JP2007214307A - 電子デバイス - Google Patents

電子デバイス Download PDF

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Publication number
JP2007214307A
JP2007214307A JP2006031950A JP2006031950A JP2007214307A JP 2007214307 A JP2007214307 A JP 2007214307A JP 2006031950 A JP2006031950 A JP 2006031950A JP 2006031950 A JP2006031950 A JP 2006031950A JP 2007214307 A JP2007214307 A JP 2007214307A
Authority
JP
Japan
Prior art keywords
substrate
sealing material
electronic component
bonding
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006031950A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007214307A5 (https=
Inventor
Yuugo Koyama
裕吾 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2006031950A priority Critical patent/JP2007214307A/ja
Publication of JP2007214307A publication Critical patent/JP2007214307A/ja
Publication of JP2007214307A5 publication Critical patent/JP2007214307A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2006031950A 2006-02-09 2006-02-09 電子デバイス Withdrawn JP2007214307A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006031950A JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006031950A JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Publications (2)

Publication Number Publication Date
JP2007214307A true JP2007214307A (ja) 2007-08-23
JP2007214307A5 JP2007214307A5 (https=) 2009-02-26

Family

ID=38492476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006031950A Withdrawn JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Country Status (1)

Country Link
JP (1) JP2007214307A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
US8080921B2 (en) 2008-03-10 2011-12-20 Epson Toyocom Corporation Reduced-height piezoelectric device having a piezoelectric resonator and electronic component
US8547182B2 (en) 2010-10-08 2013-10-01 Nihon Dempa Kogyo Co., Ltd. Oven controlled crystal oscillator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8080921B2 (en) 2008-03-10 2011-12-20 Epson Toyocom Corporation Reduced-height piezoelectric device having a piezoelectric resonator and electronic component
JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
US8547182B2 (en) 2010-10-08 2013-10-01 Nihon Dempa Kogyo Co., Ltd. Oven controlled crystal oscillator

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