B2 (ja) * | 2004-08-30 | 2008-07-02 | 大日本スクリーン製造株式会社 | 基板搬入・搬出装置及びこれを用いた基板処理装置 |
-
2006
- 2006-02-24 JP JP2006047672A patent/JP4875905B2/ja active Active
-
2007
- 2007-01-29 US US11/699,066 patent/US7772567B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007227192A (ja) | 2007-09-06 |
US20070210261A1 (en) | 2007-09-13 |
US7772567B2 (en) | 2010-08-10 |
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