JP2007201038A - Part mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely detect a position, a shape, and an inclination of parts using an imaging camera capable of imaging by splitting the reflection light of a plurality of different wavelengths into lights of each wavelength. <P>SOLUTION: The part mounting device comprises a first irradiator 26 that radiates green light to a part 24 sucked to a work head 20; a second irradiator 28 that radiates red light of the wavelength different from that of the green light; an imaging camera 22 that takes in green and red reflection light radiated almost simultaneously from the first and second irradiators to split the reflection light into each of wavelengths, and outputs image signals; and a control unit 50 that splits the image signals outputted from the imaging camera 22 for each wavelength for image processing, and calculates a position, a shape, and an inclination of the part 24 relative to the center axis of the work head 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus including an imaging device that detects the position of a component such as an electronic component mounted on a substrate.

  A component mounting apparatus that mounts electronic components on a substrate is required to have high accuracy and high speed against the background of high density of component mounting. For this reason, it is necessary to accurately grasp the position and inclination of the electronic component to be mounted on the apparatus side.

  As such a component mounting apparatus, conventionally, for example, a technique disclosed in Patent Document 1 is known. In this prior art, a first illumination unit that emits light for detecting the tilt of a component held by the suction nozzle, a second illumination unit that emits light for detecting rotation of the component, a first illumination unit, and a first illumination unit And a camera that images reflected light from the two illumination units.

Then, when the central axis of the camera and the central axis of the suction nozzle coincide with each other, both the first and second illumination units are operated, and the electronic component is imaged with the reflected light, and the inclination of the electronic component is detected. The inclination is detected.
JP 2004-170288 A (page 6-7, FIG. 1)

  According to the technique disclosed in Patent Document 1 described above, the component imaging by the first light of the first illumination unit and the component imaging by the second light of the second illumination unit are performed by the camera, and based on these component imaging The inclination, shape, and rotation state of the electronic component are obtained.

  However, in the camera, it is difficult to distinguish the reflected light of the light emitted from the first illumination unit and the second illumination unit, and it is difficult to obtain a clear component image due to interference between the reflected lights.

  For this reason, in Patent Document 1, in order to obtain more accurate and clear component information, for example, the first illumination unit and the second illumination unit are turned on at a predetermined timing while the electronic component is moving, and image information is individually obtained. There is also a need to obtain

  The present invention has been made to solve such a problem, and the object of the present invention is to use an imaging device capable of separating reflected light of a plurality of different wavelengths for each wavelength, and to determine the position and shape of components. Another object of the present invention is to provide an electronic component mounting apparatus that can detect inclination with high accuracy.

In order to achieve the above object, the invention according to claim 1 includes a work head that detachably holds a component, and a component mounting apparatus that mounts the component held by the work head on a substrate.
A first illumination unit that irradiates the component held by the work head with a first light;
A second illumination unit that irradiates the component held by the work head with a second light having a wavelength different from that of the first light;
An imaging device that takes in the reflected lights of the first and second lights irradiated from the first and second illumination sections substantially simultaneously, and outputs the image signals by separating the reflected lights for each wavelength; ,
A control unit that separates the image signal output from the imaging device for each wavelength, performs image processing, and calculates the position, shape, and inclination of the component relative to the working head. To do.

  According to the present invention, by using an imaging device capable of separating reflected light of different wavelengths from a plurality of illumination units for each wavelength, and simultaneously obtaining a reflected image for each illumination unit, the shape, position, And the inclination can be detected with high accuracy.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an external perspective view of an electronic component mounting apparatus with an exterior cover removed.
In FIG. 1, an electronic component mounting apparatus (hereinafter referred to as an apparatus main body) 10 includes a base 11, and various devices are disposed inside and above the base 11.

  A pair of fixed and movable parallel substrate guide rails 12a and 12b are horizontally extended in the center of the upper portion of the base 11 in the substrate transport direction (X-axis direction). A loop-shaped conveyor belt (not shown) is movably disposed so as to be in contact with the lower portions of the board guide rails 12a and 12b. The conveyor belt is driven by a belt drive motor, travels in the substrate conveyance direction, and conveys the substrate while supporting the substrate from below.

  In addition, a pair of parallel fixed rails 13a and 13b extending across the pair of board guide rails 12a and 12b and extending substantially in the direction perpendicular to the board conveyance direction (X-axis direction) and the Y-axis direction are arranged. It is installed. A long moving rail 14 is slidably engaged with the fixed rails 13a and 13b, and a work tower 15 for performing an operation of mounting components on the board is slidably suspended on the moving rail 14. A work head 20 is disposed in the work tower 15.

  On the base 11, a Y-axis direction drive servo motor that freely rotates in both forward and reverse directions according to an instruction from the central control unit is disposed. Thereby, the moving rail 14 advances and retreats in the Y-axis direction along the fixed rails 13a and 13b via the drive transmission system. A flexible cable 16 is connected to the moving rail 14.

  The moving rail 14 is provided with an X-axis direction drive servo motor that freely rotates in both forward and reverse directions according to instructions from the central control unit. Thereby, the work tower 15 moves freely on the fixed rails 13a and 13b in the X-axis direction via another drive transmission system. A flexible cable 17 is connected to the work tower 15.

  The work tower 15 is connected to the central control unit via the cables 16 and 17, and thereby, for example, recognition data (image data) such as a target position on the substrate to be worked is transmitted from the work tower 15 to the central control unit. Is done.

  Parts cassette bases 18a and 18b are disposed on the front and rear parts of the base 11, respectively. Further, for example, an imaging camera 22 to be described later is disposed between the front part cassette base 18a and the fixed board guide rail 12a.

FIG. 2 is a control block diagram of the main part of the electronic component mounting apparatus 10 of the present embodiment.
In the figure, the electronic component mounting apparatus 10 includes a control CPU 30 that controls the movement of the work head 20 described above, an illumination control device 32 that is controlled by the control CPU 30, an image processing device 34, and the like. The control CPU 30 is connected to a keyboard mouse 36 for data input to the control CPU 30 and a monitor 38 that displays input information from the keyboard mouse 36 based on output data from the control CPU 30.

  The work head 20 can be controlled to move in the X-axis direction via the motor driver 40 and the X-axis motor 41, and can be controlled to move in the Y-axis direction via the motor driver 42 and the Y-axis motor 43. Further, the working head 20 incorporates a Z-axis motor 45 controlled by the motor driver 44 and a θ-axis motor 47 controlled by the motor driver 46. Thereby, the work head 20 can be controlled to move in the Z-axis direction orthogonal to the XY plane, and can be controlled to rotate in the XY plane.

A nozzle 21 is attached to the lower part of the work head 20, and the electronic component 24 is sucked by the tip of the nozzle 21.
The illumination control device 32 controls a first illumination unit 26 and a second illumination unit 28, which will be described later, and controls the amount of light emitted to the electronic component 24 sucked by the nozzle 21.

  The image processing device 34 includes a first image capturing unit 48 that captures a green image signal output from the imaging camera 22, a second image capturing unit 49 that captures a red image signal, and the first and second images. An image processing calculation CPU 50 is provided that takes in signals from the image capturing units 48 and 49, processes the images, and transmits the results to the control CPU 30.

FIG. 3 is a diagram showing a positional relationship between the nozzle 21 attached to the lower part of the work head 20 and the imaging camera 22 arranged on the base 11.
The imaging camera 22 is provided with a light receiving lens 23 on the side facing the work head 20. The imaging camera 22 uses a color imaging device and includes individual image outputs of red, green, and blue.

  The nozzle 21 has a function of vacuum-sucking the electronic component 24. A first illumination unit 26 and a second illumination unit 28 are disposed between the nozzle 21 and the imaging camera 22. The first illumination unit 26 has a base plate 126 and a hole 126 a drilled in the center of the base plate 126, and the center of the hole 126 a coincides with the central axis O of the nozzle 21. The hole 126 a is provided so that the imaging camera 22 can capture the reflected light of the electronic component 24.

  The base plate 126 is provided with an optical element 27 that emits green light, for example. In the present embodiment, green light is emitted from the optical element 27 obliquely with respect to the central axis O of the nozzle 21. In this way, by irradiating light to the electronic component 24 from an oblique direction, the imaging camera 22 captures a reflection image for obtaining the shape and position information (including rotation) of the electronic component 24.

  For example, FIG. 4A shows a state in which the electronic component 24 is sucked in the correct positional relationship with respect to the central axis O of the nozzle 21. FIG. 4B shows a state where the electronic component 24 is deviated from the central axis O of the nozzle 21 by a deviation amount x and sucked.

  The second illumination unit 28 has a base plate 128 and a hole 128 a drilled in the center of the base plate 128, and the center of the hole 128 a coincides with the central axis O of the nozzle 21. The hole 128 a is provided so that the imaging camera 22 can capture the reflected light of the electronic component 24.

  For example, an optical element 29 that emits red light is disposed on the base plate 128. The optical element 29 emits red light substantially parallel to the central axis O of the nozzle 21. In this way, by irradiating light substantially parallel to the central axis O of the nozzle 21, a reflected image for obtaining discrimination information as to whether or not the electronic component 24 is attracted to the imaging camera 22 at a normal inclination. Is captured.

  That is, for example, as shown in FIG. 4A, when the electronic component 24 is adsorbed in a normal state in which the nozzle 21 is not inclined, strong specularly reflected light is taken into the imaging camera 22 and is normal. An image of the electronic component 24 in the state is obtained. On the other hand, as shown in FIG. 4C, when the electronic component 24 is abnormally sucked with respect to the center O of the nozzle 21, the intensity of the reflected light is different, so that the image becomes bright or dark, It is determined that the size of the image is reduced or the electronic component 24 is sucked and sucked.

The reason why the light colors of the first illumination unit 26 and the second illumination unit 28 are changed is that the reflected light having different wavelengths is used to facilitate the image analysis.
Next, based on the flowchart of FIG. 5, the operation of the present embodiment will be described with reference to FIGS. 2 and 3.

  In S <b> 51, the electronic component 24 is attracted to the nozzle 21 of the work head 20, and the attracted electronic component 24 is moved to a predetermined height position directly above the imaging camera 22. Next, in S <b> 52, the optical elements 27 and 29 of the green first illumination unit 26 and the red second illumination unit 28 are turned on simultaneously, and the respective reflected lights are reflected by the electronic component 24. These reflected light images are simultaneously captured by the imaging camera 22. As the imaging camera 22, a color camera is used, and this camera can separately output images captured with respect to red, green, and blue light at the same time.

  Next, in S <b> 53 to S <b> 55, an image of a green component that is reflected light from the first illumination unit 26 is output from the imaging camera 22, and the image is captured by the first image capturing unit 48 of the image processing device 34. The captured image is subjected to image processing by the image processing calculation CPU 50, and the position information of the electronic component 24 with respect to the center O of the nozzle 21 is obtained here. Then, the process proceeds to S59.

  On the other hand, in S <b> 56 to S <b> 58, an image of a red component that is reflected light from the second illumination unit 28 is output from the imaging camera 22, and the image is captured by the second image capturing unit 49 of the image processing device 34. The captured image is subjected to image processing by the image processing calculation CPU 50, and the inclination information of the electronic component 24 with respect to the center O of the nozzle 21 is obtained here. Then, the process proceeds to S59.

  In S59, based on the tilt information of the electronic component 24, it is determined whether or not the tilt of the electronic component 24 is within a normal range. Then, if normal (Yes), the process proceeds to S60, and the nozzle 21 is rotated or moved in the XY plane so that the electronic component 24 is at a desired position with respect to the substrate from the position information of the sucked electronic component 24. Mount on the board.

  If the inclination of the attracted electronic component 24 is not normal in S59 (No), the process proceeds to S61 to perform processing (for example, disposal) in which the electronic component 24 is not mounted on the substrate, and in S62. A message indicating that the inclination of the electronic component 24 is not normal is output to the monitor 38.

  According to the present embodiment, by changing the wavelength of light of the plurality of illumination units 26 and 27 and using a color camera as the imaging camera 22, images for different illumination units can be obtained simultaneously. The shape, position information, and tilt information of the electronic component 24 can be obtained at high speed.

  In the case of a single-panel color camera, red, green, and blue pixels must be prepared for the image sensor, so that an image with monochromatic light has a lower resolution than a monochrome camera. Therefore, in this case, the reflected light of a plurality of wavelengths is not separated by the color camera inside the camera to obtain an image, but before the reflected light is incident on the camera, the reflected light is filtered by the color filter. You may image | photograph simultaneously with several monochrome cameras, after isolate | separating into a wavelength. The light source used for the first illumination unit 26 and the second illumination unit 28 may be an LED or a laser transmitter.

It is the external appearance perspective view which removed the exterior cover of the electronic component mounting apparatus which concerns on this invention. It is a control block diagram of the present embodiment. It is a front view of the principal part of an electronic component mounting apparatus. (A) is a figure which shows the state in which the electronic component was normally attracted | sucked to the nozzle, (b) is a figure which shows the state in which the electronic component was biased and attracted | sucked to the nozzle, (c) is a figure in which the electronic component was nozzle It is a figure which shows the state attracted | sucked and inclined. It is a figure which shows the control flowchart of this Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component mounting apparatus 20 Work head 21 Nozzle 22 Imaging camera 24 Electronic component 26 1st illumination part 27 Optical element 28 2nd illumination part 29 Optical element 30 Control CPU
32 Illumination control device 34 Image processing device 50 Image processing CPU

Claims (1)

In a component mounting apparatus that includes a work head that detachably holds a component, and that mounts the component held by the work head on a substrate,
A first illumination unit that irradiates the component held by the work head with a first light;
A second illumination unit that irradiates the component held by the work head with a second light having a wavelength different from that of the first light;
An imaging device that takes in the reflected lights of the first and second lights irradiated from the first and second illumination sections substantially simultaneously, and outputs the image signals by separating the reflected lights for each wavelength; ,
A control unit that separates the image signal output from the imaging device for each wavelength, performs image processing, and calculates the position, shape, and inclination of the component with respect to the working head;
A component mounting apparatus characterized by that.

Images