JP2007214454A - Unit for substrate connection test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a unit for substrate connection test which is easy in a check of connection state, and enables a substrate connection test at a substrate center. <P>SOLUTION: In the unit for substrate connection test, an excellent workability is obtained with easy check of connection state in such a way that, since 2 pieces of first lands 4 and 2 pieces of second lands 13 are connected in a serial state, when a connection between second lands 12 located at both ends connected serially is checked to be passed, all connection conductors 16 will be passed between it, and an easy checking work is obtained in such a way that a connection state of connection conductor unit 8 can be checked by checking a state between a second center land 10 and a cover 7. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board connection test unit suitable for application to an electronic circuit module such as a short-range wireless device.

  FIG. 5 is a plan view showing a conventional board connection test unit, FIG. 6 is a plan view of a board according to a conventional board connection test unit, The configuration of the conventional board connection test unit will be described with reference to FIGS. 5 and 6. The board 51 includes a plurality of output land portions 53 arranged in a row at the end of the wiring pattern 52, and wiring patterns 54. It has a row of input land portions 55 provided at the end.

  The semiconductor component 56 connected to the substrate 51 has input / output bumps 57, 58 used for mounting and dummy bumps 59 used for testing. The input / output bumps 57, 58 and dummy bumps 59 are used. Are arranged at point-symmetric positions, and the plurality of dummy bumps 59 are connected in series by the short-circuit conductor 60 having the common conductor 60a.

  As shown in FIG. 5, in the semiconductor component 56 having such a configuration, dummy bumps 59 are connected to the input land portion 55 and some input and output bumps 57 and 58 are connected to the output land portion 53 and the input land portion. 55.

  The plurality of dummy bumps 59 connected by the short-circuit conductor 60 are subjected to a substrate connection test between the respective wiring patterns 54. When the semiconductor component 56 is mounted, the dummy bump 59 is changed by 180 degrees from the position of the test state. A conventional board connection test unit is formed by being mounted on the board 51 in a state of being aligned by 61 (see, for example, Patent Document 1).

That is, even if the connection test between the wiring patterns 54 located at both ends of the dummy bump 59 connected by the short-circuit conductor 60 passes, the wiring patterns 54 located at both ends are connected to each other by the common conductor 60a. Therefore, the wiring pattern 54 located inward of the both end portions is in an unknown state as to whether it is acceptable or not, and therefore a check between the individual wiring patterns 54 is required.
JP 2000-277574 A

  However, in the conventional board connection test unit, each of the plurality of dummy bumps 59 is connected in series by the short-circuit conductor 60 having the common conductor 60a. Even if the connection test between the wiring patterns 54 located at both ends is successful, the wiring pattern 54 located inward of the both ends is unclear whether it is acceptable. It is necessary to check the connection state between the wiring patterns 54, which is troublesome and deteriorates workability. In addition, the output land portion 53 and the input land portion 55 are arranged in a line, so that the board There is a problem that the board connection test at the central portion of 51 cannot be performed.

  Further, the conventional board connection test unit performs a connection test of the semiconductor component 56 and has a problem that the connection state of the cover cannot be checked.

  The present invention has been made in view of such a state of the art, and an object of the present invention is to provide a board connection test unit capable of easily checking the connection state and performing a board connection test at the center of the board. It is to provide.

  In order to achieve the above object, according to the present invention, there is provided a board connection test unit for testing a connection state between the first and second boards. Conductive connection connecting the substrate, the first central land portion provided in the central portion of the first substrate, the external land portion provided in the through hole, and the first central land portion and the external land portion Body, a plurality of first land portions provided at positions avoiding the first central land portion and the external land portion, and a conductive material connecting two adjacent first land portions alternately. A module including a first connection portion and a cover attached to the first substrate in a state of being connected to the external land portion via the connection conductive portion, and the second substrate includes: A second central land portion provided opposite to the central land portion; A second land portion provided opposite to the second land portion, and a second connection portion made of a conductive material for connecting every other two second land portions adjacent to each other. The two central land portions and the first and second land portions are connected by a connection conductor, and the first land portions having no first connection portion are connected by a second connection portion. The second land portions connected by the two second land portions and having no second connecting portion are connected by the two first land portions connected by the first connecting portion, The two first land portions and the two second land portions are connected in series.

  In the present invention configured as described above, the first substrate in which every two adjacent first land portions are connected by the first connecting portion, and the two adjacent second land portions are provided. Since each of the second substrates connected by the second connection portion is provided in an alternate manner and the two first land portions and the two second land portions are connected in series, both ends of the series connection If the second land portions located in the area are checked and passed, all the connecting conductors located between them are in the passed state, and the connection state can be easily checked and a workable work can be obtained. .

  In addition, since the first and second central land portions are located at the central portions of the first and second substrates that are least affected by the bending test or the like, the influence on the connection conductor during the test is reduced. Since the connection state between the first and second central land portions by the connection conductor is maintained, the connection conductivity located between the cover and the external land portion is checked by the check between the cover and the second central land portion. The connection state of the parts can be confirmed, and an easy check operation can be obtained.

  Further, according to the present invention, in the above invention, the second substrate is connected to the second central land portion, and is connected in series with the central lead conductor led out of the first substrate. It is characterized by having a both-ends lead-out conductor led out of the first substrate in a state of being connected to the second land portion located in the portion.

  In the present invention configured as described above, an easy check operation of the connection state by the connection conductive portion can be obtained by the central lead conductor, and the check operation of the connection state by the connection conductor can be easily performed by the presence of the double-end lead conductor. Things are obtained.

  The present invention is characterized in that, in the above invention, the first and second land portions are arranged in a spiral shape, and the first and second land portions are connected in a spiral shape.

  According to the present invention configured as described above, it is possible to easily arrange the first and second land portions and form the first and second connection portions.

  Further, according to the present invention, in the above invention, the second substrate is connected to the second land portion or the second connection portion located in the vicinity of the spiral corner portion, and is outside the first substrate. It is characterized by having a drawn-out conductor.

  According to the present invention configured as described above, the presence of the lead conductor enables checking at a partial location and an easy check operation.

  Further, the present invention is characterized in that, in the above invention, the cover has a leg portion, and the leg portion is inserted into the through hole and connected to the external land portion by a connection conductive portion made of solder. .

  In the present invention configured as described above, the attachment of the cover can be matched to the mounting structure, and the connection state of the connection conductive portion can be accurately checked.

  In the present invention, since the two first land portions and the two second land portions are connected in series, the second land portions located at both ends of the series connection can be checked and passed. For example, all connection conductors positioned between them are in a pass state, and it is easy to check the connection state, and a good workability is obtained, and the first and second central land portions are subjected to a bending test or the like. Is located in the central part of the first and second substrates, where the influence of the connection conductor is the smallest, the influence on the connection conductor during the test is reduced, and the connection conductor between the first and second central land parts Since the connection state is maintained, the connection between the cover and the external land part can be confirmed by the check between the cover and the second central land part, and the check work is easy. Is obtained.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of an essential part of a substrate connection test unit according to the present invention, and FIG. FIG. 3 is a plan view of a second substrate according to the substrate connection test unit of the present invention, and FIG. 4 relates to the substrate connection test unit of the present invention. It is explanatory drawing which shows the connection state between the lands of the 1st, 2nd board | substrate.

  Next, the configuration of the board connection test unit according to the present invention will be described with reference to FIGS. 1 to 4. The module M is made of an insulating material such as a ceramic material, and has a rectangular shape as a circuit board of an electronic circuit module. 1 substrate 1 and a metal cover 7 which is attached to the substrate 1 and covers an electronic component (not shown) provided on the circuit board.

  As shown in FIG. 2 in particular, the first substrate 1 includes a plurality (four) of through holes 1a provided in the vicinity of the four corners of the outer peripheral portion and a plurality (4) of conductive materials provided in the center of the lower surface. First central land portions 2, a plurality (four) of external land portions 3 made of a conductive material provided around the through hole 1 a on the lower surface, the first central land portions 2, and the external land portions. In a state where 3 is avoided, a plurality of first land portions 4 are provided on the lower surface.

  Each of the first central land portion 2 and the external land portion 3 is connected by a conductive connection body 5 made of a conductive material provided on the lower surface of the first substrate 1 and two adjacent first first land portions. A first connecting portion 6 made of a conductive material for connecting every other land portion 4 is provided.

  The conductive connection body 5 and the first connection portion 6 are exposed on the lower surface of the first substrate 1 with the first central land portion 2, the outer land portion 3, and the first land portion 4 exposed. An insulating film (not shown) may be provided.

  The cover 7 has a box-shaped portion 7a and a plurality of (four) leg portions 7b protruding from the lower portion of the box-shaped portion 7a. The cover 7 is in a state where the leg portions 7b are inserted into the through holes 1a. The module M is formed by being connected to the external land portion 3 by the connection conductive portion 8 made of solder filled in the through hole 1a.

  The second substrate 9 made of an insulating material becomes a mother substrate on the set side which is an electronic device, and the first substrate 9 has a first surface on the first substrate 1 side, particularly as shown in FIG. A plurality of (four) second central land portions 10 facing the central land portion 2 and a plurality of second land portions 12 facing the first land portion 4 on the first substrate 1 side. Yes.

  Further, on the upper surface of the second substrate 9, a second connection portion 13 made of a conductive material for connecting every other two second land portions 12, and a second central land portion 10. A plurality of center lead conductors 14 led out from the lead wires 15 and lead conductors 15 led out from the second land portions 12 and the second connection portions 13 are provided.

  A terminal portion 14a for contacting the probe of the measuring instrument is provided at the end portion of the central lead conductor 14, and a terminal portion 15a for contacting the probe of the measuring instrument also at the end portion of the lead conductor 15. ~ 15n are provided.

  The second connecting portion 13 and the center lead are exposed on the upper surface of the second substrate 9 with the second central land portion 10, the second land portion 12, and the terminal portions 14a and 15a to 15n exposed. An insulating film (not shown) that covers the conductor 14 and the lead conductor 15 may be provided.

  In addition, on the upper surface of the second substrate 9, lead conductors and terminal portions connected to the individual second land portions 12 and the individual second connection portions 13 may be provided.

  As shown in FIG. 1, the module M and the second substrate 9 having such a configuration are arranged between the first and second central land portions 2 and 10 and between the first and second land portions 4 and 12. Are connected by the connection conductor 16 to form the board connection test unit of the present invention.

  The connection conductor 16 is made of cream solder, solder bumps, ball grid array (BGA), or the like, and the first and second substrates 1 and 9 connected by the connection conductor 16 are as shown in FIG. The first land portions 4 where the first connection portion 6 does not exist are connected by the two second land portions 12 connected by the second connection portion 13, and the second connection portion 13 exists. The second land portions 12 that are not connected are connected by the two first land portions 4 connected by the first connecting portions 6 to form a spiral shape, and the two first land portions 4 are connected to each other. Two second land portions 12 are connected in series.

  At this time, the central lead conductor 14 including the terminal portion 14a and the lead conductor 15 including the terminal portions 15a to 15n are led out of the first substrate 1 and connected to terminals other than the terminal portions 15a and 15n. The drawn-out conductor 14 is connected to the second connection portion 13 or the second land portion 12 located near the spiral corner.

  The board connection test unit having such a configuration is subjected to a durability test such as bending, a temperature test, an impact test, and the like, and is connected to both ends of the second land portion 12 for each of these tests. The probe is brought into contact with the terminal portions 15a and 15n to check the connection state of the connection conductor 16 between the first and second land portions 4 and 12, and, if necessary, between the terminal portions 15a to 15n. In addition, the probe is brought into contact with the terminal portion 14a and the cover 7, and the connection state of the connection conductor 16 and the connection conductive portion 8 between the first and second central land portions 2 and 10 is checked. It has become.

  When the connection conductive portion 8 is checked, the first and second central land portions 2 and 10 are located at the central portions of the first and second substrates 1 and 9 that are least affected by the bending test or the like. Therefore, the influence on the connection conductor 16 during the test is reduced, and the connection state between the first and second center land portions 2 and 10 by the connection conductor 16 is maintained. By checking with the central land portion 10, the connection state of the connecting conductive portion 8 located between the cover 7 and the external land portion 3 can be confirmed, and an easy check operation can be obtained.

It is principal part sectional drawing which concerns on the unit for board | substrate connection tests of this invention. It is explanatory drawing which shows the connection state between the land part of a 1st board | substrate in connection with the unit for board | substrate connection tests of this invention. It is a top view of the 2nd board | substrate which concerns on the unit for board | substrate connection tests of this invention. It is explanatory drawing which shows the connection state between the land of the 1st, 2nd board | substrate concerning the unit for board | substrate connection tests of this invention. It is a top view which shows the conventional board | substrate connection test unit. It is a top view of the board | substrate which concerns on the conventional board connection test unit.

Explanation of symbols

M module 1 1st board | substrate 1a Through-hole 2 1st center land part 3 External land part 4 1st land part 5 Conductive connection body 6 1st connection part 7 Cover 7a Box-shaped part 7b Leg part 8 Connection conductive part (solder)
DESCRIPTION OF SYMBOLS 9 2nd board | substrate 10 2nd center land part 12 2nd land part 13 2nd connection part 14 Center lead conductor 14a Terminal part 15 Lead conductor 15a-15n Terminal part 16 Connection conductor

Claims (5)

In the board connection test unit for testing the connection state between the first and second boards,
The first substrate provided with a plurality of through holes in the outer peripheral portion, the first central land portion provided in the central portion of the first substrate, and the external land portion provided at the position of the through hole A conductive connection body connecting the first central land portion and the external land portion, a plurality of first land portions provided at positions avoiding the first central land portion and the external land portion, In a state where the first connecting portion made of a conductive material for connecting every other two first land portions adjacent to each other and the external land portion connected via the connecting conductive portion, A module including a cover attached to the substrate, and the second substrate includes a second central land portion provided opposite to the first central land portion, and a first land portion. The second land portion provided opposite to the second land portion and the two adjacent second land portions A second connecting portion made of a conductive material for connecting every other land portion, and a connection conductor between the first and second central land portions and between the first and second land portions. The two first land portions connected by the second connection portion are connected between the first land portions that are connected and do not have the first connection portion, and the second connection portions are connected. The second land portions that do not exist are connected by the two first land portions connected by the first connection portion, and the two first land portions and the two land portions are connected. A board connection test unit, wherein the second land portions are connected in series. The second substrate is connected to the second central land portion and connected to the central lead conductor led out of the first substrate in series with the second substrate positioned at both ends. 2. The unit for board connection test according to claim 1, further comprising a both-end lead conductor led out of the first board in a state of being connected to the land part. 3. The substrate connection test according to claim 2, wherein the first and second land portions are arranged in a spiral shape, and the first and second land portions are connected in a spiral shape. unit. The second substrate has a lead conductor led out of the first substrate in a state connected to the second land portion or the second connection portion located in the vicinity of the spiral corner portion. The board connection test unit according to claim 3, wherein the board connection test unit is provided. The said cover has a leg part, This leg part is inserted in the said through-hole, and was connected to the said external land part by the said connection conductive part which consists of solder. The board connection test unit according to any one of the preceding claims.

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