TWI491324B - Flexible substrate, display apparatus using the same and manufacturing method thereof - Google Patents

Description

Flexible substrate, display device therewith and method of manufacturing same

The present invention relates to a flexible substrate and a display device therewith, and more particularly to a flexible substrate capable of adjusting adhesion between a flexible substrate and a glass carrier, a display device therewith, and a method of manufacturing the same.

Conventional display devices often use a glass substrate as a material. However, the glass substrate is fragile and not flexible. Therefore, the display device made of a glass substrate has poor tolerance to external stress and cannot be used for development of a flexible display device. In contrast, flexible substrates have flexibility and better strength and toughness, and are lighter and thinner than glass substrates. In the market, display devices made using a flexible substrate instead of a glass substrate have become a trend.

Since the rigidity and mechanical strength of the flexible substrate itself are inferior to those of the glass substrate, it is often necessary to use a hard substrate or a glass substrate as a carrier when manufacturing a flexible substrate, as a supporting structure in the manufacturing process of the flexible substrate, after the soft substrate is formed, The flexible substrate is separated from the glass carrier to remove the flexible substrate, and the glass carrier is recycled. Therefore, the adhesion between the flexible substrate and the glass carrier affects the manufacturing quality and productivity of the flexible substrate, and the ease of recovery of the glass carrier.

If the adhesion between the flexible substrate and the glass carrier is too strong, it is not easy to remove the soft substrate that is desired to be used flat, and the soft substrate remaining on the glass carrier also affects the recycling of the hard substrate. If the adhesion between the soft and hard substrate and the glass carrier is too weak, the flexible substrate may fall off during the manufacturing process, resulting in failure of the manufacture of the flexible substrate.

The present invention relates to a flexible substrate and a display device therewith. The adhesion between the flexible substrate and the glass carrier is adjusted by the special first polymer layer to improve the manufacturing quality and yield of the flexible substrate.

According to a first aspect of the present invention, a flexible substrate comprising a first polymer layer and a second polymer layer is provided. The first polymer layer comprises at least one of polyamic acid (PAA), polyamidamine, an epoxy compound and a photoresist material, and the first polymer layer is formed on a glass carrier. The second polymer layer is formed on the first polymer layer, and the second polymer layer includes at least one of a polymethyleneamine and a transparent polymer film.

According to a second aspect of the present invention, a display device includes a first substrate, a second substrate, a display medium layer, and a driving circuit. The first substrate includes a first polymer layer and a second polymer layer. The first polymer layer comprises at least one of a polyamic acid, a polyamidamine, an epoxy compound and a photoresist material, and the first polymer layer is formed on a glass carrier. The second polymer layer is formed on the first polymer layer, and the second polymer layer includes at least one of a polymethyleneamine and a transparent polymer film. The second substrate is disposed opposite to the first substrate. The display medium layer is disposed between the first substrate and the second substrate. The driving circuit is disposed between the first substrate and the second substrate for driving the display medium layer.

According to a third aspect of the invention, a method of manufacturing a display device is presented. The method includes the following steps. Providing a first substrate, comprising forming a first polymer layer on a glass carrier, the first polymer layer comprising at least one of polyamic acid, polyamidamine, epoxy compound and photoresist material, and The adhesion of a polymer layer to a glass carrier can be adjusted. Forming a second polymer layer on the first polymer layer, and the second polymer layer comprises at least one of a polymethyleneamine and a transparent polymer film. The first substrate is stripped from the glass carrier. A second substrate is provided. Forming a display dielectric layer between the first substrate and the second substrate. A driving circuit is formed between the first substrate and the second substrate to drive the display medium layer.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

First embodiment

1A to 1G are views showing a manufacturing flow chart of the flexible substrate 10 according to the first embodiment of the present invention. Please refer to FIG. 1A to provide a glass carrier 100. Applying a third polymer material (not shown) to the glass carrier 100 by brushing or spin coating, and heating at a temperature of 110 degrees C to 120 degrees C to form a third polymer layer 120. On the glass carrier 100. The third polymer layer 120 is, for example, a composite material having at least one of polyoxyalkylene, polyamic acid, polytetrafluoroethylene, and polyamidene, and the material of the third polymer layer 120 and The adhesion of the glass carrier 100 is not good, so that a release surface is formed between the third polymer layer 120 and the glass carrier 100. Referring to FIG. 1B, the third polymer layer 120 is subjected to an exposure and development patterning process using a mask M. The patterned third polymer layer 120' is as shown in Fig. 1C.

Referring to FIG. 1D, a first polymer material (not shown) is applied to the patterned third polymer layer 120' and a portion of the glass carrier 100 by brushing or spin coating. Heating is performed at a temperature of 80 degrees C to 450 degrees C to form the first polymer layer 140 on the patterned third polymer layer 120' and a portion of the glass carrier 100. Next, as shown in FIG. 1E, a second polymer material (not shown) is applied to the first polymer layer 140 by brushing or spin coating, and then at a temperature of 150 degrees C to 450 degrees C. Heating is performed to form the second polymer layer 160. The second polymer layer 160 includes at least one of polyamine, a polymer film, or other plastic material having transparent properties.

In this embodiment, the first polymer material includes, for example, a polyimide (PI) polymer material such as polyacrylic acid (PAA), an epoxy compound, and a photoresist material. At least one of the polymer materials. The first polymer material is prepared by dissolving poly-proline and a specific proportion of epoxy compound in N-methyl-2-pyrrolidone (NMP), dimethyl Dimethylformamide (DMF), Dimethyl acetamide (DMAC) or Tetrahydrofuran (THF) solvent. The epoxy compound is, for example, an epoxy resin, and the specific addition ratio of the epoxy compound is, for example, 0.1% to 10% by weight of the epoxy compound, and is added to the polyamine in a weight percentage of 99.9% to 90%. . After being heated and baked at a temperature of 80 ° C to 450 ° C, the epoxy compound of the first polymer material undergoes a ring-opening reaction and is grafted with a polyamine acid amino acid (Amic Acid) group to form A crosslinked structure of an epoxy compound and polyamic acid.

In this embodiment, the crosslinked structure of the epoxy compound and the polyamic acid in the first polymer layer 140 can be closely combined with the second polymer layer 160. Further, the more the crosslinked structure of the epoxy compound and the poly-proline, the adhesion between the first polymer layer 140 and the glass carrier 100, and the adhesion between the first polymer layer 140 and the second polymer layer 160. The stronger, the higher the degree of resistance (bridging) of the first polymer layer 140. For example, the adhesion between the first polymer layer 140 having an epoxy compound having a weight percentage of 0.1% to 10% and the glass carrier 100 is 0B in the adhesion test specification (ASTM-D3359). 4B. For example, in the Adhesion Test Specification (ASTM-D3359), when the adhesion level of the second substrate of the test area to the first substrate is 0B, it means that there are more than 65% of the second in the test area. The substrate will peel off, ie grade 0B is only weakly adhered, not completely non-adhesive. When the adhesion level of the second substrate of the test area to the first substrate is 4B, it means that less than 5% of the second substrate in the test area will peel off, that is, only the adhesion is relatively strong. When the adhesion level is 5B, it means that the second substrate of the test zone does not peel off at all. Therefore, the weight percentage of the epoxy compound in the first polymer layer 140 can be adjusted as required for the adhesion requirements in the process, so that the grade in the adhesion test specification (ASTM-D3359) is 0B to 4B, The first polymer layer 140 having an adhesion rating of 0B is used as needed for the process.

Referring to FIG. 1F, the second polymer layer 160, the first polymer layer 140, and the patterned third polymer layer 120' are cut by laser, wheel cutter or die cutting to form a second polymer. The layer 160a, the first polymer layer 140a, and the patterned third polymer layer 120'a. It should be noted that the cutting position S1 and the cutting position S2 substantially correspond to the boundary of the patterned third polymer layer 120, and the surface area of the patterned third polymer layer 120'a after cutting is smaller than the patterning. The surface area of the third polymer layer 120'. Next, as shown in FIG. 1G, the third polymer layer 120 and the glass carrier 100 are released from each other to form the flexible substrate 10. The flexible substrate 10 of this embodiment includes a three-layer structure of the second polymer layer 160a, the first polymer layer 140a, and the patterned third polymer layer 120'a.

In this embodiment, the adhesion between the first polymer layer 140 and the glass carrier 100 and the chemical resistance of the first polymer layer 140 can be adjusted by changing the weight ratio of the polyamic acid and the epoxy compound. The first polymer layer 140 is disposed between the material of the second polymer layer 160 and the glass carrier 100, and the adhesion between the first polymer layer 140 and the glass carrier 100 can be adjusted to make the second polymer The selectivity of the material of layer 160 is increased. That is, regardless of the adhesion between the material of the second polymer layer 160 and the glass carrier 100, the adhesion between the material of the second polymer layer 160 and the glass carrier 100 is too strong, or the second highest The material of the molecular layer 160 may corrode or destroy the material of the third polymer layer 120, and the material selection rate of the second polymer layer 160 is up to 90%, and the second polymer layer 160 may also be selected. There are many types of materials.

Second embodiment

2A to 2D are views showing a manufacturing flow chart of the flexible substrate 20 according to the second embodiment of the present invention. Please refer to FIG. 2A to provide a glass carrier 200. A patterned third polymer layer 220 is formed on the glass carrier 200. The adhesion of the material of the patterned third polymer layer 220 to the glass carrier 200 is such that a patterned release surface is formed between the patterned third polymer layer 220 and the glass carrier 200. The first polymer layer 240 is formed on the patterned third polymer layer 220 and a portion of the glass carrier 200. The materials and formation methods of the first polymer layer 240 and the patterned third polymer layer 220 may be the same as those of the first embodiment, and will not be described herein.

Next, as shown in FIG. 2B, the second polymer layer 260 is formed on the first polymer layer 240. The second polymer layer 260 includes a glue 262 and a second polymer material 264. The second polymer material 264 can be attached to the first polymer layer 240 by transfer using a glue 262. Since the characteristics of the rubber 262 are small, the selectivity can be improved. In one embodiment, the glue 262 is resistant to high temperatures to improve the high temperature resistance of the subsequent component process. The second polymer material 264 includes at least one of polyimide (PI), a polymer film, and other plastic materials having transparent properties.

Referring to FIGS. 2C to 2D, the second polymer layer 260, the first polymer layer 240, and the patterned third polymer layer 220 are cut by laser, wheel cutter or die cutting. The cutting position N1 and the cutting position N2 substantially correspond to the boundary of the patterned third polymer layer 220, and the surface area of the patterned third polymer layer 220a after cutting is smaller than the patterned third polymer layer 220 before cutting. Surface area. Next, the patterned third polymer layer 220 and the glass carrier 200 are released to form a flexible substrate 20. As shown in FIG. 2D, the flexible substrate 20 includes a three-layer structure of the second polymer layer 260a, the first polymer layer 240a, and the patterned third polymer layer 220a, and the flexible substrate 20 is resistant to high temperatures.

Third embodiment

3A to 3C are views showing a manufacturing flow chart of the flexible substrate 30 according to the third embodiment of the present invention. The material of the glass carrier 300, the first polymer layer 340, and the second polymer layer 360 of this embodiment, and the glass carrier 100, the first polymer layer 140, and the second polymer layer 160 of the first embodiment. The same, no longer repeat here. As shown in FIG. 3A, a glass carrier 300 is provided, and the first polymer material (not shown) is coated on the glass carrier 300 by brushing or spin coating, and then at 80 degrees C to 450 degrees. The temperature of C is heated to form a first polymer layer 340 on the glass carrier 300.

Next, as shown in FIG. 3B, a second polymer material (not shown) is coated on the first polymer layer 340 by brushing or spin coating, and then 150 degrees C to 450 degrees C. The temperature is heated to form the second polymer layer 360. Finally, the first polymer layer 340 and the glass carrier 300 are separated from each other to form a flexible substrate 30 as shown in FIG. 3C. The flexible substrate 30 of this embodiment includes a two-layer structure of the second polymer layer 360 and the first polymer layer 340.

The adhesion between the first polymer layer 340 and the glass carrier 300 and the resistance of the first polymer layer 340 can be adjusted by changing the weight ratio of the polyamic acid and the epoxy compound in the material of the first polymer layer 340. Chemical. In this embodiment, an epoxy compound having a weight percentage of 0.1% to 10% may be selected as a material component of the first polymer layer 340 according to the process requirements, such that the first polymer layer 340 and the glass carrier 300 are disposed. The adhesion rating is 0B to 4B (adhesion test specification ASTM-D3359), and the first polymer layer 340 having an adhesion rating of 0B can also be used.

Preferably, an epoxy compound having a weight percentage of 0.1% to 6% may be added to form the first polymer layer 340. At this time, the adhesion between the first polymer layer 340 and the glass carrier 300 is 1B~ 2B. In the process of the thin film transistor substrate and the liquid crystal display device, when the adhesion between the first polymer layer 340 and the glass carrier 300 is 1B, the first polymer layer 340 can be prevented from being detached from the glass carrier 300 during the process. When the adhesion between the first polymer layer 340 and the glass carrier 300 is 2B, the first polymer layer 340 and the glass carrier 300 can be separated from the existing machine after the process of FIG. 3B is completed.

Since the adhesion between the first polymer layer 340 and the glass carrier 300 can be adjusted, the material of the second polymer layer 360 having poor adhesion to the glass carrier 300 and the adhesion to the glass carrier 300 are too strong. The material of the second polymer layer 360 can be appropriately adhered to the glass carrier 300 by the first polymer layer 340 to improve the selectivity of the material of the second polymer layer 360, thereby effectively reducing the production cost. And speed up development.

Fourth embodiment

4A to 4E are views showing a manufacturing flow chart of the flexible substrate 40 according to the fourth embodiment of the present invention. As shown in FIG. 4A, a glass carrier 400 is provided, the second region II of the glass carrier 400 is shielded by a mask M, and the first region I not covered by the mask M is irradiated with ultraviolet light, and the ultraviolet light is irradiated. The wavelength range is, for example, short-wavelength ultraviolet light of 172 to 258 nanometers (nm). Referring to Fig. 4B, after the ultraviolet light irradiation, the hydrogen bond system of the first region I of the glass carrier 400' is lowered. At this time, the degree of wetting of the first region I of the glass carrier 400' is higher than that of the second region II.

Next, as shown in Fig. 4C, the first polymer layer 440 is formed on the glass carrier 400', and the second polymer layer 460 is formed on the first polymer layer 440. The materials and formation methods of the first polymer layer 440 and the second polymer layer 460 are the same as those of the first and second embodiments, and will not be described herein. Please refer to FIG. 4D. FIG. 4D is a cross-sectional view showing the structure of FIG. 4C taken along the line X-X. As shown in FIG. 4D, the second polymer layer 460 and the first polymer layer 440 are cut by laser, wheel cutter or die cutting, and the cutting position T1 and the cutting position T2 are substantially located in the second polymer layer. 460 and the first polymer layer 440 correspond to the second region II of the glass carrier 400' and correspond to the boundary between the first region I and the second region II of the glass carrier 400'.

In this embodiment, since the degree of wetting of the first region I of the glass carrier 400' is higher than the degree of wetting of the second region II, the adhesion of the first polymer layer 440 to the first region I is greater than the first height. Adhesion of molecular layer 440 to second region II. Therefore, the first polymer layer 440a and the glass carrier 400' can be separated from the cutting position T1 and the cutting position T2 to form the flexible substrate 40 as shown in FIG. 4E. The flexible substrate 40 includes the first polymer layer 440a and The two-layer structure of the second polymer layer 460a. The surface area of the flexible substrate 40 is substantially smaller than the surface area of the second region II of the glass carrier 400'.

Fifth embodiment

5A to 5D are views showing a manufacturing flow chart of the flexible substrate 50 according to the fifth embodiment of the present invention. As shown in Fig. 5A, a glass carrier 500 treated with ultraviolet light is provided, and the wavelength range of the ultraviolet light is, for example, 172 to 258 nanometers (nm) of short-wavelength ultraviolet light. The hydrogen bonding system of the first region I of the glass carrier 500 after the ultraviolet light irradiation is lowered, so that the degree of wetting of the first region I after ultraviolet light irradiation is higher than that of the second region II not irradiated with ultraviolet light. Next, the third polymer layer 520 is sequentially formed on the glass carrier 500, and the first polymer layer 540 is formed on the third polymer layer 520. The third polymer layer 520 is, for example, a surface-treated release material, such as a polyoxyalkylene material, a polyamic acid, a fluorine-based polymer material (such as polytetrafluoroethylene), or a polyamidene. material.

Referring to FIGS. 5B-5C, a second polymer layer 560 is provided. The second polymer layer 560 includes a glue 562 and a second polymer material 564, and the second polymer layer 560 is formed by transfer. On the polymer layer 540. The first polymer layer 540 and the second polymer material 564 are formed in the same manner as the first polymer layer 440 and the second polymer layer 460 corresponding to the fourth embodiment, and will not be described again. The materials of the first polymer layer 540 and the second polymer material 564 are the same as those of the first polymer layer 240 and the second polymer layer 260 corresponding to the second embodiment, and will not be described herein.

Referring to FIG. 5C, the second polymer layer 560 and the first polymer layer 540 are cut by laser, wheel cutter or die cutting, and the cutting position P1 and the cutting position P2 are substantially located in the second polymer layer. 560 and the first polymer layer 540 correspond to the second region II of the glass carrier 500 and correspond to the boundary between the first region I and the second region II of the glass carrier 500.

In this embodiment, since the degree of wetting of the first region I of the glass carrier 500 is higher than that of the second region II, the adhesion of the third polymer layer 520 to the first region I is greater than that of the third polymer. The adhesion of layer 520 to second region II. Therefore, the third polymer layer 520 and the glass carrier 500 can be separated from the cutting position P1 and the cutting position P2 to form the flexible substrate 50 as shown in FIG. 5D, and the flexible substrate 50 includes the third polymer layer 520a, A three-layer structure of a polymer layer 540a and a second polymer layer 560a. The surface area of the flexible substrate 50 is substantially smaller than the surface area of the second region II of the glass carrier 500.

Sixth embodiment

6A to 6D are views showing a manufacturing flow chart of the flexible substrate 60 according to the sixth embodiment of the present invention. As shown in FIG. 6A, a patterned third polymer layer 620 is formed on the glass carrier 600. Referring to FIG. 6B, a first polymer layer 640 is formed on the patterned third polymer layer 620 and a portion of the glass carrier 600. As shown in FIG. 6C, a second polymer layer 660 is formed on the first polymer layer 640, and the second polymer layer 660 and the first polymer layer 640 are cut. The cutting position V1 and the cutting position V2 are substantially Corresponding to the boundary of the patterned third polymer layer 620, the surface areas of the first polymer layer 640a and the second polymer layer 660a after dicing are smaller than the surface area of the patterned third polymer layer 620.

In this embodiment, the materials and forming methods of the first polymer layer 640 and the second polymer layer 660 are the same as those in the first embodiment, and details are not described herein again. It should be noted that the patterned third polymer layer 620 of this embodiment is, for example, a surface-treated release material, such as a polyoxyalkylene material, a polyamic acid, or a fluorine-based polymer material. Materials such as polytetrafluoroethylene or polyamidamine. The polyoxyalkylene material is a polymer derived from a skeleton of a ruthenium oxygen bond. The common property of the polyoxyalkylene material and the fluorine-based polymer material is that the material is extremely inert, so the surface properties are not easily adhered. The adhesion between the patterned third polymer layer 620 and the first polymer layer 640a is not good, so that a release surface is formed between the patterned third polymer layer 620 and the first polymer layer 640a. Next, the third polymer layer 620 and the first polymer layer 640a are patterned and formed into a flexible substrate 60 as shown in FIG. 6D. The flexible substrate 60 includes a first polymer layer 640a and a second polymer layer 660a.

Seventh embodiment

7A to 7D are views showing a manufacturing flow chart of the flexible substrate 70 according to the seventh embodiment of the present invention. As shown in FIG. 7A, a patterned third polymer layer 720 is formed on the glass carrier 700. The patterned third polymer layer 720 is patterned to form regions A and B having different viscosities. Referring to FIG. 7B, a buffer layer 740 is formed on the patterned third polymer layer 720. The buffer layer 740 is composed of, for example, a buffer material 742 and a buffer material 744. The buffer material 742 and the buffer material 744 are, for example, polyamines, general photoresist materials, Acrylic materials, Silicon type materials or Organic polymer materials.

Referring to FIGS. 7B-7C, a second polymer layer 760 is provided. The second polymer layer 760 includes a glue material 762 and a second polymer material 764. The second polymer material 764 can be attached to the buffer layer 740 by transfer by the glue 762. Since the characteristics of the rubber 762 are small, the selectivity can be improved. The buffer layer 740 can insulate the glue 762 from the patterned third polymer layer 720 to avoid damaging the release ability of the patterned third polymer layer 720.

Next, referring to FIG. 7C, the second polymer layer 760 and the buffer layer 740 are cut, and the cutting position U1 and the cutting position U2 substantially correspond to the boundary of the patterned third polymer layer 720. The surface area of the buffer layer 740a (shown in FIG. 7D) and the second polymer layer 760a (shown in FIG. 7D) after cutting is smaller than the surface area of the patterned third polymer layer 720.

In this embodiment, the material and the forming method of the second polymer layer 760 are the same as those in the sixth embodiment, and details are not described herein again. The patterned third polymer layer 720 is, for example, a surface-treated release material, including polyoxyalkylene, polyamic acid, fluorine-based polymer material (for example, polytetrafluoroethylene) or polytheneamine. material. The polyoxyalkylene material is a polymer derived from a skeleton of a ruthenium oxygen bond. The common property of the polyoxyalkylene material and the fluorine-based polymer material is that the material is extremely inert, so the surface properties are not easily adhered. The adhesion between the patterned third polymer layer 720 and the buffer layer 740a is not good, so that a release surface is formed between the patterned third polymer layer 720 and the buffer layer 740a. Next, the third polymer layer 720 and the buffer layer 740a are patterned and patterned to form a flexible substrate 70 as shown in FIG. 7D. The flexible substrate 70 includes a buffer layer 740a and a second polymer layer 760a.

Applying the above embodiments to different types of display devices

The flexible substrate manufactured by the method of the above embodiment can be applied to different kinds of display devices, such as an organic light emitting diode (OLED), a liquid crystal display device (LCD), and an electronic paper (E-Paper) display device. Identical, the following will describe the aspects of these different display devices.

Please refer to FIG. 8 , which is a schematic structural diagram of an organic light emitting diode (OLED) display device 8 according to an embodiment of the invention. As shown in FIG. 8, the organic light emitting diode display device 8 includes an upper substrate 800, and a lower substrate 810 is disposed opposite to the upper substrate 800. A driving circuit 80 is disposed between the upper substrate 800 and the lower substrate 810. The driving circuit 80 includes a first conductive layer 820 disposed on the upper substrate 800, and a second conductive layer 830 disposed on the lower substrate 810. A display dielectric layer 850 is interposed between the first conductive layer 820 and the second conductive layer 830. The display medium layer 850 of this embodiment includes a plurality of organic light emitting diodes. It should be noted that the upper substrate 800 or the lower substrate 810 can be fabricated using any of the above embodiments.

Please refer to FIG. 9 , which is a schematic structural diagram of a liquid crystal display device (LCD) 9 according to an embodiment of the invention. As shown in FIG. 9, the liquid crystal display device 9 includes an upper substrate 900 and a lower substrate 910 opposite to the upper substrate. A driving circuit 90 is disposed between the upper substrate 900 and the lower substrate 910. The driving circuit 90 includes a first conductive layer 920 disposed on the upper substrate 900, and a second conductive layer 930 disposed on the lower substrate 910. A display dielectric layer 950 is interposed between the first conductive layer 920 and the second conductive layer 930. The display dielectric layer 950 of this embodiment includes a plurality of liquid crystal cells. It should be noted that the upper substrate 900 or the lower substrate 910 can be made using any of the above embodiments.

Please refer to FIG. 10, which is a schematic structural diagram of an electronic paper (E-Paper) display device 12 according to an embodiment of the invention. As shown in FIG. 10, the electronic paper display device 12 includes an upper substrate 1000 and a lower substrate 1010 opposite to the upper substrate. A driving circuit 110 is disposed between the upper substrate 1000 and the lower substrate 1010. The driving circuit 110 includes a first conductive layer 1020 disposed on the upper substrate 1000, and a second conductive layer 1030 disposed on the lower substrate 1010. A display dielectric layer 1050 is interposed between the first conductive layer 1020 and the second conductive layer 1030. The display medium layer 1050 of this embodiment includes, for example, a plurality of electronic inks that display particles. It is to be noted that the upper substrate 1000 or the lower substrate 1010 can be made using any of the above embodiments.

In summary, the above embodiment of the present invention can improve the adhesion between the first polymer layer and the glass carrier by changing the weight ratio of the polyamic acid and the epoxy compound in the material of the first polymer layer. The selectivity of the material of the second polymer layer. The method for manufacturing a flexible substrate according to the above embodiment of the present invention not only provides an appropriate adhesion between the edge of the flexible substrate and the glass carrier, so that the process of the flexible substrate does not fall off the glass carrier, and after the flexible substrate is manufactured, The boundary of the flexible substrate can be defined by laser cutting, etc., and the flexible substrate and the glass carrier can be easily and completely removed by using the current machine, which can reduce the production cost and speed up the development, and facilitate the recovery of the carrier. Utilize and provide better process yield and quality of the flexible substrate.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

8~12. . . Display device

10, 20, 30, 40, 50, 60, 70. . . Flexible substrate

80, 90, 110. . . Drive circuit

100, 200, 300, 400, 400', 500, 600, 700. . . Glass carrier

120, 120', 120'a, 420, 420a, 520, 520a, 620, 620a, 720, 720a. . . Third polymer layer

140, 140a, 240, 340, 340a, 440, 440a, 540, 540a, 640, 640a. . . First polymer layer

160, 160a, 260, 360, 360a, 460, 460a, 560, 560a, 660, 660a, 760, 760a. . . Second polymer layer

260, 560, 760. . . Second polymer material

262, 562, 762. . . Plastic material

800, 810, 900, 910, 1000, 1010. . . Substrate

820, 830, 920, 930, 1020, 1030. . . Conductive layer

850, 950, 1050. . . Display media layer

262, 562, 762, 262a, 562a, 762a. . . Plastic material

264, 564, 764, 264a, 564a, 764a. . . Second polymer material

742, 744, 742a, 744a. . . Cushioning material

740, 740a. . . The buffer layer

I, II. . . region

M. . . Mask

S1, S2, T1, T2, V1, V2. . . Cutting position

X-X. . . Tangent

1A to 1G are views showing a manufacturing flow chart of a flexible substrate according to a first embodiment of the present invention.

2A to 2D are views showing a manufacturing flow chart of a flexible substrate according to a second embodiment of the present invention.

3A to 3C are views showing a manufacturing flow chart of a flexible substrate in accordance with a third embodiment of the present invention.

4A to 4E are views showing a manufacturing flow chart of a flexible substrate in accordance with a fourth embodiment of the present invention.

5A to 5D are views showing a manufacturing flow chart of a flexible substrate according to a fifth embodiment of the present invention.

6A to 6D are views showing a manufacturing flow chart of a flexible substrate according to a sixth embodiment of the present invention.

7A to 7D are views showing a manufacturing flow chart of a flexible substrate according to a seventh embodiment of the present invention.

Fig. 8 is a schematic view showing an organic light emitting diode display device of the embodiment.

Figure 9 is a schematic view showing a liquid crystal display device in accordance with an embodiment of the present invention.

Figure 10 is a schematic view showing an electronic paper display device in accordance with an embodiment of the present invention.

10. . . Flexible substrate

120’a. . . Third polymer layer

140a. . . First polymer layer

160a. . . Second polymer layer

Claims (18)

A flexible substrate comprising: a first polymer layer comprising at least one of a polyamic acid (PAA), a polyamidamine, an epoxy compound and a photoresist material, the first a polymer layer is formed on a glass carrier, wherein the first polymer layer and the glass carrier have an adhesion force, the adhesion level is 0B to 4B, and the first polymer layer and the glass The adhesion between the carrier plates is adjusted by the weight ratio of the epoxy compound added to the polyaminic acid; and a second polymer layer is formed on the first polymer layer, the second polymer The layer comprises at least one of a polymethyleneamine (PI) and a transparent polymer film. The flexible substrate according to claim 1, wherein the weight ratio of the epoxy compound to the polyamic acid is from 0.1% to 10% by weight. The flexible substrate of claim 1, further comprising a third polymer layer attached between the first polymer layer and the glass carrier, the third polymer layer comprising a polyoxyl At least one of an alkane, a polytetrafluoroethylene, the polyamidamine, and the polyamic acid. The flexible substrate according to claim 3, wherein the third polymer layer has a surface area smaller than a surface area of the first polymer layer. The flexible substrate of claim 1, further comprising a color filter or a thin film transistor disposed on the surface of the first polymer layer. A display device comprising: a first substrate, the first substrate comprises: a first polymer layer formed on a glass carrier, the first polymer layer comprising a poly-proline, a polyamine, an epoxy compound and At least one of a photoresist material; and a second polymer layer formed on the first polymer layer, the second polymer layer comprising at least one of the polyamidamine and a transparent polymer film, a gel And a second polymer material disposed between the second polymer material and the first polymer layer, the glue material for bonding the first polymer layer and the second polymer material a second substrate disposed opposite the first substrate; a display dielectric layer disposed between the first substrate and the second substrate; and a driving circuit disposed on the first substrate and the second substrate Between, to drive the display medium layer. The display device of claim 6, wherein the first substrate is a flexible substrate, and the second substrate is substantially identical to the first substrate. The display device according to claim 6, wherein the weight ratio of the epoxy compound to the polyamic acid is from 0.1% to 10% by weight. The display device according to claim 6, wherein the first polymer layer and the glass carrier have an adhesion force, and the adhesion level is 0B to 4B. The display device of claim 6, wherein the display medium layer comprises an organic light emitting diode, a liquid crystal, and an electronic ink. At least one of the three. A method for manufacturing a display device, comprising: providing a first substrate, comprising: forming a first polymer layer on a glass carrier, the first polymer layer comprising a poly-proline, a polyammonium, At least one of an epoxy compound and a photoresist material, and adhesion of the first polymer layer to the glass carrier is adjustable; forming a second polymer layer on the first polymer layer, the first The second polymer layer comprises at least one of the polyamidamine and a transparent polymer film; and the first substrate is stripped from the glass carrier; a second substrate is provided; and a display dielectric layer is formed on the first substrate And a driving circuit between the first substrate and the second substrate to drive the display medium layer. The method of claim 11, wherein the step of forming the first polymer layer on the glass carrier comprises: coating a first polymer material on the glass carrier, the first polymer The material comprises at least one of the polyamic acid, the polyamidamine, the epoxy compound and the photoresist; and heating the first polymer material at a temperature of 80 degrees C to 450 degrees C to form the first high The molecular layer is on the glass carrier. The method of claim 12, wherein the step of forming the second polymer layer on the first polymer layer comprises: Coating a second polymer material on the glass carrier, the second polymer material comprising at least one of the polyamidamine and the transparent polymer film; heating the second at a temperature of 150 degrees C to 450 degrees C a polymer material to form the second polymer layer on the first polymer layer. The method of claim 12, wherein before the step of coating the first polymer material on the glass carrier, the method further comprises: 0.1% by weight of the epoxy compound and 10% by weight The polyamic acid is used to produce the first polymer material. The method of claim 12, wherein before the step of forming the first polymer layer on the glass carrier, the method further comprises: forming a third polymer layer on the glass carrier, the first The three polymer layers include at least one of a polyoxyalkylene oxide, a polytetrafluoroethylene, the polyamidamine, and the polyamic acid. The method of claim 12, wherein before the forming the first polymer layer on the glass carrier, the method further comprises: irradiating a region of the glass carrier with an ultraviolet light to make the first polymer The layer has a first adhesion between the layer and the region of the glass carrier, and the first polymer layer and the other region of the glass carrier have a second adhesion, the first adhesion is greater than the Second adhesion. The method of claim 16, wherein the ultraviolet light has a wavelength ranging from 172 nm to 258 nm. The method of claim 11, wherein the step of stripping the first substrate from the glass carrier comprises: cutting the first substrate, the first substrate after the cutting is divided into a first a region and a second region, the first region having a third adhesion to the glass substrate, the second region having a fourth adhesion to the glass substrate, the third adhesion being greater than the fourth adhesion And stripping the second region of the first substrate from the glass carrier.