JP2007223224A5 - - Google Patents
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- Publication number
- JP2007223224A5 JP2007223224A5 JP2006049029A JP2006049029A JP2007223224A5 JP 2007223224 A5 JP2007223224 A5 JP 2007223224A5 JP 2006049029 A JP2006049029 A JP 2006049029A JP 2006049029 A JP2006049029 A JP 2006049029A JP 2007223224 A5 JP2007223224 A5 JP 2007223224A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thin film
- thermoplastic polyimide
- metal thin
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001721 Polyimide Polymers 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 10
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000009719 polyimide resin Substances 0.000 claims 10
- 229920001169 thermoplastic Polymers 0.000 claims 10
- 239000004416 thermosoftening plastic Substances 0.000 claims 10
- 239000010409 thin film Substances 0.000 claims 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 238000010438 heat treatment Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 239000006185 dispersion Substances 0.000 claims 5
- 239000002734 clay mineral Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N Copper(I) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000006482 condensation reaction Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229940112669 cuprous oxide Drugs 0.000 claims 1
- 238000006297 dehydration reaction Methods 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
Claims (11)
縁性樹脂層と、絶縁性樹脂層上に形成された金属粒子が互いに融着した構造を有する金属
薄膜層とからなる積層体であって、絶縁性樹脂層には粘土鉱物が分散されていることを特
徴とする積層体。 An insulating substrate, an insulating resin layer having an imide bond and / or an amide bond formed on the insulating substrate, and a metal thin film layer having a structure in which metal particles formed on the insulating resin layer are fused to each other A laminated body comprising a clay mineral dispersed in an insulating resin layer.
層体。 The laminate according to claim 1, further comprising a metal plating layer on the metal thin film layer.
。 The laminate according to any one of claims 1 to 3, wherein the metal thin film layer contains copper.
合を有し、粘土鉱物が分散された絶縁性樹脂層および／または絶縁性樹脂前駆体層を形成
する工程（１）と、前記絶縁性樹脂層および／または絶縁性樹脂前駆体層の上に、加熱処
理によって互いに融着する金属薄膜前駆体粒子を含有する分散体を塗布し、加熱処理する
工程（２）とを含む請求項１に記載の積層体の製造方法。 Step (1) of forming an insulating resin layer and / or an insulating resin precursor layer having an imide bond and / or an amide bond whose elastic modulus is changed by heat treatment and having clay mineral dispersed thereon on an insulating substrate. And a step (2) of applying a dispersion containing metal thin film precursor particles that are fused to each other by heat treatment on the insulating resin layer and / or insulating resin precursor layer, and heat-treating (2). The manufacturing method of the laminated body of Claim 1 containing.
後、脱溶剤および脱水縮合反応のための熱処理を行って前駆体をポリイミドに全転化して
熱可塑性ポリイミド樹脂からなる層を絶縁基板上に形成させる工程（１）と、次いで、前
記熱可塑性ポリイミド樹脂層の上に、加熱処理によって互いに融着する金属薄膜前駆体粒
子を含有する分散体を塗布し、加熱処理することによって、前記熱可塑性ポリイミド樹脂
を可塑化させると共に、金属薄膜を形成させる工程（２）とを含むことを特徴とする請求
項３に記載の積層体の製造方法。 After applying a solution of a thermoplastic polyimide resin precursor in which clay mineral is dispersed on an insulating substrate, heat treatment for solvent removal and dehydration condensation reaction is performed to completely convert the precursor to polyimide, and the thermoplastic polyimide resin Applying a dispersion containing metal thin film precursor particles fused to each other by heat treatment on the thermoplastic polyimide resin layer, and then heating the layer on the insulating substrate (1). The method for producing a laminate according to claim 3, further comprising a step (2) of plasticizing the thermoplastic polyimide resin and forming a metal thin film by treatment.
溶剤処理を行って熱可塑性ポリイミド系樹脂からなる層を絶縁基板上に形成させる工程（
１）と、次いで、前記熱可塑性ポリイミド樹脂層の上に、加熱処理によって互いに融着す
る金属薄膜前駆体微粒子を含有する分散体を塗布し、加熱処理することによって、前記熱
可塑性ポリイミド樹脂を可塑化させると共に、金属薄膜層を形成させる工程（２）とを含
むことを特徴とする請求項３に記載の積層体の製造方法。 A process of applying a solution of a thermoplastic polyimide resin in which a clay mineral is dispersed on an insulating substrate, and then performing a solvent removal process to form a layer made of the thermoplastic polyimide resin on the insulating substrate (
1) Then, a dispersion containing metal thin film precursor fine particles that are fused to each other by heat treatment is applied on the thermoplastic polyimide resin layer, and the thermoplastic polyimide resin is plasticized by heat treatment. And a step (2) of forming a metal thin film layer. 4. The method of manufacturing a laminate according to claim 3.
５〜請求項７のいずれかに記載の積層体の製造方法。 The manufacturing method of the laminated body in any one of Claims 5-7 which performs the heat processing of a process (2) above the glass transition temperature of a thermoplastic polyimide resin.
The manufacturing method of the laminated body of Claim 9 or Claim 10 in which a dispersion contains a linear aliphatic polyether compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006049029A JP4628971B2 (en) | 2006-02-24 | 2006-02-24 | Laminated body and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006049029A JP4628971B2 (en) | 2006-02-24 | 2006-02-24 | Laminated body and method for producing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007223224A JP2007223224A (en) | 2007-09-06 |
| JP2007223224A5 true JP2007223224A5 (en) | 2009-03-26 |
| JP4628971B2 JP4628971B2 (en) | 2011-02-09 |
Family
ID=38545469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006049029A Expired - Fee Related JP4628971B2 (en) | 2006-02-24 | 2006-02-24 | Laminated body and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4628971B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009196249A (en) * | 2008-02-22 | 2009-09-03 | Asahi Kasei E-Materials Corp | Laminate and manufacturing method of laminate |
| WO2024038701A1 (en) * | 2022-08-17 | 2024-02-22 | 株式会社ダイセル | Laminate and manufacturing method for laminate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3781118B2 (en) * | 2003-03-03 | 2006-05-31 | セイコーエプソン株式会社 | Wiring board manufacturing method |
| JP2005262598A (en) * | 2004-03-18 | 2005-09-29 | Asahi Kasei Corp | Laminate and its production method |
-
2006
- 2006-02-24 JP JP2006049029A patent/JP4628971B2/en not_active Expired - Fee Related
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