JP2010103269A5 - - Google Patents

Claims (9)

A film forming step of forming a thermoplastic liquid crystal polymer film by extruding a thermoplastic liquid crystal polymer that forms an optically anisotropic melt phase;
By subjecting at least one surface of the thermoplastic liquid crystal polymer film to physical polishing or ultraviolet irradiation, the film surface has a hardness of 0.01 to 0.1 GPa measured by a nanoindentation method. Softening step to form an adhesive surface,
The adhesive surface is opposed to the circuit forming surface of the substrate on which the conductor circuit is formed on at least one surface of the thermoplastic liquid crystal polymer film forming the optically anisotropic molten phase, and the whole is bonded by thermocompression bonding. Crimping process;
A method for manufacturing a multilayer circuit board comprising: 2. The method of manufacturing a multilayer circuit board according to claim 1, wherein in the softening step, (i) a thickness of 0.01 to 1 [mu] m is removed from the film surface by physical polishing to form an adhesive surface , or (ii) 185 nm And a method of forming an adhesive surface by simultaneously irradiating ultraviolet rays having a wavelength of 254 nm . 3. The method of manufacturing a multilayer circuit board according to claim 1, wherein the thermocompression bonding temperature is at least 15 ° C. lower than the melting point (Ta: ° C.) of the thermoplastic liquid crystal polymer forming the adhesive polymer layer. The temperature is selected from the range of 15 ° C. or higher than (Ta), and the thermocompression bonding temperature is 20 ° C. or more lower than the melting point (Tb: ° C.) of the thermoplastic liquid crystal polymer forming the substrate layer. And the manufacturing method which satisfies the range below 10 degreeC temperature higher than this melting | fusing point (Tb).   In the manufacturing method of the multilayer circuit board as described in any one of Claims 1-3, melting | fusing point (Ta: degreeC) of the thermoplastic liquid crystal polymer which forms an adhesive film layer, and melting | fusing point of the thermoplastic liquid crystal polymer which forms a board | substrate layer (Tb: ° C)
    Ta ≦ Tb + 5
Manufacturing method that satisfies. A substrate layer having a conductor circuit formed on at least one surface of a thermoplastic liquid crystal polymer film forming an optically anisotropic molten phase;
An adhesive film layer that is thermocompression-bonded with the adhesive surface facing the circuit forming surface of the substrate layer;
A multilayer circuit board comprising at least
The adhesive film layer is a thermoplastic liquid crystal polymer film forming an optically anisotropic melt phase, and the adhesive surface of the adhesive film layer has a hardness of 0.01 to 0 measured by a nanoindentation method. A multilayer circuit board having 1 GPa.   6. The multilayer circuit board according to claim 5, wherein an adhesive surface of the adhesive film layer is formed by physical polishing or ultraviolet irradiation.   The multilayer circuit board according to claim 5 or 6, wherein the adhesive film layer has a thickness of 10 to 100 µm.   The multilayer circuit board according to any one of claims 5 to 7, wherein the adhesive film layer is at least one selected from the group consisting of a coverlay film and a bonding film. The multilayer circuit board according to any one of claims 5 to 8, wherein the thermoplastic liquid crystal polymer forming the adhesive film layer has a melting point (Ta: ° C) and the thermoplastic liquid crystal polymer forming the substrate layer (Tb: ° C) Ta ≦ Tb + 5
Multilayer circuit board that meets.