TW200713521A - Method of fabricating flexible thin film transistor array substrate - Google Patents

Method of fabricating flexible thin film transistor array substrate

Info

Publication number
TW200713521A
TW200713521A TW094132258A TW94132258A TW200713521A TW 200713521 A TW200713521 A TW 200713521A TW 094132258 A TW094132258 A TW 094132258A TW 94132258 A TW94132258 A TW 94132258A TW 200713521 A TW200713521 A TW 200713521A
Authority
TW
Taiwan
Prior art keywords
thin film
film transistor
transistor array
polymer material
flexible thin
Prior art date
Application number
TW094132258A
Other languages
Chinese (zh)
Other versions
TWI265606B (en
Inventor
Te-Chi Wong
Jian-Shu Wu
Horng-Long Tyan
Chy-Min Leu
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094132258A priority Critical patent/TWI265606B/en
Priority to US11/306,564 priority patent/US7279401B2/en
Application granted granted Critical
Publication of TWI265606B publication Critical patent/TWI265606B/en
Publication of TW200713521A publication Critical patent/TW200713521A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Formation Of Insulating Films (AREA)
  • Thin Film Transistor (AREA)

Abstract

A method of fabricating a flexible thin film transistor array substrate is provided. A hard substrate is first provided. A polymer material layer is coated on the hard substrate. An insulating layer is coated over the polymer material layer by spin coating process, wherein the insulating layer covers side surfaces of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array thereon is separated from the hard substrate. The method of the present invention can resolve the problem of hardly separating the flexible thin film transistor array substrate from a glass substrate in the prior art. The problem caused from the conventional polymer material has poor acid, basic or organic solvent resistance can also be avoided.
TW094132258A 2005-09-19 2005-09-19 Method of fabricating flexible thin film transistor array substrate TWI265606B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094132258A TWI265606B (en) 2005-09-19 2005-09-19 Method of fabricating flexible thin film transistor array substrate
US11/306,564 US7279401B2 (en) 2005-09-19 2006-01-03 Fabricating method for flexible thin film transistor array substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094132258A TWI265606B (en) 2005-09-19 2005-09-19 Method of fabricating flexible thin film transistor array substrate

Publications (2)

Publication Number Publication Date
TWI265606B TWI265606B (en) 2006-11-01
TW200713521A true TW200713521A (en) 2007-04-01

Family

ID=37884713

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132258A TWI265606B (en) 2005-09-19 2005-09-19 Method of fabricating flexible thin film transistor array substrate

Country Status (2)

Country Link
US (1) US7279401B2 (en)
TW (1) TWI265606B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137629A (en) * 2011-11-25 2013-06-05 群康科技(深圳)有限公司 Soft base plate, display device with soft base plate and manufacturing method of soft base plate and display device with soft base plate
CN103855324A (en) * 2012-11-29 2014-06-11 财团法人工业技术研究院 Method for taking out flexible element and method for separating substrates
TWI491324B (en) * 2011-11-25 2015-07-01 群康科技(深圳)有限公司 Flexible substrate, display apparatus using the same and manufacturing method thereof
US9096044B2 (en) 2010-06-24 2015-08-04 Au Optronics Corporation Flexible display panel and method of fabricating the same
TWI773091B (en) * 2020-02-12 2022-08-01 瑞士商尼瓦克斯 法爾公司 Method for manufacturing a one-piece silicon device with flexible blades, in particular for timepieces

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI276191B (en) * 2005-08-30 2007-03-11 Ind Tech Res Inst Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
KR101572814B1 (en) * 2008-12-05 2015-12-01 코닌클리케 필립스 엔.브이. Electronic devices having plastic substrates
TWI505410B (en) * 2008-12-30 2015-10-21 Ind Tech Res Inst Substrate structures applied in flexible electrical devices and fabrication method thereof
TWI419091B (en) * 2009-02-10 2013-12-11 Ind Tech Res Inst Appratus for a transferrable flexible electronic device and method for fabricating a flexible electronic device
TWI410329B (en) * 2009-03-09 2013-10-01 Ind Tech Res Inst Apparatus for releasing a flexible device and method thereof
TWI439976B (en) * 2009-04-17 2014-06-01 Ind Tech Res Inst Method for isolating a flexible film from a substrate and method for fabricating an electric device
TWI421809B (en) * 2009-04-17 2014-01-01 Ind Tech Res Inst Method for isolating a flexible substrate from a carrier and method for fabricating an electric device
CN102194829B (en) * 2010-03-11 2013-07-10 财团法人工业技术研究院 Substrate structure and manufacturing method thereof
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
US20110291544A1 (en) * 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
TWI402012B (en) * 2010-09-01 2013-07-11 Ind Tech Res Inst Method for patterning a flexible substrate
TWI433625B (en) 2011-07-04 2014-04-01 Ind Tech Res Inst Method for fabricating the flexible electronic device
US20130115426A1 (en) * 2011-11-09 2013-05-09 Au Optronics Corporation Method of manufacturing flexible electronic device
TWI596751B (en) * 2012-08-30 2017-08-21 財團法人工業技術研究院 Flexible display and method for fabricating the same
US9853243B2 (en) 2013-07-05 2017-12-26 Industrial Technology Research Institute Flexible display and method for fabricating the same
JP6363077B2 (en) * 2013-07-24 2018-07-25 ユニチカ株式会社 LAMINATE, PROCESSING METHOD THEREOF, AND METHOD FOR PRODUCING FLEXIBLE DEVICE
CN104377165B (en) * 2013-08-12 2017-11-17 上海和辉光电有限公司 Flat-panel monitor and its flexible base board and preparation method
EP3087558A4 (en) * 2013-12-26 2017-06-21 Intel Corporation Method and apparatus for flexible electronic communicating device
CN107369761B (en) * 2017-08-10 2020-04-14 武汉华星光电技术有限公司 Flexible display panel, substrate PI layer structure thereof and preparation method
TWI650882B (en) * 2018-01-18 2019-02-11 榮創能源科技股份有限公司 Flexible light source structure and method for manufacturing same
KR102696647B1 (en) * 2018-11-09 2024-08-22 삼성디스플레이 주식회사 Flexible display apparatus and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW564471B (en) * 2001-07-16 2003-12-01 Semiconductor Energy Lab Semiconductor device and peeling off method and method of manufacturing semiconductor device
US20060189023A1 (en) * 2005-02-23 2006-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Three dimensional structure formed by using an adhesive silicon wafer process
TWI321241B (en) * 2005-09-14 2010-03-01 Ind Tech Res Inst Flexible pixel array substrate and method of fabricating the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9096044B2 (en) 2010-06-24 2015-08-04 Au Optronics Corporation Flexible display panel and method of fabricating the same
CN103137629A (en) * 2011-11-25 2013-06-05 群康科技(深圳)有限公司 Soft base plate, display device with soft base plate and manufacturing method of soft base plate and display device with soft base plate
TWI491324B (en) * 2011-11-25 2015-07-01 群康科技(深圳)有限公司 Flexible substrate, display apparatus using the same and manufacturing method thereof
CN103137629B (en) * 2011-11-25 2016-01-20 群康科技(深圳)有限公司 Flexible base plate, the display unit with this flexible base plate and manufacture method thereof
CN103855324A (en) * 2012-11-29 2014-06-11 财团法人工业技术研究院 Method for taking out flexible element and method for separating substrates
CN103855324B (en) * 2012-11-29 2016-08-03 财团法人工业技术研究院 Method for taking out flexible element and method for separating substrates
TWI773091B (en) * 2020-02-12 2022-08-01 瑞士商尼瓦克斯 法爾公司 Method for manufacturing a one-piece silicon device with flexible blades, in particular for timepieces
US11774914B2 (en) 2020-02-12 2023-10-03 Nivarox-Far S.A. Method for manufacturing a one-piece silicon device with flexible blades, in particular for timepieces

Also Published As

Publication number Publication date
US7279401B2 (en) 2007-10-09
TWI265606B (en) 2006-11-01
US20070065993A1 (en) 2007-03-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees