JP4817931B2 - Light emitting device and light emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device and a light emitting module capable of inhibiting deterioration by light emitted from a light emitting element even if the light emitting element with a short wavelength of emitted light is used, so that the deterioration in light emission brightness is hard to occur after a long-term use. <P>SOLUTION: The light emitting device X includes the light emitting element 1 consisting of a first conductivity type layer 11, a light emitting layer 12 and a second conductivity type layer 13 formed on a substrate 10 and an optical members 2 for tightly covering at least part of a region of the element 1 where the light is emitted. The optical member 2 is formed of glass. Preferably, the optical member 2 is brought into tight contact with the light emitting element 1 via a glass joining material 21. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a light emitting device having a light emitting element, and a light emitting module such as a lighting device or a display device including the light emitting device.

  As shown in FIG. 12, there is a light emitting device 9 in which a light emitting element 93 is accommodated in a space 92 formed by an insulating substrate 90 and a frame body 91 (see, for example, Patent Document 1).

  The insulating substrate 90 has a concave portion 94 for mounting the light emitting element 93, and conductor layers 95 and 96 are formed on the surface. The conductor layer 95 is electrically connected to the lower surface electrode (not shown) of the light emitting element 93 and is continuously provided from the bottom surface 94A of the recess 94 to the lower surface 90A of the insulating substrate 90. The conductor layer 96 is electrically connected to the upper surface electrode (not shown) of the light emitting element 93 through the wire 97, and is provided continuously from the upper surface 90B to the lower surface 90A of the insulating substrate 90.

  The frame body 91 has a through space 98 and is joined to the upper surface 90 </ b> B of the insulating substrate 90. In a state where the frame body 91 is bonded to the insulating substrate 90, a space 92 for mounting the light emitting element 93 is formed by the concave portion 94 of the insulating substrate 90 and the through space 98 of the frame body 91. In this space 92, a light transmitting part 99 is provided to protect the light emitting element 93. The translucent part 99 is formed by filling the space 92 with a transparent resin.

  Various light-emitting elements 93 are used. For example, in the light-emitting device 9, when white light is emitted, a light-emitting diode that emits blue light is used. In this case, a wavelength conversion layer for converting blue light into yellow light is provided on the surface of the light transmitting portion 99 or the light emitting element 93, or a phosphor that emits yellow fluorescence is contained inside the light transmitting portion 99. It is done.

  On the other hand, in recent years, light emitting elements that emit shorter wavelength light (near ultraviolet light to blue light) have been developed (see, for example, Patent Document 2). It can be used when white light is emitted from the light emitting device 9.

Japanese Patent Laid-Open No. 5-175553 JP 2004-342732 A

  However, in the light emitting device 9, a part of the light emitted from the light emitting element 93 is absorbed by the light transmitting portion 99 because the light transmitting portion 99 is made of resin. Therefore, the translucent part 99 deteriorates with time due to absorbed light energy. As a result, when the light emitting device 9 is used for a long period of time, problems such as a decrease in the light emission luminance of the light emitting device 9 may occur due to the deterioration of the light transmitting portion 99. In particular, when a light emitting element 93 that emits light having a short wavelength, such as a blue light emitting diode, is used as the light emitting device 93 such as the light emitting device 9 that emits pseudo white light, the light transmitting portion 99 may be deteriorated. In the case of using a light emitting element that has been developed in recent years and emits light having a shorter wavelength, there is a higher possibility that the translucent part 99 will be deteriorated.

  The present invention has been made in view of the above-described circumstances, and even when a light-emitting element having a short wavelength of emitted light is used, deterioration due to light emitted from the light-emitting element can be suppressed and used for a long time. It is an object of the present invention to provide a light emitting device and a light emitting module that are less likely to cause deterioration in light emission luminance.

In the first aspect of the present invention, a first conductive type layer, a light emitting layer, and a second conductive type layer are formed on a substrate, and the first conductive type layer, the light emitting layer, and the second conductive type layer are formed . A light emitting element having first and second electrodes for applying a voltage to the conductive type layer and a glass bonding material made of a glass material are provided on the side of the light emitting element so as to surround each of the layers. A translucent optical member made of an inorganic material , wherein the first and second electrodes are exposed without at least the surface being covered by the optical element, and the first and second electrodes are There is provided a light emitting device characterized in that at least one is a transparent electrode .

  According to a second aspect of the present invention, there is provided a light emitting module in which one or a plurality of light emitting devices are mounted on an insulating substrate, the light emitting device according to the first aspect of the present invention. A featured light emitting module is provided.

  The insulating substrate is mounted with, for example, a single light emitting device, and has first and second connection conductors that are conductively connected to the light emitting device. The first and second connection conductors have, for example, a portion that is conductively connected to the light emitting device and a portion that is connected to external wiring.

  The insulating substrate may have a plurality of recesses for accommodating a plurality of light emitting devices. In this case, each light emitting device is fitted into a corresponding recess among the plurality of recesses.

  The light emitting module of the present invention is configured to be used as, for example, a lighting device or a display device.

  In the light-emitting device according to the present invention, at least a part of a portion of the light-emitting element from which light is emitted is covered with an optical member formed of glass. Therefore, the light emitting element is protected by the optical member. The optical member is made of glass, but has a high transmittance with respect to light having a wavelength of 230 nm to 400 nm, the molecular structure is not easily broken by light absorption, and the transmittance and mechanical strength are not easily deteriorated. It is. In addition, the light-emitting element is not covered with glass that is transformed from liquid to solid, such as sol-gel glass or low-melting glass, but solid glass is disposed around the light-emitting element through a glass bonding material. As a result, the light from the light emitting element is efficiently incident on the optical member, and the light energy is quickly diffused to the outside from the optical member while being repeatedly reflected at the interface between the optical member and the external gas. Compared to a conventional light emitting device (see FIG. 12) in which the periphery of the light emitting element is protected by resin, the light output of the light emitting device is very unlikely to deteriorate due to light energy. As a result, the possibility that the element (optical member) that protects the light emitting element with the light from the light emitting element is deteriorated by the light energy is reduced, and the light emission luminance of the light emitting device is suppressed from decreasing. Thereby, the light-emitting device according to the present invention can output stable light over a long period of time.

  Further, in the light emitting module according to the present invention, for example, the lighting device or the display device, since the previous light emitting device is used, it is possible to perform stable illumination and display over a long period of time.

  Furthermore, when the optical member is closely attached to the light emitting element via the glass bonding material, the possibility of gas remaining between the light emitting element and the optical member due to the presence of the glass bonding material is reduced. Therefore, compared with the case where gas remains between a light emitting element and an optical member, possibility that the light from a light emitting element will be reflected between a light emitting element and an optical member will be reduced. Thereby, in the light emitting device of the present invention, light from the light emitting element can be efficiently introduced into the optical member. In particular, when the refractive index of the glass bonding material is set smaller than the refractive index of the light emitting element and larger than the refractive index of the optical member, the interface between the light emitting element and the glass bonding material, and the glass bonding material and the optical member. Therefore, it is possible to suppress the reflection loss at the interface between the light emitting element and the light from the light emitting element more efficiently. Furthermore, by arranging an optical member around the light emitting element through a transparent glass bonding material, volume shrinkage of the glass in the manufacturing process of the light emitting device can be reduced in volume compared to the light emitting element and the optical member. Limited to glass bonding materials only. As a result, the optical member is attached to the periphery of the light emitting element without generating a crack in the glass bonding material.

  Further, if the optical member is arranged so that the surfaces of the first and second electrodes are exposed, various connections can be made between the mounting substrate such as a wiring board or circuit board on which predetermined wirings are formed and the light emitting device. Appropriate conductive connection can be made by applying the means. That is, the light emitting device can be mounted on the mounting substrate in a target state by using a method such as soldering or wire bonding in accordance with the configuration of the mounting substrate or the light emitting direction of the light emitting device. Furthermore, in the light emitting module, if the mounting substrate is provided with a recess and a terminal is provided so as to be exposed on the inner surface of the recess, the light emitting device can be connected to the mounting substrate by simply inserting the light emitting device into the recess. It can also be connected.

  The light emitting device in which the surfaces of the first and second electrodes are exposed from the optical member uses a cylindrical body having a through space for accommodating the light emitting element as the optical member, or a plurality of plate-like elements as the optical member Can be easily formed by adhering to the side surface of the light emitting element.

  Further, if the optical member includes one or more kinds of phosphors for converting the wavelength of light emitted from the light emitting element, light having a target wavelength can be emitted from the light emitting device. . For example, as the light emitting element, one that emits light having at least one emission intensity peak in the wavelength range of 230 to 400 nm, for example, is used, while light emitted from the light emitting element is used as a plurality of types of phosphors. Is converted into light having an emission intensity peak in the wavelength range of 400 to 500 nm, light having an emission intensity peak in the wavelength range of 500 to 600 nm, and light having an emission intensity peak in the wavelength range of 600 to 700 nm. In the case where the first to third phosphors are used, white light can be emitted from the light emitting device.

  Of course, the light emitting device of the present invention can be configured to emit light other than white light depending on the type of phosphor used, for example, red light, green light, blue light, yellow, magenta, cyan. Etc. can be emitted.

  Furthermore, when the phosphor is unevenly distributed on the outer surface portion of the optical member, the thickness of the portion containing the phosphor is reduced, so that the optical path difference between the light transmitted perpendicularly and the light transmitted obliquely through this portion is reduced. Becomes smaller. As a result, the difference in wavelength conversion amount between vertically transmitted light and obliquely transmitted light is reduced, so that a part of the light from the light emitting element is transmitted as it is, while the wavelength of the other light is transmitted. Is converted and the mixed colors thereof are emitted, it is possible to emit light of the same color from the whole while suppressing color unevenness.

  In the light emitting device of the present invention, since the optical member is made of glass and a glass bonding material is used as necessary, the light emitting device emits light having a short wavelength, for example, blue light or near Even when using a zinc oxide-based compound semiconductor that emits ultraviolet light, it is possible to effectively suppress deterioration of the optical member, and thus it is possible to effectively suppress a decrease in light emission luminance in the light emitting device. .

  Hereinafter, first to fourth embodiments of the present invention will be described with reference to the drawings.

  First, a light emitting device according to a first embodiment of the present invention will be described with reference to FIGS.

  The light-emitting device X shown in FIGS. 1 and 2 includes a light-emitting element 1 and an optical member 2, and is configured to emit light from at least the outer surface of the optical member 2.

  The light emitting element 1 is formed by stacking an n-type semiconductor layer 11, a light emitting layer 12, and a p-type semiconductor layer 13 on a substrate 10, and is configured to emit light at least laterally. The light emitting element 1 includes, for example, a ZnO-based oxide semiconductor light emitting diode, and is configured to emit light having a wavelength of 230 nm to 400 nm. Of course, as the light-emitting element 1, a silicon carbide (SiC) -based compound semiconductor, a diamond-based compound semiconductor, a boron nitride-based compound semiconductor, or the like other than the ZnO-based oxide semiconductor light-emitting diode can be used. What is necessary is just to select suitably the kind of light emitting element 1 which should be used according to the wavelength of the light to make.

Electrodes 14 and 15 are formed on the lower surface 10 </ b> A of the substrate 10 and the upper surface 13 </ b> A of the p-type semiconductor layer 13. These electrodes 14 and 15 are for applying a voltage between the n-type semiconductor layer 11, the light-emitting layer 12 and the p-type semiconductor layer 13 in order to emit light from the light-emitting layer 12. The electrodes 14 and 15 are formed of a transparent material when it is necessary to transmit light, and are formed of a highly reflective material when it is necessary to reflect light. As a material for forming the electrodes 14 and 15, when the electrodes 14 and 15 are formed transparently, ITO (Indium Tin Oxide) glass, a zinc oxide based transparent conductive film, indium (In) and tin (Sn), An oxide of SnO ₂ , In ₂ O ₃ or the like is used. Further, when the electrodes 14 and 15 are formed with high reflectivity, metals and alloys having high reflectivity with respect to light having a wavelength of 230 nm to 400 nm, such as aluminum, rhodium, and silver, are used.

  The optical member 2 is provided on the side surface 1 </ b> B of the light emitting element 1 through the glass bonding material 21. The optical member 2 functions to protect the light emitting element 1 and also plays a role of guiding light emitted from the light emitting element 1 to the outside. The optical member 2 has a through space 20 for accommodating the light emitting element 1 and is formed of a glass having a translucent shape as a whole. As a glass material for forming the optical member 2, for example, quartz glass, optical glass containing boric acid and silicic acid, crystal, sapphire, or meteorite can be used.

  The through space 20 is formed in a rectangular parallelepiped shape corresponding to the external shape of the light emitting element 1, and the light emitting element 2 is placed in a state where the glass bonding material 21 is interposed between the inner surface and the side surface of the light emitting element 1. Contained. In a state where the light emitting element 1 is accommodated in the through space 20, the periphery of the substrate 10, the n-type semiconductor layer 11, the light emitting layer 12, and the p type semiconductor layer 13 is surrounded by the optical member 2, and the light emitting device X as a whole is substantially omitted. It has a solid shape.

  However, the optical member 2 only needs to cover a portion where light is emitted from the side surface of the light emitting element 1, and does not necessarily need to cover the entire side surface of the light emitting element 1. For example, when no light is emitted from the substrate 10, the optical member 2 may be formed to selectively surround, for example, the n-type semiconductor layer 11, the light emitting layer 12, and the p-type semiconductor layer 13. .

  Further, in order to reduce reflection loss on the outer surface of the optical member 2, the outer surface is provided with a diffraction grating having a conical shape, a cylindrical shape, a quadrangular prism shape, or the outer surface is subjected to surface processing such as blasting or chemical polishing. By roughening, light can be efficiently led from the optical member 2 to the external gas while further suppressing reflection loss. The arithmetic average roughness of the outer surface is preferably 0.1 to 100 μm. When the arithmetic average roughness is smaller than 0.1 μm and when the arithmetic average roughness is larger than 100 μm, reflection loss on the outer surface is suppressed. Therefore, light cannot be efficiently led out from the optical member 2 to the external gas.

  The glass bonding material 21 has translucency, and is made of, for example, a material having a refractive index smaller than that of the light emitting element 1 and larger than that of the optical member 2. As such a glass bonding material, for example, sol-gel glass, low-melting glass, or water glass adhesive can be used.

  As shown in FIG. 3, the light-emitting device X is used by being mounted on a circuit board 3 or the like. In the figure, the electrode 14 is conductively connected to the wiring 30 of the circuit board 3 via a conductive bonding material such as solder, and the electrode 15 is conductively connected to the wiring 31 of the circuit board 3 via the wire 32. An example was given.

  In the light emitting device X, the optical member 2 made of glass surrounds at least a part of the light emitting element 1 where light is emitted. On the other hand, glass is a material that has a higher transmittance with respect to light having a wavelength of 230 nm to 400 nm than that of a resin, a molecular structure is not easily broken by light absorption, and a transmittance and mechanical strength are not easily deteriorated. Therefore, even if the light emitted from the light emitting element 1 is absorbed around the light emitting element 1 (the optical member 2), the light emitting apparatus X protects the surroundings of the light emitting element 1 with a resin (see FIG. 12), the possibility of deterioration in transmittance and mechanical strength due to light energy is extremely small. As a result, the possibility that the element (optical member 2) that protects the light emitting element 1 by the light from the light emitting element 1 deteriorates is reduced, and the light emission luminance of the light emitting device X is suppressed from decreasing. Thereby, the light emitting device X can output stable light over a long period of time. Furthermore, since the light emitting area in the light emitting device X is increased by the outer surface of the optical member 2, there is a probability that the light of the light emitting element 1 incident on the optical member 2 is led to the external gas while being reflected by the outer surface. To increase. As a result, the light of the light emitting element 1 is efficiently guided from the optical member 2 to the external gas, and the amount of light emitted from the light emitting device X increases.

  Further, by adopting a configuration in which the optical member 2 is in close contact with the light emitting element 1 through the glass bonding material 21, there is a possibility that gas remains between the light emitting element 1 and the optical member 2. It is reduced by the presence of the material 21. Therefore, compared with the case where gas remains between the light emitting element 1 and the optical member 2, the possibility that the light from the light emitting element 1 is reflected between the light emitting element 1 and the optical member 2 is reduced. . Thereby, in the light emitting device X, the light from the light emitting element 1 can be efficiently introduced into the optical member 2. Further, the occurrence of cracks in the optical member 2 and the glass bonding material 21 due to the heat applied in the manufacturing process of the light-emitting device X, the mounting process on the circuit board 3 and the operating environment and the difference in thermal expansion coefficient of each member is suppressed. Therefore, the light emitting device X can output stable light over a long period of time. In particular, when the refractive index of the glass bonding material 21 is set smaller than the refractive index of the light emitting element and larger than the refractive index of the optical member 2, the interface between the light emitting element 1 and the glass bonding material 21, and the glass bonding material. Since the reflection loss at the interface between the optical member 21 and the optical member 2 can be suppressed, the light from the light emitting element 1 can be introduced into the optical member 2 more efficiently.

  Next, a light emitting module according to a second embodiment of the present invention will be described with reference to FIG.

  The light emitting module 4 shown in FIG. 4 is configured to be surface-mountable, and includes a light emitting device 40 and a wiring board 41.

  The light emitting device 40 is the same as the light emitting device X (see FIGS. 1 and 2) according to the first embodiment of the present invention described above, and includes a light emitting element 42 and an optical member 43.

  In the light emitting device 40, the light emitting element 42 is accommodated in the through space 44 of the optical member 43 so that the periphery of the light emitting element 42 is surrounded by the optical member 43. A glass bonding material 45 is interposed between the inner surface of the through space 44 and the side surface of the light emitting element 42, and the light emitting element 42 is in close contact with the inner surface of the optical member 43.

  The light emitting element 42 further includes electrodes 46 </ b> A and 46 </ b> B, and these electrodes 46 </ b> A and 46 </ b> B are exposed above and below the through space 44.

  The optical member 43 is made of glass and has a refractive index smaller than that of the glass bonding material 45. On the other hand, the glass bonding material 45 has a refractive index smaller than that of the light emitting element 42. In addition, as a material for forming the optical member 43 and the glass bonding material 45, the same material as the light-emitting device X described above (see FIGS. 1 and 2) can be used.

  On the other hand, the wiring board 41 is formed by forming external connection conductors 48 </ b> A and 48 </ b> B on the surface of the insulating base 47. The external connection conductors 48A and 48B include upper surface conductor portions 48Aa and 48Ba that are conductively connected to the electrodes 46A and 46B of the light emitting device 40, and lower surface conductor portions 48Ab and 48Bb that are conductively connected to wiring of a mounting object such as a circuit board. And side conductor portions 48Ac, 48Bc that connect the upper conductor portions 48Aa, 48Ba and the lower conductor portions 48Ab, 48Bb.

  The upper conductor portion 48Aa is conductively connected to the electrode 46A of the light emitting element 42 through a conductive bonding material 49A such as solder or conductive resin. On the other hand, the upper surface conductor portion 48Ba is electrically connected to the electrode 46B of the light emitting element 42 through the wire 49B.

  In the light emitting module 4, the light emitting element 42 is surrounded by the optical member 43 formed of glass, and the glass bonding material 45 is interposed between the inner surface of the optical member 43 (through space 44) and the side surface of the light emitting element 42. It has been. Therefore, similarly to the light-emitting device X described above (see FIGS. 1 and 2), the light emitted from the light-emitting element 42 can be efficiently guided to the optical member 43. Further, since the refractive index of the glass bonding material 45 is smaller than that of the light emitting element 42 and the refractive index of the optical member 43 is smaller than that of the glass bonding material 45, the step extends from the light emitting element 42 to air having a refractive index of 1, for example. By reducing the refractive index, the reflection loss at each interface of the light emitting element 42, the glass bonding material 45, the optical member 43 and the air is suppressed, and the light from the light emitting element 42 can be emitted to the outside more efficiently. The light output of the device 40 can be improved.

  Next, a light emitting module according to a third embodiment of the present invention will be described with reference to FIG. However, in FIG. 5, the same code | symbol is attached | subjected about the member or element similar to the light emitting module 4 demonstrated with reference to FIG. 4, and duplication description is abbreviate | omitted.

  The light emitting module 4 ′ shown in FIG. 5 includes the light emitting device 40 ′ and the wiring board 41, and is similar to the light emitting module 4 (see FIG. 4) described above in that it can be surface-mounted. is there. On the other hand, the light emitting module 4 ′ is different in that the light emitting device 40 ′ is mounted so that the outer surface 43 A of the optical member 43 faces the wiring board 41.

  The light emitting device 40 ′ has the same basic configuration as the light emitting devices X and 40 (see FIGS. 1, 2, and 4) described above, but the light emitting devices X and 40 are electrodes. The configurations of 46A ′ and 46B ′ are different. That is, the electrodes 46A ′ and 46B ′ are provided to extend to the surface 43B of the optical member 43 so as to be surely conductively connected to the upper surface conductors 48Aa and 48Ba of the external connection conductors 48A and 48B on the wiring board 41. ing. The light emitting device 40 'is mounted on the wiring board 41 with the electrodes 46A' and 46B 'extending downward from the light emitting element 42, and the electrodes 46A' and 46B 'and the upper surface conductor portions 48Aa and 48Ba. Are electrically connected through conductive bonding materials 49A 'and 49B'.

  In the light emitting device 40 ′ of the light emitting module 4 ′, light emitted from the light emitting element 42 is transmitted through the glass bonding material in the same manner as the light emitting devices X and 40 (see FIGS. 1, 2, and 4). While being efficiently guided to the optical member 43, light absorption by the wire 49B in the light emitting device 40 of FIG. 4 is eliminated. As a result, since the shadow of the wire 49B disappears and the light emitted upward from the outer surface of the optical member 43 increases on the irradiation surface when the light emitting device 40 ′ is used as an illumination device, the light emitting device 40 ′, As a result, the brightness of the light emitting module 4 'can be improved.

  The light-emitting device employed in the light-emitting device and the light-emitting module according to the present invention is not limited to those described with reference to FIGS. 1 to 5 and can be variously changed. For example, the light emitting device can be configured as shown in FIGS. 6 to 9, and in this case as well, the same operational effects as those of the previous light emitting device X (see FIGS. 1 and 2) can be achieved.

  In the light emitting device X2 shown in FIG. 7, the optical member 2A is composed of four plate-like elements 22A and 23A, and is formed in a substantially rectangular parallelepiped shape as a whole. In the light emitting device X2, the optical member 2A includes four plate-like elements 22A and 23A, but the function is the same as that of the optical member 2 (see FIGS. 1 and 2) formed in a cylindrical shape.

  In the light emitting device X3 shown in FIG. 8, the optical member 2B is formed in a cylindrical shape. In such a light emitting device X3, since the outer surface 24B of the optical member 2B is a curved surface, the light emitted from the light emitting element 1 can be emitted substantially uniformly from the outer surface 24B of the optical member 2B. .

  The light emitting devices X4 and X5 shown in FIGS. 9A and 9B are obtained by dispersing the phosphor 25 in the optical members 2C and 2D. The light emitting device X4 shown in FIG. 9A is obtained by dispersing the phosphor 25 over the entire optical member 2C, and the light emitting device X5 shown in FIG. In the outer surface portion.

The phosphor 25 contained in the optical members 2C and 2D is selected according to the wavelength (color) of light to be emitted from the light emitting devices X4 and X5. For example, when white light is emitted from the light emitting devices X4 and X5, the phosphor 25 converts the light emitted from the light emitting element 1 into light having a light emission intensity peak in the wavelength range of 400 to 500 nm. A first phosphor, a second phosphor that converts light having an emission intensity peak in a wavelength range of 500 to 600 nm, and a third phosphor that converts light having an emission intensity peak in a wavelength range of 600 to 700 nm. used. Examples of the first phosphor include (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu or BaMgAl ₁₀ O ₁₇ : Eu. Examples of the second phosphor include SrAl _2. Examples include O ₄ : Eu, ZnS: Cu, Al, or SrGa ₂ S ₄ : Eu. Examples of the third phosphor include SrCaS: Eu or La ₂ O ₂ S: Eu, LiEuW ₂ O _8. Can do.

  On the other hand, when white light is emitted from the light emitting devices X4 and X5 using the first to third phosphors, the light emitting element 1 has, for example, at least one emission intensity peak in the wavelength range of 230 to 400 nm. What emits the light which it has is used. Examples of such a light emitting element 1 include a ZnO-based oxide semiconductor light emitting diode.

  Further, a light emitting element 1 that emits blue light is used, and a phosphor 25 that converts blue light into yellow light, such as an yttrium aluminum garnet phosphor activated with cerium (Ce) ( YAG) or alkaline earth metal orthosilicate phosphor activated with divalent europium (Eu) may be used to emit white light from the light emitting devices X4 and X5.

  Since the light emitting device X4 shown in FIG. 9A is obtained by dispersing the phosphor 25 over the entire optical member 2C, the optical member 2C in which the phosphor 25 is dispersed can be easily formed. That is, the light emitting device X4 has an advantage that the optical member 2C can be easily manufactured. On the other hand, since the light emitting device X5 shown in FIG. 9B is obtained by selectively dispersing the phosphor 25 on the outer surface portion of the optical member 2D, the light that travels horizontally through the optical member 2D and the horizontal The optical path difference becomes small between the light traveling in the direction inclined from the direction. As a result, since the difference in wavelength conversion between the light transmitted in the horizontal direction and the light transmitted obliquely becomes small, a part of the light from the light emitting element 1 is transmitted as it is, When the mixed colors are emitted by converting the wavelengths, it is possible to emit light of the same color from the whole while suppressing color unevenness. Furthermore, since the light emitted from the light emitting element 1 is efficiently incident on the optical member 2D without being inhibited by the phosphor 25, the phosphor 25 excited by the light of the light emitting element 1 increases and emits light. The light output of device X5 increases.

  Of course, the light emitting devices X4 and X5 can be configured to emit light other than white by appropriately selecting the type of phosphor 25 to be used, and the phosphor 25 is dispersed in the optical members 2C and 2D. Instead of this, a wavelength conversion layer containing a phosphor may be provided on the outer surfaces of the optical members 2C and 2D.

  Next, a light emitting module according to a fourth embodiment of the present invention will be described with reference to FIGS.

  The light emitting module 5 shown in FIGS. 10 and 11 can be used as a lighting device or a display device, and includes a plurality of light emitting devices 6 and an insulating substrate 7.

  The plurality of light emitting devices 6 are configured by surrounding the light emitting element 60 with an optical member 61 as in the light emitting devices X and X2 (see FIGS. 1, 2, and 7) described above, and as a whole. It is formed in a rectangular parallelepiped shape. As the light-emitting device 6, the optical member 61 containing a phosphor is used according to the purpose (see the light-emitting devices X4 and X5 in FIGS. 9A and 9B).

  The insulating substrate 7 is for positioning and fixing the plurality of light emitting devices 6 and for supplying driving power to each light emitting device 6. The insulating substrate 7 has a first substrate 71 in which a plurality of through holes 70 are formed, and a second substrate 72 in which wiring (not shown) is patterned.

  The plurality of through holes 70 of the first substrate 71 are for housing the light emitting device 6 and are arranged in a matrix. A pair of terminals 73 and 74 for contacting the electrodes 62 and 63 of the light emitting device 6 are provided on the inner surface of each through hole 70 so as to face each other. That is, in a state where the light emitting device 6 is accommodated in each through hole 70, the plurality of light emitting devices 6 are arranged in a matrix, and the electrodes 62 and 63 of each light emitting device 6 and the pair of terminals 73 of the through hole 70, 74 is in a conductive connection state.

  The wiring (not shown) of the second substrate 72 is conductively connected to the pair of terminals 73 and 74 of the first substrate 71. This wiring is further conductively connected to a terminal 75 provided on the side surface of the second substrate 72. The wiring pattern is designed according to the driving mode of the plurality of light emitting devices 6 in the light emitting module 5, for example.

  For example, when the light emitting module 5 is configured as a display device, each light emitting element device 6 can be individually driven, and thus the wiring is patterned so that each light emitting device 6 can be individually driven. On the other hand, when the light emitting module 5 is configured as a lighting device, each light emitting device 6 is not necessarily configured to be individually drivable. For example, all of the light emitting devices 6 can be driven simultaneously, or a plurality of light emitting devices 6 are grouped into a plurality of groups. In other words, each group can be driven, and the wiring is patterned so that such driving is possible.

  In the light emitting module 5, the light emitting device 6 is the same as the light emitting devices X, X2, X4, and X5 described above (see FIGS. 1, 2, 7, 9A, and 9B). Is used. That is, in the light emitting device 6, the optical member 61 is suppressed from being deteriorated by the light from the light emitting element 60, and the volume shrinkage of each member in the manufacturing process of the light emitting device 6 is smaller than that of the light emitting element 60 and the optical member 61. Therefore, the optical member 61 is attached to the periphery of the light emitting element without generating a crack in the glass bonding material 21. As a result, the light emitting module 5 using such a light emitting device 6 can output stable light over a long period of time.

  In the light emitting module 5, a plurality of through holes 70 are provided in the first substrate 71, and the light emitting device 6 is accommodated in the through holes 70. It may be simply implemented.

1 is an overall perspective view showing a light emitting device according to a first embodiment of the present invention. It is a longitudinal cross-sectional view of the light-emitting device shown in FIG. It is a perspective view for demonstrating the usage example of the light-emitting device shown to FIG. 1 and FIG. It is sectional drawing which shows the light emitting module which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the light emitting module which concerns on the 3rd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the other example of a light-emitting device. It is a whole perspective view which shows the other example of a light-emitting device. It is a whole perspective view which shows the other example of a light-emitting device. It is a longitudinal perspective view which shows the other example of a light-emitting device. It is a whole perspective view which shows the light emitting module which concerns on the 4th Embodiment of this invention. It is the perspective view which exploded and showed a part which shows the principal part of the light emitting module shown in FIG. It is sectional drawing which shows an example of the conventional light-emitting device.

Explanation of symbols

X, X1 to X5, 40, 40 ', 6 Light-emitting device 1, 42, 60 Light-emitting element 10 (light-emitting element) substrate 11 (light-emitting element) n-type semiconductor layer (first conductive type layer)
12 (light emitting element) light emitting layer 13 (light emitting element) p-type semiconductor layer (second conductivity type layer)
14, 15, 46A, 46B, 46A ', 46B', 62, 63 (light emitting element) electrode 2, 2A to 2D, 43 optical member 20, 44 (optical member) penetration space 21, 45 glass bonding material 22A, 23A (optical member) plate-like element 25 (optical member) phosphor 4, 4 ', 5 light emitting module 41 (light emitting module) wiring board 48A, 48B (light emitting module) external connection conductor 7 (light emitting module) ) Insulating substrate 70 Recessed part (of insulating substrate)

Claims (14)

A first conductive type layer, a light emitting layer, and a second conductive type layer are formed on a substrate, and a voltage is applied to the first conductive type layer, the light emitting layer, and the second conductive type layer. A light emitting device having first and second electrodes ;
Provided on the side surface of the light emitting element so as to surround the periphery of each layer through a glass bonding material made of a glass material, and having a light-transmitting optical member made of an inorganic material ,
The first and second electrodes are exposed without at least the surface being covered by the optical element,
A light emitting device wherein at least one of the first and second electrodes is a transparent electrode . The refractive index of the glass bonding material is set smaller than the refractive index of the light emitting element,
The light emitting device according to claim 1, wherein a refractive index of the optical member is set higher than a refractive index of the glass bonding material. The light emitting device according to claim 1 , wherein the optical member is a cylindrical body having a through space for accommodating the light emitting element. The light emitting device according to claim 3 , wherein the optical member has a curved outer surface . The optical member includes a plurality of plate-like elements, and the plate-like elements are positioned on the sides of the side surfaces of the light-emitting elements, thereby forming a through space for accommodating the light-emitting elements. The light-emitting device according to claim 1 . The light emitting device according to claim 1, wherein the optical member is provided with a diffraction grating on an outer surface . The light emitting device according to any one of claims 1 to 6 , wherein the optical member contains one or more kinds of phosphors for converting the wavelength of light emitted from the light emitting element. The light emitting device according to claim 7 , wherein the phosphor is unevenly distributed on an outer surface portion of the optical member. The light emitting element emits light having at least one peak of emission intensity in a wavelength range of 230 to 400 nm,
The plurality of types of phosphors emit light emitted from the light emitting element, light having a peak of emission intensity in a wavelength range of 400 to 500 nm, light having a peak of emission intensity in a wavelength range of 500 to 600 nm, and 600 The light-emitting device according to claim 7 or 8 , comprising first to third phosphors that respectively convert light having an emission intensity peak in a wavelength range of ˜700 nm . It said first conductivity type layer, the second conductivity type layer and the light emitting layer is a zinc oxide-based compound, the light emitting device according to any one of claims 1 to 9. A light emitting module in which one or more light emitting devices are mounted on an insulating substrate,
The light emitting device is characterized in that as claimed in any one of claims 1 to 10, the light emitting module. The light emitting module according to claim 11 , wherein the insulating substrate includes a single light emitting device and includes first and second connection conductors that are conductively connected to the light emitting device. The light emitting module according to claim 12 , wherein the first and second connection conductors have a portion that is conductively connected to the light emitting device and a portion that is connected to an external wiring. The insulating substrate has a plurality of recesses for accommodating the plurality of light emitting devices,
The light-emitting module according to claim 11 , wherein each of the light-emitting devices is fitted into a corresponding recess among the plurality of recesses.

Images