JP2007207895A - Light emitting device and light emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device and a light emitting module which do not easily cause deterioration in light emitting luminance even after long-time use by suppressing deterioration caused by light emitted from the light emitting element, even if the light emitting element is used with a shorter wavelength of the emitted light. <P>SOLUTION: In the light emitting device X provided with the light emitting element 1 and an optical member 2 covering at least a part of the portion of the light emitting element 1 from which light is emitted; the optical member 2 is formed of quartz glass, optical glass including a boric acid and a silisic acid, crystal, sapphire, or fluorite, etc. This optical member 2 includes a box type case 20 for accommodating the light emitting element 1. The light emitting element 1 is preferably placed closely in contact with the internal front surface of the case 20 via a glass joining material 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device having a light emitting element, and a light emitting module such as a lighting device or a display device including the light emitting device.

  As shown in FIG. 10, as the light emitting device 9, there is one in which a light emitting element 93 is accommodated in a space 92 formed by an insulating substrate 90 and a frame body 91 (see, for example, Patent Document 1).

  The insulating substrate 90 has a concave portion 94 for mounting the light emitting element 93, and conductor layers 95 and 96 are formed on the surface. The conductor layer 95 is electrically connected to the lower surface electrode (not shown) of the light emitting element 93 and is continuously provided from the bottom surface 94A of the recess 94 to the lower surface 90A of the insulating substrate 90. The conductor layer 96 is electrically connected to the upper surface electrode (not shown) of the light emitting element 93 through the wire 97, and is provided continuously from the upper surface 90B to the lower surface 90A of the insulating substrate 90.

  The frame body 91 has a through space 98 and is joined to the upper surface 90 </ b> B of the insulating substrate 90. In a state where the frame body 91 is bonded to the insulating substrate 90, a space 92 for mounting the light emitting element 93 is formed by the concave portion 94 of the insulating substrate 90 and the through space 98 of the frame body 91. In this space 92, a light transmitting part 99 is provided to protect the light emitting element 93. The translucent part 99 is formed by filling the space 92 with a transparent resin.

  Various light-emitting elements 93 are used. For example, in the light-emitting device 9, when white light is emitted, a light-emitting diode that emits blue light is used. In this case, a wavelength conversion layer for converting blue light into yellow light is provided on the surface of the light transmitting portion 99 or the light emitting element 93, or a phosphor that emits yellow fluorescence is contained inside the light transmitting portion 99. It is done.

  On the other hand, in recent years, light emitting elements that emit shorter wavelength light (near ultraviolet light to blue light) have been developed (see, for example, Patent Document 2). It can be used when white light is emitted from the light emitting device 9.

Japanese Patent Laid-Open No. 5-175553 JP 2004-342732 A

  However, in the light emitting device 9, the light emitted from the light emitting element 93 is partially absorbed by the light transmitting portion 99 when the light transmitting portion 99 is formed of resin. Then, the intermolecular bonds of the resin are broken by the absorbed light energy, and the material properties such as the transmittance, the adhesive strength, and the hardness of the light transmitting portion 99 are deteriorated with time. Further, when the translucent part 99 is formed by curing an uncured translucent part 99 such as a sol-gel glass or a low melting point glass made of an inorganic material, the translucent part 99 occurs when the translucent part 99 is cured. A crack is generated in the light transmitting portion 99 due to the stress caused by the volume shrinkage of the light transmitting portion 99. As a result, when the light-emitting device 9 is used for a long period of time, problems such as a decrease in light emission luminance of the light-emitting device 9 occur due to deterioration of the transmittance of the light-transmitting portion 99 and cracks generated in the light-transmitting portion 99. obtain. In particular, like the light emitting device 9 that emits white light, a light emitting element 93 that emits light with a short wavelength, such as a light emitting diode that generates light from the ultraviolet region to the near ultraviolet region, or a blue light emitting diode is used. In such a case, there is a high possibility that characteristics such as the transmittance, adhesive strength, and hardness of the translucent part 99 are deteriorated. In the case of using a light emitting element that emits light having a shorter wavelength, which has been developed in recent years. The possibility that the characteristics of the translucent part 99 will deteriorate is further increased.

  The present invention has been made in view of the above-described circumstances, and is emitted from a light emitting element even when a light emitting element having a short wavelength of emitted light including an ultraviolet region to a near ultraviolet region and a blue region is used. It is an object of the present invention to provide a light emitting device and a light emitting module that can suppress deterioration of characteristics such as transmittance, adhesive strength, hardness, and the like due to light, and are less susceptible to deterioration of light emission luminance even after long-term use. .

  In the first aspect of the present invention, a container made of a translucent inorganic material, having a concave opening, and accommodated in the concave opening of the container via a glass bonding material, the first on the substrate, And a light-emitting element on which the light-emitting layer and the second conductive-type layer are formed, and a lid made of a light-transmitting inorganic material and closing the concave opening of the container. A light emitting device is provided.

  The light emitting element is preferably adhered to the inner surface of the container via a glass bonding material.

  It is preferable that the lid closes the concave opening in a state of being in close contact with the light emitting element via a glass bonding material.

  The refractive index of the glass bonding material is preferably set smaller than the refractive indexes of the container and the lid.

  The light emitting element has, for example, a first electrode formed on the surface of the substrate and a second electrode formed on the surface of the second conductivity type layer.

  In this case, the light-emitting device of the present invention is conductively connected to the first electrode, and is electrically connected to the second electrode and the first external connection conductor that penetrates the container and is partially exposed on the surface of the container. And a second external connection conductor that penetrates the lid and is partially exposed on the surface of the lid.

  The container may have a configuration including a cylindrical member having a through space for accommodating the light emitting element, and a mounting substrate on which the opening of the container is mounted and the light emitting element is mounted.

  In this case, the light emitting device of the present invention is configured to be further connected to the first and second electrodes and further provided with first and second external connection conductors provided on the surface of the mounting substrate. Can do. The first and second external connection conductors are provided, for example, as extending continuously on the upper surface, side surface, and lower surface of the mounting substrate. In addition, the first external connection conductor is, for example, substantially conductively connected to the first electrode (without passing through a relay conductor such as a relay lead (excluding the conductive bonding material)), and the second external connection conductor The connection conductor is conductively connected to the second electrode, for example, via a relay lead.

  The container or the lid contains, for example, one or more kinds of phosphors for converting the wavelength of light emitted from the light emitting element. In this case, the phosphor is preferably unevenly distributed on the outer surface portion of the container or the lid.

  The light emitting element emits light having at least one emission intensity peak in the wavelength range of 230 to 450 nm, for example, the first conductive type layer, the second conductive type layer, and the light emitting layer are zinc oxide-based. Those formed by the compound are used. In this case, the plurality of kinds of phosphors emit light emitted from the light emitting element, light having a peak of emission intensity in a wavelength range of 400 to 500 nm, light having a peak of emission intensity in a wavelength range of 500 to 600 nm, And first to third phosphors which respectively convert to light having a peak of emission intensity in the wavelength range of 600 to 700 nm.

  According to a second aspect of the present invention, there is provided a light emitting module in which one or a plurality of light emitting devices are mounted on an insulating substrate, the light emitting device according to the first aspect of the present invention. A featured light emitting module is provided.

  The insulating substrate may have a plurality of recesses for accommodating a plurality of light emitting devices. In this case, each light emitting device is fitted into a corresponding recess among the plurality of recesses.

  The light emitting module of the present invention is configured to be used as, for example, a lighting device or a display device.

  A light-emitting device according to the present invention is made of a light-transmitting inorganic material, and has a container having a concave opening, and is accommodated in the concave opening of the container via a glass bonding material. The light-emitting element includes a light-emitting element in which a layer, a light-emitting layer, and a second conductivity type layer are formed, and a lid that is made of a light-transmitting inorganic material and closes the concave opening of the container. Protected by material container and lid. That is, the container and lid made of a light-transmitting inorganic material are less likely to break the molecular structure due to the light energy from the light-emitting element, and the light-emitting element is protected from the light-emitting element compared to conventional light-emitting devices that protect the periphery of the light-emitting element with resin. The possibility that the elements (the container and the lid) that protect the light emitting element with light are deteriorated by light energy is reduced, and the light emission luminance of the light emitting device is suppressed from being lowered. Thereby, the light-emitting device according to the present invention can output stable light over a long period of time.

  Further, in the light emitting module according to the present invention, for example, the lighting device or the display device, since the previous light emitting device is used, it is possible to perform stable illumination and display over a long period of time.

  Furthermore, when the light emitting element is closely attached to the inner surface of the container via the glass bonding material, the stress generated by the volume shrinkage in the process of manufacturing the light emitting device is limited to the glass bonding material. That is, as a translucent inorganic material that covers the entire light emitting element, a solid container and a lid are prepared in advance, and when the light emitting element is disposed inside the container, the light emitting element and the inner surface of the container and the lid The gap is made as thin as possible, and this gap is filled with a glass bonding material and cured. Thereby, while restrict | limiting the member which volume shrinks in the manufacture process of a light-emitting device to a glass bonding material, the crack which generate | occur | produces in a glass bonding material can be suppressed by making the volume of the glass bonding material with which the clearance gap was filled as much as possible. As a result, cracks generated in the container, the lid, or the glass bonding material generated in the manufacturing process of the light emitting device are suppressed. As a result, the light emitting device can output stable light over a long period of time. Further, the possibility of gas remaining between the light emitting element and the container and the lid is reduced by the glass bonding material. Therefore, compared with the case where gas remains between a light emitting element, a container, and a lid | cover, possibility that the light from a light emitting element will be reflected between a light emitting element, a container, and a lid | cover will be reduced. Thereby, in the light emitting device of the present invention, light from the light emitting element can be efficiently introduced into the container and the lid. In particular, when the refractive index of the glass bonding material is set smaller than the refractive index of the container and the lid, reflection at the interface between the glass bonding material and the container and the lid can be suppressed, and the container, the lid, and the external gas Some of the light reflected at the interface is totally reflected and emitted sideways at the interface between the glass bonding material and the container and the lid according to Snell's law. This suppresses light absorption by the light emitting element and increases the amount of light emitted to the outside of the light emitting device. As a result, light from the light emitting element can be more efficiently introduced into the container and the lid through the glass bonding material, and the light output of the light emitting device can be improved.

  Further, if a part of the first and second external connection conductors are exposed or provided on the surface of the mounting substrate, the light emitting device of the present invention can be applied to a wiring board or a circuit board on which predetermined wirings are formed. Various connection means can be applied to the mounting substrate for appropriate conductive connection. Further, if the first and second external connection conductors are formed in a film shape continuously extending on the upper surface, the side surface, and the lower surface of the mounting substrate, the light emitting device of the present invention can be surface mounted on the mounting substrate.

  Further, if the container and the lid include one or more kinds of phosphors for converting the wavelength of light emitted from the light emitting element, light having a target wavelength can be emitted from the light emitting device. it can. For example, as the light emitting element, one that emits light having at least one emission intensity peak in a wavelength range of 230 to 450 nm, for example, is used, while light emitted from the light emitting element as a plurality of types of phosphors. Is converted into light having an emission intensity peak in the wavelength range of 400 to 500 nm, light having an emission intensity peak in the wavelength range of 500 to 600 nm, and light having an emission intensity peak in the wavelength range of 600 to 700 nm. In the case where the first to third phosphors are used, white light can be emitted from the light emitting device.

  Of course, the light emitting device of the present invention can be configured to emit light other than white light depending on the type of phosphor used, for example, red light, green light, blue light, yellow, magenta, cyan. Etc. can be emitted.

  Further, when the phosphor is unevenly distributed on the outer surface portion of the container or the lid, the thickness of the portion containing the phosphor is reduced, so that the optical path of the light that is transmitted vertically and the light that is transmitted obliquely through this portion. The difference becomes smaller. As a result, the difference in wavelength conversion amount between vertically transmitted light and obliquely transmitted light is reduced, so that a part of the light from the light emitting element is transmitted as it is, while the wavelength of the other light is transmitted. Is converted and the mixed colors thereof are emitted, it is possible to emit light of the same color from the whole while suppressing color unevenness.

  In the light emitting device of the present invention, the container or lid is made of quartz glass, optical glass containing boric acid and silicic acid, crystal, sapphire, or meteorite, and therefore emits light having a short wavelength as a light emitting element. Even when using a zinc oxide compound semiconductor that emits blue light or near-ultraviolet light, for example, it is possible to effectively suppress deterioration of the container and the lid. Can be effectively suppressed.

  Hereinafter, first to third embodiments of the present invention will be described with reference to the drawings.

  First, a light emitting device according to a first embodiment of the present invention will be described with reference to FIGS.

  A light emitting device X shown in FIGS. 1 to 3 includes an optical member 2 including a light emitting element 1, a container 20 and a lid 21, and external connection terminals 3 </ b> A and 3 </ b> B, and a space formed by the optical member 2. The light emitting element 1 is housed in the housing. That is, in the light emitting device X, the entire light emitting element 1 is covered with the optical member 2.

  The light emitting element 1 is formed by stacking an n-type semiconductor layer 11, a light emitting layer 12, and a p-type semiconductor layer 13 on a substrate 10, and is configured to emit light at least laterally. The light-emitting element 1 is, for example, a ZnO-based oxide semiconductor light-emitting diode, and is configured to emit light having a wavelength of 230 nm to 450 nm. Of course, as the light-emitting element 1, a device other than a ZnO-based oxide semiconductor light-emitting diode can be used. For example, a compound semiconductor such as a silicon carbide (SiC) -based compound semiconductor, a diamond-based compound semiconductor, or a boron nitride-based compound semiconductor. The type of the light-emitting element 1 to be used may be appropriately selected according to the wavelength of light emitted from the light-emitting device X.

  Electrodes 14 and 15 are formed on the lower surface 10 </ b> A of the substrate 10 and the upper surface 13 </ b> A of the p-type semiconductor layer 13. These electrodes 14 and 15 are for applying a voltage between the n-type semiconductor layer 11, the light-emitting layer 12 and the p-type semiconductor layer 13 in order to emit light from the light-emitting layer 12. The electrodes 14 and 15 are formed of a transparent material when it is necessary to transmit light, and are formed of a highly reflective material when it is necessary to reflect light. As a material for forming the electrodes 14 and 15, when the electrodes 14 and 15 are formed transparently, ITO (Indium Tin Oxide) glass, a zinc oxide based transparent conductive film, indium (In) and tin (Sn), An oxide of SnO2, In2O3, or the like is used. Further, when the electrodes 14 and 15 are formed with high reflectivity, metals and alloys having high reflectivity with respect to light having a wavelength of 230 nm to 450 nm such as aluminum, rhodium, and silver are used.

  The optical member 2 functions to protect the light emitting element 1 and also serves to guide light emitted from the light emitting element 1 to the outside, and includes a container 20 and a lid 21.

  The container 20 is formed in a bottomed box shape having a concave portion 22 and an upper opening 23 as well as being translucent as a whole by an inorganic material. As the translucent inorganic material for forming the container 20, for example, quartz glass, optical glass containing boric acid and silicic acid, quartz, sapphire, or meteorite can be used.

  The recess 22 is for housing the light emitting element 1 and has a larger volume than the light emitting element 1. In the recess 22, the light emitting element 1 is accommodated with the glass bonding material 4 interposed between the inner surface 24 of the recess 22 and the side surface of the light emitting element 1.

  The glass bonding material 4 has translucency and is made of, for example, a material having a refractive index smaller than that of the optical member 2. Such a glass bonding material 4 has a high transmittance with respect to light having a wavelength of 230 nm to 450 nm, such as sol-gel glass, water glass, low melting point glass, and the like, and is made mineral by utilizing melting or hydrolysis reaction. A bonding material made of a light-transmitting inorganic material can be used.

  The lid 21 seals the upper opening 23 of the container 20 and is a plate having translucency by an inorganic material made of quartz glass, optical glass containing boric acid and silicic acid, quartz, sapphire, or meteorite. Is formed. Examples of the light-transmitting inorganic material for forming the lid 21 include quartz glass for forming the container 20, optical glass containing boric acid and silicic acid, quartz. The same thing as the translucent inorganic material which consists of sapphire or a meteorite etc. can be used. Thereby, the difference in thermal expansion between the container 20 and the lid 21 is eliminated, and the stress due to the thermal expansion difference generated in the manufacturing process or operating environment of the light emitting device X is suppressed, and the container 20, the lid 21 or the glass bonding material 4 is suppressed. The occurrence of breakage such as cracks can be suppressed.

  The lid 21 is fixed to the container 20 via a bonding material 40 made of an inorganic material such as sol-gel glass, low melting point glass, water glass, or solder. When the upper opening 23 of the container 20 is closed by the lid 21, a translucent inorganic material such as sol-gel glass, low-melting glass, water glass, etc. is provided between the inner surface 25 of the lid 21 and the upper surface of the light emitting element 1. A glass bonding material 4 made of is interposed.

  Note that the bonding material 40 may be omitted when the glass bonding material 4 can maintain a sufficient bonding strength between the light emitting element 1 and the lid 21.

  The external connection conductors 3A and 3B are portions that are electrically connected to wirings and terminals of the mounting board when the light emitting device X is mounted on a predetermined mounting board. The external connection conductor 3 </ b> A penetrates the bottom wall container 20 </ b> A of the container 20, and both end portions 30 </ b> A and 31 </ b> A protrude from the bottom wall container 20 </ b> A of the container 20. That is, the end 30 </ b> A is conductively connected to the electrode 14 of the light emitting element 1, and the end 30 </ b> B is exposed in a state of protruding from the container 20. On the other hand, the external connection conductor 3 </ b> B penetrates the lid 21, and both end portions 30 </ b> B and 31 </ b> B protrude from the lid 21. That is, the end 30 </ b> B is conductively connected to the electrode 15 of the light emitting element 1, and the end 31 </ b> B is exposed in a state of protruding from the lid 21. Furthermore, since the external connection conductors 3A and 3B are arranged in a direction perpendicular to the light emitted from the light emitting element 1 to the side, light absorption by the external connection conductors 3A and 3B is reduced, and the light emitting device The light output of X is improved.

  In the light emitting device X, quartz glass, optical glass containing boric acid and silicic acid, quartz. The entire light emitting element 1 is surrounded by the optical member 2 (20, 21) formed of sapphire or meteorite. Therefore, in the light emitting device X, the light emitted from the light emitting element 1 is absorbed around the light emitting element 1 (the optical member 2 (20, 21)) as compared with the optical member 2 (20, 21) formed of resin. Even if it is done, the molecular structure is not easily broken by this light energy, which is caused by the light energy from the light emitting element 1 as compared with the conventional light emitting device 9 (see FIG. 10) that protects the periphery of the light emitting element 1 with resin. The possibility that the transmittance and mechanical strength of the optical member 2 (20, 21) are deteriorated is extremely small. Furthermore, the light emitting element 1 is arranged inside the container 20 in which the concave portion 22 is formed, and the gap between the light emitting element 1 and the inner surfaces 23 and 25 is filled with the glass bonding material 4 and sealed with the lid 21. The stress generated by the volume shrinkage in the manufacturing process of the light emitting device X is limited to the glass bonding material 4. That is, when the solid optical member 2 (20, 21) is prepared in advance as a light-transmitting inorganic material covering the entire light-emitting element 1, and the light-emitting element 1 is disposed inside the container 20, the light-emitting element 1 The gap between 1 and the inner surfaces 23 and 25 is made as thin as possible, and the gap is filled with the glass bonding material 4 and cured. Thereby, while limiting the member which volume shrinks in the manufacture process of the light-emitting device X to the glass bonding material 4, the crack which generate | occur | produces in the glass bonding material 4 by making the volume of the glass bonding material 4 with which the clearance gap was filled as small as possible. Can be suppressed. As a result, the possibility that the transmittance and mechanical strength of the element (optical member 2 (20, 21)) that protects the light-emitting element 1 by the light from the light-emitting element 1 deteriorates is reduced, and the light emission luminance of the light-emitting device X is reduced. While being suppressed, the crack which generate | occur | produces in the optical member 2 (20, 21) and the glass bonding material 4 which generate | occur | produce in the manufacturing process of a light-emitting device is suppressed. Thereby, the light emitting device X can output stable light over a long period of time.

  The glass bonding material 4 preferably has a thickness of 0.05 to 1 mm. When the thickness of the glass bonding material 4 is smaller than 0.05 mm, the glass bonding material 4 has a mechanical strength such as adhesive strength and hardness. The characteristics are remarkably deteriorated, the optical member 2 (20, 21) is easily detached from the light emitting element 1 and a crack is easily generated in the glass bonding material 4 with respect to a physical impact on the light emitting device X. The light output is reduced.

  Further, when the thickness of the glass bonding material 4 is larger than 1 mm, cracks are likely to occur due to the volume shrinkage that occurs when the uncured glass bonding material 4 is cured and the stress generated therewith. Output and long-term reliability are reduced. Therefore, it is preferable that the glass bonding material 4 has a thickness of 0.05 to 1 mm, and the light emitting device X can operate normally over a long period of time.

  Further, by adopting a configuration in which the optical member 2 (20, 21) is brought into close contact with the light emitting element 1 through the glass bonding material 4, the light emitting element 1 and the optical member 2 (20, 21) are interposed. The possibility of remaining gas is reduced. Therefore, compared with the case where gas remains between the light emitting element 1 and the optical member 2, the possibility that the light from the light emitting element 1 is reflected between the light emitting element 1 and the optical member 2 is reduced. . Thereby, in the light-emitting device X, the light from the light-emitting element 1 can be efficiently introduced into the optical member 2 (20, 21). In particular, when the refractive index of the glass bonding material 4 is set to be smaller than the refractive index of the optical member 2 (20, 21), the light emitting element 1 at the interface between the glass bonding material 4 and the optical member 2 (20, 21). Is incident on the optical member 2 (20, 21) non-reflectingly according to Snell's law, and part of the light reflected at the interface between the optical member 2 (20, 21) and the external gas is At the interface between the glass bonding material 4 and the optical member 2 (20, 21), a part of the light is totally reflected and emitted to the side according to Snell's law. Thereby, the light absorption by the light emitting element 1 is suppressed, and the amount of light emitted to the outside of the light emitting device X increases. As a result, by adopting a configuration in which the optical member 2 (20, 21) is in close contact with the light emitting element 1 through the glass bonding material 4, the light from the light emitting element 1 is transmitted to the optical member 2 (20, 20). 21), the light output of the light-emitting device X can be improved.

  Next, a light emitting module according to a second embodiment of the present invention will be described with reference to FIGS.

  The light emitting module 5 shown in FIGS. 4 and 5 can be used as a lighting device or a display device, and includes a plurality of light emitting devices 6 and an insulating substrate 7.

  The plurality of light-emitting devices 6 are formed by surrounding the light-emitting element 60 with an optical member 61 in the same manner as the light-emitting device X described above (see FIGS. 1 to 3), and are formed in a rectangular parallelepiped shape as a whole. ing. The optical member 61 has a container 62 and a lid 63. The container 62 and the lid 63 are provided with external connection terminals 64 and 65 penetrating them.

  The insulating substrate 7 is for positioning and fixing the plurality of light emitting devices 6 and for supplying driving power to each light emitting device 6. The insulating substrate 7 has a first substrate 71 in which a plurality of through holes 70 are formed, and a second substrate 72 in which wiring (not shown) is patterned.

  The plurality of through holes 70 of the first substrate 71 are for housing the light emitting device 6 and are arranged in a matrix. A pair of terminals 73 and 74 for contacting the electrodes 62 and 63 of the light emitting device 6 are provided on the inner surface of each through hole 70 so as to face each other. That is, in a state where the light emitting device 6 is accommodated in each through hole 70, the plurality of light emitting devices 6 are arranged in a matrix, and the electrodes 62 and 63 of each light emitting device 6 and the pair of terminals 73 of the through hole 70, 74 is in a conductive connection state.

  The wiring (not shown) of the second substrate 72 is conductively connected to the pair of terminals 73 and 74 of the first substrate 71. This wiring is further conductively connected to a terminal 75 provided on the side surface of the second substrate 72. The wiring pattern is designed according to the driving mode of the plurality of light emitting devices 6 in the light emitting module 5, for example.

  For example, when the light emitting module 5 is configured as a display device, each light emitting element device 6 can be individually driven, and thus the wiring is patterned so that each light emitting device 6 can be individually driven. On the other hand, when the light emitting module 5 is configured as a lighting device, each light emitting device 6 is not necessarily configured to be individually drivable. For example, all the light emitting devices 5 can be simultaneously driven, or a plurality of light emitting devices 5 are grouped into a plurality of groups. In other words, each group can be driven, and the wiring is patterned so that such driving is possible.

  In the light emitting module 5, the light emitting device 6 is the same as the light emitting device X described above (see FIGS. 1 to 3). That is, in the light emitting device 6, the optical member 61 (62, 63) is suppressed from being deteriorated by the light from the light emitting element 60, and thus the light emitting module 5 using such a light emitting device 6 is long. It becomes possible to output stable light over a period.

  In the light emitting module 5, a plurality of through holes 70 are provided in the first substrate 71, and the light emitting device 6 is accommodated in the through holes 70. It may be simply implemented.

  The light-emitting device employed in the light-emitting device and the light-emitting module according to the present invention is not limited to those described with reference to FIGS. 1 to 3 and can be variously changed. For example, the light emitting device can be configured as shown in FIGS. 6 and 7, and in this case as well, the same operational effects as those of the previous light emitting device X (see FIGS. 1 and 2) can be achieved.

  FIG. 6A and FIG. 6B show other examples of the containers 26 and 27 in the optical member. These containers 26 and 27 are composed of cylindrical members 26A and 27A having through spaces 26Aa and 27Aa and plate-like members 26B and 27B, and as a whole, similar to the container 20 of the light-emitting device X described above. It is formed in a bottomed box shape.

  The cylindrical members 26A and 27A have through spaces 26Aa and 27Aa for accommodating the light emitting elements. The cylindrical member 26A (see FIG. 6A) of the container 26 is formed integrally, and the cylindrical member 27A of the container 27 (see FIG. 6B) is composed of four flat plates 27Ab, It consists of 27Ac. On the other hand, the plate-like members 26B and 27B are for closing the lower openings 26Ad and 27Ad of the cylindrical members 26A and 27A.

  In the light emitting devices X1 and X2 shown in FIGS. 7A and 7B, phosphors 28Aa and 29Aa are dispersed in containers 28A and 29A of optical members 28 and 29, respectively. The light emitting device X1 shown in FIG. 7A is obtained by dispersing the phosphor 28Aa in the entire container 28A in the optical member 28, and the light emitting device X2 shown in FIG. 7B has the phosphor 29Aa. The optical member 29 is selectively dispersed on the outer surface portion of the container 29A.

  The same effect can be obtained when the phosphor is dispersed in the glass bonding material 4 without dispersing the phosphor in the optical member. (Not shown)

  The phosphors 28Aa and 29Aa to be contained in the containers 28A and 29A of the optical members 28 and 29 are selected according to the wavelength (color) of light to be emitted from the light emitting devices X1 and X2. For example, when white light is emitted from the light emitting devices X1 and X2, as the phosphors 28Aa and 29Aa, the light emitted from the light emitting element 1 is converted into light having a peak of emission intensity in the wavelength range of 400 to 500 nm. A first phosphor to be converted, a second phosphor to be converted to light having an emission intensity peak in a wavelength range of 500 to 600 nm, and a third fluorescence to be converted to light having an emission intensity peak in a wavelength range of 600 to 700 nm The body is used. Examples of the first phosphor include (Sr, Ca, Ba, Mg) 10 (PO4) 6Cl2: Eu or BaMgAl10O17: Eu. Examples of the second phosphor include SrAl2O4: Eu and ZnS: Cu, Al or SrGa2S4: Eu can be mentioned, and examples of the third phosphor include SrCaS: Eu or La2O2S: Eu, LiEuW2O8.

  On the other hand, when white light is emitted from the light emitting devices X1 and X2 using the first to third phosphors, the light emitting element 1 has at least one emission intensity peak in the wavelength range of 230 to 450 nm, for example. What emits the light which it has is used. Examples of such a light-emitting element 1 include compound semiconductor light-emitting diodes such as ZnO-based oxide semiconductors, silicon carbide (SiC) -based compound semiconductors, diamond-based compound semiconductors, and boron nitride-based compound semiconductors.

  In addition, a light emitting element 1 that emits blue light is used, and phosphors 28Aa and 29Aa that convert blue light into yellow light, such as yttrium, aluminum, and garnet fluorescence activated by cerium (Ce), are used. A white light may be emitted from the light emitting devices X1 and X2 by using an alkaline earth metal orthosilicate phosphor activated with a body (YAG) or divalent europium (Eu).

  Since the light emitting device X1 shown in FIG. 7A is obtained by dispersing the phosphor 28Aa in the entire container 28A of the optical member 28, the optical member 28 (container 28A) in which the phosphor 28Aa is dispersed is simplified. Can be formed. That is, the light emitting device X1 has an advantage that the optical member 28 (28A) can be easily manufactured. On the other hand, in the light emitting device X2 shown in FIG. 7B, the phosphor 29Aa is selectively dispersed on the outer surface portion of the container 29A in the optical member 29. Therefore, the container 29A of the optical member 29 is horizontally disposed. The optical path difference is small between the traveling light and the light traveling in the direction inclined from the horizontal direction. As a result, since the difference in wavelength conversion between the light transmitted in the horizontal direction and the light transmitted obliquely becomes small, a part of the light from the light emitting element 1 is transmitted as it is, When the mixed colors are emitted by converting the wavelengths, it is possible to emit light of the same color from the whole while suppressing color unevenness.

  Of course, the light emitting devices X1 and X2 can be configured to emit light other than white by appropriately selecting the type of phosphors 28Aa and 29Aa to be used. The lids 28B and 29B may contain phosphors 28Aa and 29Aa, and the phosphors 28Aa and 29Aa corresponding to the bottom walls 28Ab and 29Ab of the containers 28A and 29A of the optical members 28 and 29 may be omitted. Further, instead of dispersing the phosphors 28Aa and 29Aa in the containers 28A and 29A of the optical members 28 and 29, a wavelength conversion layer containing the phosphor may be provided on the outer surfaces of the optical members 28 and 29.

  Next, a light-emitting device according to a third embodiment of the present invention will be described with reference to FIGS.

  The light emitting device X3 shown in FIG. 8 is configured to be surface-mountable, and includes a light emitting element 80 and an optical member 81 formed in a hollow shape.

  The light-emitting element 80 is the same as the light-emitting element 1 (see FIGS. 1 to 3) of the light-emitting device X according to the first embodiment of the present invention described above, and includes electrodes 80A and 80B. Yes. The light emitting element 80 is accommodated inside the optical member 81 with a glass bonding material 82 interposed between the outer surface thereof and the inner surface of the optical member 81. That is, in the light emitting device X3, the entire light emitting element 80 is surrounded by the optical member 81.

  The glass bonding material 82 has a refractive index smaller than that of the optical member 81. In addition, as a material for forming the glass bonding material 82, the same material as the light-emitting device X described above (see FIGS. 1 to 3) can be used.

  The optical member 81 has a configuration in which the upper opening 83A of the container 83 is closed with a lid 84, and is formed of a translucent inorganic material as a whole having translucency. As the inorganic material for forming the optical member 81 (the container 83 and the lid 84), the same material as the light emitting device X described above (see FIGS. 1 to 3) can be used.

  As shown in FIGS. 8 and 9, the lid 84 is provided with a lead 85 </ b> A for electrical connection to the electrode 80 </ b> A of the light emitting element 80.

  The container 83 is formed in a bottomed box shape by closing the lower opening 86 </ b> A of the cylindrical member 86 with the mounting substrate 87. On the inner surface 86B of the cylindrical member 86, a lead 85B extending in the vertical direction is formed. The lead 85B is in contact with the lead 85A of the lid 84.

  The mounting substrate 87 is for mounting the light emitting element 80 and for closing the lower opening 86 </ b> A of the cylindrical member 86. External mounting conductors 88 and 89 are formed on the mounting substrate 87.

  The external connection conductors 88 and 89 are the upper surface conductor portions 88A and 89A that are conductively connected to the electrodes 80A and 80B of the light emitting element 80, and the lower surface conductor portions 88B and 89B that are conductively connected to the wiring of an object to be mounted such as a circuit board. And side conductor portions 88C and 89C that connect the upper conductor portions 88A and 89A and the lower conductor portions 88B and 89B.

  The upper conductor portion 88A is electrically connected to the electrode 80B of the light emitting element 80 via a conductive bonding material such as solder or conductive resin. On the other hand, the upper conductor portion 89A is conductively connected to the electrode 80A of the light emitting element 80 via leads 85A and 85B.

  In the light emitting device X3, the light emitting element 80 is surrounded by the optical member 81 formed of glass, and the glass bonding material 82 is interposed between the inner surface of the optical member 81 and the surface of the light emitting element 80. Therefore, similarly to the light-emitting device X described above (see FIGS. 1 and 2), the light emitted from the light-emitting element 80 can be efficiently guided to the optical member 81. In addition, since the refractive index of the optical member 81 is larger than that of the glass bonding material 82, when light enters the optical member 81 from the glass bonding material 82, the interface between the glass bonding material 82 and the optical member 81. Generation of reflection is suppressed, light from the light emitting element 80 can be guided to the optical member 81 more efficiently, and part of the light reflected at the interface between the optical member 81 and the external gas is glass bonded. At the interface between the material 82 and the optical member 81, a part of the light is totally reflected and emitted to the side according to Snell's law. Thereby, light absorption by the light emitting element 80 is suppressed, and the amount of light radiated to the outside of the light emitting device X3 increases. As a result, the light from the light emitting element 80 can be more efficiently introduced into the optical member 81 through the glass bonding material 82, and the light output of the light emitting device X3 can be improved.

1 is an overall perspective view showing a light emitting device according to a first embodiment of the present invention. It is a longitudinal cross-sectional view of the light-emitting device shown in FIG. It is a disassembled perspective view of the light-emitting device shown in FIG. It is a whole perspective view which shows the light emitting module which concerns on the 2nd Embodiment of this invention. It is the perspective view which decomposed | disassembled one part which shows the principal part of the light emitting module shown in FIG. It is a longitudinal cross-sectional view which shows the other example of the optical member in a light-emitting device. It is a longitudinal perspective view which shows the other example of a light-emitting device. It is a longitudinal cross-sectional view which shows the light-emitting device which concerns on the 3rd Embodiment of this invention. It is a disassembled perspective view which shows the optical member in the light-emitting device shown in FIG. It is sectional drawing which shows an example of the conventional light-emitting device.

Explanation of symbols

X, X1 to X3 light emitting device 1,80 light emitting element 10 (light emitting element) substrate 11 (light emitting element) n-type semiconductor layer (first conductivity type layer)
12 (light emitting element) light emitting layer 13 (light emitting element) p-type semiconductor layer (second conductivity type layer)
14, 80B (light emitting element) electrode (first electrode)
15, 80A (light emitting element) electrode (second electrode)
2,26-29,81 Optical member Container 20, 26-29 (Optical member) Container lid 21, 28B, 29B (Optical member) Lid 23 (Container) upper opening 26A, 27A (Container) cylindrical member 26B, 27B (container) plate-like member (mounting board)
28Aa, 29Aa (Optical member) phosphor 3A, 64, 88 External connection conductor (first external connection conductor)
3B, 65, 89 External connection conductor (second external connection conductor)
4, 82 Glass bonding material 5 Light emitting module 7 Insulating substrate (of light emitting module) 70 Recessed portion (of insulating substrate) 85A, 85B Lead (relay lead)

Claims (18)

A container made of a light-transmitting inorganic material and having a concave opening, and is accommodated in the concave opening of the container via a glass bonding material. On the substrate, the first conductivity type layer, the light emitting layer, and the second A light-emitting device comprising: a light-emitting element on which the conductive type layer is formed; and a lid made of a light-transmitting inorganic material and closing the concave opening of the container. The light emitting device according to claim 1, wherein the light emitting element is in close contact with the inner surface of the container via a glass bonding material. The light emitting device according to claim 2, wherein the lid closes the concave opening in a state of being in close contact with the light emitting element via a glass bonding material. The light emitting device according to claim 2 or 3, wherein a refractive index of the glass bonding material is set smaller than a refractive index of the container or the lid. The light emitting element has a first electrode formed on the surface of the substrate and a second electrode formed on the surface of the second conductivity type layer, and
The first external connection conductor that is conductively connected to the first electrode, penetrates the container and is partially exposed on the surface of the container, and is conductively connected to the second electrode, and The light-emitting device according to claim 1, further comprising a second external connection conductor that penetrates the lid and is partially exposed on a surface of the lid. The said container contains the cylindrical member which has the penetration space for accommodating the said light emitting element, and the mounting board | substrate with which the said light emitting element is mounted while closing the opening part of the said container. 5. The light emitting device according to any one of 4. The light emitting element includes a first electrode formed on the surface of the substrate and a second electrode formed on the surface of the second conductivity type layer, and
The light-emitting device according to claim 6, further comprising first and second external connection conductors that are conductively connected to the first and second electrodes and provided on a surface of the mounting substrate. The light emitting device according to claim 7, wherein the first and second external connection conductors are formed in a film shape continuously extending on an upper surface, a side surface, and a lower surface of the mounting substrate. The first external connection conductor is substantially conductively connected to the first electrode, and the second external connection conductor is conductively connected to the second electrode via a relay lead. The light emitting device according to claim 8. The light emitting device according to any one of claims 1 to 9, wherein the container or the lid contains one or more kinds of phosphors for converting a wavelength of light emitted from the light emitting element. The light emitting device according to claim 10, wherein the phosphor is unevenly distributed on an outer surface portion of the container or the lid. The light emitting element emits light having at least one emission intensity peak in a wavelength range of 230 to 450 nm, and the plurality of types of phosphors emit light emitted from the light emitting element at 400 to 500 nm. Are converted into light having an emission intensity peak in the wavelength range of 500 nm, light having an emission intensity peak in the wavelength range of 500 to 600 nm, and light having an emission intensity peak in the wavelength range of 600 to 700 nm. The light emitting device according to claim 10 or 11, comprising three phosphors. The light emitting device according to claim 1, wherein the substrate, the first conductive type layer, the second conductive type layer, and the light emitting layer are zinc oxide-based compounds. 14. A light emitting module comprising one or more light emitting devices mounted on an insulating substrate, wherein the light emitting device is the one described in any one of claims 1 to 13. The insulating substrate has a plurality of recesses corresponding to the shapes of the plurality of light emitting devices, and each of the light emitting devices is fitted in a corresponding recess of the plurality of recesses. The light emitting module according to 1. The light emitting module according to claim 15, wherein the insulating substrate includes first and second connection conductors having a portion that is conductively connected to the light emitting device and a portion that is connected to an external wiring. The light emitting module of Claim 16 comprised so that it can be used as an illuminating device. The light emitting module of Claim 16 comprised so that it can be used as a display apparatus.

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