JP2007182623A - 金属薄体の製造方法 - Google Patents

金属薄体の製造方法 Download PDF

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Publication number
JP2007182623A
JP2007182623A JP2006276055A JP2006276055A JP2007182623A JP 2007182623 A JP2007182623 A JP 2007182623A JP 2006276055 A JP2006276055 A JP 2006276055A JP 2006276055 A JP2006276055 A JP 2006276055A JP 2007182623 A JP2007182623 A JP 2007182623A
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JP
Japan
Prior art keywords
metal
copper
plane
acetonitrile
electrolytic solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006276055A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007182623A5 (enExample
Inventor
Toshiaki Ono
俊昭 小野
Yasuo Komoda
康夫 薦田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2006276055A priority Critical patent/JP2007182623A/ja
Priority to PCT/JP2006/324525 priority patent/WO2007066751A1/ja
Priority to US12/096,519 priority patent/US20080257746A1/en
Publication of JP2007182623A publication Critical patent/JP2007182623A/ja
Publication of JP2007182623A5 publication Critical patent/JP2007182623A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2006276055A 2005-12-08 2006-10-10 金属薄体の製造方法 Pending JP2007182623A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006276055A JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法
PCT/JP2006/324525 WO2007066751A1 (ja) 2005-12-08 2006-12-08 金属薄体の製造方法
US12/096,519 US20080257746A1 (en) 2005-12-08 2006-12-08 Method for Producing Metal Thin Body

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005355354 2005-12-08
JP2006276055A JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法

Publications (2)

Publication Number Publication Date
JP2007182623A true JP2007182623A (ja) 2007-07-19
JP2007182623A5 JP2007182623A5 (enExample) 2008-11-20

Family

ID=38122896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006276055A Pending JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法

Country Status (3)

Country Link
US (1) US20080257746A1 (enExample)
JP (1) JP2007182623A (enExample)
WO (1) WO2007066751A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192841A (ja) * 2009-02-20 2010-09-02 Dainippon Printing Co Ltd 導電性基板
WO2012101984A1 (ja) * 2011-01-26 2012-08-02 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
JP2012162775A (ja) * 2011-02-08 2012-08-30 Dowa Metaltech Kk 銀めっき材およびその製造方法
KR101318051B1 (ko) * 2010-04-30 2013-10-14 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 배선판용 적층체
JP2014194522A (ja) * 2013-02-26 2014-10-09 Ricoh Co Ltd 定着ベルト用基材、定着ベルト、定着装置、および、画像形成装置
JPWO2021002009A1 (enExample) * 2019-07-04 2021-01-07

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10039171A1 (de) * 2000-08-10 2002-02-28 Consortium Elektrochem Ind Kathode für Elektrolysezellen
WO2002063069A2 (en) * 2001-01-12 2002-08-15 University Of Rochester Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9420698B2 (en) 2009-02-20 2016-08-16 Dai Nippon Printing Co., Ltd. Conductive substrate comprising a metal fine particle sintered film
JP2010192841A (ja) * 2009-02-20 2010-09-02 Dainippon Printing Co Ltd 導電性基板
KR101318051B1 (ko) * 2010-04-30 2013-10-14 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 배선판용 적층체
WO2012101984A1 (ja) * 2011-01-26 2012-08-02 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
JP2012162775A (ja) * 2011-02-08 2012-08-30 Dowa Metaltech Kk 銀めっき材およびその製造方法
US9897954B2 (en) 2013-02-26 2018-02-20 Ricoh Company, Ltd. Base for fixing belt, fixing belt, fixing device, and image forming apparatus
JP2014194522A (ja) * 2013-02-26 2014-10-09 Ricoh Co Ltd 定着ベルト用基材、定着ベルト、定着装置、および、画像形成装置
JPWO2021002009A1 (enExample) * 2019-07-04 2021-01-07
WO2021002009A1 (ja) * 2019-07-04 2021-01-07 住友電気工業株式会社 プリント配線板及びその製造方法
JP7283544B2 (ja) 2019-07-04 2023-05-30 住友電気工業株式会社 プリント配線板及びその製造方法
JP2023103401A (ja) * 2019-07-04 2023-07-26 住友電気工業株式会社 プリント配線板及びその製造方法
US11979983B2 (en) 2019-07-04 2024-05-07 Sumitomo Electric Industries, Ltd. Printed wiring board and method of manufacturing the same
JP7597147B2 (ja) 2019-07-04 2024-12-10 住友電気工業株式会社 プリント配線板及びその製造方法

Also Published As

Publication number Publication date
WO2007066751A1 (ja) 2007-06-14
US20080257746A1 (en) 2008-10-23

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