JP2007220893A5 - - Google Patents

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Publication number
JP2007220893A5
JP2007220893A5 JP2006039380A JP2006039380A JP2007220893A5 JP 2007220893 A5 JP2007220893 A5 JP 2007220893A5 JP 2006039380 A JP2006039380 A JP 2006039380A JP 2006039380 A JP2006039380 A JP 2006039380A JP 2007220893 A5 JP2007220893 A5 JP 2007220893A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006039380A
Other versions
JP2007220893A (ja
JP4813204B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2006039380A priority Critical patent/JP4813204B2/ja
Priority claimed from JP2006039380A external-priority patent/JP4813204B2/ja
Priority to TW095141333A priority patent/TWI391063B/zh
Priority to KR1020060111952A priority patent/KR101170764B1/ko
Priority to CN200610166785A priority patent/CN100594758C/zh
Publication of JP2007220893A publication Critical patent/JP2007220893A/ja
Publication of JP2007220893A5 publication Critical patent/JP2007220893A5/ja
Application granted granted Critical
Publication of JP4813204B2 publication Critical patent/JP4813204B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006039380A 2006-02-16 2006-02-16 多層回路基板の製造方法 Active JP4813204B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006039380A JP4813204B2 (ja) 2006-02-16 2006-02-16 多層回路基板の製造方法
TW095141333A TWI391063B (zh) 2006-02-16 2006-11-08 Multilayer circuit board and manufacturing method thereof
KR1020060111952A KR101170764B1 (ko) 2006-02-16 2006-11-14 다층 회로기판 제조방법
CN200610166785A CN100594758C (zh) 2006-02-16 2006-11-30 多层电路板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039380A JP4813204B2 (ja) 2006-02-16 2006-02-16 多層回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2007220893A JP2007220893A (ja) 2007-08-30
JP2007220893A5 true JP2007220893A5 (ja) 2011-03-17
JP4813204B2 JP4813204B2 (ja) 2011-11-09

Family

ID=38497840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006039380A Active JP4813204B2 (ja) 2006-02-16 2006-02-16 多層回路基板の製造方法

Country Status (4)

Country Link
JP (1) JP4813204B2 (ja)
KR (1) KR101170764B1 (ja)
CN (1) CN100594758C (ja)
TW (1) TWI391063B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101946989B1 (ko) * 2011-12-09 2019-02-12 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101390696B1 (ko) * 2012-11-27 2014-04-30 대덕지디에스 주식회사 인쇄회로기판 및 그 제조방법
CN106163141A (zh) * 2016-07-08 2016-11-23 台山市精诚达电路有限公司 四层fpc的制作方法
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JPH11150370A (ja) * 1997-11-18 1999-06-02 Kyocera Corp 多層配線基板
JP2004228446A (ja) * 2003-01-24 2004-08-12 Nec Corp プリント基板

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