JP2007214000A - Method for manufacturing electrochemical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrochemical device elongating a service life by suppressing reduction in opening ratio by broadening an insulating layer. <P>SOLUTION: An auxiliary electrode layer 14 is formed on an organic insulating layer 12, and a function layer 13 is formed over the whole surface on the organic insulating layer 12 and auxiliary electrode layer 14. Thereafter, the function layer 13 formed on the auxiliary electrode layer 14 is peeled from the auxiliary electrode layer 14 by rotating an adhesive roller in contact with the function layer 13. A counter electrode 15 is then formed on the auxiliary electrode layer 14. Since the function layer 13 is formed without using a mask, it is not necessary to ensure an alignment tolerance between the mask and the substrate S as in the past, needing no broadening of the organic insulating layer 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device.

  In recent years, from the viewpoint of wide viewing angle, low power consumption, high response performance, etc., an organic electroluminescence element (hereinafter referred to as “organic EL display”) using an “organic EL element” as a light emitting element has been developed. Organic EL devices generally have a structure in which a functional layer including an organic light emitting layer is sandwiched between an anode (pixel electrode) and a cathode (counter electrode) from above and below, and holes and electrons are formed in the organic light emitting layer. Are recombined to produce light emission.

  By the way, organic EL displays are roughly classified into a bottom emission type in which light is extracted from the substrate side (anode side) and a top emission type in which light is extracted from the side facing the substrate (cathode side). . In the bottom emission type organic EL display, the anode is made of a light-transmitting conductive material, and the light emitted from the light emitting layer is transmitted through the anode (pixel electrode) and the substrate and emitted to the outside. In the type, the light is transmitted to the outside through the cathode (counter electrode). Therefore, the top emission type organic EL display has an advantage that the aperture ratio can be increased, and as a result, the lifetime of the panel can be extended.

  By the way, in the top emission type organic EL display, in order to ensure the light transmittance of the cathode (counter electrode), the cathode (counter electrode) is made of a light transmissive conductive material such as indium-tin (ITO) or zinc oxide (ZnO). A material or a highly conductive material such as magnesium-silver (MgAg) made into an extremely thin film is used. Accordingly, since the resistance value of the cathode (counter electrode) is relatively high, the potential becomes nonuniform at each position on the cathode (counter electrode), and as a result, the luminance may vary depending on the position of the pixel. .

Therefore, an insulating layer having an opening is formed between each anode (pixel electrode) so that the anode (pixel electrode) is exposed, and the auxiliary electrode is in electrical contact with the cathode (counter electrode) on the insulating layer. Those with layers are known. Thereby, since the electric potential in each position on a cathode (counter electrode) becomes uniform, the dispersion | variation in a brightness | luminance is suppressed (for example, refer patent document 1).
JP 2002-352963 A

  By the way, the functional layer of the organic EL element is formed on the anode (pixel electrode) by vapor deposition after the auxiliary electrode layer is formed on the insulating layer. The anode in which the functional layer is exposed at the opening of the insulating layer. It is difficult to form accurately only on the (pixel electrode). Therefore, vapor deposition is performed using a precise mask so that the functional layer overlaps the edge of the insulating layer and the exposed surface of the anode (pixel electrode) is reliably covered with the functional layer. Therefore, it is necessary to widen the insulating layer in order to ensure alignment tolerance with the mask. As a result, the aperture ratio is lowered, resulting in a problem that the lifetime of the panel is reduced.

  The present invention has been made in view of the above-described problems, and provides a method for manufacturing an electro-optical device that can prevent the aperture ratio from being lowered by widening an insulating layer and can achieve a long lifetime. It is in.

  The method of manufacturing an electro-optical device according to the present invention includes a first electrode layer, a second electrode layer, and at least a light emitting layer disposed between the first electrode layer and the second electrode layer on a substrate. A method for manufacturing an electro-optical device, comprising: a plurality of electro-optical elements each including a functional layer, wherein light emitted from the light-emitting layer is transmitted from the side facing the substrate through the second electrode layer And forming an insulating layer having an opening at a position corresponding to the first electrode layer on the substrate, and electrically connecting the second electrode layer on the insulating layer. An auxiliary electrode layer forming step for forming an auxiliary electrode layer, a functional layer forming step for forming the functional layer on the insulating layer and the auxiliary electrode layer, and the functional layer formed on the auxiliary electrode layer as the auxiliary A peeling step for peeling from the electrode layer; and the second step on the auxiliary electrode layer. And an electrode layer forming step of forming a cathode layer.

  According to this, the functional layer is formed without using a mask in which an opening is formed at a position corresponding to the first electrode layer. Therefore, since it is not necessary to ensure the tolerance of alignment with the mask, it is not necessary to widen the insulating layer. As a result, it is possible to suppress a decrease in the aperture ratio, so that the life of the electro-optical device can be extended.

In the method for manufacturing the electro-optical device, the auxiliary electrode layer forming step may be performed by a transfer method.
According to this, since the auxiliary electrode layer is formed by the transfer method, a mask for forming the auxiliary electrode layer is unnecessary, and there is no need to consider alignment tolerances for that purpose. Therefore, the width of the insulating layer can be reduced. As a result, the aperture ratio can be increased.

  In the electro-optical device manufacturing method, the peeling step rotates a sticky roller-shaped transfer member in contact with the functional layer formed on the entire surface of the insulating layer and the auxiliary electrode layer. The functional layer formed on the auxiliary electrode layer may be peeled off from the auxiliary electrode layer.

  According to this, the functional layer formed on the auxiliary electrode layer can be easily peeled off from the auxiliary electrode layer by using a transfer member provided with an adhesive roller. In addition, by disposing an adhesive roller-shaped transfer member in the chamber, the functional layer is peeled off from the auxiliary electrode layer without being exposed to the atmosphere, and in this state, the second electrode layer is formed on the auxiliary electrode layer. Since it can be formed, the functional layer can be formed on the electrode without causing adhesion of impurities such as particles and alteration of the electrode surface.

  In the electro-optical device manufacturing method, in the peeling step, an adhesive sheet is rotated while being brought into contact with the functional layer formed on the entire surface of the insulating layer and the auxiliary electrode layer by a roller-shaped transfer member. Thus, the functional layer formed on the auxiliary electrode layer may be peeled off from the auxiliary electrode layer.

According to this, compared with the case where the roller-shaped transfer member which has adhesiveness is used, the replacement frequency of a transfer member can be decreased by lengthening the length of a sheet | seat.
In this electro-optical device manufacturing method, the functional layer formed on the auxiliary electrode layer is peeled off from the auxiliary electrode layer by rotating the transfer member while being in contact with the auxiliary electrode layer in the longitudinal direction. May be.

  According to this, the functional layer formed on the auxiliary electrode layer can be reliably peeled off from the auxiliary electrode layer.

(First embodiment)
A method for manufacturing a top emission type organic EL display as an electro-optical device according to an embodiment of the invention will be described below with reference to the drawings.

First, the structure of the organic EL display manufactured by the manufacturing method of the present invention will be described.
FIG. 1 is a partial schematic cross-sectional view for explaining the configuration of the organic EL display according to the present embodiment. The organic EL display 10 of the present embodiment is an active matrix drive system, and is a drive transistor (in this embodiment, a thin film transistor) for controlling the amount of current (carrier) supplied to each organic EL element on the substrate S. A circuit forming layer Sa including To and the like is provided.

  On the circuit formation layer Sa, pixel electrodes 11 as a plurality of first electrodes are arranged and formed in a matrix. Each pixel electrode 11 is electrically connected to the drain electrode of the drive transistor To formed in the circuit formation layer Sa, and is supplied with a current (carrier) controlled by each drive transistor To. The pixel electrode 11 is made of a conductive material having light reflectivity and a high work function. In this embodiment, the pixel electrode 11 is configured by forming indium-tin oxide (ITO) on a chromium (Cr) or aluminum (Al) reflective film. An organic insulating layer 12 is formed on the circuit forming layer Sa. The organic insulating layer 12 has an opening Qo at a position corresponding to the pixel electrode 11. A pixel region Z is defined by each opening Qo. Note that the organic insulating layer 12 of the present embodiment is made of polyimide.

  A functional layer 13 is disposed on the organic insulating layer 12 around each pixel electrode 11 and the opening Qo. The functional layer 13 includes a hole injection layer 13a, a hole transport layer 13b, a light emitting layer 13c, and an electron transport layer 13d. From the pixel electrode 11 side, the hole injection layer 13a → the hole transport layer 13b → the light emitting layer. The layers are stacked in the order of 13c → electron transport layer 13d. Each of the hole injection layer 13a, the hole transport layer 13b, the light emitting layer 13c, and the electron transport layer 13d is made of a known low molecular material. For example, in this embodiment, copper phthalocyanine is used for the hole injection layer 13a, triphenyldiamine (TPD) is used for the hole transport layer 13b, alkynolyl chain aluminum (Alq3) is used for the light emitting layer 13c, and the electron transport layer 13d is used. Oxadiazole (BND) is used. The light emitting layer 13c of this embodiment emits white light.

  An auxiliary electrode layer 14 is formed between the pixel electrode 11 rows arranged on the organic insulating layer 12 along one direction of the substrate S (direction orthogonal to the paper surface). Each auxiliary electrode layer 14 is an elongated linear wiring along one direction of the substrate S (a direction orthogonal to the paper surface). Each auxiliary electrode layer 14 is connected to a ground terminal (not shown) and has a ground potential.

  A counter electrode 15 is formed on the entire surface of the functional layer 13 such that a part thereof is in contact with the auxiliary electrode layer 14. The counter electrode 15 is made of a light-transmitting conductive material. In the present embodiment, the counter electrode 15 is made of an indium-tin compound (ITO). The auxiliary electrode layer 14 is made of a conductive material having a resistance lower than that of the counter electrode 15 and is made of aluminum (Al) in the present embodiment. As a result, the potential at each position on the counter electrode 15 is uniformly the ground potential. Each pixel electrode 11, the counter electrode 15, and the functional layer 13 disposed between the pixel electrode 11 and the counter electrode 15 constitute an organic EL element 16 as one electro-optical element. .

A protective layer 17 is formed on the entire surface of the counter electrode 15. The protective layer 17 is made of a known insulating material having optical transparency. A color filter 18 is attached to the entire surface of the protective layer 17. The color filter 18 includes a red conversion layer 18R that converts white light emitted from the organic EL element 16 into red light, a green conversion layer 18G that converts green light, and blue conversion that converts blue light. The conversion layer 18R, 18G, 18B is disposed at a position corresponding to each pixel region Z.

  A part of the light emitted from the light emitting layer 13c of each organic EL element 16 is reflected by the pixel electrode 11 to the counter electrode 15 side, passes through the counter electrode 15 and faces the substrate S. That is, the light is emitted to the color filter 18 side. At this time, red light LR is emitted from the red conversion layer 18R, green light LG is emitted from the green conversion layer 18G, and blue light LB is emitted from the blue conversion layer 18B.

  In the organic EL display 10 configured in this manner, the width of the organic insulating layer 12 (the length indicated by the symbol “W” in FIG. 1) is narrower than that of the conventional top emission type organic EL display. The aperture ratio of the organic EL element 16 is high.

Next, the manufacturing method of the organic EL display 10 mentioned above is demonstrated according to FIGS.
First, a circuit forming layer Sa is formed by forming various electronic elements such as the drive transistor To on the substrate S by a known method. Subsequently, the pixel electrode 11 is formed so as to be electrically connected to the drain electrode of the formed driving transistor To (see FIG. 2A). For example, a layer made of chromium (Cr) is formed on the entire surface of the circuit formation layer Sa by a sputtering method, and then a resist photolithography process is performed to form a resist pattern in accordance with a predetermined pixel shape. Further, the pixel electrode 11 having a predetermined shape is formed by performing an etching process.

  Subsequently, an organic insulating layer is formed over the entire surface of the circuit forming layer Sa so as to cover each pixel electrode 11 by vapor deposition, and then a resist pattern (including a transmissive portion at a position corresponding to the pixel electrode 11). (Not shown) is used for exposure and development (insulating layer forming step). As a result, as shown in FIG. 2B, the organic insulating layer 12 in which the opening Qo is formed at a position corresponding to the pixel electrode 11 is formed. FIG. 3 is a top view of the substrate S provided with the organic insulating layer 12 formed as described above, and FIGS. 2A and 2B correspond to the AA cross section in FIG.

  Next, the auxiliary electrode layer 14 is formed on the organic insulating layer 12 using a lithography method (transfer method) (auxiliary electrode layer forming step). First, as shown in FIG. 4A, a conductive layer 20 made of aluminum (Al) is vapor-deposited over the entire surface of the pixel electrode 11 and the organic insulating layer 12. Subsequently, as shown in FIG. 4B, a non-transmissive portion 21a is provided on the conductive layer 20 at a position corresponding to the organic insulating layer 12 along one direction of the substrate S (direction perpendicular to the paper surface). A resist pattern 21 is formed, and exposure and development are performed. Further, the conductive layer 20 disposed corresponding to the region other than the non-transmissive portion 21a is removed by performing an etching process, and the resist pattern 21 is removed. As a result, the auxiliary electrode layer 14 is formed on the organic insulating layer 12 as shown in FIG.

Next, the functional layer 13 is formed on the entire surface of the organic insulating layer 12 and the auxiliary electrode layer 14 (functional layer forming step). Specifically, as shown in FIG. 5A, the hole injection layer 13a is formed by vapor deposition using a decompression chamber (not shown) in the same manner as a known method. In the present embodiment, the hole injection layer 13a is formed by evaporating copper phthalocyanine, for example, until the film thickness reaches 600 mm. Thereafter, similarly, a hole transport layer 13b made of triphenyldiamine (TPD) is formed on the hole injection layer 13a, and a light emitting layer 13c made of alkynolyl chain aluminum (Alq3) is formed on the hole transport layer 13b. Then, an electron transport layer 13d made of oxadiazole BND is sequentially deposited on the light emitting layer 13c (see FIG. 5B). FIG. 6 is a top view of the substrate S including the functional layer 13 and the auxiliary electrode layer 14 formed as described above, and FIG.
(B) corresponds to the BB cross section in FIG.

  Next, the functional layer 13 formed on the auxiliary electrode layer 14 is peeled off (peeling step). This is performed in a chamber (not shown) connected to a decompression chamber that forms the functional layer 13. A transfer member 25 shown in FIG. 7A is mounted in the chamber. The transfer member 25 includes a roller 27 around which an adhesive 26 having adhesiveness to the functional layer 13 is attached, and the longitudinal direction of the auxiliary electrode layer 14 (the X arrow direction in FIG. 7A and FIG. 6). It is possible to move along.

  Then, as shown in FIGS. 7B and 7C, in the longitudinal direction of the auxiliary electrode layer 14 (X arrow direction in FIG. 7B) while pressing the roller 27 against the functional layer 13 in the chamber. Move along. Then, the roller 27 comes into contact with the functional layer 13 formed on the auxiliary electrode layer 14, and the functional layer 13 formed on the auxiliary electrode layer 14 is seen from above the auxiliary electrode layer 14 as shown in FIG. Peel off and stick to roller 27. As a result, the functional layer 13 is peeled off from the auxiliary electrode layer 14 as shown in FIG.

  Subsequently, the counter electrode 15 is formed. This is performed by a vapor deposition apparatus (not shown) connected to the chamber on which the transfer member 25 is mounted. And the board | substrate S from which the functional layer 13 peeled from the auxiliary electrode layer 14 is carried in to a vapor deposition apparatus, without being exposed to air | atmosphere. With the vapor deposition apparatus, as shown in FIG. 8B, the counter electrode 15 is formed by vapor-depositing indium-tin oxide (ITO) on the entire surface of the functional layer 13 (electrode layer forming step). At this time, the counter electrode 15 contacts the auxiliary electrode layer 14. Then, after forming the protective layer 17 on the counter electrode 15 using a well-known method (refer FIG.8 (c)), the color filter 18 produced separately is stuck. In this way, the organic EL display 10 is manufactured.

As described above, according to the present embodiment, the following effects are obtained.
(1) According to this embodiment, after the auxiliary electrode layer 14 is formed on the organic insulating layer 12, the functional layer 13 is formed over the entire surface on the organic insulating layer 12 and the auxiliary electrode layer 14. Thereafter, the functional layer 13 formed on the auxiliary electrode layer 14 was peeled off from the auxiliary electrode layer 14 by rotating a roller 27 having adhesiveness to the functional layer 13 while being in contact with the functional layer 13. Then, the counter electrode 15 was formed on the auxiliary electrode layer 14. Therefore, since the functional layer 13 is formed without using a mask, it is not necessary to ensure the alignment tolerance between the mask and the substrate S as in the prior art, and therefore the width W of the organic insulating layer 12 needs to be widened. There is no. As a result, a decrease in the aperture ratio of each organic EL element 16 can be suppressed, so that the lifetime of the organic EL display 10 can be increased.
(2) According to this embodiment, after forming the organic insulating layer 12, the auxiliary electrode layer 14 was formed on the organic insulating layer 12 using a photolithography method (transfer method). Therefore, the width W of the organic insulating layer 12 can be reduced. Therefore, the aperture ratio can be increased.
(3) According to the present embodiment, the transfer member 25 including the roller 27 having adhesiveness is rotated on the auxiliary electrode layer 14 by rotating the transfer member 25 while being in contact with the functional layer 13 formed on the auxiliary electrode layer 14. The formed functional layer 13 was peeled off from the auxiliary electrode layer 14. Therefore, the functional layer 13 formed on the auxiliary electrode layer 14 can be easily peeled off.
(4) According to the present embodiment, the functional layer 13 on the auxiliary electrode layer 14 is peeled off by rotating the transfer member 25 while making contact with the longitudinal direction of the auxiliary electrode layer 14. Therefore, the functional layer 13 can be reliably peeled off.
(5) According to this embodiment, the transfer member 25 is disposed in a predetermined chamber, the functional layer 13 is peeled off from the auxiliary electrode layer 14 without being exposed to the atmosphere, and the auxiliary layer 14 is left in this state. The counter electrode 15 was formed on the substrate. Accordingly, it is possible to prevent impurities such as particles from adhering to the surfaces of the auxiliary electrode layer 14 and the functional layer 13, and to prevent the surfaces of the auxiliary electrode layer 14 and the functional layer 13 from being altered by the atmosphere. As a result, the adhesion between the auxiliary electrode layer 14 and the counter electrode 15 becomes good, so that the potential of the counter electrode 15 can be made uniform uniformly.
(6) According to the present embodiment, the functional layer 13 includes the hole injection layer 13a, the hole transport layer 13b, and the electron transport layer 13d in addition to the light emitting layer 13c. Therefore, the luminous efficiency of each organic EL element 16 can be increased. As a result, a long-life organic EL display 10 can be provided.
(Second Embodiment)
Next, a method for manufacturing the organic EL display 10 according to the second embodiment of the present invention will be described with reference to FIG. In the method of manufacturing the organic EL display 10 according to the second embodiment, the configuration of the transfer member for peeling the functional layer 13 formed on the auxiliary electrode layer 14 is different from that described in the first embodiment. It is the same except that it is. Therefore, in the present embodiment, detailed description of the same points as in the first embodiment is omitted.

  FIGS. 9A to 9C are views for explaining a method of peeling the functional layer 13 formed on the auxiliary electrode layer 14 using the transfer member 30 according to this embodiment. As shown in FIG. 9A, in the transfer member 30 according to this embodiment, an adhesive sheet 31 having adhesiveness with respect to the functional layer 13 is stretched by a roller 27. Then, as shown in FIGS. 9B and 9C, by pressing the adhesive sheet 31 onto the functional layer 13 via the roller 27, the auxiliary electrode is brought into contact with the functional layer 13. It moves along the longitudinal direction of the layer 14 (X arrow direction in FIG. 9).

  Then, the functional layer 13 formed on the auxiliary electrode layer 14 comes into contact with the adhesive sheet 31, and the functional layer 13 formed on the auxiliary electrode layer 14 is peeled off from the auxiliary electrode layer 14. At this time, since the functional layer 13 is peeled along the longitudinal direction of the auxiliary electrode layer 14, the functional layer 13 is surely peeled from the auxiliary electrode layer 14.

As described above, according to the present embodiment, the following effects are obtained.
(1) According to the present embodiment, the use period of the transfer member 30 is extended by increasing the length of the pressure-sensitive adhesive sheet 31, and therefore the transfer member replacement frequency compared to the transfer member 25 of the first embodiment. Can be reduced.

In addition, embodiment of invention is not limited to the said embodiment, You may implement as follows.
In each of the above-described embodiments, the functional layer 13 on the auxiliary electrode layer 14 is peeled off using the transfer members 25 and 30. However, the present invention is not limited to this, and other than the transfer members 25 and 30. May be used to peel off the functional layer 13. For example, the functional layer 13 on the auxiliary electrode layer 14 may be peeled off by sliding the functional layer 13 on the auxiliary electrode layer 14 with a spatula.

  In each of the above embodiments, the functional members 13 on the auxiliary electrode layer 14 are peeled off by moving the transfer members 25 and 30 along the longitudinal direction of the auxiliary electrode layer 14. It is not limited. For example, the functional layer 13 on the auxiliary electrode layer 14 may be peeled off by moving the transfer members 25 and 30 obliquely with respect to the longitudinal direction of the auxiliary electrode layer 14. By doing in this way, since the functional layer 13 becomes easy to peel from on the auxiliary electrode layer 14, the functional layer 13 can be peeled reliably.

  In the first embodiment, the organic EL element 16 includes the hole injection layer 13a, the hole transport layer 13b, the light emitting layer 13c, and the electron transport layer 13d that constitute the functional layer 13 of a low molecular organic material. However, the present invention is not limited to this, and the present invention can be applied even if it is composed of a polymer organic material.

  In the first embodiment, the electro-optical element is applied to the organic EL element 16, but the present invention is not limited to this. For example, the electro-optical element may be an electro-optical element of another aspect such as a light emitting diode (LED). May be.

  In the first embodiment, the auxiliary electrode layer 14 is formed after the pixel electrode 11 is formed, and then the functional layer 13 is formed on the pixel electrode 11. However, after the pixel electrode 11 is formed, oxygen plasma treatment is performed. The surface modification of the pixel electrode 11 may be performed. By doing so, the contact between the pixel electrode 11 and the functional layer 13 can be improved, so that the efficiency of carrier injection from the pixel electrode 11 to the functional layer 13 can be improved.

1 is a schematic cross-sectional view of an organic EL display manufactured by a method for manufacturing an electro-optical device of the present invention. (A), (b) is a figure for demonstrating the manufacturing method of the organic electroluminescent display which concerns on this embodiment, respectively. Similarly, the figure for demonstrating the manufacturing method of the organic electroluminescent display which concerns on this embodiment. Similarly, (a), (b), and (c) are diagrams for explaining a method of manufacturing an organic EL display according to the present embodiment. Similarly, (a), (b) is a figure for demonstrating the manufacturing method of the organic electroluminescent display which concerns on this embodiment, respectively. Similarly, the figure for demonstrating the manufacturing method of the organic electroluminescent display which concerns on this embodiment. Similarly, (a), (b), and (c) are diagrams for explaining a method of peeling a functional layer, respectively. Similarly, (a), (b), and (c) are diagrams for explaining a method of manufacturing an organic EL display according to the present embodiment. (A), (b), (c) is a figure for demonstrating the peeling method of the functional layer which concerns on 2nd Embodiment, respectively.

Explanation of symbols

  Q ... opening, S ... substrate, 11 ... pixel electrode as first electrode layer, 12 ... organic insulating layer as insulating layer, 13c ... light emitting layer, 13 ... functional layer, 14 ... auxiliary electrode layer, 15 ... second Counter electrode as electrode layer, 16... Organic electroluminescence element as electro-optical element, 25, 30... Transfer member, 31.

Claims (5)

An electro-optic element comprising a functional layer including a first electrode layer, a second electrode layer, and at least a light emitting layer disposed between the first electrode layer and the second electrode layer on a substrate. In the method of manufacturing an electro-optical device that emits light emitted from the light emitting layer from the side facing the substrate through the second electrode layer,
Forming an insulating layer having an opening at a position corresponding to the first electrode layer on the substrate; and
An auxiliary electrode layer forming step of forming an auxiliary electrode layer electrically connected to the second electrode layer on the insulating layer;
A functional layer forming step of forming the functional layer on the insulating layer and the auxiliary electrode layer;
A peeling step of peeling the functional layer formed on the auxiliary electrode layer from the auxiliary electrode layer;
An electro-optical device manufacturing method comprising: an electrode layer forming step of forming the second electrode layer on the auxiliary electrode layer. The method of manufacturing the electro-optical device according to claim 1,
The method of manufacturing an electro-optical device, wherein the auxiliary electrode layer forming step is performed by a transfer method. The method of manufacturing an electro-optical device according to claim 1 or 2,
The peeling step is formed on the auxiliary electrode layer by rotating an adhesive roller-shaped transfer member in contact with the functional layer formed on the entire surface of the insulating layer and the auxiliary electrode layer. The method for producing an electro-optical device is characterized by peeling the functional layer from the auxiliary electrode layer. The method of manufacturing an electro-optical device according to claim 1 or 2,
The peeling step is formed on the auxiliary electrode layer by rotating an adhesive sheet while making contact with the functional layer formed on the entire surface of the insulating layer and the auxiliary electrode layer by a roller-shaped transfer member. A method for manufacturing an electro-optical device, comprising peeling off the functional layer formed from the auxiliary electrode layer. The method of manufacturing an electro-optical device according to claim 3 or 4,
An electro-optical device characterized in that the functional layer formed on the auxiliary electrode layer is peeled off from the auxiliary electrode layer by rotating the transfer member in contact with the auxiliary electrode layer in the longitudinal direction. Manufacturing method.

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