JP2007187619A5

JP2007187619A5 -

Info

Publication number: JP2007187619A5
Application number: JP2006007411A
Authority: JP
Filing date: 2006-01-16
Publication date: 2009-02-26
Anticipated expiration: 2026-01-16

Claims

A wafer,
Dividing the wafer upper surface into a plurality of regions, a plurality of sensors arranged in each of the divided regions;
A wafer type sensor comprising: a contact point electrically connected to the plurality of sensors on the wafer surface and connected to an external contact to output sensor outputs of the plurality of sensors as output signals.

The wafer-type sensor, the sensor outputs of the plurality of sensors is given, further comprising selection means for outputting to said contact sensor output of any of the sensors in response to a selection signal given from an external device, to Claim 1 The described wafer type sensor .

The wafers are grouped into one or more groups each including one or more sensors ,
It said selection means comprises one or more group-specific selection means for selecting the sensor output of the sensor in the group provided for each said group,
The wafer type sensor according to claim 2, wherein the contact is provided for each of the group selection units and includes at least one group contact that is provided with a sensor output from the corresponding group selection unit.

The wafer type sensor according to claim 1, wherein the contact and the sensor are provided on the same surface of the wafer .

The wafer type sensor according to claim 1, wherein the contact and the sensor are provided on different surfaces of the wafer, respectively.

The contact includes an output terminal for outputting the sensor output of the sensor as an output signal, a selection signal terminal supplied selection signal from an external device, a power supply terminal receiving a supply of power supply voltage from an external power supply, according to claim 1 The wafer-type sensor in any one of -5.

Wafer, the wafer upper surface is divided into a plurality of regions, a plurality of sensors arranged in each region is divided, and wherein the plurality of sensors and is electrically connected to the wafer surface, the sensor outputs of the plurality of sensors A wafer type sensor having a contact for outputting as an output signal;
A contactor capable of contacting a contact of the wafer type sensor ;
A state measurement apparatus comprising: a determination unit configured to determine a state of each region on the wafer based on sensor outputs of the plurality of sensors in response to the contact being connected to the contact.

A device having a state measuring function ,
Wafer, the wafer upper surface arranged plurality of sensors, and the being the connection plurality of sensors and electrically at the wafer surface, accommodates the wafer-type sensor comprising a contact for outputting the sensor outputs of the plurality of sensors as an output signal Possible housing,
A plate for heating or cooling the wafer in the housing;
A contact disposed within the housing and capable of contacting a contact of the wafer-type sensor ;
The housing is arranged outside, and a data management unit for managing sensor output from said wafer sensor apparatus.

The data management unit includes a determination unit configured to determine a state of each region on the wafer based on sensor outputs of the plurality of sensors in response to the contact being connected to the contact. 9. The apparatus according to 8.

The said data management part contains the temperature correction means which correct | amends the temperature of the said plate in order to maintain the temperature distribution of each area | region on the said wafer constant based on the determination result by the said determination means. Equipment .

The apparatus further includes a lid member provided to be movable up and down above the wafer type sensor ,
The contact is provided on an upper surface of the wafer;
The contacts are provided on the lower surface of the lid member so as to face the contact point, contact with the contact when the lid member is lowered, according to any one of claims 8-10.

The apparatus further includes a pin that protrudes from the plate and supports the wafer-type sensor ,
The contact is provided at the tip of the pin,
The contact is provided on the lower surface of the wafer so as to face the contact,
The said contactor is an apparatus in any one of Claims 8-10 which contacts the said contact, when the said wafer type sensor is mounted on the said pin.

A method for measuring a temperature on a wafer placed in an apparatus ,
Inputting recipe parameters including heating time and heating temperature to the device ;
A plurality of temperature sensors which are divided into a plurality of regions on the wafer upper surface and are arranged in each of the divided regions; and the plurality of temperature sensors electrically connected to the plurality of temperature sensors on the wafer surface Carrying a wafer-type temperature sensor having a contact for outputting the sensor output as an output signal into the apparatus ;
Connecting the contact point of the wafer type temperature sensor and a contact provided inside the apparatus ;
Transmitting the sensor outputs of the plurality of temperature sensors via the contacts to a determination unit provided outside the apparatus for determining the temperature of each region on the wafer;
And releasing the connection between the contact and the contact and carrying out the wafer temperature sensor from the apparatus .